200940232 九、發明說明： .【發明所屬之技術領域】 本發明涉及切割與分離技術，尤其是一種雷射切割非 金屬或脆性基板之方法以及由該方法製得之脆性基板。 【先前技術】 參見圖1 ’雷射切割脆性基板之方法一般以配合脆性基 板強烈吸收特性之雷射，如二氧化碳（C02)雷射光束2〇來 加熱玻璃基板10之表面，再以冷卻流體30加以局部冷卻， ©進而於玻璃基板10之表面因急劇變化之溫度差產生熱應 力，使具有初始裂紋（initial crack)ll之玻璃基板1〇之邊緣 產生裂紋，並向雷射光束20之移動方向（如圖1中箭頭所示） 成長成盲裂紋（blind crack) 14’進而可於玻璃板件1〇之表面 形成沿預定方向延伸之切割線。 然而’於切割起始位置常會因玻璃基板1〇之邊緣強度 較低（例如’初始裂紋η之影響所造成），使得初始裂紋η ❹會沿玻璃基板1〇之厚度方向全斷（full cutting)並沿雷射光 束20之移動方向成長一段距離，以致於在切割線之起始端 會形成一對應圖1中之全斷區12之全斷線。 請一併參見圖2，其為先於玻璃基板1〇上沿A1方向 依序形成第一方向切割線 A10、All、A12、A13，再沿 A2 方向形成第二方向切割線A20之一狀態示意圖。從圖2中 可传知’當依序地沿單一方向（亦即第一方向A1)進行初始 裂紋及雷射切割時’第一方向切割線A10、All、A12、A13 之起始端之初始裂紋全斷且具有沿A1方向之成長距離差 6 200940232 ' 異（如圖2中第一方向切割線AlO、All、A12、A13之實線 '部分）’使得鄰近第一方向切割線A10、All、A12、A13之 起始端之第二方向切割線A20無法跨越第一方向切割線（例 如A10)之全斷線而導致切割失效（如圖2中箭頭pi所指部 为），或者沿偏離A2方向之其他方向形成裂紋成長（如圖2 中箭頭F2所指部分）而影響切割精度；進而導致玻璃基板 之切割良率不佳。 ❹ 有鑒於此，提供一種具有較高切割良率之雷射切割脆 性基板之方法以及採用該種方法製得之脆性基板實為必 要。 【發明内容】 下面將以實施例說明一種雷射切割脆性基板之方法以 及由該種方法製得之一種脆性基板。 一種雷射切割脆性基板之方法，其包括步驟： 提供一脆性基板； ❹ 耵了刀剞取程於脆性基板之鄰近其 置形成一沿一第一方向延伸之第一切割線； 於脆性基板上之鄰近第一切割線之起始端之位置形成 ^起始於該雜且跨過第—㈣線之初始狀，初始裂紋 沿一不同於第一方向之第二方向延伸；以及 一 j用-雷射切割製程於脆性基板上沿著初始裂紋形成 /σ第一方向延伸之第二切割線。 以及，一種脆性基板，盆上彡 一筮μ , 成有—第"'切割線以及 m線，第-切割線鄰近脆性基板之一邊緣，第二 7 200940232 切割線之起始端與第一切割線之起始端相交，且第二切割 線之位於其起始端且起始於該邊緣之一初始裂紋跨過一 切割線。 /相對於先前技術，上述之雷射切割脆性基板之方法經 由採用於形成一第一切割線後於鄰近第一切割線之起始端 之位置形成一第二切割線之切割製程，可有效避免後續形 成之沿第一方向延伸及/或第二方向延伸之切割線（a)因無 ❹夬跨越另方向上之切割線之起始端而導致之切割失效， 或者（b)偏離預定方向而影響切割精度，從而可達成較高之 切割良率。 【實施方式】 下面將結合附圖對本發明實施例作進一步之詳細說 明。 β >見圖3至圖5’本發明實施例提供之雷射切割脆性基 板之方法’其包括以下步驟。 〇 如圖3所示，提供一個脆性基板100,利用雷射切 程於跪性基板之鄰近跪性基板⑽之—邊緣:= 置形成-條第一切割線11〇，第一切割線11〇沿以方向延 ^其中，雜基板⑽通常為喊基板、玻璃基板、石 二二板、玻璃⑦晶圓或發*二極體晶圓等非金屬基板。脆 一土板100可為一方形板件(如圖3所示)，或依實際需求而 疋之其他形狀工件，例如圓形件q雷射切割製程可 括步驟Μ利用-雷射光束加熱跪性基板1〇〇，並使雷射 先束與脆性基板100產生一沿A1方向之相對運動；以及⑻ 200940232 ' 向脆性基板100施加（例如喷射）一冷卻流體（例如，氣液混 - 合物）以局部冷卻加熱之脆性基板100，以於脆性基板110 上形成一條第一切割線110。進一步的，於雷射光束加熱脆 性基板100之前，還可於第一切割線110之起始端111，利 用鑽石刀、刀輪或雷射刻劃等形成一個初始裂紋（initial crack)(亦即圖3中第一切割線110之實線部分之左侧部 分），該初始裂紋於雷射光束及冷卻流體之作用下成長為全 斷線（亦即，圖3中之第一切割線110之實線部分）。 ® 如圖4所示，於脆性基板100上之鄰近第一切割線110 之起始端111之位置形成一個初始裂紋122 ;初始裂紋122 起始於邊緣101且跨過第一切割線110。初始裂紋122與第 一切割線110之起始端111相交，其沿不同於A1方向之 A2方向延伸。A1方向與A2方向相交，例如垂直相交。初 始裂紋122可經由鑽石刀、刀輪或雷射刻劃形成。 如圖5所示，利用雷射切割製程於脆性基板1〇〇上沿 ❹著初始裂紋122形成一條沿A2方向延伸之第二切割線 120,進而可製得一如圖5所示之其上形成有第一切割線11〇 及與其相交之第二切割線120之脆性基板1〇〇。第一切割線 110與第二切割線120位於脆性基板1〇〇之同一表面。其 中’雷射切割製程可大致包括步驟：利用一個雷射光束 加熱脆性基板100 ’並使雷射光束與脆性基板1〇〇產生一沿 A2方向之相對運動；以及向脆性基板1〇〇施加（例如喷 射）一冷卻流體（例如，氣液混合物）以局部冷卻加熱之脆性 基板100，以於脆性基板1〇〇上形成一條第二切割線12〇。 9 200940232 第切m m之起始端121與第—切割線u。 m相父，初始裂、故122沿A2*向成長 二， 5中之第二切割線i 2 〇之實線部分)。 王斷線(亦即圖 需要指明的是，本實施例中之第二切割線12〇 A2方向延伸之第一條切割線（如圖5 ·'、、& ❹ :向，伸之最後-條切割線…卜’第-㈣:可二ΐ =Α2方向延伸，相應地，第二切割線ΐ2〇為沿μ方向 此外，對於圖5所示脆性基板工如之後續切割處理， 可先沿A1方向再沿A 2方向進行切割以於脆性基板_上 再形成多條相交之切割線，亦可先沿八2方向再沿ai方向 ，行切割；緩而言之’後續之切割線之形成順序可不作限 定。 綜上該，本發明實施例提供之雷射切割脆性基板之方 法，其經由採用於形成一條第一切割線110後於鄰近第一 〇切割線110之起始端U1之位置形成一條第二切割線 之切割製程，可有效避免後續形成之沿A1方向延伸及/或 A2方向延伸之切割線（1)因無法跨越另一方向上之切割線 之起始端而導致之切割失效，或者（2)偏離預定方向而影響 切割精度，從而可達到較高之切割良率。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申请。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 200940232 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係湘雷射切㈣程切龍性基板之—局部剖示 圖2係先前技術中利用 板之一切割效果示意圖。 雷射切割製程所切割之脆性基 :4示出於圖3所示脆性基板之第 形成=個起始㈣錢且跨過卜㈣〗線之初始裂故^ 圖5不出於圖4所示脆性基 一條沿第二方向延伸之第二切割線。 裂、、认成有 【主要元件符號說明】 10 20 30 11 、 122 12 14 101 110 111 ' 121 120 玻璃基板 φ雷射光束 冷卻流體 初始裂紋 全斷區 盲裂紋 邊緣 第一切割線 起始端 第二切割線 11 200940232 第一方向切割線 第二方向切割線 ΑΙΟ、All、A12、A13 A20BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to cutting and separating techniques, and more particularly to a method of laser cutting a non-metallic or brittle substrate and a fragile substrate produced by the method. [Prior Art] Referring to Fig. 1 'The method of laser cutting a brittle substrate is generally performed by a laser that strongly absorbs a characteristic of a brittle substrate, such as a carbon dioxide (C02) laser beam 2, to heat the surface of the glass substrate 10, and then a cooling fluid 30. Local cooling, and further thermal stress is generated on the surface of the glass substrate 10 due to a sharp change in temperature, causing cracks in the edge of the glass substrate 1 having the initial crack 11 and moving toward the laser beam 20 (As shown by the arrow in Fig. 1), a blind crack 14' is formed to form a cutting line extending in a predetermined direction on the surface of the glass sheet member. However, the starting position of the cutting is often caused by the low edge strength of the glass substrate (for example, due to the influence of the initial crack η), so that the initial crack η ❹ will be fully cut along the thickness direction of the glass substrate 1〇. And growing a distance along the moving direction of the laser beam 20, so that a full disconnection corresponding to the full-break region 12 in FIG. 1 is formed at the beginning of the cutting line. Referring to FIG. 2 together, a state in which the first direction cutting lines A10, All, A12, and A13 are formed in the A1 direction and then the second direction cutting line A20 is formed along the A2 direction is preceded by the glass substrate 1 〇. . It can be known from FIG. 2 that 'the initial crack of the initial end of the first direction cutting lines A10, All, A12, A13 when the initial crack and the laser cutting are sequentially performed in a single direction (ie, the first direction A1). Fully broken and having a growth distance difference in the direction of A1 6 200940232 'Different (as in the solid line 'section of the first direction cutting line A10, A1, A12, A13 in Fig. 2) 'to make the adjacent first direction cutting line A10, All, The second direction cutting line A20 of the beginning end of A12, A13 cannot cross the full line of the first direction cutting line (for example, A10) to cause the cutting failure (as indicated by the arrow pi in Fig. 2), or in the direction away from the A2 direction. The other direction forms crack growth (as indicated by the arrow F2 in Fig. 2), which affects the cutting precision; further, the cutting yield of the glass substrate is poor. In view of the above, it is necessary to provide a laser cutting brittle substrate having a high cutting yield and a brittle substrate obtained by such a method. SUMMARY OF THE INVENTION A method of laser cutting a brittle substrate and a brittle substrate obtained by the method will be described below by way of examples. A method for laser-cutting a brittle substrate, comprising the steps of: providing a brittle substrate; ❹ picking a blade adjacent to the brittle substrate to form a first cutting line extending along a first direction; on the brittle substrate a position adjacent to the beginning end of the first cutting line is formed in the initial shape of the impurity and crossing the first (four) line, the initial crack extends in a second direction different from the first direction; and a j-ray The shot cutting process is performed on the brittle substrate along a second cutting line extending in the first direction of the initial crack formation / σ. And a brittle substrate, the basin is 彡μ筮μ, and has a “section” and a m-line, the first-cut line is adjacent to one edge of the brittle substrate, and the second end of the second 7 200940232 cutting line is cut with the first The beginning ends of the lines intersect, and the second cutting line is at its starting end and begins with an initial crack of one of the edges across a cutting line. Compared with the prior art, the above method for laser-cutting a brittle substrate can effectively avoid the subsequent process by forming a second cutting line at a position adjacent to the beginning end of the first cutting line after forming a first cutting line. a cutting line (a) extending in the first direction and/or extending in the second direction is formed by the inability of the cutting end of the cutting line in the other direction, or (b) deviating from the predetermined direction to affect the cutting Accuracy, which results in higher cutting yields. [Embodiment] Hereinafter, embodiments of the present invention will be further described in detail with reference to the accompanying drawings. β > Fig. 3 to Fig. 5' The method of laser cutting a brittle substrate provided by the embodiment of the present invention' includes the following steps. As shown in FIG. 3, a brittle substrate 100 is provided, which utilizes a laser cut to the edge of the adjacent substrate (10) of the inert substrate: the first cutting line 11〇, the first cutting line 11〇 In the direction of the extension, the hetero-substrate (10) is usually a non-metallic substrate such as a substrate, a glass substrate, a stone plate, a glass 7 wafer, or a diode wafer. The brittle soil plate 100 can be a square plate member (as shown in FIG. 3) or other shaped workpieces that are entangled according to actual needs. For example, the circular member q laser cutting process can include the steps of using a laser beam to heat the crucible. The substrate 1〇〇, and causes the laser beam to generate a relative movement in the A1 direction with the brittle substrate 100; and (8) 200940232' applies (for example, jets) a cooling fluid to the brittle substrate 100 (eg, a gas-liquid mixture) The brittle substrate 100 heated by local cooling is used to form a first dicing line 110 on the brittle substrate 110. Further, before the laser beam is heated by the laser beam, an initial crack may be formed at the starting end 111 of the first cutting line 110 by using a diamond knife, a cutter wheel or a laser scribe (ie, a figure). 3, the left portion of the solid line portion of the first cutting line 110), the initial crack grows into a full disconnection under the action of the laser beam and the cooling fluid (ie, the first cutting line 110 in FIG. 3) Line part). As shown in FIG. 4, an initial crack 122 is formed on the brittle substrate 100 adjacent to the starting end 111 of the first cutting line 110; the initial crack 122 starts at the edge 101 and spans the first cutting line 110. The initial crack 122 intersects the starting end 111 of the first cutting line 110, which extends in the A2 direction different from the A1 direction. The A1 direction intersects the A2 direction, for example, perpendicularly intersects. The initial crack 122 can be formed by a diamond knife, a cutter wheel or a laser scoring. As shown in FIG. 5, a second cutting line 120 extending along the A2 direction is formed on the brittle substrate 1 by a laser cutting process, and an upper cutting line 120 extending in the A2 direction is formed on the first substrate 122. A brittle substrate 1A having a first cutting line 11A and a second cutting line 120 intersecting therewith is formed. The first cutting line 110 and the second cutting line 120 are located on the same surface of the brittle substrate 1〇〇. Wherein the 'laser cutting process can roughly include the steps of: heating the brittle substrate 100' with a laser beam and causing the laser beam to generate a relative movement in the A2 direction with the brittle substrate 1; and applying to the brittle substrate 1 ( For example, a cooling fluid (for example, a gas-liquid mixture) is used to locally cool the heated brittle substrate 100 to form a second cutting line 12〇 on the brittle substrate 1〇〇. 9 200940232 The starting end 121 of the first m m and the first cutting line u. The m-phase parent, the initial split, so 122 grows along A2*, the second cut line i 2 is the solid line of the second cut line i). The king break line (that is, the figure needs to indicate that the first cutting line extending in the direction of the second cutting line 12A2 in the present embodiment is as shown in Fig. 5 · ', , & ❹: Cutting line...b'--(four): can be extended in the direction of 2Α, Α2, correspondingly, the second cutting line ΐ2〇 is in the direction of μ. In addition, for the subsequent cutting process of the brittle substrate shown in Fig. 5, it can be along A1 first. The direction is further cut along the A 2 direction to form a plurality of intersecting cutting lines on the brittle substrate _, or may be cut along the ai direction in the eighth direction and the second direction; in short, the order of the subsequent cutting lines is formed. The method for laser cutting a brittle substrate provided by the embodiment of the present invention is formed by forming a first cutting line 110 and forming a strip adjacent to the starting end U1 of the first tangent cutting line 110. The cutting process of the second cutting line can effectively avoid the cutting failure of the subsequently formed cutting line extending in the A1 direction and/or extending in the A2 direction (1) due to the inability to cross the starting end of the cutting line in the other direction, or 2) Deviation from the predetermined direction affects the cut Accuracy, so that higher cutting yield can be achieved. In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above is only a preferred embodiment of the present invention, since The scope of the patent application in this case is not limited. Any equivalent modifications or variations made by those skilled in the art to the spirit of the present invention are covered by the following patents. [Simplified Schematic] Figure 1 Xiang Lei shot cut (four) Cheng Che Long substrate - partial cross-section Figure 2 is a schematic diagram of the cutting effect of one of the prior art boards. The brittle base cut by the laser cutting process: 4 is shown in the brittle substrate shown in Figure 3. The first formation = the initial (four) money and crosses the initial crack of the line (4). Figure 5 is not a brittle base shown in Figure 4. A second cutting line extending in the second direction. Explanation of main component symbols] 10 20 30 11 , 122 12 14 101 110 111 ' 121 120 glass substrate φ laser beam cooling fluid initial crack full break zone blind crack edge first cutting line start end second cutting line 11 200940 232 First direction cutting line Second direction cutting line ΑΙΟ, All, A12, A13 A20
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