201024239 六、發明說明： 【發明所屬之技術領域】 本發明係關於於脆性材料基板形成貫通孔之方法，詳 言之，係關於使用切刀於脆性材料基板形成貫通孔之方法。 【先前技術】 於做為脆性材料基板例如玻璃基板形成貫通孔時，如 圖1 1所不，將玻璃基板1之表面以不圖示之切刀呈閉曲線 _ 狀劃線，形成由對基板表面垂直之裂痕71構成之劃線6(同 圖（a))，其次使被以劃線6包圍之區域冷卻收縮，（同圖（b))， 使被以劃線6包圍之區域脫落形成貫通孔11。 然而，以此以往之方法以使被以劃線6包圍之區域收 縮為必要。又，如圖12所示，若此收縮不充分，在去除被 以劃線6包圍之區域時，形成裂痕71之對向面接觸、摩擦， 於貝通孔11之周圍產生微小凹凸或貝殼狀之缺口。 ❿ 針對此問題’例如在專利文獻1有提案如圖1 3所示， 藉由利用刀輪2之劃線於玻璃基板丨形成對玻璃基板丨之 厚度方向傾斜之裂痕7 2，形成被以劃線6包圍之區域之脫 離斜面後’對該區域於垂直方向施加外力以去除該區域之 技術。 【專利文獻1】曰本特開平7-223828 【發明内容】 然而，如圖14所示，根據本發明者實驗之結果發現， 201024239 以切刀2實際形成之裂痕73從玻璃基板i之表面至特定深 度為止雖以所望之傾斜角度形成，但在更深處裂痕Μ之傾 斜對基板厚度方向迅速變小，到接近玻璃基板1之背面側 玻璃裂痕73之傾斜成為基板厚度方向，即對基板表面大致 垂直。 、如此右裂痕73對基板表面垂直之部分L長，在去除被 以劃線6包圍之區域時，形成裂痕73之對向面接觸、摩擦， 如圖12所示於貫通孔n之周圍產生微小凹凸或貝殼狀之 缺D ° 本發明係鑑於此種以往之問題而為，纟目的在於提供 不使微小凹&或貝殼狀之缺口等於貫通孔之周緣產生，使 用切刀於脆性材料基板順利形成貫通孔之方法。 根據本發明，提供一種藉由使用切刀之劃線於跪性材 料基板形成貫通孔之方法，其特徵在於：具有以切刀將脆 性材料基板之貫通孔形成預定區域之外緣或外緣之内側劃 線並形成由對基板厚度方向傾斜之第i裂痕構成之第i劃 Λ步驟以切刀第！劃線將第（劃線之内側或第1劃 線之卜側之貫通孔形成預定區域之外緣劃線並形成由對基 板厚度方向傾斜並與第丨裂痕會合之第2裂痕構成之第2 劃線之步驟。此㈣藉由於貫通孔形成預定區域之外緣形 成第劃線時使第1裂痕對基板厚度方向往貫通孔形成預 定區域之外向傾斜，於貫通孔形成預定區域之外緣之内側 形成第i劃線時使第！裂痕對基板厚度方向往貫通孔形成 預定區域之内向傾斜’確實形成脫離斜面。 201024239 在此由將對基板厚度方向傾斜之聲 全體確實形成之觀點，裂痕於基板之厚度 0 11 + π ”則述第1劃線與第2劃線之間ρ Α 〇·1〜1mm之範圍較理想。 、间隔為 又，做為切刀可使用具 圓雜台之共同之底面接合之形狀，之2個圓錐或 為刀前緣稜線，於此刃，… 前迷底面之圓周部分 有對疑轉軸方向傾斜特定角度之槽者。又’使用具有2 有旋轉軸之2個圓錐或圓錐台之 、- 以乂、+、虎二 J之底面接合之形狀， 二述底面之圓周部分為刀前緣稜線，前述 錐台之側面與前述底面之央角相異之切刀亦可。戍圓 此外，以相異之切刀形成^劃線與第2劃線亦可。 根據本發明，提供一錄於眩佩， 捉供種於隔微小間隙或直接接合 =性材料基板藉由使心刀之劃線形成貫通孔之方法， 徵在於：具有於料2片龍㈣基板之-方以切刀 將貫通孔形成默區域之外緣劃線並形成由對基板厚 鲁 向傾斜之第1祕構成之第1劃線之步驟、以切刀沿第丨 劃線將第i劃線之内側劃線並形成由對基板厚度方向傾斜 並與第！裂痕會合之第2裂痕構成之第2劃線之步驟、於 前述2片脆性材料基板之另一方以切刀將比第U線外側 劃線並形成由對基板厚度方向傾斜之第3裂痕構成之第3 劃線之步驟、以切刀沿第3劃線將第3劃線之外侧劃線並 形成由對基板厚度方向傾斜並與第3裂痕會合之第斗裂痕 構成之第4劃線之步驟。此時係藉由使第丄裂痕對基板厚 度方向往貫通孔形成預定區域之外向傾斜，使第3裂痕對 201024239 基板厚度方向往貫通孔形成預定區域之内向傾斜，確實形 成脫離斜面。 根據本發明，提供一種於隔微小間隙或直接接人之2 片脆性材料基板藉由使用切刀之劃線形成貫通孔之方法， 其特徵在於：具有於前述2片脆性材料基板之—方以切刀 將比貧通孔形成預定區域之外緣内側劃線並形成由對基板 厚度方向傾斜之第i裂痕構成之第]劃線之步驟、以切刀 沿第1劃線將第i劃線之外側之貫通孔形成預定區域之外 緣劃線並形成由對基板厚度方向傾斜並與第丨裂痕會合之 第2裂痕構成之第2劃線之步驟、於前述2片脆性㈣基 板之另-方以切刀將比第i劃線内側劃線並形成由對基板 厚度方向傾斜之第3裂痕構成之第3劃線之步驟、以切刀 沿第3劃線將第3劃線之内側劃線並形成由對基板厚度方 向傾斜並與第3裂痕會合之第4裂痕構成之第4劃線^ 驟。此時係藉由使第！裂痕對基板厚度方向往貫通孔形二 預定區域之内向傾斜，使第3裂痕對基板厚度方向往 孔形成預定區域之外向傾斜，確實形成脫離斜面。 在本發明之實施形態之貫通孔之形成方法由於 :對基板厚度方向傾斜之第1裂痕構成之帛1劃線後再卜 第1劃線將第1劃線之内側或外側劃線並形成由對 度方向傾斜並與第1裂痕會合之第2裂痕構成之第2劃線 故確實形成被以劃線包圍之區域之脫離斜面。藉此，於 除被以劃線包圍之區域㈣成之貫通孔之周緣不會產生 小凹凸或貝殼狀之缺口等問題。 201024239 性材料基板之 可不產生微小 又’於隔微小間隙或直接接合之2片脆 狀况亦藉由於各基板形成前述之2個劃線而 凹凸或貝殼狀之缺口順利形成貫通孔。 【實施方式】 以下’雖針對本發明之貫通孔之形成方法更詳細說 明，但本發明並不受此等實施形態任何限定。 於圖1及圖2顯示顯示本發明之貫通孔之形成方法之 實施形態之流程圖。此等圖係於脆性材料基板即玻璃基 板開圓形之貫通孔時之流程圖’ g i為立體圖，圖2為縱 剖面圖。首先如圖1(a)所示，使用圓盤形狀且於外周部形成 有刃前緣之刀輪2將玻璃基板i上之貫通孔形成預定區域 之外緣劃線形成第i劃線31。藉由此劃線於玻璃基板丨形 成如圖2 (a)所示之在淺處傾斜為往半徑方向外方擴張，在深 處對基板表面大致垂直之第1裂痕41。 其次’如圖丨⑺）所示，在比第1劃線31内側且與第！ 劃線31同心圓狀地以刀輪2進行劃線形成第2劃線32。藉 由此劃線，如圖2(b)所示，形成在淺處往半徑方向外方擴 張之傾斜小，變深後傾斜迅速變大而與第丨裂痕4丨會合之 第2裂痕42。藉此’形成使被以第1劃線3 i包圍之區域從 玻璃基板1脫落之對基板表面垂直之部分L(於圖2(c)圖示） 短之脫離斜面。 在此，即使使用相同刀輪2形成第2裂痕42，第2裂 痕42仍不會與第！裂痕41平行而會與第1裂痕41會合， 201024239 可認為是因為第1裂痕41之形成使其周邊之脆性材料内部 之應力之狀態變化而成為與未形成裂痕之部分相異之狀 態。已確認即使於形成直線狀之劃線之通常之劃線，若於 基板之端邊附近沿端邊形成劃線，沿劃線被形成之裂痕有 往端邊側傾斜之傾向。因此，為使第2裂痕42與第丨裂痕 41會合，必須考慮基板1之厚度或刀輪2之壓接力等，來 調整例如第1劃線31與第2劃線32之間隔。第1劃線31 與第2劃線3 2之間隔通常為〇 _ 1〜1 mm之範圍較理想。若第 1劃線31與第2劃線32之間隔過寬，第2裂痕42被形成 為與第1裂痕41大致平行，不與第丨裂痕41會合。反之， 若第1劃線31與第2劃線32之間隔過窄，第}裂痕4丨之 對基板表面垂直之部分L(於圖2(c)圖示）變長，在使被以第 1劃線3 1包圍之區域從玻璃基板丨脫落時有產生微小凹凸 或貝殼狀之缺口之虞。 此外，如圖1(c)及圖2(c)所示，對被以第1劃線31包 圍之區域施加向下方之力後，藉由由第丨裂痕41及第2裂 痕42形成之脫離斜面，該區域容易脫落，於玻璃基板 成貫通孔i卜另外，即使為第i裂痕41未到達玻璃基板i 之背面之狀況，藉由上述外力作用，第i裂痕41進展至玻 璃基板1之背面，故無對貫通孔η之形成產生阻礙之虞。 备然，在對玻璃基板1施加外力前，將玻璃基板丨加熱及/ ^冷卻使膨脹、收縮，使第〗裂痕41進展至玻璃基板1之 背面亦無妨。若如上述在對玻璃基板1施加外力前，先將 破螭基板1加熱及/或冷卻使膨脹、收縮，在使被以第丨劃 201024239 線31包圍之區域從玻璃基板1脫落時亦可使處理更順利進 行。 做為可以本發明之方法形成貫通孔Π之脆性材料基板 1 '舉出以往公知者。例如，可舉出玻璃、陶瓷、矽、藍寶[Technical Field] The present invention relates to a method of forming a through hole in a brittle material substrate, and more particularly to a method of forming a through hole in a brittle material substrate using a cutter. [Prior Art] When a through hole is formed as a brittle material substrate such as a glass substrate, as shown in Fig. 11, the surface of the glass substrate 1 is scribed by a cutter (not shown) to form a surface of the substrate. The vertical crack 71 constitutes a scribe line 6 (the same figure (a)), and secondly, the area surrounded by the scribe line 6 is cooled and contracted (the same figure (b)), and the area surrounded by the scribe line 6 is separated and formed. Hole 11. However, in the conventional method, it is necessary to shrink the area surrounded by the scribe line 6. Further, as shown in Fig. 12, if the shrinkage is insufficient, when the region surrounded by the scribe line 6 is removed, the opposing surface contact and friction of the crack 71 are formed, and minute irregularities or shell-like shapes are formed around the passhole hole 11. The gap. ❿ In response to this problem, for example, as disclosed in Patent Document 1, as shown in FIG. 13 , a crack 7 2 which is inclined in the thickness direction of the glass substrate 丨 is formed on the glass substrate by the scribe line of the cutter wheel 2, and is formed to be drawn. The technique of applying an external force to the region in the vertical direction to remove the region after the region surrounded by the line 6 is detached from the slope. [Patent Document 1] 曰本特开平 7-223828 SUMMARY OF THE INVENTION However, as shown in FIG. 14, it is found from the results of experiments by the inventors that 201024239 is actually formed by the crack 73 actually formed by the cutter 2 from the surface of the glass substrate i to Although the inclination is formed at a predetermined inclination angle, the inclination of the crack is rapidly reduced toward the thickness direction of the substrate at a deeper depth, and the inclination of the glass crack 73 close to the back side of the glass substrate 1 becomes the thickness direction of the substrate, that is, approximately the surface of the substrate. vertical. Thus, the right crack 73 is long to the portion L perpendicular to the surface of the substrate, and when the region surrounded by the scribe line 6 is removed, the opposing surface contact and friction of the crack 73 are formed, and as shown in FIG. 12, the periphery of the through hole n is minute. The present invention is based on such conventional problems, and it is an object of the present invention to provide a chiplet for a brittle material substrate without providing a micro concave & or a shell-like notch equal to the periphery of the through hole. A method of forming a through hole. According to the present invention, there is provided a method of forming a through hole in a substrate of an inert material by using a scribing line of a cutter, characterized in that the through hole of the substrate of the brittle material is formed by a cutter to form an outer edge or an outer edge of a predetermined region. The inner side is scribed and the ith step is formed by the i-th crack which is inclined in the thickness direction of the substrate to cut the knife! The scribe line is formed on the inner side of the scribe line or the through hole on the side of the first scribe line to form a predetermined area, and the second line is formed by snagging the outer edge of the predetermined area to form a second crack which is inclined in the thickness direction of the substrate and merges with the second crack. Step (4) When the first scribe line is formed by the outer edge of the through hole forming predetermined region, the first crack is inclined outward in the thickness direction of the substrate toward the through hole forming predetermined region, and the through hole is formed outside the predetermined region. When the i-th scribe line is formed on the inner side, the first crack is formed so as to be inclined away from the substrate in the thickness direction toward the through-hole forming predetermined region. 201024239 Here, the crack is formed by the fact that the sound which is inclined in the thickness direction of the substrate is formed. The thickness of the substrate is 0 11 + π ”. The range between the first scribe line and the second scribe line is preferably ρ 〇 ·1~1 mm. The interval is again, and the cutter can make the tool common. The shape of the bottom surface joint, the two cones or the front edge of the knife edge, the edge of the blade, the front part of the bottom surface has a groove inclined to a certain angle of the direction of the axis of the suspect. Also 'Use 2 with a rotating shaft 2 The shape of the conical or truncated cone, the shape of the bottom surface of the 乂, +, and the tiger J, the circumferential portion of the bottom surface is the ridgeline of the leading edge of the blade, and the cutter of the side of the frustum is different from the central angle of the bottom surface. In addition, the circle may be formed by a different cutter, and the second line may be formed. According to the present invention, a recording is provided for the smear, and the seed is applied to the small gap or directly bonded to the substrate. The method for forming the through hole by the scribe line of the heart knife is characterized in that: the square of the substrate of the two pieces of the dragon (four) is formed by the cutter, and the through hole is formed into the outer edge of the silent region and formed by the thick slope of the substrate. In the first scribing step of the first secret structure, the inner side of the i-th scribe line is scribed by the cutter along the first scribe line to form a second crack which is inclined in the thickness direction of the substrate and merges with the first crack. In the step of the second scribe line, the step of scribing the third scribe line formed by the third slit on the other side of the U-shaped line and forming a third crack which is inclined in the thickness direction of the substrate is formed by the cutter on the other of the two pieces of the brittle material substrate. The cutter scribes the outer side of the third scribe line along the third scribe line and forms a thickness from the opposite substrate a step of forming a fourth scribe line which is formed by slanting and merging with the third crack. In this case, the third crack is made to be inclined by the third crack in the thickness direction of the substrate toward the through hole. The thickness direction of the substrate is inclined toward the inner side of the through hole forming predetermined region, and the slanting surface is surely formed. According to the present invention, a through hole is formed by using a scribing line of a two-piece brittle material substrate which is separated by a small gap or directly connected. The method is characterized in that: the two sheets of the brittle material substrate are formed by scribing the outer edge of the predetermined area of the poor via hole and forming the ith slit which is inclined by the thickness direction of the substrate. In the step of scribing, the through hole on the outer side of the i-th scribe line is formed along the first scribe line to form a predetermined region outer edge scribe line, and is formed by a second crack which is inclined to the thickness direction of the substrate and merges with the second crack. In the step of the second scribe line, the other two of the two brittle (four) substrates are scribed by the cutter to the inside of the i-th scribe line, and the third crack is formed by the third crack which is inclined in the thickness direction of the substrate. Step line, the cutter along the third scribe line to the inner side of the scribe line and the third scribe line is formed by the fourth configuration of the scribe line and the third inclined cracks cracks juncture of the fourth step of the substrate thickness direction ^. At this time, by making the first! The crack is inclined toward the inner side of the predetermined area of the through-hole shape in the thickness direction of the substrate, so that the third crack is inclined outward in the thickness direction of the substrate toward the predetermined region of the hole formation, and the separation slope is surely formed. In the method of forming the through hole according to the embodiment of the present invention, the first slit formed by tilting the thickness direction of the substrate is scribed, and the first scribe line is scribed by the first scribe line. The second scribe line formed by the second crack which is inclined in the direction of the direction and which meets the first crack does form a detachment slope of the region surrounded by the scribe line. Thereby, there is no problem such as a small unevenness or a shell-like notch in the periphery of the through hole formed in the region (4) surrounded by the scribe line. 201024239 The material substrate can be made into a through-hole without the occurrence of a small amount of brittleness in the case of a small gap or direct bonding, because the two scribe lines are formed on each of the substrates, and the irregularities or the shell-like notches are smoothly formed. [Embodiment] Hereinafter, the method of forming the through hole of the present invention will be described in more detail, but the present invention is not limited to these embodiments. A flow chart showing an embodiment of a method of forming a through hole according to the present invention is shown in Figs. 1 and 2 . These figures are a perspective view of a fragile material substrate, i.e., a through-hole of a glass substrate having a circular opening, and Fig. 2 is a longitudinal sectional view. First, as shown in Fig. 1(a), the cutter wheel 2 having a disk shape and having a blade leading edge formed on the outer peripheral portion forms a predetermined region on the glass substrate i, and the outer edge is formed by a scribe line to form an i-th scribe line 31. By this scribe line, the glass substrate is formed into a first crack 41 which is inclined at a shallow position as shown in Fig. 2(a) and which is expanded outward in the radial direction and which is substantially perpendicular to the surface of the substrate. Next, as shown in Fig. (7), it is inside the first scribe line 31 and the first! The scribe line 31 is concentrically formed by the cutter wheel 2 to form the second scribe line 32. By this scribing, as shown in Fig. 2(b), the second crack 42 is formed so that the inclination in the radial direction in the shallow direction is small, and the inclination is rapidly increased, and the inclination is rapidly increased to meet the second crack. Thereby, a portion L (shown in Fig. 2(c)) which is perpendicular to the surface of the substrate which is separated from the glass substrate 1 by the region surrounded by the first scribe line 3 i is formed to be separated from the slope. Here, even if the second slit 42 is formed using the same cutter wheel 2, the second crack 42 does not match the first! The crack 41 is parallel to the first crack 41, and 201024239 is considered to be because the first crack 41 is formed so that the state of the stress inside the brittle material around it changes to a state different from the portion where the crack is not formed. It has been confirmed that even if a normal scribe line forming a straight line is formed, a scribe line is formed along the end side in the vicinity of the end side of the substrate, and the crack formed along the scribe line tends to be inclined toward the end side. Therefore, in order to make the second crack 42 and the second crack 41 meet, it is necessary to adjust the interval between the first scribe line 31 and the second scribe line 32 in consideration of the thickness of the substrate 1 or the pressure contact force of the cutter wheel 2, for example. The interval between the first scribe line 31 and the second scribe line 3 2 is usually in the range of 〇 _ 1 to 1 mm. When the interval between the first scribe line 31 and the second scribe line 32 is too wide, the second crack 42 is formed to be substantially parallel to the first crack 41 and does not meet the second crack 41. On the other hand, if the interval between the first scribe line 31 and the second scribe line 32 is too narrow, the portion L of the first crack 4' which is perpendicular to the surface of the substrate (illustrated in Fig. 2(c)) becomes longer, and When the area surrounded by the scribe line 3 1 is detached from the glass substrate, there is a flaw in which fine irregularities or shell-like defects are generated. Further, as shown in Fig. 1 (c) and Fig. 2 (c), the downward force is applied to the region surrounded by the first scribe line 31, and the detachment is formed by the second crack 41 and the second crack 42. In the inclined surface, the region is likely to fall off, and the glass substrate is formed as a through hole. Moreover, even if the i-th crack 41 does not reach the back surface of the glass substrate i, the i-th crack 41 progresses to the back surface of the glass substrate 1 by the external force. Therefore, there is no impediment to the formation of the through hole η. In addition, before the external force is applied to the glass substrate 1, the glass substrate is heated and/or cooled to expand and contract, and the first crack 41 may be advanced to the back surface of the glass substrate 1. When the external force is applied to the glass substrate 1 as described above, the broken substrate 1 is heated and/or cooled to expand and contract, and the region surrounded by the line 201024239 may be detached from the glass substrate 1. Processing is going smoother. As a brittle material substrate 1 which can form a through-hole by the method of the present invention, it is known in the art. For example, glass, ceramic, enamel, sapphire
石寻脆性材料基板。又’可以本發明之方法形成貫通孔U 之脆性材料基丨之厚度雖因脆性材料基板之材質等而 異’但於脆性材料基板為玻璃基板時至大約2職程度之厚Stone seeking brittle material substrate. Further, the thickness of the brittle material base which can form the through hole U by the method of the present invention varies depending on the material of the brittle material substrate, etc., but when the brittle material substrate is a glass substrate, it is thick to about two levels.
❹ j可形成貫通孔"。又，貫通孔"之大小並無特別限定， ;:般越小徑之貫通孔越難形A，以本發明之方法即使為直 徑1 5mm之貫通孔亦可容易形成。 做為在本發明使用之刀輪2，只要是能形成對基板厚度 方向傾斜之裂痕者，並無特別限定。將可在本發明之方法 適备使用之切刀之-例顯示於圖3〜圖5。_ 3係刀輪之全 ，立體《 1 4⑷係從圖3之箭頭a觀察之刃前緣棱線之 邛：擴大圖’ ® 4(B)係從圖3之箭頭b觀察之刀前緣稜線 一 P刀擴大圖。圖5係在槽部分之垂直剖面圖。於圖3顯 不之切刀2a具有將共有旋轉軸22之2個圓錐台之共同之底 面接口之形狀，於前述底面之圓周部分形成有刀前緣稜線 2卜在此刀輪2a係於刃前緣稜線21於周方向以特定間隔形 成有對旋轉轴方向傾斜特定角度之槽23。若使用此刀輪2a 進:劃線’於圖5形成向下方往左方向傾斜之裂痕。槽乃 之郎距為20〜200 //m之範圍較理想。在槽23之兩端之深度 係深度2〜25G(^m之範圍，深度I為卜御爪之範 圍較理想。 201024239 於圖6顯示在本發明使用之刀輪之其 〜市態。同圖f A、 係從圖3之箭頭A觀察之刀前緣稜線之部分擴大圖a (B)係從圖3之箭頭B觀察之刃前緣棱線之部八 同圖 刀馈大圖。如 此圖所示，槽23之形狀為v字狀亦可。此 町，做為V字狀 之槽23之節距、槽23之兩端之深度d!、d2，前、f | # & 2别述形態之適 當範圍在此亦被例示。另外，於同圖（A)顯 , 不之槽之形狀除 U字狀或V字狀外’為鋸刃狀、凹形狀等形狀亦無妨 於圖7顯示在本發明之方法可適當使用之切刀之另一 例。此圖之刀輪2b在具有將共有旋轉軸22之2 ^錐台 之共同之底面接合之形狀，於前述底面之圓周部分形成有 刃前緣稜線21之點雖與於圖3顯示之刀輪相同，但在前 述2個圓錐台之側面與前述底面之角度與角度相異❹ j can form a through hole ". Further, the size of the through hole " is not particularly limited; the more the through hole having a smaller diameter is, the more difficult it is to form A, and the through hole of a diameter of 15 mm can be easily formed by the method of the present invention. The cutter wheel 2 used in the present invention is not particularly limited as long as it can form a crack that is inclined in the thickness direction of the substrate. An example of a cutter that can be suitably used in the method of the present invention is shown in Figs. 3 to 5. _ 3 series of cutter wheels, three-dimensional "1 4 (4) is the edge of the edge of the blade viewed from the arrow a of Figure 3: the enlarged figure ' ® 4 (B) is the front edge of the knife viewed from the arrow b of Figure 3 A P knife enlarges the map. Figure 5 is a vertical sectional view of the groove portion. The cutter 2a shown in Fig. 3 has a shape in which the common bottom surface of the two truncated cones of the common rotating shaft 22 is connected, and a knife leading edge ridge 2 is formed on the circumferential portion of the bottom surface, and the cutter wheel 2a is attached to the blade. The leading edge ridge line 21 is formed with a groove 23 inclined at a specific angle to the rotation axis direction at a predetermined interval in the circumferential direction. If the cutter wheel 2a is used: the score line is formed in Fig. 5 to form a crack which is inclined downward to the left. It is ideal that the range of the slot is 20 to 200 //m. The depth of the two ends of the groove 23 is 2 to 25 G (the range of ^m, and the depth I is ideal for the range of the claws. 201024239 shows the state of the cutter wheel used in the present invention. f A, a partial enlargement of the ridgeline of the leading edge of the blade as viewed from the arrow A of Fig. 3, a (B) is a larger view of the blade of the ridge of the leading edge of the blade as viewed from the arrow B of Fig. 3. As shown in the figure, the shape of the groove 23 may be a V-shape. The pitch of the groove 23 as a V-shaped groove, the depth d at both ends of the groove 23, d2, front, f | # & 2 The appropriate range of the above-described form is also exemplified here. In addition, as shown in the same figure (A), the shape of the groove other than the U-shape or the V-shape is a shape such as a saw blade shape or a concave shape. Another example of a cutter which can be suitably used in the method of the present invention is shown. The cutter wheel 2b of this figure has a shape in which a common bottom surface of a 2^frustum having a common rotating shaft 22 is joined, and a circumferential portion of the bottom surface is formed. The edge of the blade leading edge ridge 21 is the same as the cutter wheel shown in FIG. 3, but the angles and angles of the sides of the two truncated cones are different from the angle of the bottom surface.
之點不同。若使用於此圖顯示之刀輪2b進行劃線，與圖3 之刀輪2a同樣，於圖5形成向下方往左方向傾斜之裂痕。 另外，裂痕之傾斜通常係正比於前述2個圓錐台之側面與 前述底面之角度01與角度Θ2之差，角度與角度02The point is different. When the scribing wheel 2b shown in this figure is scribing, similarly to the cutter wheel 2a of Fig. 3, a crack which is inclined downward in the left direction is formed in Fig. 5 . In addition, the inclination of the crack is usually proportional to the difference between the angle 01 and the angle Θ2 of the side surface of the two truncated cones and the bottom surface, the angle and the angle 02
之差越大，裂痕之傾斜越大。 使用刀輪做為切刀時’其外徑為1 mm〜1 〇mm之範圍較 理想。若刀輪之外徑比1 mm小，操作性及耐久性可能低下， 若外徑比10mm大，劃線時傾斜裂痕可能不被深入形成。更 理想之刀輪外徑為1 mm〜5mm之範圍。又，對刀輪施加之荷 重及劃線速度雖由脆性材料基板之種類或厚度等被適當決 定’但通常對刀輪施加之荷重為0 05〜0.4Mpa之範圍，劃線 速度為10〜50〇mm/sec之範圍。 10 201024239 以上例不之刀輪雖具有將共有旋轉軸之2個圓錐台之 共同之底面接合之形狀，但即使使用如圖8所示之且有將 共有旋轉軸之2個圓錐之制之底面接合之形狀之刀輪& 亦當然無妨。 於本發明之方法在第丨劃線3丨與第2劃線Μ使用不 同之刀輪亦可。即，於形成第2劃線32之際，使用對基板 厚度方向第2裂痕42比第！裂痕41更傾斜之刀輪亦可。 _於圖9顯示本發明之方法之其他實施形態。於此圖顯 ，不之貫通孔之形成方法係於隔微小間隙或直接接合之2片 脆性材料基板（例如玻璃基板）la、lb形成貫通孔之方法。首 先如圖9⑷所示，使用圓盤形狀且於外周部形成有刃前緣之 刀輪2將玻璃基板la之貫通孔形成預定區域之外緣劃線， 形成由第i裂痕41構成之第！劃線31。其次，如圖9(b) 所不，在比第1劃線31内側且與第i劃線31同心圓狀地 以刀輪2進行劃線，形成由第2裂痕42構成之第2劃線32。 如前述，此第2裂痕42與第！裂痕41會合，形成將被以 第1劃線31包圍之區域從上玻璃基板u去除之對基板表面 垂直之部分L(於圖2(c)圖示）短之脫離斜面。 其次，如圖9(c)所不，將比下玻璃基板lb之貫通孔形 成預定區域之外緣内側且比第丨劃線31外側使用刀輪2劃 線，形成由第3裂痕43構成之第3劃線33。其次，如圖 9(d)所示，在位於比第3劃線33外側之貫通孔形成預定區 域之外緣以刀輪2劃線，形成由第4裂痕44構成之第4劃 線34。如前述，此第4裂痕44與第3裂痕43會合，形成 11 201024239 將被以第4劃線34包圍之區域從下玻璃基板ib去除之對 基板表面垂直之部分L(於圖2(c)圖示）短之脫離斜面。 之後如圖9(e)所示’對被以第1劃線3 1包圍之區域施 加向下方之力後，藉由由第1裂痕41及第2裂痕42形成 之脫離斜面’上玻璃基板la之貫通孔形成預定區域從上玻 璃基板la脫落’藉由由第3裂痕43及第4裂痕44形成之 脫離斜面’下玻璃基板lb之貫通孔形成預定區域從下玻璃 基板lb脫落。藉此’於被積層2片之玻璃基板la、lb形成 貫通孔11。 以上，在已說明之實施形態雖係貫通孔〗丨之平面形狀 為圓形狀，但以本發明之方法形成之貫通孔之平面形狀並 不受限於此，為各種形狀皆無妨。 乂下雖以實施例更詳細說明本發明，但本發明並不 受此等例任何限定。The greater the difference, the greater the slope of the crack. When using a cutter wheel as a cutter, the outer diameter is preferably 1 mm to 1 〇 mm. If the outer diameter of the cutter wheel is smaller than 1 mm, the operability and durability may be low. If the outer diameter is larger than 10 mm, the slanting crack may not be formed deep when scribing. A more ideal cutter wheel has an outer diameter of 1 mm to 5 mm. Further, the load applied to the cutter wheel and the scribing speed are appropriately determined by the type and thickness of the brittle material substrate, but the load applied to the cutter wheel is usually in the range of 0 05 to 0.4 Mpa, and the scribing speed is 10 to 50. 〇mm/sec range. 10 201024239 Although the cutter wheel of the above example has a shape in which the common bottom surfaces of the two truncated cones of the common rotating shaft are joined, even if the bottom surface of the two conical joints having the common rotating shaft is used as shown in FIG. The shape of the cutter wheel & also of course. In the method of the present invention, a different cutter wheel may be used for the third scribe line and the second scribe line. In other words, when the second scribe line 32 is formed, the second crack 42 in the thickness direction of the substrate is used. The crack 41 is more inclined to the cutter wheel. Another embodiment of the method of the present invention is shown in FIG. As shown in the figure, the method of forming the through-holes is a method of forming through-holes in two sheets of brittle material substrates (for example, glass substrates) la and lb which are directly joined to each other. First, as shown in Fig. 9 (4), the cutter wheel 2 having a disk shape and having a blade leading edge formed on the outer peripheral portion is formed so that the through hole of the glass substrate 1a is formed into a predetermined region outer edge scribe line, and the ith crack 41 is formed. Line 31. Next, as shown in FIG. 9(b), the scribing wheel 2 is scribed in a concentric manner with the i-th scribe line 31 inside the first scribe line 31, and a second scribe line composed of the second crack 42 is formed. 32. As mentioned above, this second crack 42 and the first! The cracks 41 meet and form a detachment slope which is short by the portion L (shown in Fig. 2(c)) which is perpendicular to the surface of the substrate, which is removed from the upper glass substrate u by the region surrounded by the first scribe line 31. Next, as shown in FIG. 9(c), the through hole of the lower glass substrate lb is formed on the inner side of the outer edge of the predetermined region, and is thinned by the cutter wheel 2 outside the second scribe line 31 to form the third crack 43. The third line 33. Then, as shown in Fig. 9(d), the outer peripheral edge of the through hole which is located outside the third scribe line 33 is formed by the scribing wheel 2, and the fourth scribe line 34 composed of the fourth crack 44 is formed. As described above, the fourth crack 44 and the third crack 43 meet to form a portion L which is perpendicular to the surface of the substrate which is removed from the lower glass substrate ib by the region surrounded by the fourth scribe line 34 (Fig. 2(c) Illustration) Short off the slope. Then, as shown in FIG. 9(e), after applying a downward force to the region surrounded by the first scribe line 3 1 , the glass substrate la on the detachment slope formed by the first crack 41 and the second crack 42 The through-hole forming predetermined region is detached from the upper glass substrate 1a. The through-hole forming predetermined region of the lower glass substrate lb formed by the third crack 43 and the fourth crack 44 is detached from the lower glass substrate 1b. Thereby, the through holes 11 are formed in the glass substrates 1a and 1b which are laminated. As described above, in the embodiment described, the planar shape of the through hole is circular, but the planar shape of the through hole formed by the method of the present invention is not limited thereto, and may be various shapes. The present invention is described in more detail by way of examples, but the invention is not limited by the examples.
實施例1 於劃線裝置（「MP5〇〇A」 1.1mm之鈉玻璃基板，進行第 其次，使用相同刀輪從第i劃 進行第2劃線形成第2劃線。 劃線條件係如下述。 三星鑽石工業社製）安裝厚度 1劃線形成圓形之第1劃線。 線往内側0.2mm同心圓狀地 另外，使用之刀輪之規格及 之後， 玻璃基板， 大照片。 畫J線與第2劃線交叉之位置垂直切斷鈉 〃、】面於圖10顯示納玻璃基板之剖面擴 12 201024239 (帶傾斜槽之刀輪） 直徑：2.0mm 厚度：0.65mm 刀前緣角度：130° 槽之數量：135 槽之深度：（(1020// m’（d2；) 1〇# m β (劃線條件） 劃線荷重：0.22MPa 切入量：0.20mm 吸著壓：約-35kPa 實施例2及實施例3 使第1劃線與第2劃線之距離為〇 3mm及 -^Ώΐΐϊΐ .. 鲁與實施例1同樣，於鈉破璃基板形成第丨劃線與第2 | 後垂直切斷鈉玻璃基板，觀察其剖面。於圖Μ顯 劃線 基板之剖面擴大照片。 ’坡續 如由圖1 0明白’在實施例1〜3之鈉玻璃基板係藉 1劃線形成有對基板厚度方向往半徑方向外方傾斜且$ = 到達基板之背面侧之第1裂痕。此外於第丨劃線之内側被 形成為同心圓狀之第2裂痕42係在基板之表層與第i裂痕 41大致平行，變深後迅速往外方傾斜而與第丨裂痕41會 合。第2裂痕與第丄裂痕會合之位置係帛1#J線與第2劃 13 201024239 線之間隔越大便於基板厚度方向㈣。_ m -4-^i. ； 裂痕與第 1 MM h 越深，於圖2⑷顯示之對基 板表面垂直之部分L便越短，钕釔且庇1 文题短故谷易使被以第1劃線自 之區域從鈉玻璃基板脫落。 、 本發明之方法不使所謂微 -e- .a 7. m 口一凡只喊狀之缺口等於 貫通孔之周緣發生，可使 嘗七丨b ㈣切刀於脆性材料基板順利形成 貫通孔’甚為有用。 【圖式簡單說明】 ® 1係顯示本發明之| $方丨$游Λ、+、1 w η心員逋孔之形成方法之一例之流程 圖0 圖2係對應於圖1之各步驟之縱剖面圖。 圖3係顯示在本發明使用之刀輪之一例之立體圖。 圖4係從圖3之箭頭Α及箭頭6觀察之刀輪之擴大圖。 圖5係圖3之刀輪之部分擴大剖面圖。 圖6係顯示在本發明使用之刀輪之另一例之部分擴大 圖。 圖7係顯示在本發明使用之刀輪之另一例之部分擴大 剖面圖。 圖8係係顯示在本發明使用之刀輪之再另一例之立體 圖。 圖9係顯示本發明之貫通孔之形成方法之另一例之流 程圖。 圖1 〇係實施例1〜3之鈉玻璃基板之剖面擴大照片。 14 201024239 圖1 1係顯示以往之貫通孔之形成方法之流程圖。 圖1 2係顯示以往之貫通孔之形成方法中之問題之立體 圖。 圖1 3係顯示以往之另一貫通孔之形成方法之流程圖。 圖1 4係顯示以以往之方法實際被形成之裂痕之形狀之 示意圖。Example 1 In the scribing apparatus ("MP5〇〇A" 1.1 mm soda glass substrate, the second scribing was performed by the second scribing from the i-th row using the same cutter wheel. The scribing conditions are as follows. Manufactured by Samsung Diamond Industrial Co., Ltd.) The thickness of the first line is formed by the thickness of one line. The line is 0.2 mm concentrically on the inside. In addition, the specification of the cutter wheel used and the glass substrate, large photo. The position where the J line intersects the 2nd line is cut perpendicularly to the sodium 〃, and the surface shown in Fig. 10 shows the section of the nano glass substrate. 12 201024239 (Cutter wheel with inclined groove) Diameter: 2.0mm Thickness: 0.65mm Front edge of the knife Angle: 130° Number of grooves: 135 Depth of groove: ((1020// m'(d2;) 1〇# m β (line condition) Streak load: 0.22MPa Cut-in amount: 0.20mm Suction pressure: approx. -35 kPa Example 2 and Example 3 The distance between the first scribe line and the second scribe line was 〇3 mm and -^Ώΐΐϊΐ.. Similarly, in the same manner as in the first embodiment, the second scribe line and the second scribe line were formed. The Sodium Silicate Substrate is cut vertically and the cross section is observed. The cross-sectional enlarged view of the stencil substrate is shown in Fig. 1. The slope is as understood from Fig. 10, and the sodium glass substrate of Examples 1 to 3 is lined by 1 A first crack is formed which is inclined outward in the radial direction of the substrate thickness direction and reaches the back side of the substrate. The second crack 42 which is formed concentrically inside the second scribe line is formed on the surface layer of the substrate. The i-th slit 41 is substantially parallel, and after being deepened, it is quickly inclined to the outside and merges with the third crack. The second crack and the first crack The position of the meeting is 帛1#J line and the second line 13 201024239 The greater the interval between the lines is the thickness direction of the substrate (4). _ m -4-^i. ; The deeper the crack and the first MM h, the pair shown in Figure 2 (4) The shorter the portion L of the surface of the substrate, the shorter the surface of the substrate is, so that the valley is easily detached from the soda glass substrate by the first scribe line. The method of the present invention does not make the so-called micro-e-. a 7. m mouth only the shunt-like gap is equal to the circumference of the through hole, which makes it useful to taste the seven-b (four) cutter smoothly forming the through-hole on the brittle material substrate. [Simple diagram] ® 1 series A flow chart showing an example of a method for forming a pupil of a 逋 Λ Λ + + + + + 图 图 图 图 图 图 图 图 图 图 图 0 0 0 0 0 0 0 流程图 流程图 流程图 流程图 流程图 流程图 流程图 流程图 流程图 流程图 流程图 流程图Fig. 4 is an enlarged view of a cutter wheel as viewed from arrow Α and arrow 6 of Fig. 3. Fig. 5 is a partially enlarged cross-sectional view of the cutter wheel of Fig. 3. Fig. 6 is shown in Fig. A partially enlarged view of another example of a cutter wheel used in the present invention. Fig. 7 is a partial enlarged view showing another example of the cutter wheel used in the present invention. Fig. 8 is a perspective view showing still another example of the cutter wheel used in the present invention. Fig. 9 is a flow chart showing another example of the method of forming the through hole of the present invention. Fig. 1 Embodiments 1 to 3 Fig. 1 is a flow chart showing a method of forming a conventional through hole. Fig. 1 is a perspective view showing a problem in a conventional method for forming a through hole. A flow chart of a method for forming another through hole in the past. Fig. 14 is a schematic view showing the shape of a crack actually formed by a conventional method.
【主要元件符號說明】 1 玻璃基板（脆性材料基板） 1 a 上玻璃基板 lb 下玻璃基板 2 刀輪 2a 、 2b 、 2c 刀輪 11 貫通孔 21 刃前緣棱線 22 旋轉轴 23 槽 31 第1劃線 32 第2劃線 33 第3劃線 34 第4劃線 41 第1裂痕 42 第2裂痕 43 第3裂痕 15 201024239 44 第4裂痕[Description of main component symbols] 1 Glass substrate (brittle material substrate) 1 a Upper glass substrate lb Lower glass substrate 2 Cutter wheel 2a, 2b, 2c Cutter wheel 11 through hole 21 Blade leading edge ridge 22 Rotary shaft 23 Groove 31 1 Cross-line 32 second scribe line 33 third scribe line 34 fourth scribe line 41 first crack 42 second crack 43 third crack 15 201024239 44 fourth crack
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