TW201202649A - Heat transporting unit and electronic device - Google Patents

Heat transporting unit and electronic device Download PDF

Info

Publication number
TW201202649A
TW201202649A TW100101637A TW100101637A TW201202649A TW 201202649 A TW201202649 A TW 201202649A TW 100101637 A TW100101637 A TW 100101637A TW 100101637 A TW100101637 A TW 100101637A TW 201202649 A TW201202649 A TW 201202649A
Authority
TW
Taiwan
Prior art keywords
coolant
space
heat
heat transfer
transfer unit
Prior art date
Application number
TW100101637A
Other languages
English (en)
Chinese (zh)
Inventor
Kei Mizuta
Susumu Ueda
Original Assignee
Univ Kagoshima
Molex Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Kagoshima, Molex Japan Co Ltd filed Critical Univ Kagoshima
Publication of TW201202649A publication Critical patent/TW201202649A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW100101637A 2010-01-18 2011-01-17 Heat transporting unit and electronic device TW201202649A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010008599A JP5413735B2 (ja) 2010-01-18 2010-01-18 熱輸送ユニット、電子機器

Publications (1)

Publication Number Publication Date
TW201202649A true TW201202649A (en) 2012-01-16

Family

ID=44460055

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100101637A TW201202649A (en) 2010-01-18 2011-01-17 Heat transporting unit and electronic device

Country Status (4)

Country Link
JP (1) JP5413735B2 (ja)
CN (1) CN202889855U (ja)
TW (1) TW201202649A (ja)
WO (1) WO2012154148A2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573975B (zh) * 2014-02-18 2017-03-11 Liquid - air split - type heat exchange chamber
US11417584B2 (en) 2017-09-25 2022-08-16 Sony Semiconductor Solutions Corporation Semiconductor device

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5180385B1 (ja) * 2012-03-08 2013-04-10 株式会社Ｗｅｌｃｏｎ ベーパチャンバ
JP6176433B2 (ja) * 2013-01-10 2017-08-09 株式会社Ｗｅｌｃｏｎ ベーパチャンバ
CN105210185A (zh) * 2013-05-17 2015-12-30 富士通株式会社 半导体装置及其制造方法、以及电子设备
JP2015010765A (ja) * 2013-06-28 2015-01-19 トヨタ自動車株式会社 ベーパーチャンバーおよびベーパーチャンバーの製造方法
CN103796494B (zh) * 2014-01-28 2016-02-03 华进半导体封装先导技术研发中心有限公司 密闭性温度控制装置
CN104457359B (zh) * 2015-01-02 2016-06-29 季弘 具有分离通道的板式热管
CN107429976B (zh) * 2015-03-16 2021-02-09 达纳加拿大公司 带有具有用于提高平坦度的表面图案的板的换热器和制造该换热器的方法
JP6799503B2 (ja) * 2016-12-14 2020-12-16 新光電気工業株式会社 ヒートパイプ及びその製造方法
KR102561617B1 (ko) 2017-02-24 2023-08-01 다이니폰 인사츠 가부시키가이샤 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
JP6801700B2 (ja) * 2017-11-10 2020-12-16 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
JP7535237B2 (ja) 2020-05-27 2024-08-16 大日本印刷株式会社 ベーパーチャンバおよび電子機器
TWI726765B (zh) * 2020-07-08 2021-05-01 雙鴻科技股份有限公司 均溫板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61194193A (ja) * 1985-02-20 1986-08-28 Matsushita Refrig Co 伝熱管内壁のメツキ方法
JPH11101585A (ja) * 1997-09-29 1999-04-13 Furukawa Electric Co Ltd:The 板型ヒートパイプとその実装構造
JPH11287578A (ja) * 1998-03-31 1999-10-19 Fujikura Ltd 平板状ヒートパイプの製造方法
JP2000018854A (ja) * 1998-06-30 2000-01-18 Showa Alum Corp ヒートパイプ
JP2000031363A (ja) * 1998-07-09 2000-01-28 Honda Motor Co Ltd ヒートシンクおよび該ヒートシンクが配設された基板
JP2002039693A (ja) * 2000-07-21 2002-02-06 Toufuji Denki Kk フラット型ヒートパイプ
JP2004060911A (ja) * 2002-07-25 2004-02-26 Namiki Precision Jewel Co Ltd ヒートパイプ
JP2007003164A (ja) * 2005-06-27 2007-01-11 Nakamura Mfg Co Ltd 平板状ヒートパイプまたはベーパーチャンバー、および、その形成方法
JP4892515B2 (ja) * 2008-04-23 2012-03-07 日本モレックス株式会社 ヒートパイプ、ヒートパイプの製造方法および電子基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573975B (zh) * 2014-02-18 2017-03-11 Liquid - air split - type heat exchange chamber
US11417584B2 (en) 2017-09-25 2022-08-16 Sony Semiconductor Solutions Corporation Semiconductor device

Also Published As

Publication number Publication date
CN202889855U (zh) 2013-04-17
WO2012154148A3 (en) 2013-02-28
WO2012154148A2 (en) 2012-11-15
JP5413735B2 (ja) 2014-02-12
JP2011145044A (ja) 2011-07-28

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