WO2012154148A3 - Heat transporting unit and electronic device - Google Patents

Heat transporting unit and electronic device Download PDF

Info

Publication number
WO2012154148A3
WO2012154148A3 PCT/US2011/021526 US2011021526W WO2012154148A3 WO 2012154148 A3 WO2012154148 A3 WO 2012154148A3 US 2011021526 W US2011021526 W US 2011021526W WO 2012154148 A3 WO2012154148 A3 WO 2012154148A3
Authority
WO
WIPO (PCT)
Prior art keywords
coolant
space
diffusing
return flow
plate
Prior art date
Application number
PCT/US2011/021526
Other languages
French (fr)
Other versions
WO2012154148A2 (en
Inventor
Susumu Ueda
Kei Mizuta
Original Assignee
Molex Japan Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Japan Co., Ltd. filed Critical Molex Japan Co., Ltd.
Priority to CN201190000281.0U priority Critical patent/CN202889855U/en
Publication of WO2012154148A2 publication Critical patent/WO2012154148A2/en
Publication of WO2012154148A3 publication Critical patent/WO2012154148A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat transporting unit comprises an upper plate, a lower plate that faces the upper plate, an interior space fillable with a coolant, formed by the upper plate and the lower plate, a vapor diffusing space for diffusing vaporized coolant, included within the interior space, a coolant return flow space for causing the condensed coolant to flow back, and an interference-preventing plate for preventing interference between the vaporized coolant diffusing in the vapor diffusing space and the condensed coolant flowing back in the coolant return flow space, wherein the interference-preventing plate has a plurality of pores for moving, to the coolant return flow space, coolant condensed in the vapor diffusing space, where the area of opening of the pores on the vapor diffusing space side is smaller than the area of opening on the coolant return flow space side.
PCT/US2011/021526 2010-01-18 2011-01-18 Heat transporting unit and electronic device WO2012154148A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201190000281.0U CN202889855U (en) 2010-01-18 2011-01-18 Heat transporting unit and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-008599 2010-01-18
JP2010008599A JP5413735B2 (en) 2010-01-18 2010-01-18 Heat transport unit, electronic equipment

Publications (2)

Publication Number Publication Date
WO2012154148A2 WO2012154148A2 (en) 2012-11-15
WO2012154148A3 true WO2012154148A3 (en) 2013-02-28

Family

ID=44460055

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/021526 WO2012154148A2 (en) 2010-01-18 2011-01-18 Heat transporting unit and electronic device

Country Status (4)

Country Link
JP (1) JP5413735B2 (en)
CN (1) CN202889855U (en)
TW (1) TW201202649A (en)
WO (1) WO2012154148A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5180385B1 (en) * 2012-03-08 2013-04-10 株式会社Ｗｅｌｃｏｎ Vapor chamber
JP6176433B2 (en) * 2013-01-10 2017-08-09 株式会社Ｗｅｌｃｏｎ Vapor chamber
JPWO2014185088A1 (en) 2013-05-17 2017-02-23 富士通株式会社 Semiconductor device, method for manufacturing the same, and electronic device
JP2015010765A (en) * 2013-06-28 2015-01-19 トヨタ自動車株式会社 Vapor chamber and manufacturing method of vapor chamber
CN103796494B (en) * 2014-01-28 2016-02-03 华进半导体封装先导技术研发中心有限公司 Seal temperature control equipment
TWI573975B (en) * 2014-02-18 2017-03-11 Liquid - air split - type heat exchange chamber
CN104457359B (en) * 2015-01-02 2016-06-29 季弘 There is the plate-type heat-pipe of split tunnel
DE112016001221T5 (en) 2015-03-16 2017-12-21 Dana Canada Corporation Surface pattern heat exchange plates for improving flatness and methods of making same
JP6799503B2 (en) * 2016-12-14 2020-12-16 新光電気工業株式会社 Heat pipe and its manufacturing method
CN110325810B (en) 2017-02-24 2021-05-14 大日本印刷株式会社 Vapor chamber, electronic device, metal sheet for vapor chamber, and method for manufacturing vapor chamber
CN111095542A (en) * 2017-09-25 2020-05-01 索尼半导体解决方案公司 Semiconductor device with a plurality of semiconductor chips
JP6801700B2 (en) * 2017-11-10 2020-12-16 大日本印刷株式会社 Manufacturing method of vapor chamber, electronic equipment and vapor chamber
TWI726765B (en) * 2020-07-08 2021-05-01 雙鴻科技股份有限公司 Vapor chamber

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11287578A (en) * 1998-03-31 1999-10-19 Fujikura Ltd Manufacture of flat plate type heat pipe
JP2000018854A (en) * 1998-06-30 2000-01-18 Showa Alum Corp Heat pipe
JP2007003164A (en) * 2005-06-27 2007-01-11 Nakamura Mfg Co Ltd Tabular heat pipe or vapor chamber, and its forming method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61194193A (en) * 1985-02-20 1986-08-28 Matsushita Refrig Co Plating method for inside wall of heat transmission pipe
JPH11101585A (en) * 1997-09-29 1999-04-13 Furukawa Electric Co Ltd:The Plate-type heat pump and its packaging structure
JP2000031363A (en) * 1998-07-09 2000-01-28 Honda Motor Co Ltd Heat sink and board therewith
JP2002039693A (en) * 2000-07-21 2002-02-06 Toufuji Denki Kk Flat type heat pipe
JP2004060911A (en) * 2002-07-25 2004-02-26 Namiki Precision Jewel Co Ltd Heat pipe
JP4892515B2 (en) * 2008-04-23 2012-03-07 日本モレックス株式会社 HEAT PIPE, HEAT PIPE MANUFACTURING METHOD, AND ELECTRONIC BOARD

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11287578A (en) * 1998-03-31 1999-10-19 Fujikura Ltd Manufacture of flat plate type heat pipe
JP2000018854A (en) * 1998-06-30 2000-01-18 Showa Alum Corp Heat pipe
JP2007003164A (en) * 2005-06-27 2007-01-11 Nakamura Mfg Co Ltd Tabular heat pipe or vapor chamber, and its forming method

Also Published As

Publication number Publication date
JP2011145044A (en) 2011-07-28
TW201202649A (en) 2012-01-16
JP5413735B2 (en) 2014-02-12
CN202889855U (en) 2013-04-17
WO2012154148A2 (en) 2012-11-15

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