CN103796494B - Seal temperature control equipment - Google Patents
Seal temperature control equipment Download PDFInfo
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- CN103796494B CN103796494B CN201410040927.8A CN201410040927A CN103796494B CN 103796494 B CN103796494 B CN 103796494B CN 201410040927 A CN201410040927 A CN 201410040927A CN 103796494 B CN103796494 B CN 103796494B
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- end cover
- control equipment
- temperature control
- fluid
- spoke
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Abstract
The invention discloses a kind of seal temperature control equipment of integrated antenna package field, in seal region, how effectively to control fluid when the very low fluid for radiating heat of boiling point pressure, temperature, flow velocity is adopted to solve, prevent the generation of bubble, to improve the problem of the efficiency of heat radiation.This seal temperature control equipment comprises sidewall, and upper end cover and bottom end cover and one group of O type circle form a sealing area, a set of quick despatch parts, and itself and end cap and sidewall are mechanically connected, and are realized the opening and closing in the region of above-mentioned sealing by transmission device.Inside is provided with one group of transducer, and space closes by end cap on the one hand, on the other hand integrated active device or passive device above it.The sensor can the effectively speed of test fluid, temperature, pressure and bubble, to solve in fluid for radiating heat process because of localized hyperthermia's problem that the generation of bubble brings, is well suited for the occasion that high-density packages field is very high to cooling requirements.Quick despatch parts can realize again the quick closedown of said apparatus.
Description
Technical field
The present invention relates to the technology controlled for electronic device temperature, be specifically related to the seal temperature control equipment being applicable to dissipation from electronic devices field by working fluid.
Background technology
Electronic device in the course of the work, drives a part for the electric energy of these electronic units convert heat energy to and be released.Because the performance of electronic unit has temperature dependency usually, if so the heat discharged can not be discharged in time, bring impact will to the electronic component even performance of electronic device.
Along with the high frequency of electronic device, high speed and integrated circuit constantly develop towards small-sized high density, the power density of electronic devices and components increases substantially, and physical size constantly reduces, density of heat flow rate increases thereupon, the reliability of electronic devices and components work is very responsive to temperature, so the environment of high temperature certainly will affect the performance of electronic devices and components.In order to ensure that electronic devices and components normally work, the good heat radiation of electronic devices and components must be given and its temperature is controlled within the specific limits.
Existing electronic devices and components temperature-controlled process mainly utilizes and comprises heat transfer, convection current radiation, phase place change and Peltier-Seebeck-Thomson effect or be called the principles such as hot spot-effect.
The method that current great majority control electronic component temperature is all realized by gaseous exchange, is namely dispelled the heat by the mode of Forced Air Convection.Or utilize the difference of the heat conductivility of different materials heat is transferred to a larger region from a little thermal source thus realizes heat radiation.Forced Air Convection is the most frequently used heat dissipating method, but because atmospheric density is very low, therefore its coefficient of heat conduction is very low, thus causes radiating efficiency very low.And fluid is because density is higher, can realize higher flow velocity, therefore the efficiency of Heat transmission is also higher.When considering forced convertion Heat transmission mode, the parameter of some fluids will seem particularly important than other parameter under specific system application scenario.The optimal operating temperature range of electronic devices and components be such as operated under electronics calculating occasion is 5-80 degree Celsius, viscosity, heat conductivity, surface tension, resistance are comprised for important parameter fluid, if phase-change liquid, just its boiling point and operating air pressure must be considered.If the space that airtight, optimal operating air pressure scope is usually 1-5 atmospheric pressure (1-5bars).
In " Heat transmission " periodical of 132 phases in 2010, the people such as W.Escher one section be called " apply the experimental study that ultra-thin valve micro-channel heat sink carries out chip fluid heat radiation " and article in, just adopt water to dispel the heat to electronic device, the typical case belonging to above-mentioned theory uses.In this experiment, water does not directly contact with circuit with electronic device, and centre has added one deck medium, forms thermal boundary (thermalbarrier).Other fluids outside water have also carried out similar trial, and she the Pehanorm Mu Dawa as Purdue Univ-West Lafayette USA was once disclosed oily for the immersion of the high energy chip research carrying out dispelling the heat in 1992.Rub the experiment that Cray has also carried out using phase-change liquid to dispel the heat on supercomputer in west, and applied for United States Patent (USP) (patent No. 4590538).
When using liquid to dispel the heat, along with the rising of temperature, just have bubble formation.If particularly the boiling point of this liquid is very low, air bubble problem will be more obvious.If bubble adhesion is on the surface of device, the heat in this region will be taken away in time brings obstruction by convection cell, cause localized hyperthermia.In high-density packages field, spacing between device is very little, the heat produced in unit volume is very high, for improving radiating efficiency, the fluid for radiating heat that usual employing boiling point is very low, in this case, with regard to need to the pressure of this fluid, temperature, flow velocity and bubble prevent carry out precise hard_drawn tuhes, and also do not find the effective solution for the problems referred to above at present.
Summary of the invention
The technical problem to be solved in the present invention is the pressure, temperature, the flow velocity that how effectively to control fluid when adopting the very low fluid of boiling point to dispel the heat in seal region, prevents the generation of bubble, to improve the efficiency of heat radiation.
For solving the problem, the invention provides a kind of seal temperature control equipment, comprise sidewall, upper end cover and bottom end cover, form the region of a sealing by arranging O type circle between itself and sidewall, a set of quick despatch parts, itself and end cap and sidewall are mechanically connected, extruded by transmission device and unclamp above-mentioned O type circle and realize closing of the region of above-mentioned sealing and open, also be provided with import and the outlet of fluid, one group of transducer is provided with at the intra-zone of above-mentioned sealing, space closes by above-mentioned end cap on the one hand, survey end face on the other hand in it to use as PCB, integrated active device or passive device above.
Further, the import of above-mentioned fluid comprises a fluid inlet valve, is arranged on end cap.
Further, the inlet valve of above-mentioned fluid comprises at least one by-pass valve.
Further, the outlet of above-mentioned fluid is arranged on sidewall.
Further, an extension towards bottom end cover is stamped in upper end, is positioned at the inside of sidewall, is connected, extension can form flow-guiding structure, the fluid of the intra-zone of sealing is guided to outlet by O type circle with bottom end cover.
Further, the sensor comprises transducer with presence or absence of temperature sensor, pressure sensor, flow sensor, detection bubble and detects the sound transducer of bubble regime change.
Further, above-mentioned end cap end face supports by the substrate that the insulated column of standing shape is upper and lower to it, realizes stacked package.
Further, above-mentioned quick despatch parts comprise the bottom of spoke, connecting rod, resilient pull bar, bracket and bracket, hole offered by spoke and connecting rod, pull bar passes through this hole by spoke and connecting rod bridging, moved along connecting rod direction by the bottom rotarily driving bracket and bracket of spoke centrally axle certain limit, there is a projection bottom, and when bracket moves towards spoke direction, the inclined-plane that this projection is divided along the outer folding portion of sidewall slides.
Further, pull bar there is a bend, spoke can centrally be rotated slightly larger than 90 degree by axle.
Further, above-mentioned quick despatch parts also comprise a Pop-up alignment pin, and spoke centrally axle rotation can prevent spoke opposite spin slightly larger than this alignment pin when 90 degree.
Seal temperature control equipment disclosed by the invention, inner containing multiple transducer, can the effectively speed of test fluid, temperature, pressure and bubble, localized hyperthermia's problem that a large amount of generations because of bubble in fluid for radiating heat process in effective solution High Density Packaging Technology bring, is well suited for the occasion that high-density packages field is very high to cooling requirements.Quick despatch parts can realize again the quick closedown of said apparatus.
Accompanying drawing explanation
Fig. 1 is the end view of seal temperature control equipment.
Fig. 2 be one on end cap, be typically integrated with electronic device after design sketch.
Fig. 3 is for being placed on the end view after seal temperature control equipment by the electronic device of the integrated state shown in Fig. 2.
Fig. 4 is the vertical views of quick despatch parts when open mode.
Fig. 5 is the vertical views of quick despatch parts when closure state.
Fig. 6 is that the upper and lower side of seal temperature control equipment covers the design sketch after being all integrated with electronic device.
Embodiment
Below in conjunction with concrete drawings and Examples, the invention will be further described.
As the end view that Fig. 1 is seal temperature control equipment.Therefrom can find out this seal temperature control equipment, comprise sidewall 120, upper end cover 110 and bottom end cover 130, upper end cover 110 has one towards the extension 187 of bottom end cover, be positioned at the inside of sidewall, extension can form flow-guiding structure, the fluid of the intra-zone of sealing is guided to outlet.A region sealed is formed by arranging O type circle 188,115 and 177 between upper and lower end cap and sidewall.Also be provided with import and the outlet of fluid, the import of fluid comprises a fluid inlet valve 165, is arranged on upper end cover 110, and inlet valve 165 comprises at least one by-pass valve 155.One group of transducer is provided with at the intra-zone of sealing, represent with a circle and letter wherein, transducer comprises temperature sensor (letter is T), pressure sensor (letter is P), flow sensor (letter is M), detects transducer with presence or absence of bubble (letter is B) and detect the sound transducer (letter is A) of bubble regime change.The outlet 105 of fluid is arranged on sidewall 120.Space closes by above-mentioned end cap on the one hand, and its inner side end uses as PCB on the other hand, above integrated active device or passive device, Fig. 1 is not shown.
Fig. 2 be one typically on bottom end cover 130, be integrated with electronic device after design sketch.Chip 260 can be a logical block or switch block, and it is connected with substrate 235 by tin ball 217.270 can be the assembly after an assembly or a stacked package, and 250 is heat dissipation channels, directly contacts with chip 260, helps the heat of chip 260 to pass to fluid.Substrate 235 is also provided with pressure sensor (letter is P) and sound transducer (letter is A).Bottom end cover 130 1 aspect plays effect closed for space, uses again on the other hand as the carrier of chip, above integrated active device or passive device.The upper and lower end face of bottom end cover 130 is also provided with the insulated column (280) of standing shape, supports, realize stacked package with the substrate upper and lower to it.
Fig. 3 is for being placed on the end view after seal temperature control equipment by the electronic device of the integrated state shown in Fig. 2.Broad arrow in figure represents the flowing of fluid.
The state diagram of quick despatch parts when open mode as shown in Figure 4, the bottom 126 end view of the bottom (can see Fig. 1) oppositely comprising spoke 140, resilient pull bar 175, connecting rod 145, bracket 125 and bracket respectively from the inside to surface.Hole 116 offered by spoke 140 and connecting rod 145, and pull bar 175 is by this hole 116 by spoke 140 and connecting rod 145 bridging, and pull bar 175 freely can rotate in hole 116.Moved along connecting rod 145 direction by the bottom 126 rotarily driving bracket 125 and bracket of spoke 140 centrally axle 167 certain limit, pull bar 175 has a bend 176, spoke 140 can centrally be rotated slightly larger than 90 degree by axle 167.There is a projection bottom 126, and when bracket 125 moves towards spoke 140 direction, the inclined-plane that this projection is divided along the outer folding portion of sidewall slides (schematic diagram can see Fig. 1).
Fig. 5 is the vertical views of quick despatch parts when closure state.Therefrom can find out that above-mentioned quick despatch parts also comprise a Pop-up alignment pin 410, when spoke 140 centrally axle 167 rotate and can prevent spoke opposite spin slightly larger than this alignment pin 410 when 90 degree.
Fig. 6 covers the design sketch after being integrated with electronic device at the upper and lower side of above-mentioned seal temperature control equipment.In figure 650 and 620 is O type circle, by deformability after the extruding of bracket 610, plays sealing function.Also add projection 640 and 630 respectively in the end of end cap 130 and bracket 610, prevent mutual slip.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. a seal temperature control equipment, comprise sidewall (120), upper end cover (110) and bottom end cover (130), upper end cover and bottom end cover form the region of a sealing by the O type circle be arranged between the two, upper end cover is provided with the import of fluid, sidewall is provided with the outlet (105) of fluid, one group of transducer is provided with at the intra-zone of above-mentioned sealing, comprise temperature sensor, pressure sensor, flow sensor, detect transducer with presence or absence of bubble and detect the sound transducer of bubble regime change, space closes by upper end cover and bottom end cover on the one hand, upper end cover and bottom end cover inner side end use as PCB on the other hand, integrated active device or passive device above, it is characterized in that seal temperature control equipment also comprises a set of quick despatch parts, itself and end cap and sidewall (120) are mechanically connected, extruded by transmission device and unclamp above-mentioned O type circle and realize closing of the region of above-mentioned sealing and open.
2. temperature control equipment as claimed in claim 1, is characterized in that the import of described fluid comprises a fluid inlet valve (165), is arranged on upper end cover.
3. temperature control equipment as claimed in claim 2, is characterized in that the inlet valve (165) of described fluid comprises at least one by-pass valve (155).
4. temperature control equipment as claimed in claim 1, is characterized in that the outlet of described fluid is arranged on sidewall.
5. temperature control equipment as claimed in claim 1, it is characterized in that an extension towards bottom end cover (187) is stamped in described upper end, described extending part is in the inner side in side walls enclose region, be connected with bottom end cover by O type circle (177), described extension can form flow-guiding structure, the fluid of the intra-zone of sealing is guided to outlet.
6. temperature control equipment as claimed in claim 1, is characterized in that described bottom end cover end face supports by the substrate that the insulated column (280) that arranges standing shape is upper and lower to bottom end cover.
7. temperature control equipment as claimed in claim 1, it is characterized in that described quick despatch parts comprise spoke (140), connecting rod (145), resilient pull bar (175), the bottom (126) of bracket (125) and bracket, hole (116) offered by spoke (140) and connecting rod (145), pull bar (175) by this hole (116) by spoke (140) and connecting rod (145) bridging, moved along connecting rod (145) direction by the bottom (126) rotarily driving bracket (125) and bracket of spoke (140) centrally axle (167) certain limit, there is a projection bottom (126), when bracket (125) moves towards spoke (140) direction, the inclined-plane that this projection is divided along the outer folding portion of sidewall slides.
8. temperature control equipment as claimed in claim 7, is characterized in that described pull bar (175) has a bend (176), and spoke (140) can centrally be rotated slightly larger than 90 degree by axle (167).
9. temperature control equipment as claimed in claim 7, it is characterized in that described quick despatch parts also comprise a Pop-up alignment pin (410), spoke (140) centrally axle (167) rotation can prevent spoke opposite spin slightly larger than this alignment pin (410) when 90 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410040927.8A CN103796494B (en) | 2014-01-28 | 2014-01-28 | Seal temperature control equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410040927.8A CN103796494B (en) | 2014-01-28 | 2014-01-28 | Seal temperature control equipment |
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| Publication Number | Publication Date |
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| CN103796494A CN103796494A (en) | 2014-05-14 |
| CN103796494B true CN103796494B (en) | 2016-02-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410040927.8A Active CN103796494B (en) | 2014-01-28 | 2014-01-28 | Seal temperature control equipment |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200850136A (en) * | 2007-06-15 | 2008-12-16 | Nat Univ Tsing Hua | Microchannel heat sink |
| CN201431866Y (en) * | 2009-04-14 | 2010-03-31 | 大连宏博水科技有限公司 | Pipeline mixing reaction device |
| JP2011145044A (en) * | 2010-01-18 | 2011-07-28 | Molex Japan Co Ltd | Heat transport unit, and electronic equipment |
| CN102342191A (en) * | 2009-06-25 | 2012-02-01 | 国际商业机器公司 | Electronic module with pump-enhanced, dielectric fluid immersion-cooling |
| CN102349152A (en) * | 2009-03-10 | 2012-02-08 | 丰田自动车株式会社 | Ebullient cooling device |
| CN102455765A (en) * | 2010-10-28 | 2012-05-16 | 英业达股份有限公司 | Liquid cooling fluid heat exchange chamber |
| CN202256138U (en) * | 2011-09-08 | 2012-05-30 | 江阴市长龄机械制造有限公司 | Bubble detector |
| CN102817695A (en) * | 2011-11-30 | 2012-12-12 | 凯迈(洛阳)机电有限公司 | Constant temperature, constant pressure and constant flow device of cooling liquid |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7265979B2 (en) * | 2004-06-24 | 2007-09-04 | Intel Corporation | Cooling integrated circuits using a cold plate with two phase thin film evaporation |
| TWM278218U (en) * | 2005-05-19 | 2005-10-11 | Cooler Master Co Ltd | Improved water-cooling radiator structure |
-
2014
- 2014-01-28 CN CN201410040927.8A patent/CN103796494B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200850136A (en) * | 2007-06-15 | 2008-12-16 | Nat Univ Tsing Hua | Microchannel heat sink |
| CN102349152A (en) * | 2009-03-10 | 2012-02-08 | 丰田自动车株式会社 | Ebullient cooling device |
| CN201431866Y (en) * | 2009-04-14 | 2010-03-31 | 大连宏博水科技有限公司 | Pipeline mixing reaction device |
| CN102342191A (en) * | 2009-06-25 | 2012-02-01 | 国际商业机器公司 | Electronic module with pump-enhanced, dielectric fluid immersion-cooling |
| JP2011145044A (en) * | 2010-01-18 | 2011-07-28 | Molex Japan Co Ltd | Heat transport unit, and electronic equipment |
| CN102455765A (en) * | 2010-10-28 | 2012-05-16 | 英业达股份有限公司 | Liquid cooling fluid heat exchange chamber |
| CN202256138U (en) * | 2011-09-08 | 2012-05-30 | 江阴市长龄机械制造有限公司 | Bubble detector |
| CN102817695A (en) * | 2011-11-30 | 2012-12-12 | 凯迈(洛阳)机电有限公司 | Constant temperature, constant pressure and constant flow device of cooling liquid |
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|---|---|
| CN103796494A (en) | 2014-05-14 |
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Effective date of registration: 20220224 Address after: 201114 room c402, 4th floor, building 1, No. 189, Xinjun Ring Road, Minhang District, Shanghai Patentee after: Anbo Zhihui semiconductor equipment (Shanghai) Co.,Ltd. Address before: 214135 building D1, China Sensor Network International Innovation Park, 200 Linghu Avenue, Wuxi, Jiangsu Patentee before: National Center for Advanced Packaging Co.,Ltd. |
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| CP03 | Change of name, title or address |
Address after: Room C402, 4th Floor, Building 1, No. 189, Xinjun Ring Road, Minhang District, Shanghai, 201112 Patentee after: Anpo Zhihui Semiconductor Equipment (Shanghai) Co.,Ltd. Address before: 201114 room c402, 4th floor, building 1, No. 189, Xinjun Ring Road, Minhang District, Shanghai Patentee before: Anbo Zhihui semiconductor equipment (Shanghai) Co.,Ltd. |
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| CP03 | Change of name, title or address |