JP2015010765A - Vapor chamber and manufacturing method of vapor chamber - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vapor chamber capable of being manufactured at low cost and having high heat conductivity, and a manufacturing method of the vapor chamber.SOLUTION: A vapor chamber in which working fluid is encapsulated inside a hermetic space includes: a housing formed of a resin material; a plurality of wicks provided in the inner wall of the housing and formed integrally with the housing; a metal layer formed in the inner wall of the housing and on the surfaces of the wicks by metal plating.

Description

  The present invention relates to a vapor chamber and a method for manufacturing the same.

  In recent years, with the miniaturization and high performance of electronic devices, research on highly efficient heat dissipation devices has been advanced. In particular, a vapor chamber, which is a flat plate heat dissipation device using the heat pipe principle, has attracted attention as having excellent thermal diffusivity.

The principle of operation of the conventional vapor chamber will be described with reference to FIG. 16, which is a sectional view of the vapor chamber.
Reference numeral 1601 denotes a heat source such as a CPU or MPU, reference numeral 1602 denotes a vapor chamber body, and reference numeral 1603 denotes a heat sink for dissipating heat. Inside the vapor chamber is a decompressed closed space (reference numeral 1604), which is filled with a liquid (working fluid) for transferring heat.

When the working fluid is heated by the heat source, the working fluid absorbs latent heat and evaporates. The vapor diffuses into the closed space and is cooled when it reaches the upper inner wall surface in contact with the heat sink, and releases latent heat to return to the liquid. A structure (reference numeral 1605) called a wick that generates a capillary force is disposed in the inner wall or the closed space of the vapor chamber, and the working fluid that has returned to the liquid moves by capillary action. The wick is shaped to guide the working fluid in the direction of the heat source, and the cycle in which the working fluid again absorbs heat and evaporates is repeated. Thereby, the heat generated from a small heat source can be diffused over a wide area.
Since the vapor chamber radiates heat by circulating a working fluid, the structural design of the wick greatly affects the performance of the vapor chamber.

Prior art related to the vapor chamber includes the following. For example, Patent Document 1 describes a vapor chamber in which a capillary channel is formed by stacking and arranging a plurality of intermediate plates in a closed space. Each intermediate plate is provided with a fine hole as a flow path so that the working fluid is guided to a heat source by capillary action.
Patent Document 2 describes a vapor chamber provided with protrusions (fins) on the upper and lower sides in a closed space. By grinding a housing made of metal, there is a feature that a wick integrated with the housing can be formed.
Patent Document 3 describes a vapor chamber that forms a wick by injecting molten copper powder into an aluminum casing. Since the vapor chamber forms a wick by thermal spray molding, the vapor chamber has a feature that a process of forming a fine structure does not have to be performed as compared with the above-described one.
The wicks of these vapor chambers are different in structure, but are common in that they are formed so as to guide the working fluid in the direction of the heat source.

JP 2010-28055 A JP 2007-3164 A JP 2011-102691 A

In the production of the vapor chamber, there is a problem that the cost for forming the wick is high. For example, when an intermediate plate is arranged inside a closed space as in Patent Document 1, after forming a fine flow path by etching or the like, the intermediate plates must be accurately laminated one by one by welding or the like. Moreover, when forming a wick by shaving a housing | casing like patent document 2, it is necessary to dig up one fin at a time using a blade. Thus, in order to form a wick, a complicated process must be performed, and manufacturing costs are increased.
In order to form a wick efficiently, there is also a method of performing thermal spray molding as in the invention described in Patent Document 3. In this method, a wick can be formed in a short time because a structure having a specific shape is not formed. However, in the method described in Patent Document 3, since copper powder is dissolved and sprayed, a high-temperature treatment of 1000 degrees Celsius or higher is required, and as a result, the manufacturing cost cannot be suppressed.

  On the other hand, it is not impossible to form a wick without going through costly processes such as etching, cutting, and thermal spray molding. For example, by spraying calcium particles or paint, a film can be formed on the inner wall of the vapor chamber to generate a capillary force. However, the wick formed in this way has low thermal conductivity and cannot perform efficient heat dissipation.

  The present invention has been made in consideration of the above problems, and an object of the present invention is to provide a vapor chamber that can be manufactured at low cost and has high thermal conductivity, and a method for manufacturing the vapor chamber.

In order to solve the above problems, the vapor chamber according to the present invention is:
A vapor chamber in which a working fluid is sealed in a sealed space, a housing formed of a resin material, and a plurality of wicks integrally formed with the housing provided on an inner wall of the housing And a metal layer formed on the inner wall of the casing and the surface of the wick by metal plating.

The vapor chamber according to the present invention is characterized in that the casing is formed of a resin material. A wick formed integrally with the housing is provided on the inner wall of the housing. A wick is a fine structure having irregularities such as protrusions, holes, and grooves.
A metal layer is formed on the inner wall surface of the housing including the wick by metal plating. The metal layer is typically a layer made of copper or aluminum. The vapor chamber according to the present invention reduces the cost for forming the wick by integrally molding the housing and the wick using resin, and also applies metal plating to the inner wall of the housing including the wick. Improved thermal conductivity. That is, it is possible to simultaneously solve the two problems of reducing the manufacturing cost and ensuring the thermal conductivity.

  The wick preferably has a capillary structure that guides the working fluid to a predetermined region in the housing. The predetermined region is a region in contact with a heat source to be absorbed. Preferably there is.

  The wick formed integrally with the housing by resin preferably has a structure for guiding the working fluid to a predetermined region by capillary force. The predetermined area is an area where heat is absorbed by the working fluid, and is typically an area in contact with the heat source to be endothermic.

  The casing may have an opening, and a part of the metal layer formed on the inner wall of the casing may be exposed to the outside of the casing at the opening.

An opening may be provided in the housing, and the metal layer formed on the inner wall may be exposed to the outside. By doing so, heat can be taken in and released efficiently. For example, the heat release efficiency from the inside of the housing can be improved by bringing a heat sink into contact with the exposed metal layer.

  The housing includes a first opening provided on a surface in contact with a heat source to be absorbed, and a second opening provided on a surface opposite to the surface provided with the first opening. The area of the second opening may be larger than the area of the first opening.

  That is, the metal layer exposed from the first opening is in contact with the heat source, and the metal layer exposed from the second opening is in contact with the heat dissipation means such as a heat sink. By making the area of the second opening larger than the area of the first opening, heat can be released more efficiently to the outside of the housing. In addition, the 1st and 2nd opening part in this invention may consist of a some opening part, respectively.

  Also, the method for manufacturing a vapor chamber according to the present invention is a method for manufacturing a vapor chamber in which a working fluid is sealed inside a casing having a sealed structure, and the casing is formed by injection molding a resin material. Forming a plurality of parts to be formed, forming a plurality of wicks on the inner wall of the casing, and forming a metal on the surface of the inner wall of the casing including the wick by metal plating. It includes a plating step for forming a layer, a sealing step for combining the plurality of components to form a casing, and a fluid injection step for enclosing a working fluid in the casing.

  Thus, this invention can also be specified as a manufacturing method of the vapor chamber which concerns on this invention. A wick can be formed at the same time when a plurality of parts constituting the housing are manufactured by injection molding a resin. That is, it is not necessary to go through an independent process for forming the wick. Further, by performing metal plating on the inner wall of the casing, the thermal conductivity can be improved as compared with the case where a casing made of only resin is used, and high heat dissipation efficiency can be obtained.

  The vapor chamber manufacturing method according to the present invention further includes a cutting step of removing a part of the casing and exposing a metal layer formed on the inner wall of the casing to the outside after the plating step. This may be a feature.

  By doing so, the metal layer formed on the inner wall of the housing can be exposed to the outside, and the heat absorbed by the metal layer can be efficiently released to the outside of the housing.

  Further, in the molding step, a part constituting the housing is molded so as to have a first portion having a predetermined thickness and a second portion protruding from the first portion, and in the cutting step The metal layer formed on the inner wall of the housing may be exposed outside the housing by leaving the second portion and removing the first portion.

  The first part is the thinnest part of the parts constituting the housing, and the second part is a part protruding from the first part. When molding the target part, the metal layer can be exposed to the outside by removing the first part, that is, the part with the smallest thickness.

  In addition, this invention can be specified as a vapor chamber containing at least one part of the said structure. Moreover, it can also specify as a manufacturing method of the said vapor chamber. The above processes and means can be freely combined and implemented as long as no technical contradiction occurs.

  According to the present invention, it is possible to provide a vapor chamber that can be manufactured at low cost and has high thermal conductivity, and a method for manufacturing the vapor chamber.

It is an external view of the vapor chamber which concerns on 1st embodiment. It is sectional drawing of the vapor chamber which concerns on 1st embodiment. It is sectional drawing of the vapor chamber which concerns on 1st embodiment. It is the perspective view and sectional drawing explaining the shape of the wick in 1st embodiment. It is a flowchart showing the manufacturing method of a vapor chamber. It is a perspective view of the member which comprises the vapor chamber which concerns on 1st embodiment. It is sectional drawing of the member which comprises the vapor chamber which concerns on 1st embodiment. It is the perspective view and sectional drawing explaining the other example of the shape of a wick. It is the perspective view and sectional drawing explaining the other example of the shape of a wick. It is an external view of the vapor chamber which concerns on 2nd embodiment. It is sectional drawing of the vapor chamber which concerns on 2nd embodiment. It is sectional drawing of the member which comprises the vapor chamber which concerns on 2nd embodiment. It is an external view of the vapor chamber which concerns on 3rd embodiment. It is sectional drawing of the vapor chamber which concerns on 3rd embodiment. It is sectional drawing of the member which comprises the vapor chamber which concerns on 3rd embodiment. It is sectional drawing of the vapor chamber which concerns on a prior art.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, each embodiment is an illustration to the last, and this invention is not limited by the content of embodiment.

(First embodiment)
Fig.1 (a) is the figure which looked at the vapor chamber 100 which concerns on 1st embodiment from the upper surface, ie, the surface where heat dissipation members, such as a heat sink, contact. Moreover, FIG.1 (b) is the figure which looked at the vapor chamber 100 which concerns on 1st embodiment from the bottom face, ie, the surface where heat sources, such as CPU, contact. Moreover, FIG.1 (c) is the figure which looked at the vapor chamber 100 which concerns on 1st embodiment from the side surface (Y-axis direction). In FIG. 1, reference numeral 101 denotes a vapor chamber casing formed of resin, and reference numeral 102 denotes a metal layer exposed from the casing.

<Vapor chamber structure>
The structure of the vapor chamber according to the present embodiment will be described with reference to FIGS. 2 and 3.
2 is a cross-sectional view of the vapor chamber according to the present embodiment taken along dotted lines AA ′, BB ′, and CC ′ in FIG.
Inside the casing 101 is a sealed space (reference numeral 201), and the inner wall of the housing 101 is covered with a metal layer 102 which is a metal layer. Further, the housing 101 has an opening, and a part of the metal layer 102 is exposed to the outside of the housing 101. In this example, there are 16 openings on the top surface and 4 on the bottom surface, for a total of 20 openings. The four openings on the bottom surface are the first openings in the present invention, and the 16 openings on the top surface are the second openings in the present invention. As described above, the upper surface of the vapor chamber is a surface in contact with the heat sink, and the bottom surface of the vapor chamber is a surface in contact with the heat source. Reference numeral 103 in FIG. 1B represents a region in contact with the heat source.

  FIG. 3 is a cross-sectional view of the vapor chamber according to this embodiment, which is sliced in parallel along the dotted line D-D ′ in FIG. The inside of a sealed space (hereinafter referred to as a closed space) inside the housing 101 is not a complete cavity, and the upper portion and the lower portion of the housing are connected by a support column 104. In this example, the number of support columns 104 is eight. However, any number of columns may be used as long as the strength of the casing is maintained and the circulation of the working fluid is not hindered.

<Wick structure>
Next, the position and shape of the wick present in the closed space 201 will be described.
The vapor chamber according to the present embodiment has minute protrusions formed on the inner wall of the housing as a wick. The protrusion is integrally formed with the housing. For example, when molding a casing by injection molding, a casing having a wick can be molded by providing minute irregularities on the surface of the mold corresponding to the inner wall of the casing.
The dotted line in FIG. 2 represents the inner wall portion where the wick is formed. In addition, the wick does not necessarily need to be arranged on the entire circumference so as to surround the closed space as shown in FIG. 2, and may be arranged only on the bottom surface of the inner wall of the housing, for example.

FIG. 4A is an enlarged perspective view of a portion where a wick is formed. FIG. 4B is a cross-sectional view taken along a dotted line AA ′ in FIG. Reference numeral 401 in the figure is a protrusion formed as a wick. Each protrusion is covered with a metal layer 102. The length of each protrusion is 1 millimeter or less, preferably about 10 to 500 micrometers. The same applies to the interval between the protrusions.
These wicks are arranged to generate a capillary force with respect to the working fluid and guide the working fluid toward a region 103 which is a region in contact with the heat source. Since the capillary force is known to change depending on the width of the flow path through which the fluid passes, the fluid can be guided in an arbitrary direction by appropriately arranging the intervals between the protrusions. Since the capillary structure for inducing the fluid is a known technique used in conventional heat pipes and vapor chambers, detailed description thereof is omitted.

<Operation of vapor chamber>
In the closed space 201 in the housing, a working fluid is accommodated similarly to a known vapor chamber.
The accommodated working fluid absorbs heat generated by the heat source to become vapor, flows in the closed space 201 as a vapor flow, is cooled at the upper portion of the housing in contact with the heat sink, and returns to the liquid. The cycle in which the working fluid that has become liquid moves toward the position where the heat source is in contact again by the capillary force of the wick formed on the inner wall and evaporates again is repeated.

<Vapor chamber manufacturing method>
Next, the manufacturing method of the vapor chamber which consists of the structure mentioned above is demonstrated, referring FIGS. FIG. 5 is a flowchart showing the manufacturing method for each process, and FIGS. 6 and 7 are views for explaining the shape of the casing to be molded.

First, the casing (and wick) is molded by injection molding (step S11).
The housing 101 includes an upper member 101A that is the upper half of the housing and a lower member 101B that is the lower half, and is formed by joining both members manufactured separately.
The resin material used for the casing 101 is preferably heat resistant and relatively high in thermal conductivity. For example, polysulfone (PSU) resin, polyethersulfone (PES) resin, polyetherimide (PEI) resin, polyphenylene sulfide (PPS) resin, polyetheretherketone (PEEK) resin, polyarylate (PAR) resin, polyimide ( PI) resin and the like can be used.
Moreover, in order to improve thermal conductivity, you may use what mixed the metal particle and the carbon nanotube in resin. Such a resin is called a high thermal conductive resin.

The upper member 101A and the lower member 101B are molded by injection molding, which is a normal resin molding method. A mold is used for the injection molding, but a minute uneven process for forming a wick is applied to the position of the mold located on the inner wall of the casing as described above.
FIG. 6A is a view showing the upper member 101A formed by injection molding, and FIG. 6B is a view showing the lower member 101B in the same manner. In FIG. 6, the concentration is changed for each part for ease of viewing, but the upper member and the lower member are integrally formed respectively. That is, each member shown in FIGS. 6A and 6B is composed of one member.
FIG. 7 is a cross-sectional view taken along dotted line CC ′ of the upper member and the lower member. Although not shown in FIGS. 6 and 7, the member serving as the housing is provided with an injection hole for injecting the working fluid after joining.

  Next, the upper member and the lower member are combined to perform a process (packaging) for forming one housing (step S12). In the packaging process, the upper member and the lower member are bonded and integrated.

  Next, metal plating is performed on the molded housing (step S13). The metal plating is preferably performed using a metal having good thermal conductivity. More preferably, copper having a good balance between material cost and thermal efficiency may be used. In this step, metal plating is performed on the entire surface of the portion that hits the inner wall of the housing, that is, the portion that touches the enclosed working fluid, using the injection hole provided in the housing. In FIG. 7, surfaces represented by reference numerals 702A and 702B are plating target surfaces. Note that the metal plating may be performed on the entire housing, or may be performed only on the inner wall portion of the housing using a partial plating technique.

In this embodiment, in order to perform copper plating on the resin member that is an insulator, a direct plating technique is used in which a metal is laminated on the surface of the member by an electroless plating process and then electrolytic plating is performed. Hereinafter, the steps performed in steps S12 and S13 will be described in more detail.
First, a member is degreased and cleaned using a degreasing material or a surfactant. As a result, dust, oil, mold release agent, and the like attached to the surface are removed.
Next, an etching process is performed on the member. An etching process is a process for improving the adhesiveness of plating with respect to resin. For example, fine irregularities are formed on the surface of the resin by chemically corroding the surface using a liquid containing an oxidizing agent such as chromic acid.
Next, the process which provides a catalyst with respect to a member is performed, and the catalyst nucleus required for electroless plating is deposited on the surface of resin. For example, a Pd—Sn compound, which is a catalyst metal having a high adsorption capacity, is adsorbed on a rough surface.
Next, electroless plating is performed to deposit a conductor necessary for electrolytic plating on the surface of the member. In the present embodiment, tin is dissolved using an acid or alkali dilute solution to form metallic palladium, and then copper is infiltrated into the catalyst layer with a reducing agent and a copper salt.
Next, electrolytic plating is performed by immersing the member in an electrolytic solution and passing a current. In this embodiment, copper plating is performed by using copper sulfate as the electrolytic solution.
In addition, although the direct plating method was illustrated here, other plating methods may be used.

  Next, the dummy part of the housing is cut (step S14). The dummy part of the housing is a part above the dotted line 701A in FIG. 7A and a part below the dotted line 701B in FIG. 7B. That is, the dummy portion is the thinnest portion of each member. By cutting the dummy portion after the plating process, the metal layer formed on the inner wall of the housing is exposed to the outside.

  Next, the working fluid is injected into a closed space inside the casing from an injection hole provided in the casing (step S15). The working fluid is injected in a reduced pressure environment. This is because by reducing the pressure in the closed space, the boiling point of the working fluid is lowered and the vapor is easily diffused. When injection of the working fluid is completed, the injection hole is sealed, and the manufacturing process of the vapor chamber is completed.

  According to the embodiment described above, a high-temperature process such as melting and sintering, and a metal processing process such as etching, cutting, and welding are used, and the wick has a complicated shape and has high thermal conductivity. A vapor chamber can be manufactured. By using resin as the main material of the housing, the manufacturing cost can be reduced, and by performing metal plating on the inner wall, the absorbed heat can be diffused widely on the heat dissipation surface.

(Modification of the first embodiment)
In the first embodiment, the wick is formed by providing a cylindrical protrusion on the inner wall of the housing. However, the shape of the wick is not necessarily limited to a cylindrical shape as long as a capillary force can be generated with respect to the working fluid. There is no need.
For example, FIG. 8 shows an example in which a wick is formed by denting the inner wall of the housing instead of providing a protrusion on the inner wall. In this example, capillary force is generated by arranging holes having a diameter and depth of several tens to several hundreds of micrometers.
FIG. 9 shows an example in which a wick is formed by providing a plurality of grooves on the inner wall of the housing. In this example, the capillary force is generated by arranging rectangular parallelepipeds having a width and height of several tens to several hundreds of micrometers.
Thus, the wick provided on the inner wall of the housing may have any shape as long as it can generate a capillary force with respect to the working fluid.

(Second embodiment)
In the first embodiment, high heat dissipation efficiency can be obtained by exposing the metal layer 102 to the outside of the housing. In contrast, the second embodiment is an embodiment in which the strength of the housing is improved by reducing the area of the metal layer exposed to the outside of the housing and increasing the number of openings instead. Hereinafter, differences from the first embodiment will be described.
FIG. 10A is a top view of the vapor chamber 100 according to the second embodiment, and FIG. 10B is a bottom view of the vapor chamber 100 according to the second embodiment. FIG. 11 is a cross-sectional view of the vapor chamber according to the present embodiment taken along dotted lines AA ′, BB ′, and CC ′ in FIG.

As in the first embodiment, the vapor chamber according to the second embodiment has a closed space 201 inside the housing 101, and the inner wall of the housing 101 is covered with the metal layer 102. Moreover, although the opening part is provided in the housing | casing 101, it differs from 1st embodiment in the point that each opening part is each divided into 16. In addition, since the internal structure of the closed space 201 is the same as that of 1st embodiment (FIG. 3), description is abbreviate | omitted.
The housing having such a shape can be manufactured by partially changing the mold design in the first embodiment. FIG. 12 is a cross-sectional view of the upper and lower members. Moreover, in 2nd embodiment, when cut | disconnecting a housing | casing in step S14, it cut | disconnects in the position of dotted line 1201A and 1201B. Other manufacturing processes are the same as those in the first embodiment.

  In the vapor chamber according to the present invention, the larger the opening, the larger the exposed area of the metal layer, and thus the heat dissipation is improved. However, since the thickness of the metal plating is several hundred micrometers, the strength is lowered. On the other hand, in 2nd embodiment, the intensity | strength in an opening part is securable by dividing the opening part of a housing | casing.

(Third embodiment)
In the third embodiment, the metal layer 102 is not exposed to the outside of the housing.
FIG. 13 is a top view of the vapor chamber 100 according to the second embodiment. Although not shown, the bottom view is the same.
FIG. 14 is a cross-sectional view of the vapor chamber according to the present embodiment taken along dotted lines AA ′, BB ′, and CC ′ in FIG.

The vapor chamber according to the third embodiment has a closed space 201 inside the housing 101 and the inner wall of the housing 101 is covered with the metal layer 102 as in the first embodiment. Is different from the first embodiment in that is omitted. In addition, since the internal structure of the closed space 201 is the same as that of 1st embodiment, description is abbreviate | omitted.
The housing having such a shape can be manufactured by partially changing the mold design in the first embodiment. FIG. 15 is a cross-sectional view of the upper and lower members. In the third embodiment, since the housing does not have an opening, the housing cutting step performed in step S14 is omitted. Other manufacturing processes are the same as those in the first embodiment.

  In the third embodiment, the strength of the casing can be further improved by omitting the opening of the casing and eliminating the exposure of the metal layer to the outside. Since there is no exposure of the metal layer to the outside of the housing, compared with the first and second embodiments, the absolute heat dissipation amount is reduced, but the inner wall of the housing is subjected to metal plating, Heat can be sufficiently diffused in the plane direction. Since the purpose of the vapor chamber is to diffuse heat generated in a narrow region to a wide region, even in such an embodiment, the effects of the present invention can be sufficiently obtained.

The above-described embodiment is merely an example, and the present invention can be implemented with appropriate modifications within a range not departing from the gist thereof. For example, any material may be used as the housing material as long as the housing and the wick can be integrally molded, and the shape of the wick may be other than that exemplified. Good.
In addition, any metal may be used for the metal as long as the metal layer can be formed by performing metal plating on the inner wall of the housing, and the metal layer may be formed in any shape. It may be exposed to the outside.

DESCRIPTION OF SYMBOLS 100 ... Vapor chamber 101 ... Housing 101A ... Upper member 101B ... Lower member 102 ... Metal layer 401 ... Wick

Claims (11)

A vapor chamber in which a working fluid is sealed in a sealed space,
A housing formed of a resin material;
A plurality of wicks integrally formed with the housing provided on the inner wall of the housing;
A metal layer formed on the inner wall of the housing and the surface of the wick by metal plating;
A vapor chamber. The wick has a capillary structure that guides the working fluid to a predetermined region in the housing.
The vapor chamber according to claim 1. The predetermined area is an area in contact with a heat source to be endothermic,
The vapor chamber according to claim 2. The housing has an opening, and a part of the metal layer formed on the inner wall of the housing is exposed to the outside of the housing in the opening.
The vapor chamber according to any one of claims 1 to 3. The housing has a first opening provided on a surface in contact with a heat source to be absorbed, and
Having a second opening provided on a surface opposite to the surface provided with the first opening;
The area of the second opening is larger than the area of the first opening,
The vapor chamber according to claim 4. A method of manufacturing a vapor chamber in which a working fluid is sealed inside a sealed space,
A molding step of molding a plurality of components constituting the casing by injection molding a resin material, and integrally molding a plurality of wicks on the inner wall of the casing;
A plating step of forming a metal layer by metal plating on the surface of the portion that becomes the inner wall of the housing, including the wick,
A sealing step of combining the plurality of parts to form a sealing structure;
A fluid injection step of enclosing a working fluid inside the housing;
A method for manufacturing a vapor chamber. The wick has a capillary structure that guides the working fluid to a predetermined region in the housing.
The manufacturing method of the vapor chamber of Claim 6. The predetermined area is an area in contact with a heat source to be endothermic,
The manufacturing method of the vapor chamber of Claim 7. The housing has a first opening provided on a surface in contact with a heat source to be absorbed, and
Having a second opening provided on a surface opposite to the surface provided with the first opening;
The area of the second opening is larger than the area of the first opening,
The manufacturing method of the vapor chamber of Claim 8. After the completion of the plating step, further including a cutting step of removing a part of the housing and exposing a metal layer formed on the inner wall of the housing to the outside of the housing.
The method for manufacturing a vapor chamber according to claim 6. In the molding step, a part constituting the housing is molded so as to have a first part having a predetermined thickness and a second part protruding from the first part,
In the cutting step, leaving the second part and removing the first part, the metal layer formed on the inner wall of the casing is exposed to the outside of the casing,
The method for manufacturing a vapor chamber according to claim 10.

Images