TW201144478A - Apparatus for controlling temperature uniformity of a showerhead - Google Patents

Apparatus for controlling temperature uniformity of a showerhead Download PDF

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Publication number
TW201144478A
TW201144478A TW100100533A TW100100533A TW201144478A TW 201144478 A TW201144478 A TW 201144478A TW 100100533 A TW100100533 A TW 100100533A TW 100100533 A TW100100533 A TW 100100533A TW 201144478 A TW201144478 A TW 201144478A
Authority
TW
Taiwan
Prior art keywords
showerhead
heat transfer
transfer fluid
flow paths
flow
Prior art date
Application number
TW100100533A
Other languages
English (en)
Chinese (zh)
Inventor
Kallol Bera
James D Carducci
Hamid Noorbakhsh
Larry D Elizaga
Douglas A Buchberger Jr
Andrew Nguyen
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW201144478A publication Critical patent/TW201144478A/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/4557—Heated nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW100100533A 2010-01-27 2011-01-06 Apparatus for controlling temperature uniformity of a showerhead TW201144478A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29867610P 2010-01-27 2010-01-27
US12/886,258 US20110180233A1 (en) 2010-01-27 2010-09-20 Apparatus for controlling temperature uniformity of a showerhead

Publications (1)

Publication Number Publication Date
TW201144478A true TW201144478A (en) 2011-12-16

Family

ID=44308077

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100100533A TW201144478A (en) 2010-01-27 2011-01-06 Apparatus for controlling temperature uniformity of a showerhead

Country Status (3)

Country Link
US (1) US20110180233A1 (fr)
TW (1) TW201144478A (fr)
WO (1) WO2011094143A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI805813B (zh) * 2018-07-27 2023-06-21 美商應用材料股份有限公司 用於熱沉積的氣體分配板

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