TW201144471A - Film forming device - Google Patents

Film forming device Download PDF

Info

Publication number
TW201144471A
TW201144471A TW100106893A TW100106893A TW201144471A TW 201144471 A TW201144471 A TW 201144471A TW 100106893 A TW100106893 A TW 100106893A TW 100106893 A TW100106893 A TW 100106893A TW 201144471 A TW201144471 A TW 201144471A
Authority
TW
Taiwan
Prior art keywords
film forming
film
sheet
target
forming apparatus
Prior art date
Application number
TW100106893A
Other languages
English (en)
Chinese (zh)
Inventor
Kenji Date
Hiroyoshi Kuroki
Akihide Kitabatake
Original Assignee
Sanyo Vacuum Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Vacuum Ind Co Ltd filed Critical Sanyo Vacuum Ind Co Ltd
Publication of TW201144471A publication Critical patent/TW201144471A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0068—Reactive sputtering characterised by means for confinement of gases or sputtered material, e.g. screens, baffles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3421—Cathode assembly for sputtering apparatus, e.g. Target using heated targets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
TW100106893A 2010-03-08 2011-03-02 Film forming device TW201144471A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010050960A JP4574739B1 (ja) 2010-03-08 2010-03-08 成膜装置

Publications (1)

Publication Number Publication Date
TW201144471A true TW201144471A (en) 2011-12-16

Family

ID=43319595

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100106893A TW201144471A (en) 2010-03-08 2011-03-02 Film forming device

Country Status (3)

Country Link
JP (1) JP4574739B1 (ja)
KR (1) KR20110102202A (ja)
TW (1) TW201144471A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5718767B2 (ja) * 2011-08-30 2015-05-13 株式会社アルバック スパッタリング装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935580Y2 (ja) * 1982-07-30 1984-10-01 株式会社徳田製作所 スパツタリング装置
JPS61266571A (ja) * 1985-05-21 1986-11-26 Toyoda Gosei Co Ltd スパツタリング装置
EP0428358B1 (en) * 1989-11-13 1996-05-15 Optical Coating Laboratory, Inc. Geometries and configurations for magnetron sputtering apparatus
JPH10287977A (ja) * 1997-04-14 1998-10-27 Ricoh Co Ltd スパッタ装置
JP2002309371A (ja) * 2001-04-11 2002-10-23 Sanyo Shinku Kogyo Kk フィルム基板への成膜方法とその装置
JP2004197139A (ja) * 2002-12-17 2004-07-15 Asahi Glass Co Ltd スパッタリング装置
JP4591080B2 (ja) * 2004-12-27 2010-12-01 富士電機システムズ株式会社 薄膜形成装置
JP2006213963A (ja) * 2005-02-03 2006-08-17 Tomonobu Hata 低温スパッタリング方法及び装置

Also Published As

Publication number Publication date
KR20110102202A (ko) 2011-09-16
JP4574739B1 (ja) 2010-11-04
JP2011184733A (ja) 2011-09-22

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