TW201141768A - Method of reducing photomask pollution and photomask storage device thereof - Google Patents
Method of reducing photomask pollution and photomask storage device thereof Download PDFInfo
- Publication number
- TW201141768A TW201141768A TW099122160A TW99122160A TW201141768A TW 201141768 A TW201141768 A TW 201141768A TW 099122160 A TW099122160 A TW 099122160A TW 99122160 A TW99122160 A TW 99122160A TW 201141768 A TW201141768 A TW 201141768A
- Authority
- TW
- Taiwan
- Prior art keywords
- gas
- reticle
- accommodating space
- space
- storage device
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000002955 isolation Methods 0.000 claims abstract description 30
- 230000001276 controlling effect Effects 0.000 claims abstract description 10
- 230000001105 regulatory effect Effects 0.000 claims abstract description 5
- 239000007789 gas Substances 0.000 claims description 120
- 230000008859 change Effects 0.000 claims description 20
- 238000013022 venting Methods 0.000 claims description 20
- 238000011109 contamination Methods 0.000 claims description 17
- 125000006850 spacer group Chemical group 0.000 claims description 10
- 238000001179 sorption measurement Methods 0.000 claims description 9
- 230000004888 barrier function Effects 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 4
- 238000005286 illumination Methods 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000003570 air Substances 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000008267 milk Substances 0.000 claims description 2
- 210000004080 milk Anatomy 0.000 claims description 2
- 235000013336 milk Nutrition 0.000 claims description 2
- 230000032258 transport Effects 0.000 claims 2
- 238000005096 rolling process Methods 0.000 claims 1
- 230000008569 process Effects 0.000 description 20
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000000889 atomisation Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002808 molecular sieve Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000003431 steroids Chemical class 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 238000001890 transfection Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Library & Information Science (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099122160A TW201141768A (en) | 2010-05-19 | 2010-07-06 | Method of reducing photomask pollution and photomask storage device thereof |
| US13/110,474 US8597859B2 (en) | 2010-05-19 | 2011-05-18 | Method and storage system for reducing contamination of a photomask |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99115945 | 2010-05-19 | ||
| TW099122160A TW201141768A (en) | 2010-05-19 | 2010-07-06 | Method of reducing photomask pollution and photomask storage device thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201141768A true TW201141768A (en) | 2011-12-01 |
| TWI403443B TWI403443B (https=) | 2013-08-01 |
Family
ID=44971581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099122160A TW201141768A (en) | 2010-05-19 | 2010-07-06 | Method of reducing photomask pollution and photomask storage device thereof |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8597859B2 (https=) |
| TW (1) | TW201141768A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111948907A (zh) * | 2019-05-16 | 2020-11-17 | 上海微电子装备（集团）股份有限公司 | 掩模板温度控制装置和掩模曝光装置 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104443848B (zh) * | 2014-10-20 | 2017-02-15 | 深圳市华星光电技术有限公司 | 一种液晶玻璃包装箱及防潮包装结构 |
| KR101637498B1 (ko) * | 2015-03-24 | 2016-07-07 | 피코앤테라(주) | 웨이퍼 수납용기 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5346518A (en) * | 1993-03-23 | 1994-09-13 | International Business Machines Corporation | Vapor drain system |
| US7763395B2 (en) * | 2003-06-30 | 2010-07-27 | Intel Corporation | Radiation stability of polymer pellicles |
-
2010
- 2010-07-06 TW TW099122160A patent/TW201141768A/zh not_active IP Right Cessation
-
2011
- 2011-05-18 US US13/110,474 patent/US8597859B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111948907A (zh) * | 2019-05-16 | 2020-11-17 | 上海微电子装备（集团）股份有限公司 | 掩模板温度控制装置和掩模曝光装置 |
| CN111948907B (zh) * | 2019-05-16 | 2022-01-28 | 上海微电子装备（集团）股份有限公司 | 掩模板温度控制装置和掩模曝光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI403443B (https=) | 2013-08-01 |
| US20110284423A1 (en) | 2011-11-24 |
| US8597859B2 (en) | 2013-12-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |