TW201126180A - IC device testing socket - Google Patents

IC device testing socket Download PDF

Info

Publication number
TW201126180A
TW201126180A TW099132854A TW99132854A TW201126180A TW 201126180 A TW201126180 A TW 201126180A TW 099132854 A TW099132854 A TW 099132854A TW 99132854 A TW99132854 A TW 99132854A TW 201126180 A TW201126180 A TW 201126180A
Authority
TW
Taiwan
Prior art keywords
substrate
layer
component
conductive
dielectric layer
Prior art date
Application number
TW099132854A
Other languages
English (en)
Chinese (zh)
Inventor
Yuichi Tsubaki
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW201126180A publication Critical patent/TW201126180A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW099132854A 2009-09-29 2010-09-28 IC device testing socket TW201126180A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009224929A JP2011075313A (ja) 2009-09-29 2009-09-29 Ｉｃデバイス検査用ソケット

Publications (1)

Publication Number Publication Date
TW201126180A true TW201126180A (en) 2011-08-01

Family

ID=43302431

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099132854A TW201126180A (en) 2009-09-29 2010-09-28 IC device testing socket

Country Status (7)

Country Link
US (1) US8957693B2 (enExample)
EP (1) EP2483699A1 (enExample)
JP (1) JP2011075313A (enExample)
KR (1) KR20120079839A (enExample)
PH (1) PH12012500637A1 (enExample)
TW (1) TW201126180A (enExample)
WO (1) WO2011041158A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112310689A (zh) * 2019-07-15 2021-02-02 李承龙 弯曲结构的接口、包括接口的接口组件和测试插座以及制造接口的方法

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* Cited by examiner, † Cited by third party
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US20150168450A1 (en) * 2013-12-17 2015-06-18 Tim WOODEN Coaxial Impedance-Matched Test Socket
KR20160113690A (ko) * 2014-03-29 2016-09-30 인텔 코포레이션 국소 열원을 이용한 집적 회로 칩 부착
JP2017026505A (ja) * 2015-07-24 2017-02-02 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
SG11202002097UA (en) * 2017-09-08 2020-04-29 Enplas Corp Electric connection socket
US11189945B2 (en) * 2017-11-30 2021-11-30 Enplas Corporation Method of manufacturing electrical connection socket, and electrical connection socket
CN111707920B (zh) * 2020-07-23 2024-08-27 苏州朗之睿电子科技有限公司 一种陶瓷嵌入定位式半导体器件用测试座

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JPH05235550A (ja) * 1992-02-20 1993-09-10 Nec Corp 低誘電率ガラスセラミック多層配線基板およびその製造方法
US5854534A (en) 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US5502397A (en) * 1992-11-12 1996-03-26 Advanced Micro Devices, Inc. Integrated circuit testing apparatus and method
US5480309A (en) * 1994-05-23 1996-01-02 Kel Corporation Universal multilayer base board assembly for integrated circuits
JP3591894B2 (ja) * 1994-11-24 2004-11-24 キヤノン株式会社 多層プリント基板
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US6512389B1 (en) * 2000-11-17 2003-01-28 Aql Manufacturing Services, Inc. Apparatus for use in an electronic component test interface having multiple printed circuit boards
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JP2003023257A (ja) * 2001-07-06 2003-01-24 Matsushita Electric Works Ltd プリント配線板
JP2003050262A (ja) * 2001-08-08 2003-02-21 Hitachi Ltd 高周波ｉｃソケット、半導体試験装置および半導体試験方法ならびに半導体装置の製造方法
US6891258B1 (en) * 2002-12-06 2005-05-10 Xilinx, Inc. Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit
US6846184B2 (en) 2003-01-24 2005-01-25 High Connection Density Inc. Low inductance electrical contacts and LGA connector system
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WO2005006003A1 (ja) 2003-07-10 2005-01-20 Nec Corporation Ｂｇａ用ｌｓｉテストソケット
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112310689A (zh) * 2019-07-15 2021-02-02 李承龙 弯曲结构的接口、包括接口的接口组件和测试插座以及制造接口的方法
CN112310689B (zh) * 2019-07-15 2022-06-10 李承龙 弯曲结构的接口、包括接口的接口组件和测试插座以及制造接口的方法

Also Published As

Publication number Publication date
EP2483699A1 (en) 2012-08-08
JP2011075313A (ja) 2011-04-14
US8957693B2 (en) 2015-02-17
WO2011041158A1 (en) 2011-04-07
US20120182037A1 (en) 2012-07-19
KR20120079839A (ko) 2012-07-13
PH12012500637A1 (en) 2012-11-12

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