TW201125091A - Method for detecting wiring location of wire rack. - Google Patents

Method for detecting wiring location of wire rack. Download PDF

Info

Publication number
TW201125091A
TW201125091A TW099101079A TW99101079A TW201125091A TW 201125091 A TW201125091 A TW 201125091A TW 099101079 A TW099101079 A TW 099101079A TW 99101079 A TW99101079 A TW 99101079A TW 201125091 A TW201125091 A TW 201125091A
Authority
TW
Taiwan
Prior art keywords
wire
lead frame
image
standard
corrected
Prior art date
Application number
TW099101079A
Other languages
English (en)
Chinese (zh)
Other versions
TWI423411B (enExample
Inventor
de-bao Peng
Wei-Ting Shen
Gui-Qi Zhang
Original Assignee
de-bao Peng
Wei-Ting Shen
Gui-Qi Zhang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by de-bao Peng, Wei-Ting Shen, Gui-Qi Zhang filed Critical de-bao Peng
Priority to TW099101079A priority Critical patent/TW201125091A/zh
Publication of TW201125091A publication Critical patent/TW201125091A/zh
Application granted granted Critical
Publication of TWI423411B publication Critical patent/TWI423411B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Image Processing (AREA)
TW099101079A 2010-01-15 2010-01-15 Method for detecting wiring location of wire rack. TW201125091A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW099101079A TW201125091A (en) 2010-01-15 2010-01-15 Method for detecting wiring location of wire rack.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099101079A TW201125091A (en) 2010-01-15 2010-01-15 Method for detecting wiring location of wire rack.

Publications (2)

Publication Number Publication Date
TW201125091A true TW201125091A (en) 2011-07-16
TWI423411B TWI423411B (enExample) 2014-01-11

Family

ID=45047329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099101079A TW201125091A (en) 2010-01-15 2010-01-15 Method for detecting wiring location of wire rack.

Country Status (1)

Country Link
TW (1) TW201125091A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI818614B (zh) * 2022-07-04 2023-10-11 日商新川股份有限公司 半導體裝置的製造裝置及製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6362241A (ja) * 1986-09-02 1988-03-18 Toshiba Corp ワイヤボンデイング方法
JPH0810715B2 (ja) * 1989-03-24 1996-01-31 株式会社カイジョー ワイヤボンディング方法
JP2672695B2 (ja) * 1990-07-12 1997-11-05 ローム株式会社 集積回路用ボンディング装置
JP3215871B2 (ja) * 1992-06-19 2001-10-09 ティーディーケイ株式会社 ワイヤーボンディング外観検査装置
JPH0835474A (ja) * 1994-07-26 1996-02-06 Ngk Spark Plug Co Ltd 内燃機関の二次電圧波形検出器
US5731244A (en) * 1996-05-28 1998-03-24 Micron Technology, Inc. Laser wire bonding for wire embedded dielectrics to integrated circuits
US6068174A (en) * 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
JP2000216188A (ja) * 1999-01-22 2000-08-04 Seiko Epson Corp ワイヤボンディング方法、半導体装置、回路基板、電子機器及びワイヤボンディング装置
KR100896828B1 (ko) * 2001-10-26 2009-05-12 외르리콘 어셈블리 이큅먼트 아게, 슈타인하우젠 와이어 본더를 보정하는 방법
TWI242251B (en) * 2004-08-11 2005-10-21 Advanced Semiconductor Eng Method for auto checking wire bonding parameters

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI818614B (zh) * 2022-07-04 2023-10-11 日商新川股份有限公司 半導體裝置的製造裝置及製造方法

Also Published As

Publication number Publication date
TWI423411B (enExample) 2014-01-11

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MM4A Annulment or lapse of patent due to non-payment of fees