TW201125091A - Method for detecting wiring location of wire rack. - Google Patents

Method for detecting wiring location of wire rack. Download PDF

Info

Publication number
TW201125091A
TW201125091A TW099101079A TW99101079A TW201125091A TW 201125091 A TW201125091 A TW 201125091A TW 099101079 A TW099101079 A TW 099101079A TW 99101079 A TW99101079 A TW 99101079A TW 201125091 A TW201125091 A TW 201125091A
Authority
TW
Taiwan
Prior art keywords
wire
lead frame
image
standard
corrected
Prior art date
Application number
TW099101079A
Other languages
English (en)
Chinese (zh)
Other versions
TWI423411B (enrdf_load_stackoverflow
Inventor
de-bao Peng
Wei-Ting Shen
Gui-Qi Zhang
Original Assignee
de-bao Peng
Wei-Ting Shen
Gui-Qi Zhang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by de-bao Peng, Wei-Ting Shen, Gui-Qi Zhang filed Critical de-bao Peng
Priority to TW099101079A priority Critical patent/TW201125091A/zh
Publication of TW201125091A publication Critical patent/TW201125091A/zh
Application granted granted Critical
Publication of TWI423411B publication Critical patent/TWI423411B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Image Processing (AREA)
TW099101079A 2010-01-15 2010-01-15 Method for detecting wiring location of wire rack. TW201125091A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW099101079A TW201125091A (en) 2010-01-15 2010-01-15 Method for detecting wiring location of wire rack.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099101079A TW201125091A (en) 2010-01-15 2010-01-15 Method for detecting wiring location of wire rack.

Publications (2)

Publication Number Publication Date
TW201125091A true TW201125091A (en) 2011-07-16
TWI423411B TWI423411B (enrdf_load_stackoverflow) 2014-01-11

Family

ID=45047329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099101079A TW201125091A (en) 2010-01-15 2010-01-15 Method for detecting wiring location of wire rack.

Country Status (1)

Country Link
TW (1) TW201125091A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI818614B (zh) * 2022-07-04 2023-10-11 日商新川股份有限公司 半導體裝置的製造裝置及製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6362241A (ja) * 1986-09-02 1988-03-18 Toshiba Corp ワイヤボンデイング方法
JPH0810715B2 (ja) * 1989-03-24 1996-01-31 株式会社カイジョー ワイヤボンディング方法
JP2672695B2 (ja) * 1990-07-12 1997-11-05 ローム株式会社 集積回路用ボンディング装置
JP3215871B2 (ja) * 1992-06-19 2001-10-09 ティーディーケイ株式会社 ワイヤーボンディング外観検査装置
JPH0835474A (ja) * 1994-07-26 1996-02-06 Ngk Spark Plug Co Ltd 内燃機関の二次電圧波形検出器
US5731244A (en) * 1996-05-28 1998-03-24 Micron Technology, Inc. Laser wire bonding for wire embedded dielectrics to integrated circuits
US6068174A (en) * 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
JP2000216188A (ja) * 1999-01-22 2000-08-04 Seiko Epson Corp ワイヤボンディング方法、半導体装置、回路基板、電子機器及びワイヤボンディング装置
KR100896828B1 (ko) * 2001-10-26 2009-05-12 외르리콘 어셈블리 이큅먼트 아게, 슈타인하우젠 와이어 본더를 보정하는 방법
TWI242251B (en) * 2004-08-11 2005-10-21 Advanced Semiconductor Eng Method for auto checking wire bonding parameters

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI818614B (zh) * 2022-07-04 2023-10-11 日商新川股份有限公司 半導體裝置的製造裝置及製造方法

Also Published As

Publication number Publication date
TWI423411B (enrdf_load_stackoverflow) 2014-01-11

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