TWI423411B - - Google Patents

Info

Publication number
TWI423411B
TWI423411B TW099101079A TW99101079A TWI423411B TW I423411 B TWI423411 B TW I423411B TW 099101079 A TW099101079 A TW 099101079A TW 99101079 A TW99101079 A TW 99101079A TW I423411 B TWI423411 B TW I423411B
Authority
TW
Taiwan
Application number
TW099101079A
Other languages
Chinese (zh)
Other versions
TW201125091A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW099101079A priority Critical patent/TW201125091A/zh
Publication of TW201125091A publication Critical patent/TW201125091A/zh
Application granted granted Critical
Publication of TWI423411B publication Critical patent/TWI423411B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Image Processing (AREA)
TW099101079A 2010-01-15 2010-01-15 Method for detecting wiring location of wire rack. TW201125091A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW099101079A TW201125091A (en) 2010-01-15 2010-01-15 Method for detecting wiring location of wire rack.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099101079A TW201125091A (en) 2010-01-15 2010-01-15 Method for detecting wiring location of wire rack.

Publications (2)

Publication Number Publication Date
TW201125091A TW201125091A (en) 2011-07-16
TWI423411B true TWI423411B (enrdf_load_stackoverflow) 2014-01-11

Family

ID=45047329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099101079A TW201125091A (en) 2010-01-15 2010-01-15 Method for detecting wiring location of wire rack.

Country Status (1)

Country Link
TW (1) TW201125091A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI818614B (zh) * 2022-07-04 2023-10-11 日商新川股份有限公司 半導體裝置的製造裝置及製造方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4864514A (en) * 1986-09-02 1989-09-05 Kabushiki Kaisha Toshiba Wire-bonding method and apparatus
JPH02250340A (ja) * 1989-03-24 1990-10-08 Marine Instr Co Ltd ワイヤボンディング方法
JPH0472637A (ja) * 1990-07-12 1992-03-06 Rohm Co Ltd 集積回路用ボンディング装置
JPH063124A (ja) * 1992-06-19 1994-01-11 Tdk Corp ワイヤーボンディング外観検査装置
JPH0835474A (ja) * 1994-07-26 1996-02-06 Ngk Spark Plug Co Ltd 内燃機関の二次電圧波形検出器
TW560022B (en) * 2001-10-26 2003-11-01 Esec Trading Sa Method for the calibration of a wire bonder
US6709967B2 (en) * 1996-05-28 2004-03-23 Micron Technology, Inc. Laser wire bonding for wire embedded dielectrics to integrated circuits
US6886734B2 (en) * 1996-12-13 2005-05-03 Micron Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
TW200607031A (en) * 2004-08-11 2006-02-16 Advanced Semiconductor Eng Method for auto checking wire bonding parameters
EP1069608B1 (en) * 1999-01-22 2007-03-14 Seiko Epson Corporation Wire bonding method, semiconductor device and wire bonding device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4864514A (en) * 1986-09-02 1989-09-05 Kabushiki Kaisha Toshiba Wire-bonding method and apparatus
JPH02250340A (ja) * 1989-03-24 1990-10-08 Marine Instr Co Ltd ワイヤボンディング方法
JPH0472637A (ja) * 1990-07-12 1992-03-06 Rohm Co Ltd 集積回路用ボンディング装置
JPH063124A (ja) * 1992-06-19 1994-01-11 Tdk Corp ワイヤーボンディング外観検査装置
JPH0835474A (ja) * 1994-07-26 1996-02-06 Ngk Spark Plug Co Ltd 内燃機関の二次電圧波形検出器
US6709967B2 (en) * 1996-05-28 2004-03-23 Micron Technology, Inc. Laser wire bonding for wire embedded dielectrics to integrated circuits
US6886734B2 (en) * 1996-12-13 2005-05-03 Micron Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
EP1069608B1 (en) * 1999-01-22 2007-03-14 Seiko Epson Corporation Wire bonding method, semiconductor device and wire bonding device
TW560022B (en) * 2001-10-26 2003-11-01 Esec Trading Sa Method for the calibration of a wire bonder
TW200607031A (en) * 2004-08-11 2006-02-16 Advanced Semiconductor Eng Method for auto checking wire bonding parameters

Also Published As

Publication number Publication date
TW201125091A (en) 2011-07-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees