TW201118027A - Chip transporting machine table - Google Patents

Chip transporting machine table Download PDF

Info

Publication number
TW201118027A
TW201118027A TW098140801A TW98140801A TW201118027A TW 201118027 A TW201118027 A TW 201118027A TW 098140801 A TW098140801 A TW 098140801A TW 98140801 A TW98140801 A TW 98140801A TW 201118027 A TW201118027 A TW 201118027A
Authority
TW
Taiwan
Prior art keywords
unit
wafer
floating
width
transport unit
Prior art date
Application number
TW098140801A
Other languages
English (en)
Chinese (zh)
Other versions
TWI399332B (enExample
Inventor
zhi-hao Huang
Original Assignee
Schmid Yaya Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schmid Yaya Technology Co Ltd filed Critical Schmid Yaya Technology Co Ltd
Priority to TW098140801A priority Critical patent/TW201118027A/zh
Priority to JP2010070481A priority patent/JP2011119635A/ja
Priority to DE102010021315A priority patent/DE102010021315A1/de
Priority to US12/785,529 priority patent/US20110129322A1/en
Publication of TW201118027A publication Critical patent/TW201118027A/zh
Application granted granted Critical
Publication of TWI399332B publication Critical patent/TWI399332B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW098140801A 2009-11-30 2009-11-30 Chip transporting machine table TW201118027A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW098140801A TW201118027A (en) 2009-11-30 2009-11-30 Chip transporting machine table
JP2010070481A JP2011119635A (ja) 2009-11-30 2010-03-25 ウェハのコンベヤ台
DE102010021315A DE102010021315A1 (de) 2009-11-30 2010-05-22 Waferfördersystem
US12/785,529 US20110129322A1 (en) 2009-11-30 2010-05-24 Wafer conveying system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098140801A TW201118027A (en) 2009-11-30 2009-11-30 Chip transporting machine table

Publications (2)

Publication Number Publication Date
TW201118027A true TW201118027A (en) 2011-06-01
TWI399332B TWI399332B (enExample) 2013-06-21

Family

ID=43927240

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098140801A TW201118027A (en) 2009-11-30 2009-11-30 Chip transporting machine table

Country Status (4)

Country Link
US (1) US20110129322A1 (enExample)
JP (1) JP2011119635A (enExample)
DE (1) DE102010021315A1 (enExample)
TW (1) TW201118027A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113562422B (zh) * 2021-09-26 2021-12-14 中铁九局集团有限公司 一种轨道板运输顶正装置及运输顶正方法
CN115440646B (zh) * 2022-11-04 2023-01-31 阳光中科（福建）能源股份有限公司 太阳能电池片的正片装置以及太阳能电池片的正片方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3603646A (en) * 1970-01-26 1971-09-07 Ibm Semiconductor wafer air slide with controlled wafer motion
US3685632A (en) * 1970-08-27 1972-08-22 Anchor Hocking Corp Pneumatic article spreader
US3706475A (en) * 1971-03-29 1972-12-19 Ibm Air slides
US4306629A (en) * 1979-01-19 1981-12-22 Geosource Inc. Pneumatic weighing device and method
US4348139A (en) * 1980-04-30 1982-09-07 International Business Machines Corp. Gas film wafer transportation system
US4561806A (en) * 1983-01-31 1985-12-31 Precision Metal Fabricators, Inc. Vertical single filer conveyor system
US4676699A (en) * 1985-04-11 1987-06-30 Intel Corporation Semiconductor wafer guides
US4976343A (en) * 1989-09-22 1990-12-11 Fuller Stuart C Ordering apparatus having walls with polygonal rotators
DE69928828T2 (de) * 1998-10-30 2006-09-07 Hi-Speed Checkweigher Co., Inc. Pneumatische wiegevorrichtung mit hoher geschwindigkeit
JP2000159342A (ja) * 1998-11-20 2000-06-13 Daiichi Shisetsu Kogyo Kk 板状部材の搬送装置
JP2003042958A (ja) * 2001-07-30 2003-02-13 V Technology Co Ltd 被検査体の搬送検査装置
US6814533B1 (en) * 2003-11-25 2004-11-09 Prud'homme Hugo Loop conveyor with air cushion transfer
JP2005247444A (ja) * 2004-03-01 2005-09-15 Mitsubishi Materials Techno Corp 単列合流エアフロー装置
TWM286219U (en) * 2005-07-29 2006-01-21 Univ Kao Yuan Improved arranged structure for component
TWM288004U (en) * 2005-10-19 2006-02-21 Utechzone Co Ltd Air-float platform and air-float apparatus having the same
JP4884039B2 (ja) * 2006-03-14 2012-02-22 東京エレクトロン株式会社 基板バッファ装置、基板バッファリング方法、基板処理装置、制御プログラムおよびコンピュータ読取可能な記憶媒体
JP2009014617A (ja) * 2007-07-06 2009-01-22 Olympus Corp 基板外観検査装置

Also Published As

Publication number Publication date
DE102010021315A1 (de) 2011-06-01
US20110129322A1 (en) 2011-06-02
TWI399332B (enExample) 2013-06-21
JP2011119635A (ja) 2011-06-16

Similar Documents

Publication Publication Date Title
TW200947641A (en) Die bonding apparatus
CN109671660B (zh) 电池片的传输机构及太阳能电池焊接机
EP1139303A3 (en) Reversing and aligning mechanism for sheet processing apparatus
JP5558288B2 (ja) 紙葉類検査装置
KR20100134498A (ko) 태양 에너지 실리콘 칩 테스터 및 테스트 방법
CN101799886A (zh) 一种计数合流装置
JP2001327929A (ja) ワーク検査装置
TW201118027A (en) Chip transporting machine table
TWI637928B (zh) Glass plate manufacturing method and glass plate manufacturing device
JP2012096920A (ja) ガラス基板欠陥検査装置及びガラス基板欠陥検査方法並びにガラス基板欠陥検査システム
JP5098780B2 (ja) 紙葉類の供給装置、紙葉類の供給方法、及び、区分装置
WO2011125115A1 (ja) 検査装置及び検査分類装置
JP2004115273A (ja) チップ自動分離搬送装置
CN101740446A (zh) 晶片输送检测机台及其输送检测方法
TW201033600A (en) System and processing of a substrate
CN101740445B (zh) 晶片输送机台
KR20180101208A (ko) 마킹 장치, 결함 검사 시스템 및 필름 제조 방법
JP2014093441A (ja) ウエハ搬送装置およびそれを備えたウエハ検査装置
TW513899B (en) Method for determining a position in a TAB automatic handling machine, and automatic handling machine
US4757904A (en) Apparatus for transporting sheets
TWM316389U (en) Testing machine used for optical thin films
JP5405267B2 (ja) 電子部品搬送装置
JP6434813B2 (ja) 印刷装置、カード保持部材、及び印刷方法
JP2015147599A (ja) ラベル貼付け装置、ラベル貼付け方法、及びプログラム
JP2016132567A (ja) 印刷システム、印刷装置、カード搬送装置、及び印刷方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees