JP2011119635A - ウェハのコンベヤ台 - Google Patents

ウェハのコンベヤ台 Download PDF

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Publication number
JP2011119635A
JP2011119635A JP2010070481A JP2010070481A JP2011119635A JP 2011119635 A JP2011119635 A JP 2011119635A JP 2010070481 A JP2010070481 A JP 2010070481A JP 2010070481 A JP2010070481 A JP 2010070481A JP 2011119635 A JP2011119635 A JP 2011119635A
Authority
JP
Japan
Prior art keywords
wafer
unit
floating
transfer unit
transport unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010070481A
Other languages
English (en)
Japanese (ja)
Inventor
Chih-Hao Huang
黄志浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SCHMID-YAYA TECHNOLOGY CO Ltd
Original Assignee
SCHMID-YAYA TECHNOLOGY CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SCHMID-YAYA TECHNOLOGY CO Ltd filed Critical SCHMID-YAYA TECHNOLOGY CO Ltd
Publication of JP2011119635A publication Critical patent/JP2011119635A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2010070481A 2009-11-30 2010-03-25 ウェハのコンベヤ台 Pending JP2011119635A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW098140801A TW201118027A (en) 2009-11-30 2009-11-30 Chip transporting machine table
TW098140801 2009-11-30

Publications (1)

Publication Number Publication Date
JP2011119635A true JP2011119635A (ja) 2011-06-16

Family

ID=43927240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010070481A Pending JP2011119635A (ja) 2009-11-30 2010-03-25 ウェハのコンベヤ台

Country Status (4)

Country Link
US (1) US20110129322A1 (enExample)
JP (1) JP2011119635A (enExample)
DE (1) DE102010021315A1 (enExample)
TW (1) TW201118027A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113562422B (zh) * 2021-09-26 2021-12-14 中铁九局集团有限公司 一种轨道板运输顶正装置及运输顶正方法
CN115440646B (zh) * 2022-11-04 2023-01-31 阳光中科（福建）能源股份有限公司 太阳能电池片的正片装置以及太阳能电池片的正片方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000159342A (ja) * 1998-11-20 2000-06-13 Daiichi Shisetsu Kogyo Kk 板状部材の搬送装置
JP2003042958A (ja) * 2001-07-30 2003-02-13 V Technology Co Ltd 被検査体の搬送検査装置
JP2005247444A (ja) * 2004-03-01 2005-09-15 Mitsubishi Materials Techno Corp 単列合流エアフロー装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3603646A (en) * 1970-01-26 1971-09-07 Ibm Semiconductor wafer air slide with controlled wafer motion
US3685632A (en) * 1970-08-27 1972-08-22 Anchor Hocking Corp Pneumatic article spreader
US3706475A (en) * 1971-03-29 1972-12-19 Ibm Air slides
US4306629A (en) * 1979-01-19 1981-12-22 Geosource Inc. Pneumatic weighing device and method
US4348139A (en) * 1980-04-30 1982-09-07 International Business Machines Corp. Gas film wafer transportation system
US4561806A (en) * 1983-01-31 1985-12-31 Precision Metal Fabricators, Inc. Vertical single filer conveyor system
US4676699A (en) * 1985-04-11 1987-06-30 Intel Corporation Semiconductor wafer guides
US4976343A (en) * 1989-09-22 1990-12-11 Fuller Stuart C Ordering apparatus having walls with polygonal rotators
EP1125100B1 (en) * 1998-10-30 2005-12-07 Hi-Speed Checkweigher Co., Inc. High speed pneumatic weighing device
US6814533B1 (en) * 2003-11-25 2004-11-09 Prud'homme Hugo Loop conveyor with air cushion transfer
TWM286219U (en) * 2005-07-29 2006-01-21 Univ Kao Yuan Improved arranged structure for component
TWM288004U (en) * 2005-10-19 2006-02-21 Utechzone Co Ltd Air-float platform and air-float apparatus having the same
JP4884039B2 (ja) * 2006-03-14 2012-02-22 東京エレクトロン株式会社 基板バッファ装置、基板バッファリング方法、基板処理装置、制御プログラムおよびコンピュータ読取可能な記憶媒体
JP2009014617A (ja) * 2007-07-06 2009-01-22 Olympus Corp 基板外観検査装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000159342A (ja) * 1998-11-20 2000-06-13 Daiichi Shisetsu Kogyo Kk 板状部材の搬送装置
JP2003042958A (ja) * 2001-07-30 2003-02-13 V Technology Co Ltd 被検査体の搬送検査装置
JP2005247444A (ja) * 2004-03-01 2005-09-15 Mitsubishi Materials Techno Corp 単列合流エアフロー装置

Also Published As

Publication number Publication date
TW201118027A (en) 2011-06-01
US20110129322A1 (en) 2011-06-02
TWI399332B (enExample) 2013-06-21
DE102010021315A1 (de) 2011-06-01

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