TW201038699A - Resin paste for die bonding, process for producing semiconductor device using the resin paste, and semiconductor device - Google Patents

Resin paste for die bonding, process for producing semiconductor device using the resin paste, and semiconductor device Download PDF

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Publication number
TW201038699A
TW201038699A TW099107287A TW99107287A TW201038699A TW 201038699 A TW201038699 A TW 201038699A TW 099107287 A TW099107287 A TW 099107287A TW 99107287 A TW99107287 A TW 99107287A TW 201038699 A TW201038699 A TW 201038699A
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Taiwan
Prior art keywords
wafer
resin paste
resin
semiconductor device
bonding
Prior art date
Application number
TW099107287A
Other languages
English (en)
Inventor
Yoshifumi Sugiura
Seigo Yokochi
Shuuichi Mori
Youji Katayama
Takafumi Doudou
Satoshi Ebana
Original Assignee
Hitachi Chemical Co Ltd
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Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201038699A publication Critical patent/TW201038699A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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  • Epoxy Resins (AREA)

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201038699 六、發明說明： 【發明所屬之技術領域】 本發明係有關作爲1C、LSI等之半導體晶片（ 有時稱爲晶片）與導線框架或絕緣性支持基板等（ 爲基板）之支持構件之接合材料所用之晶片接合用 使用其之半導體裝置的製造方法以及半導體裝置等 D 【先前技術】 作爲IC、LSI等之半導體元件與導線框架或絕 ί寸基板寺之支持構件之接合材料，亦即晶片接合材 以往已知有Au - S i共晶合金、焊錫、銀膏等。然厅 S i共晶合金由於耐熱性及耐濕性高，彈性率大， 用在大型晶片時有容易破裂之傾向。又，Au-Si共 亦有高價之缺點。另一方面，焊錫雖然便宜但耐熱 其彈性率與Au-Si合金一樣高，而難以使用於大型 〇 相對於此，銀膏（例如參考專利文獻1 )爲便 濕性高，相較於Au-Si共晶合金及焊錫彈性率較低 具有可使用於在350°C熱壓著型晶片接合之耐熱性 ，現在在上述晶片接合材料中亦已廣泛使用銀膏。 對應於隨著1C或LSI之高積集化之進展，伴隨於 大型化之狀況’銀膏難以在晶片全面上廣範圍地塗 法稱爲有效率。 另一方面’可對應於晶片大型化之晶片接合材 有使用特定的聚醯亞胺樹脂之接著薄膜，以及於特 以下亦 以下稱 樹脂、 緣性支 料，自 ΐ ' Au-故於使 晶合金 性差， 晶片。 宜 '耐 ，進而 。因此 然而， 此晶片 佈，無 料已知 定聚酶 -5- 201038699 亞胺樹脂中添加導電性塡料或無機塡料之晶片接合用接著 薄膜等之薄膜狀晶片接合材料（參考專利文獻2〜4)。 先前技術文獻 專利文獻 專利文獻1·特開2002-179769號公報 專利文獻2:特開平〇7_228697號公報 專利文獻3 :特開平〇 6 _丨4 5 6 3 9號公報 專利文獻4:特開平〇6_264035號公報 【發明內容】 [發明欲解決的問題] 接著薄膜型之晶片接合材料可容易地在支持基板上形 成晶片接合層。尤其，如專利文獻2〜4所揭示之接著薄膜 ’可較好地對於42合金框架（鐵-鎳合金）等支持基板使 用’進而具有良好的熱時晶片剪切強度之優點。然而，作 爲晶片接合材料之接著薄膜有效率地貼合於支持基板時， 有必要用以預先將接著薄膜切出或衝壓成晶片大小，接著 貼附於支持基板之貼附裝置。又，衝壓出接著薄膜並以一 次貼附複數個晶片量之方法，有容易產生接著薄膜浪費之 傾向。再者，支持基板的大部分由於係在基板內部形成有 內配線層，故貼附接著薄膜之表面大多爲凹凸，而有接著 薄膜貼附時產生空隙，易使半導體裝置的信賴性降低之傾 向。 -6 - 201038699 又，近幾年來，BOC ( Board On Chip )型半導體裝置 備受囑目，並已使用有機基板等之絕緣性支持基板。於使 用上述絕緣性支持基板之半導體裝置之製造步驟，考慮到 絕緣性支持基板之耐熱性等，有必要在例如20CTC以下之 較低溫度搭載半導體元件。然而，如專利文獻2~4所揭示 之接著薄膜有低溫接著性差的傾向，大多有在比較低溫（ 2 00°C以下）難以貼附晶片之情況。因此，於BOC型半導 〇 體裝置的製造中，低溫接著性優異之晶片接合用樹脂膏備 受關注。 使用晶片接合用樹脂膏貼附晶片的方法，一般爲例如 使塗佈在基板上之晶片接合用樹脂膏經B階段化後，於此 時使晶片加熱壓著而暫時接著，爲使晶片與基板完全固定 而在1 8(TC進行1小時左右之後硬化。通常，若省略晶片 接合用樹脂膏之後硬化，則晶片與基板等之接著性變得不 充分，而在金屬線接合步驟中，有發生晶片震動之缺陷的 〇 可能性。又，於封裝步驟中，若晶片與基板等之接著性不 充分，則自晶片側面流下封裝材而有使晶片剝離之情況。 然而，最近，由縮短半導體封裝之組裝時間之觀點而 言，要求有即使省略後硬化，於金屬線接合及封裝步驟中 亦不會產生缺陷之晶片接合用樹脂膏。因此，於省略後硬 化步驟而使用晶片接合用樹脂膏之貼附方法中，B階段化 狀態之晶片接合用樹脂膏之層，有必要具備與晶片之良好 接著性。又，亦期望不因B階段化之溫度範圍而對影響與 晶片之接著性，亦即在廣的溫度範圍具有良好接著強度之 201038699 晶片接合用樹脂膏。又，於晶片貼附時，於B階段化狀態 之晶片接合用樹脂膏之層與晶片間有產生空隙（以下稱爲 孔隙）之情況，亦期望孔隙得以減低。孔隙大時，於焊錫 回焊步驟中於晶片接合材料容易產生龜裂，而有使半導體 裝置之信賴性降低之可能性。 又，於封裝步驟後，有焊錫回焊步驟，此時之最高溫 度爲2 50 °C〜260 °C ’故對晶片接合用樹脂膏亦要求有在 250°C〜260°C之加熱時晶片剪切強度優異。 本發明係鑒於此等情況而完成者，目的在於提供一種 在B階段化中，在廣溫度範圍內與晶片之接著強度優異同 時亦可降低與晶片間之孔隙，且即使在焊錫回焊步驟中亦 具有加熱時之充分晶片剪切強度之晶片接合用樹脂膏。又 ，本發明目的在於提供一種使用上述晶片接合用樹脂膏之 半導體裝置之製造方法。進而，本發明之目的在於提供一 種使用上述晶片接合用樹脂膏之信賴性優異之半導體裝置 [用以解決問題之手段] 爲達成上述問題，本發明採用以下構成。亦即，本發 明之一實施形態，係有關一種晶片接合用樹脂膏，其包含 使具有羧基之丁二烯之聚合物（al)及具有環氧基之化合 物（a2 )反應獲得之聚合物（A )、熱硬化性樹脂（B ) 及塡料（C )。 本發明之另一實施形態，係有關一種半導體裝置之製 -8 - 201038699 造方法’其係使用上述晶片接合用樹脂膏之半導體裝置之 製造方法，其包含（1)在基板上塗佈上述晶片接合用樹 脂膏之步驟，（2 )使前述樹脂膏乾燥並使樹脂膏b階段 化之步驟’ （3 )於經B階段化之前述樹脂膏上搭載半導 體晶片之步驟。 本發明之另一實施形態，係有關一種半導體裝置，其 係由有關使用上述晶片接合用樹脂膏之半導體裝置之製造 〇 方法製得者’該方法包含（1)在基板上塗佈上述晶片接 合用樹脂膏之步驟，（2)使前述樹脂膏乾燥並使樹脂膏 B階段化之步驟’ （3 )於經B階段化之前述樹脂膏上搭 載半導體晶片之步驟。 本發明之另一實施形態，係有關一種半導體裝置之製 造方法，其包含（1)於基板上塗佈上述晶片接合用樹脂 膏之步驟，（2)於塗佈之樹脂膏上搭載半導體晶片之步 驟’（3 )利用封裝劑封裝前述半導體晶片之步驟。 〇 進而本發明之另一實施形態’係有關一種由半導體裝 置之製造方法所得之半導體裝置，該製造方法包含（1) 於基板上塗佈上述晶片接合用樹脂膏之步驟，（2 )於塗 佈之樹脂膏上搭載半導體晶片之步驟，（3 )利用封裝劑 封裝前述半導體晶片之步驟。 本說明書之揭示係有關日本專利申請特願2009-07053 1號（2009年3月23日申請）中所含之主題，該等 申請說明書以全文參照之方式倂入本文供參考。 201038699 [發明效果] 依據本發明之一實施形態，可提供在B階段化中，在 廣溫度範圍內具有與晶片之良好接著強度同時亦可降低與 晶片間之孔隙，且即使在焊錫回焊步驟中加熱時亦具有充 分的晶片剪切強度之晶片接合用樹脂膏。又，依據本發明 之一實施形態，即使省略晶片貼附後之後硬化，於金屬線 接合及封裝步驟中亦不會產生缺陷，故可縮短製造步驟。 依據本發明之一實施形態之晶片接合用樹脂膏，由於 其低溫接著性優異，故可適當作爲晶片接合材而使用於有 機基板等之絕緣性支持基板。又，依據本發明之一實施形 態’藉由使用上述本發明之晶片接合用樹脂膏，可提供作 業丨生優異之半導體裝置之製造方法。再者，依據本發明之 一實施形態，藉由使用上述本發明之晶片接合用樹脂膏， 可提供信賴性優異之半導體裝置。 【實施方式】 以下’依據情況參考圖式對本發明之較佳實施形態加 以詳細說明。又，圖式中，相同或相當部份賦予相同符號 ’並省略重複說明。又，本發明中，所謂「B階段化」意 指晶片接合用樹脂膏塗佈後經熱處理使溶劑（D )揮發， 使經塗佈之晶片接合用樹脂膏成乾燥狀態，且於該狀態晶 片接合用樹脂膏未完全硬化。所謂完全硬化係定義爲以 DSC (不差掃描卡 g十’ Differential scaning calorimetry) 之測定中’在8 0〜1 8 0 °C (升溫速度：1 〇。<： /分鐘）之範圍 -10- 201038699 無吸熱峰之狀態，後文有時亦稱爲「後硬化」。 以下，對本發明更詳細加以說明。 本發明之晶片接合用樹脂膏（以下有時亦僅稱爲「樹 脂膏」）包含使具有羧基之丁二烯之聚合物（al)與具有 環氧基之化合物（a2)反應而得之聚合物（A)、熱硬化 性樹脂（B )以及塡料（C )。 〇 [具有羧基之丁二烯之聚合物（al )] 作爲具有羧基之丁二烯之聚合物（以下有時簡稱爲成 分（al))，只要是具有丁二烯構造及羧基則並未特別限 制。例如，可爲由丁二烯衍生之丁二烯構造與具有羧基之 化合物之共聚物。又，亦可爲以丁二烯與丙烯腈等之其他 聚合性化合物之共聚物作爲主鏈，於其末端之至少一端具 有羧基者。由印刷性、接著強度及作業性之觀點觀之，成 分（al)之數平均分子量較好爲 500~1 0000，更好爲 〇 100〇〜7000。本發明中，前述成分（al)更好爲以下述通 式（1)表示之具有羧基之丁二烯-丙烯腈共聚物。 [化1] HOOC- -fCH2-CH=CH-CH2)^(CH2-CH-}
-COOH (l)
CN
[通式（1)中，x/y爲95/5〜50/50，η爲5〜50之整數]。 以上述通式（1 )表示之化合物亦可以市售品獲得。 以前述通式（1)表示之具有羧基之丁二烯-丙烯腈共 聚物例如可以 Hycar CTBN-2009xl62、CTBN-1300x31、 -11 - 201038699 CTBN-l 3 00 x 8 ' CTBN- 1 3 00x 1 3 ' CTBNX- 1 3 00 x 9 (均爲宇 部興產股份有限公司製）之市售品獲得。又本發明中之較 佳成分（a 1)之例，舉例有爲具有羧基之低分子量液狀聚 丁二烯的NISSO-PB-C-2000 (日本曹達股份有限公司製， 商品名）（日本曹達（股）製，商品名）等。 該等可單獨使用或組合兩種以上使用。 [具有環氧基之化合物（a2 )] 作爲具有環氧基之化合物（以下有時簡稱爲（a2 )成 分）並無特別限制，但可舉例爲例如乙二醇二縮水甘油醚 、二乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、二丙二 醇二縮水甘油醚、甘油三縮水甘油醚等之縮水甘油醚型環 氧化合物；二聚酸等之以多元羧酸與其酸酐作爲原料之縮 水甘油酯型環氧化合物；以脂肪族胺作爲原料之縮水甘油 基胺型環氧化合物等之脂肪族環氧化合物；由氫醌、甲基 氫醌、二甲基氫醌、三甲基氫醌、間苯二酚、甲基間苯二 酚、兒茶酚、甲基兒茶酚、二酚、四甲基二酚、二羥基萘 、二羥基甲基萘、二羥基二甲基萘、雙（4-羥基苯基）酮 、雙（4-羥基-3,5_二甲基苯基）酮、雙（4_羥基-3,5-二氯 苯基）酮、雙（4-羥基苯基）颯、雙（4-羥基-3,5-二甲基 苯基）楓、雙（4_羥基-3,5-二氯苯基）颯、雙（4-羥基苯 基）六氟丙烷、雙（4-羥基-3,5-二甲基苯基）六氟丙烷、 雙（4-羥基-3,5-二氯苯基）六氟丙烷、雙（4-羥基苯基） 二甲基矽烷、雙（[羥基-3,5_二甲基苯基）二甲基矽烷、 12- 201038699 雙（4-羥基-3,5-二氯苯基）二甲基矽烷、雙（4-羥基苯基 )甲烷、雙（4 -羥基_3,5_二氯苯基）甲烷、雙（4_羥基_ 3,5 -二溴苯基）甲烷、2,2 -雙（4 -羥基苯基）丙烷、2,2 -雙 (4-羥基-3,5-二甲基苯基）丙烷、2,2-雙（4-羥基-3,5-二 氯苯基）丙烷、2,2 -雙（4_羥基_3_甲基苯基）丙烷' 2,2_ 雙（4 -羥基-3-氯苯基）丙烷、雙-羥基苯基）醚、雙（ 4 -羥基-3,5 -二甲基苯基）醚、雙（4_羥基-3, 5 -二氯苯基） 〇 醚、9,9·雙（4_羥基苯基）蕗、9,9-雙（4-羥基-3-甲基苯 基）莽、9,9·雙（4-羥基-3_氯苯基）蒹、9,9·雙（4-羥基_ 3-溴苯基）莽、9,9 -雙（4 -羥基-3-氟苯基）莽、9,9 -雙（ 4_羥基-3-甲氧基苯基）莽、9,9_雙（4_羥基-3,5_二甲基苯 基）荛、9,9-雙（4-羥基_3,5_二氯苯基）葬、9,9-雙（4-經基-3,5 -二溴苯基）蒔等之1種以上與環氧鹵丙烷縮合所 得之二縮水甘油基化合物等之具有芳香環之環氧化合物等 之1分子內具有2個環氧基之化合物。 〇 又’亦可使用酚之縮水甘油醚型之環氧樹脂。作爲此 等樹脂，舉例有雙酚A、雙酚AD、雙酚S、雙酚F或鹵 化雙酚A與環氧氯丙烷之縮合物、酚類酚醛樹脂之縮水 甘油醚、甲酚酚醛樹脂之縮水甘油醚、雙酚A酚醛樹脂 之縮水甘油醚等。該等可單獨或組合兩種以上使用。該等 環氧化合物中’由樹脂強度之觀點而言，最好爲以下述通 式（2)表示之環氧化合物。 201038699 [化2]
;R1及R2各獨立爲氫原子、碳數1〜6之烷基或鹵素原子 ;m及η各獨立表不1〜4之整數；又，η爲2以上時，複 數個存在之R1可爲相同亦可相異’《^爲2以上時，複數 個存在之R2可爲相同亦可相異]。 該等具有環氧基之化合物可單獨或組合兩種以上使用 [聚合物（A )] 聚合物（A)係由成分（al)及成分（a2)反應獲得 。此時之配合比，相對於成分（a 1 )之1羧酸當量，成分 (a2 )之環氧當量，若考慮接著強度則爲0.01以上，若 考慮因逸出氣體產生而引起剝離困難則較好爲1 〇以下， 更好爲〇，1〜2，最好爲0.25〜1。 聚合物（A)之黏度，可藉由合成時之反應溫度及反 應溫度而調整，藉提高反應溫度或增長反應時間，成爲黏 度變高之傾向。聚合物（A)之較佳黏度，由可提高接著 強度之觀點而言，爲150 Pa. s以上，更好爲300〜900 Pa -14- 201038699 .S ’最好爲500〜700 Pa . s。尤其以較佳之材料比，使具 有羧基之丁二烯之均聚物或共聚物與具有環氧基之化合物 反應，進而黏度設爲300 pa. s以上時，就可更提高成爲 樹脂膏時之接著強度之觀點而言爲較佳，爲900 Pa. s以 下時成爲樹脂膏時之作業性變良好。 聚合物（A)之重量平均分子量較好爲5000以上， 更好爲15000〜70000，最好爲17000〜40000。重量平均分 0 子量若爲5000以上，則接著強度更優異，若小於70000 ，則成爲樹脂膏時之作業性可更提高。 又，重量平均分子量（Mw)及數平均分子量（Μη) 可藉由凝膠滲透層析儀（GPC )測定（使用標準聚苯乙烯 由校正線換算）。 又，聚合物（A )之酸價較好爲1 〇〜25 mg KOH/g，更 好爲 15〜23 mg KOH/g。 酸價若爲10〜25 mg KOH/g，則成爲樹脂膏時之作業 〇 性可更提高。 上述聚合物（A)之酸價可由以下方法測定。首先， 精秤約1 g之聚合物（A )之樹脂溶液後，於該樹脂溶液 中添加丙酮3 0 g，使樹脂溶液均一溶解。接著，於該溶液 中適量添加作爲指示劑之酚酞，使用0.1N之KOH水溶液 進行滴定。接著，由滴定結果以下式（3)算出酸價。 A= 1〇xVfx56. 1 / (W p x I ).....(3) -15- 201038699 又’式（3)中’ a表示酸價（mg KOH/g) ，Vf表示 酣献之滴定量（mL) ’ Wp表示聚合物（A )之樹脂溶液 重量（g ) ’ 1表示聚合物（A )之樹脂溶液之不揮發份比 例（質量％ )。 (A )成分之含有率，就基板與晶片間之應力緩和性 以及接著強度之觀點而言，於（A)成分及（B)成分之 總量中，較好爲5〇〜9ξ)重量％，更好爲75~97重量％，最 好爲80~95重量％。 [熱硬化性樹脂（B )] 作爲熱硬化性樹脂（B )，並無特別限定，舉例有例 如環氧樹脂、酚樹脂、1分子中具有至少2個熱硬化性醯 亞胺基之醯亞胺化合物等。該等可單獨使用1種或組合2 種以上使用。 前述環氧樹脂爲分子內至少具有2個環氧基者，由加 熱時晶片剪切強度之觀點觀之，較好爲酚之縮水甘油醚型 之環氧樹脂。作爲該等樹脂，舉例有雙酚A、雙酚AD、 雙酚S、雙酚F或鹵化雙酚A與環氧氯丙烷之縮合物，酚 型酚醛樹脂之縮水甘油醚、甲酚酚醛樹脂之縮水甘油醚、 雙酚A酚醛樹脂之縮水甘油醚等。該等可單獨使用1種 或組合2種以上使用。 使用環氧樹脂時之含有量’由加熱時晶片剪切強度之 觀點觀之，對於聚合物（A) 100重量份較好爲1〜100質 量份’更好爲2〜50質量份’最好爲3〜20質量份。 -16- 201038699 前述酣樹脂爲分子中具有至少兩個酣性經基者，舉例 爲例如酚型酚醛樹脂、甲酚酚醛樹脂、雙酚A型酣醒樹 月旨 '聚-對-乙烯基酚、酚醇酸樹脂等。該等可單獨使用1 種或組合2種以上使用。 使用前述酚樹脂時之含有量，若考慮加熱時晶片剪切 強度以及半導體封裝信賴性，則相對於聚合物（A ) 1 0 0 重量份’較好爲0·5~100質量份，更好爲uo質量份， 最好爲2~20質量份。 就可提高半導體封裝信賴性之觀點而言，較好倂用環 氧樹脂與酚樹脂。 至於前述1分子中具有至少2個熱硬化性醯亞胺基之 醯亞胺化合物，舉例有例如鄰-雙馬來醯亞胺苯、間-雙馬 來醯亞胺苯 '對-雙馬來酿亞胺苯、1，4_雙（對-馬來酸亞 胺對-異丙基苯基）苯、1，4 -雙（間-馬來醯亞胺對—異丙基 苯基）苯等。該等可單獨使用1種或組合2種以上使用。 〇 再者’亦較好使用以下述式（I)〜（III)表示之醯亞 胺化合物等。 -17- 201038699 [化3]
[式中，X，或 Y 表示 0、CH2、CF2' S〇2、s、CO、c( CH3) 2 或 C ( CF3) 2 ; Rl、Κ·2、R3、R4、R5、R6、R7 及 各獨立表示氫、低級院基、低級院氧基、氟、氣或溴 ;D表示具有乙烯性不飽和雙鍵之二羧酸殘基；m’表示 0〜4之整數]。 使用醯亞胺化合物時之含有量’若考慮樹脂膏之保存 安定性，則相對於聚合物（A ) 1 00重量份’更好爲小於 1 0 0重量份。 作爲式（I )之醯亞胺化合物’舉例有例如4，4 -雙馬 來醯亞胺二苯基醚、4,4 -雙馬來醯亞胺二苯基甲烷、4,4-雙馬來醯亞胺_3，3，_二甲基-二苯基甲院、4,4·雙馬來醯亞 胺二苯基碾、4,4·雙馬來醯亞胺二苯基亞颯、4,4-雙馬來 醯亞胺二苯基酮、2,2’ -雙（4 -馬來醯亞胺苯基）丙烷、 4,4 -雙馬來醯亞胺二苯基氟甲烷、丨，1，1，3, 3，3·六氟-2，2 -雙 -18- 201038699 (4-馬來醯亞胺苯基）丙烷等。 作爲式（II )之醯亞胺化合物舉例有例如雙[4- ( 馬 來醯亞胺苯氧基）苯基]醚、雙[4_( 4-馬來醯亞胺苯氧基 )苯基]甲烷、雙[4-(4-馬來醯亞胺苯氧基）苯基]氟甲烷 、雙[4- (4-馬來醯亞胺苯氧基）苯基]颯、雙[4_ (3-馬來 醯亞胺苯氧基）苯基]颯、雙[4- ( 4-馬來醯亞胺苯氧基） 苯基]硫醚、雙[4- (4 -馬來醯亞胺苯氧基）苯基]酮、2,2-0 雙[4- (4-馬來醯亞胺苯氧基）苯基]丙烷、1，1，1，3,3,3·六 氟-2,2-雙[4- (4-馬來醯亞胺苯氧基）苯基]丙烷等。 爲促進該等醯亞胺化合物之硬化’亦可使用自由基聚 合劑。作爲自由基聚合劑’舉例有乙醯基環己基磺基過氧 化物、異丁醯過氧化物、苯甲醯基過氧化物、辛醯基過氧 化物、乙醯基過氧化物、二異丙苯基過氧化物、異丙苹過 氧化氫、偶氮雙異丁腈等。使用自由基聚合劑時之含有量 ，相對於醯亞胺化合物1 〇 〇重量份，較好爲0 _01 ~1.0重 Q 量％。 (B)成分的熱硬化性樹脂之含有量’於B階段化在 較高溫進行時，由在隨後之晶片加熱壓著時提高晶片接合 層之濡濕展開之觀點而言，相對於上述成分（A ) 1 00質 量份，較好爲1〜100質量份，更好爲3~30質量份’最好 爲5〜20質量份。 [塡料（C )] 作爲塡料（C )，舉例有例如銀粉、金粉、銅粉等之 -19- 201038699 導電性塡料；氧化砂、氧化鋁、氧化 陶瓷等之無機物質塡料等，但不限定 單獨使用1種或可組合2種以上使用 塡料（C)中，銀粉 '金粉、銅 提闻晶片接合材料之導電性、傳熱性 。又，氧化矽、氧化鋁、氧化鈦、玻 之無機物質塡料可提高晶片接合材料 濕率及觸變性。 該等中’由半導體封裝之信賴性 最好爲氧化砂。 塡料（C )，若考慮半導體封裝 均粒徑爲 Ο.ΟΟΙμπι〜ΙΟμτη，更好爲 0.0 1 〜1 μτη。 作爲提高半導體裝置之電性信賴 添加無機離子交換體。作爲無機離子 化物於熱水中進行萃取時，可有效判 所萃取出之離子例如Na+、K+、C1—、 子之作用者。作爲該等離子交換體其 出之沸石、沸石類、酸性白土、白雲 然礦物；人工合成之合成沸石等。 該等導電性塡料或無機物質塡料 而使用。在不損及物性之範圍內，亦 料之1種以上及無機物質塡料之1種 塡料（c )之含有量，相對於上； 鈦、玻璃、氧化鐵、 於上述之例。該等可 〇 粉等之導電性塡料可 以及樹脂膏之觸變性 璃、氧化鐵、陶瓷等 之低熱膨脹性、低吸 之觀點而言，大致上 信賴性，則較好爲平 0.005μηι〜5μιη，最好 丨性之塡料（C )亦可 交換體，於樹脂膏硬 定具有捕捉水溶液中 F·、RCOO·、Βγ·等離 例舉例有例如天然產 石、水滑石類等之天 亦可各混合2種以上 可混合使用導電性塡 以上。 並聚合物（A ) 1 0 〇質 -20- 201038699 量份，若考慮樹脂膏之觸變指數（1 .5以上）， 1重量份以上，若考慮接著強度、硬化物之彈性 接合材料之應力緩和能以及半導體裝置之安裝信 較好爲100質量份以下。更好爲2〜50質量份 3〜3 〇質量份。又，於b階段化在較低溫進行時 制隨後之晶片加熱壓著時之晶片接合層之濡濕展 而言’較好爲1 0質量份以上。 〇 塡料（c )之混合、混練係適宜地組合一般 、擂潰機、三輥混合機、球磨機等之分散機。 [溶劑（D )] 本發明之樹脂膏亦可含有溶劑（D )。溶齊! 好自可均一混練或分散塡料之有機溶劑中加以選 到印刷時防止有機溶劑之揮發發散以及B階段化 性’較好選擇沸點（大氣壓）爲1 00。(：以上且小 〇 之有機溶劑。 作爲該等有機溶劑，舉例有N -甲基-2 - Π比略 乙二醇二甲醚（亦稱爲二甘醇二甲醚）、三乙二 (亦稱爲三甘醇二甲醚）、二乙二醇二乙醚、2-基乙氧基）乙醇、丁內酯、異佛爾酮、卡必 醇乙酸酯、1，3-二甲基-2-咪唑啶酮、乙酸2- (2-氧基）乙酯、乙基溶纖劑、乙基溶纖劑乙酸酯、 劑、二噁烷、環己酮、苯甲醚 '以石油蒸餾物爲 劑等。該等可單獨使用1種或可組合2種以上使 則較好爲 率、晶片 賴性，則 *最好爲 ，由可抑 開之觀點 之攪拌機 1 ( D )較 擇。考慮 時之乾燥 於 2 5 0 〇C 啶酮、二 醇二甲醚 • ( 2-甲氧 醇、卡必 丁氧基乙 丁基溶纖 主體之溶 用。 -21 - 201038699 該等溶劑中，由吸水性低之觀點而言’最好爲卡必醇 乙酸酯。 使用溶劑（D )時之含有量’由印刷性之觀點而言’ 相對於聚合物（A) 100質量份，較好爲5~2〇〇質量份’ 更好爲10〜100質量份，最好爲30~80質量份。 又’樹脂膏於不使用溶劑（D )時’可省略B階段化 之步驟。未使用溶劑（D)時，由印刷性之觀點觀之’熱 硬化性樹脂（B )較好於常溫下爲液狀。 [硬化促進劑（E)] 本發明之樹脂膏較好含有硬化促進劑（E )。硬化促 進劑（E )可促進熱硬化性樹脂（B )之硬化。尤其使用 環氧樹脂作爲熱硬化性樹脂（B )時特別有效° 作爲硬化促進劑（E )，舉例有例如咪哩類、二氰基 二醯胺衍生物、二羧酸二醯肼、三苯膦、四苯基錢四苯基 硼酸鹽、2 -乙基-4-甲基咪唑四苯基硼酸酯、丨，8·二氮雜雙 環（5,4,0) Η——碳烯-7 -四苯基硼酸酯等。該等可單獨使 用1種或可組合2種以上使用。 使用硬化促進劑（Ε )時之含有量’相對於熱硬化性 樹脂（Β ) 1 0 0質量份，較好爲0.0 1質量份’若考慮樹脂 膏之保存安定性則較好爲20質量份以下。更好爲0·1〜10 重量份，最好爲0.5〜5重量份。 [其他成分] -22 - 201038699 進而於本發明之樹脂膏中’依據需要可添加消泡劑、 破泡劑、抑泡劑、矽烷系偶合劑、鈦系偶合劑、非離子系 界面活性劑、氟系界面活性劑、聚矽氧系可塑劑等之各種 添加劑。 上述各成分可使用例如高速分散機等混練機，以葉片 1 Orpra混合.攪拌1 〇分鐘，獲得樹脂膏。 樹脂膏硬化後（於1 8 0 °C下1小時，以厚度1 〇 〇 μ m硬 0 化時）之彈性率，亦即樹脂膏硬化物之彈性率，若考慮基 板與晶片不易偏離以及組裝作業，較好爲1 MP a以上，若 考慮基板與晶片間之應力緩和性及半導體封裝之耐溫度循 環性，較好爲300MPa以下。 上述彈性率爲以動態黏彈性測定裝置測定乾燥硬化後 之樹脂膏硬化物之儲存彈性率E ’時成爲2 5 °C之値。所謂 「乾燥硬化後」意指使樹脂成分完全硬化後者，例如，塗 佈樹脂膏且經B階段化後以乾燥機等在1 80°C加熱1小時 〇 再者，樹脂膏之固體成分濃度較好爲20〜95重量％， 更好爲40〜90重量％以上，最好爲60〜80重量％。上述固 體成分若爲20重量％以上，基於樹脂膏乾燥後之體積減 少之形狀變化抑制之觀點而§爲較佳’若爲95重量％以 下，則可提高樹脂膏之流動性與印刷作業性。 樹脂膏之觸變性指數較好爲1.5〜10.0，更好爲 2.0〜7.0，最好爲3.0〜5.0。樹脂膏之觸變性指數爲1.5以 上時’就抑制以印刷法供給•塗佈樹脂膏塌邊等之發生， -23- 201038699 且良好地保有印刷形狀之觀點而言爲較佳。再者，若該觸 變指數爲1 0 · 0以下，就抑制以印刷法供給.塗佈樹脂膏 時之「碎片」或留白等之發生之觀點而言爲較佳。 樹月曰霄之黏度（25C )較好爲5〜1000 Pa· s，更好爲 20~5 00 Pa · s，最好爲50〜200 pa · s。樹脂膏之黏度爲 5〜1 000 Pa · s時’就印刷性之觀點而言爲較佳。樹脂膏之 黏度較好依據印刷法之種類適當調整，例如，如絲網網版 等之在遮罩開口部張開網目時’考慮網目部份之透過性， 較好在5〜100 Pa . s之範圍，刻花模版等時較好調整爲 20~500 Pa · s之範圍。又，於B階段化之晶片接合層中 見到多數殘存之孔隙時，較好調整成1 5 〇 P a · s以下之黏 度。 上述黏度係使用E型旋轉黏度計，在251，以轉數 0.5rpm測定時之値。觸變指數定義爲以e型旋轉黏度計 ’在2 5 °C以轉數0.5 r p m測定時之値，與以轉數5 r p m測 定時之値之比（觸變指數=(於0.5rpm之黏度）/(於 5rpm之黏度））。 [半導體裝置（半導體封裝）之製造] 以下針對半導體裝置之製造方法加以說明。 圖1爲顯示半導體裝置之製造步驟之一例之示意圖。 首先，將本發明之樹脂膏印刷於被印刷體上。作爲被 印刷體列舉爲42合金導線框架或銅導線框架等導線框架 :或聚醯亞胺樹脂、環氧樹脂、聚醯亞胺系樹脂等之塑膠 -24- 201038699 膜；進而爲於玻璃不織布等之基材中含浸·硬化聚醯亞胺 樹脂、環氧樹脂、聚醯亞胺系樹脂等之塑膠而成者；或者 氧化鋁等之陶瓷製等之絕緣性支撐基板。印刷方法列舉爲 例如網版印刷法。具體而言亦可如圖1 ( a )所示，使用 刮板1 03 ’透過金屬遮罩1 02，於基板1 01上塗佈本發明 之樹脂膏104而成。 接著，使塗佈之樹脂膏經熱處理使溶劑乾燥（B階段 ¢) 化），獲得B階段化之晶片接合層（圖1(b))。據此 ，獲得形成有B階段化狀態之樹脂膏之層（以下稱爲晶片 接合層）之支撐基板。B階段化之溫度較好爲1 〇 〇〜2 0 0 °C ’更好爲12〇〜180°C。B階段化之時間，就作業效率之觀 點而言’較好爲1 20分鐘以下，使用溶劑（D )時就提高 揮發率之觀點而言，較好爲5分鐘以上。又，B階段化之 條件就防止晶片接合層龜裂之觀點而言，較好使自室溫之 升溫及朝室溫之降溫步驟在10分鐘以上緩緩加熱、降溫
G 接著，於形成該晶片接合層之支撐基板上貼附I c、 LSI等半導體元件（晶片）’並加熱將晶片壓著在支撐基 板上。如圖1(c)所示，亦可在載置於熱源106上之晶 片1 〇 7上貼附基板之晶片接合層側。加熱溫度在使用有機 基板等時’就有機基板之耐熱性觀點而言較好爲20(TC以 下，就接著強度之觀點而言較好爲100〜200。〇。 接著，於使晶片接合層後硬化之步驟，獲得硬化狀態 之晶片接合層1 08，將晶片搭載於支撐基板上（圖d ) -25- 201038699 )。晶片接合層之後硬化，在無安裝組裝步驟的問題時亦 可與封裝材之後硬化步驟時一起進行。此處所謂安裝組裝 步驟的問題係指晶片與基板等之固定不充分時，在金屬線 接合步驟之際，晶片振動而於金屬線接合產生缺陷，或者 由於封裝步驟之際晶片在基板上之固定不足，因封裝材自 晶片側面流動而造成晶片剝離。 接著，亦可以金屬線1 09將基板與晶片電性連接（圖 1 ( e ) ) ° 接著，亦可將搭載晶片之基板配置於模具內，利用擠 出機1 1 1將封裝材1 1 2塡充於模具1 1 0內並進行封裝（圖 1 ( f) ) ° 本發明之半導體裝置之製造方法亦可包含以上各步驟 ’本發明之半導體裝置可利用包含以上各步驟之製造方法 製造。 圖2爲顯示本發明之半導體裝置之一實施形態的 BOC型半導體裝置之構造之示意剖面圖。B0C型半導體 裝置100具有下述構造：在中央部設有窗之基板2之一面 上，透過晶片接合層4搭載半導體元件6，在基板2之與 半導體元件搭載面相反之面上形成配線圖型8、絕緣層χ 〇 及焊錫球1 2，藉由金屬線1 4連接半導體元件2之端子部 (未圖示）與配線圖型8，且進一步藉由樹脂等封裝材16 至少封裝其連接部。本發明之樹脂膏在加熱1C、LSI等半 導體元件（晶片）並貼附之步驟中，由於可於100〜200。(： 接合，故特別適用於使用有機基板之BOC型半導體裝置 -26- 201038699 之製造。然而，本發明之樹脂膏並不限於BOC型半導體 裝置之製造，亦可適當地使用於具有其他構成之半導體裝 置（例如’圖3所示之導線框架型半導體裝置）之製造中 〇 圖3之導線框架型半導體裝置中，矽晶片201係利用 樹脂膏202固定於導線框架203上，矽晶片上之A1焊墊 204與導線框架上之Ag鍍層2〇5係藉由金線206予以電 0 性連接。 藉由封裝樹脂2 07對該等進行封裝時，對突出至外部 之導線框架之端部施加外部鍍層2 0 8。 上述樹脂膏雖含有溶劑，但使用於半導體裝置之製造 方法之際，由於乾燥步驟中藉由B階段化溶劑大部分已揮 發，故於晶片接合層中之孔隙少，可組裝具有良好安裝信 賴性之半導體裝置。 另一方面，利用印刷法塗佈樹脂膏之後，只要對半導 〇 體封裝之信賴性不產生影響，則亦可不經B階段化而貼附 半導體元件（晶片），隨後，加熱，將晶片接合於支撐基 板上。進而亦可省略封裝劑之硬化步驟。再者亦可省略B 階段化與封裝劑之硬化步驟二者。 因此，另一本發明之半導體裝置之製造方法爲包含在 基板上塗佈特定量之上述樹脂膏，於樹脂膏上搭載晶片， 使樹脂膏中之樹脂硬化之各步驟，另一本發明之半導體裝 置係利用包含以上各步驟之製造方法製造者。 -27- 201038699 實施例 以下，藉由實施例更具體說明本發明。 (合成例1 ) 秤取100重量份之作爲成分（al)之CTBNX- 1300X9 (宇部興產股份有限公司製造，含有羧基之丙烯腈聚丁二 烯共聚物之商品名，丙烯腈含量約爲1 7重量％ )及1 0重 量份之作爲成分（a2 )之EXA-83 0CRP ( DIC股份有限公 司製造’通式（2)中X爲-CHz-'R1及R2爲氫原子，η 及m爲4之雙酚F型環氧化合物），並添加於燒瓶中。 在145°C下邊加熱該等（羧酸當量：環氧當量=1: 1)邊 攪拌1小時，獲得作爲聚合物（A )之樹脂A。黏度爲 450 Pa· s。重量平均分子量（Mw)爲25000。 (合成例2 ) 除將攪拌時間自1小時變更爲3 0分鐘以外，餘如合 成例1般，獲得樹脂B。黏度爲l88Pa . s。重量平均分子 量（Mw )爲 1 70〇〇。 (合成例3 ) 除將攪拌時間自1小時變更爲1小時4 5分鐘以外’ 餘如合成例1般，獲得樹脂C。黏度爲962 Pa· s。重量 平均分子量（Mw)爲37000。 -28- 201038699 (合成例4 ) 除將成分（a2)之EXA-830CRP之量自ι〇重量份變 更爲2 · 5重量份以外，餘如實施例1般，獲得樹脂〇 (羧 酸當量：環氧當量=1: 0.25)。黏度爲212 Pa· s。重量 平均分子量（Mw)爲1 8700 ° (合成例5) Ο 除將成分（a2)之EXA-83 0CRP之量自10重量份變 更爲1 〇〇重量份以外，餘如實施例1般，獲得樹脂E (羧 酸當量：環氧當量=1: 1〇)。黏度爲472 Pa· s。重量平 均分子量（Mw )爲23 500。 (合成例6 ) 除將成分（a2)自10重量份之EXA-830CRP變更爲 10重量份之R171〇(雙酚AD型’三井化學股份有限公司 〇 製造）以外，餘如實施例1般’獲得樹脂F (羧酸當量： 環氧當量=1: 1)。黏度爲412 Pa. S。重量平均分子量（ Mw)爲 25000。 黏度之測定方法如下。 以東機產業股份有限公司製造之E型黏度劑，使用直 徑19.4mm，3 °角錐，測定於 25 °C之樹脂膏之黏度（ 0.5 rpm )。 分子量之測定方法係使用GPC，以下列條件測定。 機種：日立 L6000 -29- 201038699
檢測器··日立 L-3 300 RI
數據處理機：ATT
管柱：Gelpack GL-R440+ Gelpack GL-R450+ Gelpack GL-R400M 管柱尺寸：10.7mm<i)x300mm
溶劑：T H F 試料濃度：120mg/5ml 注入量：200μ1 壓力：3 4kgf/cm2 流量：2.05ml/min (實施例1 ) 秤取80重量份之作爲聚合物（A )(基底樹脂）之 樹脂A，且將其倒入混練機中。於其中加入以40重量份 之溶劑（D )的卡必醇乙酸酯（C A )溶解4.7重量份之作 爲熱硬化樹脂（B )之環氧樹脂（商品名：YDCN-700-7， 東都化成股份有限公司製造）及3 · 3重量份之酚樹脂（商 品名：TrisP-PA-MF，本洲化學工業股份有限公司製造） 而成之溶液（熱硬化性樹脂之固體成分濃度約爲40重量 % )，及0.12重量份之硬化促進劑（商品名：TPPK，東 京化成工業股份有限公司製造），並經混合。接著，添加 I 5重量份之作爲塡料（C )之氧化矽微粉末（商品名： Aerosil#50，日本AEROSIL股份有限公司製造），接著添 加1 1.4重量份之卡必醇以酸酯（CA ) ’且攪拌•混練1 -30- 201038699 小時，獲得樹脂膏。實施例1獲得之樹脂膏之固體成分濃 度、黏度及觸變係數示於表2。 (實施例2〜7、比較例1 ) 除如表1所示替換基底樹脂、硬化促進劑、塡料之種 類及含量以外，餘如實施例1般獲得樹脂膏。實施例2~7 及比較例1中獲得之樹脂膏之固體成分濃度、黏度及觸變 0 係數示於表2。 [接著強度] 以1 0 0 μ m厚度將實施例1〜7及比較例1之樹脂膏印 刷於42合金導線框架上。接著，將B階段化溫度設定成 1 3 5 °C進行B階段化。B階段化之條件爲以熱風乾燥機自 40 °C於30分鐘內升溫至135 °C，在135 °C乾燥30分鐘後 ，於3 0分鐘內自1 3 5 °C降溫至4 0 °C ’藉此形成B階段化 Q 狀態之塗膜（晶片接合層）。隨後’在14(TC之熱盤上施 力口 5kg之荷重，將5x5mm之矽晶片（厚度0.5mm)壓著 於晶片接合層上1秒鐘。使用自動接著力試驗機（商品名 ·- serie-4000，Dage公司製造）測定其在180C之剪切斷 裂強度（kgf/晶片）。 又，在將B階段化之設定溫度變更成l4〇°C、Id 、1 5 0 °C、1 5 5 °c、1 6 0 °c、1 6 5 °C 及 1 7 0 °C 之條件，分別對 實施例1〜7及比較例1之樹脂膏測定於1 80 t：之剪切斷裂 強度（kgf/晶片）。結果示於表3。 -31 - 201038699 [孔隙] 以3mmxl〇mm、厚度ΙΟΟμηι將實施例1~7及比較例1 之樹脂膏印刷於42合金導線框架上。接著，將Β階段化 溫度設定成1 3 5 t進行Β階段化。Β階段化之條件爲以熱 風乾燥機於3 0分鐘內自4 0 °C升溫至1 3 5 °C，在1 3 5 °C乾 燥30分鐘後，於30分鐘內自135°C降溫至40°C，藉此形 成B階段化狀態之塗膜（晶片接合層）。隨後，在140°C 之熱盤上施加5kg之荷重，將透明玻璃板壓著於晶片接合 層上1秒鐘。使之在18〇°C、4MPa下90秒之條件加熱壓 著，且以下列基準目視評價孔隙。 又，在將B階段化之設定溫度變更成140°C、145°C 、1 5 0 °C、1 5 5 °C、1 6 0 °C、1 6 5 °C 及 1 7 0 °C 之條件下，亦分 別對實施例1〜7及比較例1之樹脂膏，以目視同樣地評價 孔隙。結果示於表3。 A :對於晶片接合層與玻璃基板之接著面積，孔隙之 面積小於5 % B :對於晶片接合層與玻璃基板之接著面積，孔隙之 面積爲5%以上 [B階段化溫度裕度] 於接著強度爲O.IMPa以上，且孔隙之評價成爲[A]之 B階段化溫度範圍設爲B階段化之溫度裕度。結果示於表 3。B階段化溫度裕度較大意指較佳。 -32- 201038699 通常，若接著強度爲o.l MPa以上，則即使是省略後 硬化之步驟以後之組裝步驟，亦即金屬線接合及封裝亦係 可能。 [2 5 0 °C之加熱時晶片剪切強度] 以1 0 0μιη厚度於42合金導線框架上印刷樹脂膏，以 熱風乾燥機於30分鐘內自40°C升溫至160°C，在160°C 0 乾燥30分鐘後’於30分鐘內自I60t：降溫至40°C，藉此 乾燥，形成B階段化狀態之塗膜（晶片接合層）。隨後， 在14(TC之熱盤上施加5kg之荷重，將5x 5mm之矽晶片 (厚度0.5mm )壓著於晶片接合層上1秒鐘。接著，以 1 8 0°C之熱風乾燥機加熱60分鐘，進行後硬化。使用自動 接著力試驗機（商品名：serie-4000，Dage公司製造）測 定其在250°C之剪切斷裂強度（kgf/晶片），設爲25〇°C 下之加熱時晶片剪切強度。 〇 結果示於表3。 [耐回焊性評價] 使用印刷機與金屬遮罩（遮罩形狀9.〇χ4.〇χ12〇μπιχ2 處），將實施例1〜7及比較例1之樹脂膏分別印刷於塗佈 有焊錫光阻劑（商品名：AUS-3 08，太陽油墨製造（股） 公司製造）之有機基板上。接著，對分別印刷有實施例 1〜7及比較例1之樹脂膏之各有機基板，藉由熱風乾燥機 在3 0分鐘內自40°C升溫至Β階段化溫度裕度之最下限激 -33- 201038699 度（例如，實施例1之樹脂膏爲155 °c )，且在B階段化 溫度裕度之最下限溫度保持30分鐘，隨後在30分鐘內降 溫至40°C藉此進行乾燥，形成B階段化狀態之塗膜（晶 片接合層）。接著，使用曰立製作所製造之晶片安裝機（ CM-110)，在140°C之熱盤上施加6kg之荷重，將貼附熱 氧化膜之矽晶片（8.8mmx8.8mmx280umt)壓著在晶片接 合層上1秒鐘，製作成評價用封裝基板。所得各評價用封 裝基板，使用轉移成形機（藤和精機製造之轉移壓印機） 進行封裝（封裝劑；商品名：CEL-9240HF-SI (日立化成 工業（股）製造），封裝條件；模具溫度：1 80°C，壓力 :6.9MPa，成形時間：90秒）。隨後，在17 5 °C之熱風乾 燥機鐘加熱硬化封裝材 5 小時，獲得 10.lmmxl2_2mmxl.0mmt 之評價用 BOC 封裝。 所得評價用BOC封裝分別以85°C /85%RH/168小時， 及85%/60%RH/168小時之條件吸濕處理後，於使評價用 BOC封裝之最高表面溫度達到260°C之方式所設定之IR 回焊爐（TAMURA製造）中來回通過3次。接著，使用 超音波偵測影像裝置 （SAT : Scanning Automatic Tomograph,日立製作所製造HYE-FOCUS)，對該評價用 B OC封裝以目視確認晶片接合層之剝離或氣泡之有無， 且以下列基準評價耐回焊性。結果示於表3。 等級 1 ;在 8 5 °C / 8 5 % R Η /1 6 8 小時及 8 5 °C / 6 0 % R Η / 1 6 8 小時之任一條件下均無晶片接合層之剝離或氣泡。 等級2 ;在8 5 °C / 6 0 % R Η /1 6 8小時之條件下，雖無晶 -34 - 201038699 片接合層之剝離或氣泡，但在8 5 °C /8 5 %RH/ 1 6 8小時之條 件下有晶片接合層之剝離或氣泡。 等級1意味著耐回焊性優於等級2。 〇
裊 -35- 201038699 【1谳： 比較例1 g 寸· m cn I 0.12 1 yn i 50.6 實施例7 m rn 0.12 » yn 50.3 實施例6 寸 m ΓΟ 0.12 1 r 52.5 丨實施例5 g 寸· m ro* ^ 0.12 1 i 51.2 丨實施例4 卜 寸 rn ^ 0.12 1 iTi 「 54.9 實施例3 § ^J· m m' 0.12 1 [ 50.8 實施例2 卜 m 1 0.12 in 53.2 實施例1 g 卜 — m 0.12 1 [ 51.4 材料 25000 17000 37000 18700 23500 25000 15000 YDCN-700-7 TrisP-PA TPPK 2P4MHZ AEROSIL 50 < u Mw 樹脂A 樹脂B 樹脂c 樹脂D 樹脂E 樹脂F CTBN-1003x9 1 基底樹脂 環氧樹脂 酚樹脂 1 硬化促進劑 塡料 匿 锲 成分 (A) 代替(A) /"N ω N' /-~s u (D) -36- 201038699
Τ—Μ § 卜 鎰 七 卜 辑 67.21 CN 00 CO IH m m 66.26 s r- cn u in (N 〇〇 in 辑 VO 觀 實施例4 65.26 $ 寸 c〇 m 〇 % 辑 U CN Os 00 >T) 辑 … v〇 {H » 嶙 辑 vd v〇 Γ〇 到 t 成份濃度 (%) 度 '25°c ) 额 am 4V» ΰΐπ πχ» *S w 親 m 画 cd On 避 W- -37 201038699 表1中，各種記號意指下述。 YDCN-700-7:東都化成股份有限公司， 環氧樹脂（環氧當量：1 97-207g/eq)
TrisP-PA :本州化學工業股份有限公司， 雙（4_羥基苯基）乙基]-α，α-二甲基苄基]苯酚 ΤΡΡΚ ：東京化成工業股份有限公司，四 基硼酸鹽 2Ρ4ΜΗΖ ：四國化成工業股份有限公司， 甲基-5 -羥基甲基咪唑） AEROSIL#50 ：日本AEROSIL股份有限么 之微粉末，平均粒徑〇.〇3μη〇 CA :卡必醇乙酸酯 甲酚酚醛型 (4-[4-[l,i- ) 本基鱗四苯 (2-苯基-4-司（氧化矽 -38- 201038699
OD 【ε«】 比較例1 0.01 c 0.01 < 0.01 < 0.01 < 0.03 < 0.08 < 0.25 < 0.31 < i 165 〜170°C 1 ,4.10 銮 她 實施例7 1 0,01 < 0.01 < 0.03 < 0.05 < 0.26 < 0.34 < 0.37 < 0.41 < 155~170〇C 5.30 栅 實施例6 0.01 < 0.01 < 0.01 < 0.04 < 1 1 0.25 < 0.37 < 1- 0.35 < 0.38 < 155-170°C 5.20 銮 她 實施例5 0.01 < 1 0.01 < 0.01 < 0.03 < 0.20 < ! 0.29 < ! 0.33 < ! 0.38 < 155-170°C 1 4.40 1 她 實施例4 0.01 < 0.01 1 < 0.03 < 0.06 < 0.26 < 0.33 < 0.38 < 0.35 < 155-170°C 4.80 她 實施例3 | 0.01 < 0.01 < 0.01 < 0.03 < 0.17 < 0.30 < 0.33 < 0.38 < 155-170°C 5.10 她 實施例2 0.10 < 0.18 < 0.24 < I 0.31 < 1 0.27 < I 0.35 1 0.31 1 1 135-155〇C 5.30 銮 她 U 1 1 1 1 0.02 < 0.04 < 0.24 < 0.32 < 0.35 < 0.40 < | 155〜170°c | 5.40 等級1 評價項目 接著強度 (MPa) 孔隙 接著強度 (MPa) 孔隙 接著強度 (MPa) 孔隙 接著強度 (MPa) 孔隙 接著強度 (MPa) m 接著強度 (MPa) 孔隙 接著強度 (MPa) 丨接著強度 (MPa) 趣 4¾ il 伽 〇υ (N i狂 H「一 回 135〇C 140°C 145。。 150°C 155°C 160°C 165〇C 170°C 1 i 1 B階段化 溫度 CQ mg 盤 ii【-】 -39- 201038699 本發明之晶片接合用樹脂膏，於B階段化中，在廣的 溫度範圍與晶片之接著強度優異，同時晶片間之孔隙亦得 以減少，且即使於焊錫回焊步驟中加熱時之晶片剪切強度 及耐回焊性亦優異。 依據本發明，可提供一種可藉由印刷法容易地對於有 必要在較低溫度貼附半導體晶片之基板進行供給及塗佈之 晶片接合用樹脂膏。 應注意除已述及者以外，在不脫離本發明之新穎且有 利之特徵之範圍內，亦可對上述實施形態進行各種修正及 變更。因此’該等所有修正及變更均欲包含於隨附之申請 專利範圍內。 【圖式簡單說明】 圖1係顯示本發明之半導體裝置之製造步驟之一例的 圖。 圖2爲本發明之半導體裝置之一例的BOC之剖面圖 〇 圖3爲本發明之半導體裝置之一例的導線框架型半導 體裝置之一實施例的剖面圖。 【主要元件符號說明】 2 :基板 4 :晶片接合層 6 :半導體晶片 -40- 201038699 8 :配線圖型 1 〇 :絕緣層 1 2 :焊錫球 1 4 ·金屬線 1 6 :封裝材 100 :半導體裝置 1 〇 1 :基板 0 1 02 :金屬遮罩 103 :刮板 104 :晶片接合用樹脂膏 1 05 :晶片接合層（B階段化狀態） 1 〇 6 :熱源 1 〇 7 :晶片 1 08 :晶片接合層（完全硬化狀態） 1 〇 9 :金屬線 〇 110 :模具 1 1 1 :擠出機 1 1 2 :封裝材 2 0 1 :矽晶片 202 :晶片接合用樹脂膏 203 :導線框架 204 ： A1 墊 205 : Ag鍍層 2 0 6 :金線 -41 - 201038699 2 0 7 :封裝樹脂 2 0 8 :外部鍍層 -42

Claims (1)

  1. 201038699 七、申請專利範圍： 1. 一種晶片接合用樹脂膏，其特徵 丁二烯之聚合物（al)與具有環氧基 而獲得之聚合物（A )、熱硬化性樹 〇 2.如申請專利範圍第1項之晶片 一步包含溶劑（D )。 0 3 ·如申請專利範圍第1項之晶片 一步包含硬化促進劑（E )。 4. 如申請專利範圍第1項之晶片 使前述具有羧基之丁二烯之聚合物（ 化合物（a2 )反應而獲得之聚合物（ 量爲 15,000〜70,000 。 5. —種半導體裝置之製造方法， 在基板上塗佈申請專利範圍第1至3 〇 合用樹脂膏之步驟，（2 )使前述樹月1 ，（3 )於經B階段化之前述樹脂膏 步驟。 6. —種半導體裝置，其特徵係利 項之半導體裝置之製造方法獲得。 7. —種半導體裝置之製造方法， 於基板上塗佈申請專利範圍第1至3 合用樹脂膏之步驟，（2)於前述樹 片之步驟，（3 )利用封裝劑封裝前 爲包含使具有羧基之 之化合物（a2 )反應 脂（B )及塡料（C ) •接合用樹脂膏，其進 接合用樹脂膏，其進 接合用樹脂膏，其中 al)與具有環氧基之 A)之重量平均分子 其特徵係包含（1 ) 項中任一項之晶片接 旨膏B階段化之步驟 上搭載半導體晶片之 用申請專利範圍第5 其特徵係包含（1 ) 項中任一項之晶片接 脂膏上搭載半導體晶 述半導體晶片之步驟 -43- 201038699 8 . —種半導體裝置，其特徵係利用申請專利範圍第7 項之半導體裝置之製造方法獲得。 -44 -
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