JPWO2010110069A1 - ダイボンディング用樹脂ペースト、それを用いた半導体装置の製造方法、及び半導体装置 - Google Patents

ダイボンディング用樹脂ペースト、それを用いた半導体装置の製造方法、及び半導体装置 Download PDF

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JPWO2010110069A1
JPWO2010110069A1 JP2011505970A JP2011505970A JPWO2010110069A1 JP WO2010110069 A1 JPWO2010110069 A1 JP WO2010110069A1 JP 2011505970 A JP2011505970 A JP 2011505970A JP 2011505970 A JP2011505970 A JP 2011505970A JP WO2010110069 A1 JPWO2010110069 A1 JP WO2010110069A1
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Prior art keywords
resin paste
die bonding
resin
semiconductor device
chip
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JP2011505970A
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English (en)
Japanese (ja)
Inventor
良史 杉浦
良史 杉浦
精吾 横地
精吾 横地
修一 森
修一 森
片山　陽二
陽二 片山
隆史 堂々
隆史 堂々
哲 江花
哲 江花
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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Publication of JPWO2010110069A1 publication Critical patent/JPWO2010110069A1/ja
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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JP2011505970A 2009-03-23 2010-03-10 ダイボンディング用樹脂ペースト、それを用いた半導体装置の製造方法、及び半導体装置 Pending JPWO2010110069A1 (ja)

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