JP5360124B2 - ダイボンディング用樹脂ペーストおよびその用途 - Google Patents
ダイボンディング用樹脂ペーストおよびその用途 Download PDFInfo
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Description
半田は安価であるものの、耐熱性に劣り、その弾性率はAu−Si共晶合金と同様に高く、大型チップへの適用は難しい。
銀ペーストは、安価で、耐湿性が高く、弾性率はこれらの中では最も低く、350℃の熱圧着型ワイヤボンダーに適用できる耐熱性もあるので、現在はダイボンディング材の主流である。しかし、ICやLSIの高集積化が進み、それに伴ってチップが大型化していくなかで、ICやLSIとリードフレームとを銀ペーストで接合しようとすると、これをチップ全面に広げて塗布しなければならず、それには困難を伴う。
イミド化合物を用いる場合の配合量は、成分(A)100重量部に対して200重量部を超えない程度、好ましくは100重量部を超えない程度である。この配合量が200重量部を超えると、ペーストの保管安定性が低下しやすい。
カルボン酸末端基を有するブタジエンのホモポリマーまたはコポリマー(A)(ベース樹脂)として、CTBNX−1300×9(宇部興産株式会社製)を100重量部を秤取し、これをらいかい機に入れた。ここに、熱硬化性樹脂(B)として予め用意していた、エポキシ樹脂(YDCH−702)25重量部およびフェノール樹脂(H−1)15重量部の、印刷用溶剤(D)であるカルビトールアセテート(60重量部)溶液(熱硬化性樹脂の固形分濃度は約40重量%)と、硬化促進剤(TPPK)0.5重量部を加え、混合した。続いて、フィラー(C)としてシリカ微粉末であるアエロジル8重量部を加え、1時間撹拌・混練し、ダイボンディング用樹脂ペースト(樹脂ペーストNo.1;固形分71.2重量%)を得た。
ベース樹脂、熱硬化性樹脂、フィラーおよび/または溶剤の種類および配合量を変えて、実施例1と同様に行い、ダイボンディング用樹脂ペースト(樹脂ペーストNo.2〜No.6;固形分は順に68.3、72.5、65.5、67.3、44.5重量%;ただしNo.6の樹脂ペーストは比較対照用)を得た。
CTBN−1300×31:宇部興産(株)製、カルボン酸末端液状ポリブタジエン(官能基数1.9/mol)
CTBN−1300×8:宇部興産(株)製、カルボン酸末端液状ポリブタジエン(官能基数1.85/mol)
YDCH−702:東都化成(株)、クレゾールノボラック型エポキシ樹脂(エポキシ当量220)
ESCN−195:日本化薬(株)、クレゾールノボラック型エポキシ樹脂(エポキシ当量200)
H−1:明和化成(株)、フェノールノボラック樹脂(OH当量106)
VH−4170:大日本インキ化学工業(株)、ビスフェノールAノボラック樹脂(OH当量118)
TPPK:東京化成工業(株)、テトラフェニルホスホニウムテトラフェニルボラート
2P4MHZ:四国化成工業(株)、キュアゾール(イミダゾール化合物)
アエロジル:日本アエロジル(株)、アエロジル#380(シリカの微粉末)
CA:カルビトールアセテート
NMP:N−メチル−2−ピロリドン
調合・混合後のダイボンディング用樹脂ペーストの粘度およびチキソトロピー指数を、表2に示す。粘度およびチキソトロピー指数の測定方法は、以下のとおりである。
Claims (7)
- カルボン酸末端基を有するブタジエンのホモポリマーまたはコポリマー(A)、エポキシ樹脂を含む熱硬化性樹脂(B)、シリカを含むフィラー(C)、およびN−メチル−2−ピロリジノン、ジエチレングリコールジメチルエーテル、トリエチレングリコールジメチルエーテル、ジエチレングリコールジエチルエーテル、2−(2−メトキシエトキシ)エタノール、γ−ブチロラクトン、イソホロン、カルビトール、カルビトールアセテート、1,3−ジメチル−2−イミダゾリジノン、酢酸2−(2−ブトキシエトキシ)エチル、エチルセロソルブ、エチルセロソルブアセテート、ブチルセロソルブ、ジオキサン、シクロヘキサノン、およびアニソールからなる群から選択される少なくとも一種を含む印刷用溶剤(D)を含み、
固形分が40〜90重量%であり、
前記エポキシ樹脂の配合量が、前記(A)成分100重量部に対して200重量部を超えない量であり、
前記フィラーの配合量が、前記(A)成分100重量部に対して1〜100重量部であり、かつ
乾燥硬化後の樹脂ペーストの弾性率が1〜300MPa(25℃)であるダイボンディング用樹脂ペースト。 - チキソトロピー指数が1.5〜8.0であり、かつ粘度(25℃)が5〜1000Pa・sである請求項1に記載のダイボンディング用樹脂ペースト。
- 前記エポキシ樹脂が、クレゾールノボラック型エポキシ樹脂である請求項1又は2に記載のダイボンディング用樹脂ペースト。
- (1)基板上に所定量の請求項1〜3のいずれか1項に記載のダイボンディング用樹脂ペーストを塗布し、
(2)前記樹脂ペーストを乾燥して樹脂をBステージ化し、
(3)Bステージ化した前記樹脂に半導体チップを搭載し、
(4)前記樹脂を後硬化することを含む、半導体装置の製造方法。 - 請求項4に記載の半導体装置の製造方法により得られる半導体装置。
- (1)基板上に所定量の請求項1〜3のいずれか1項に記載のダイボンディング用樹脂ペーストを塗布し、
(2)前記樹脂ペーストに半導体チップを搭載し、
(3)前記樹脂ペースト中の樹脂を硬化することを含む、半導体装置の製造方法。 - 請求項6に記載の半導体装置の製造方法により得られる半導体装置。
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Application Number | Priority Date | Filing Date | Title |
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JP2011098093A JP5360124B2 (ja) | 2004-06-18 | 2011-04-26 | ダイボンディング用樹脂ペーストおよびその用途 |
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JP2004180959 | 2004-06-18 | ||
JP2004180959 | 2004-06-18 | ||
JP2011098093A JP5360124B2 (ja) | 2004-06-18 | 2011-04-26 | ダイボンディング用樹脂ペーストおよびその用途 |
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JP2005176765A Division JP4816876B2 (ja) | 2004-06-18 | 2005-06-16 | ダイボンディング用樹脂ペーストおよび半導体装置の製造方法 |
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US (1) | US20070290369A1 (ja) |
EP (1) | EP1758157A1 (ja) |
JP (1) | JP5360124B2 (ja) |
KR (2) | KR100970312B1 (ja) |
CN (2) | CN100495671C (ja) |
TW (1) | TWI302931B (ja) |
WO (1) | WO2005124851A1 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
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US9795367B1 (en) | 2003-10-17 | 2017-10-24 | Nuvasive, Inc. | Surgical access system and related methods |
JP4816876B2 (ja) * | 2004-06-18 | 2011-11-16 | 日立化成工業株式会社 | ダイボンディング用樹脂ペーストおよび半導体装置の製造方法 |
JP4355010B2 (ja) * | 2006-10-04 | 2009-10-28 | 昭栄化学工業株式会社 | 積層電子部品用導体ペースト |
JP4975514B2 (ja) * | 2007-04-26 | 2012-07-11 | 信越化学工業株式会社 | ダイボンド剤及びこれを用いてなる半導体装置 |
KR100981396B1 (ko) * | 2007-09-28 | 2010-09-10 | 엘지이노텍 주식회사 | 반도체 패키지용 접착 페이스트 조성물 |
US7985662B2 (en) * | 2009-04-14 | 2011-07-26 | Powertech Technology Inc. | Method for manufacturing dies formed with a dielectric layer |
WO2012026981A1 (en) | 2010-08-23 | 2012-03-01 | Nuvasive, Inc. | Surgical access system and related methods |
JP5613253B2 (ja) * | 2010-10-08 | 2014-10-22 | 田中貴金属工業株式会社 | 半導体素子接合用の貴金属ペースト |
WO2012124527A1 (ja) * | 2011-03-14 | 2012-09-20 | 日立化成工業株式会社 | 半導体素子接着用樹脂ペースト組成物及び半導体装置 |
CN103534327B (zh) * | 2011-04-05 | 2015-05-20 | 汉高知识产权控股有限责任公司 | 可b阶段化且无需固化的晶圆背面涂覆粘合剂 |
US8252631B1 (en) * | 2011-04-28 | 2012-08-28 | Freescale Semiconductor, Inc. | Method and apparatus for integrated circuit packages using materials with low melting point |
JP2013093564A (ja) * | 2011-10-04 | 2013-05-16 | Hitachi Chemical Co Ltd | ダイボンディング用樹脂ペースト、半導体装置の製造方法及び半導体装置 |
US9066701B1 (en) | 2012-02-06 | 2015-06-30 | Nuvasive, Inc. | Systems and methods for performing neurophysiologic monitoring during spine surgery |
US9655505B1 (en) | 2012-02-06 | 2017-05-23 | Nuvasive, Inc. | Systems and methods for performing neurophysiologic monitoring during spine surgery |
JP5945480B2 (ja) * | 2012-09-07 | 2016-07-05 | ナミックス株式会社 | 銀ペースト組成物及びその製造方法 |
US9757067B1 (en) | 2012-11-09 | 2017-09-12 | Nuvasive, Inc. | Systems and methods for performing neurophysiologic monitoring during spine surgery |
CN103497722B (zh) * | 2013-10-10 | 2015-05-13 | 南宁珀源化工有限公司 | 一种用于硅棒粘接的胶黏剂 |
KR102012788B1 (ko) | 2015-09-23 | 2019-08-21 | 주식회사 엘지화학 | 접착 필름, 반도체 장치의 제조 방법 및 반도체 장치 |
JP7184002B2 (ja) * | 2019-09-13 | 2022-12-06 | 味の素株式会社 | 樹脂組成物 |
JP7502598B2 (ja) | 2020-01-29 | 2024-06-19 | 日亜化学工業株式会社 | 半導体装置と半導体装置の製造方法 |
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JP3461023B2 (ja) * | 1994-02-28 | 2003-10-27 | 日立化成工業株式会社 | 接着剤および半導体装置 |
JP2003045902A (ja) * | 1996-10-08 | 2003-02-14 | Hitachi Chem Co Ltd | 半導体装置、半導体チップ搭載用基板、それらの製造法、接着剤、および、両面接着フィルム |
AU4471797A (en) * | 1996-10-08 | 1998-05-05 | Hitachi Chemical Company, Ltd. | Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film |
JP2001247780A (ja) * | 2000-03-06 | 2001-09-11 | Hitachi Chem Co Ltd | 耐熱性樹脂ペースト及びこれを用いた半導体装置 |
JP2002180017A (ja) * | 2000-12-14 | 2002-06-26 | Toray Ind Inc | 半導体用接着剤シートおよびそれを用いた部品ならびに半導体装置 |
CN1246412C (zh) * | 2001-09-10 | 2006-03-22 | 台虹科技股份有限公司 | 用于挠性印刷电路板的粘合剂 |
JP2004018715A (ja) * | 2002-06-18 | 2004-01-22 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及びこれを用いた半導体装置。 |
JP2004172443A (ja) * | 2002-11-21 | 2004-06-17 | Sumitomo Bakelite Co Ltd | ダイアタッチペースト及び半導体装置 |
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2005
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- 2005-06-17 TW TW094120149A patent/TWI302931B/zh active
- 2005-06-17 KR KR1020087028219A patent/KR100970312B1/ko not_active IP Right Cessation
- 2005-06-17 CN CNB2005800140472A patent/CN100495671C/zh not_active Expired - Fee Related
- 2005-06-17 CN CN2008101447159A patent/CN101323769B/zh not_active Expired - Fee Related
- 2005-06-17 KR KR1020067022657A patent/KR100893992B1/ko not_active IP Right Cessation
- 2005-06-17 US US11/629,876 patent/US20070290369A1/en not_active Abandoned
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TWI302931B (en) | 2008-11-11 |
KR20070038033A (ko) | 2007-04-09 |
WO2005124851A1 (ja) | 2005-12-29 |
CN101323769A (zh) | 2008-12-17 |
US20070290369A1 (en) | 2007-12-20 |
TW200600559A (en) | 2006-01-01 |
JP2011193009A (ja) | 2011-09-29 |
EP1758157A1 (en) | 2007-02-28 |
CN101323769B (zh) | 2011-04-13 |
CN100495671C (zh) | 2009-06-03 |
CN1950935A (zh) | 2007-04-18 |
KR20080113446A (ko) | 2008-12-30 |
KR100970312B1 (ko) | 2010-07-15 |
KR100893992B1 (ko) | 2009-04-20 |
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