201038362 六、發明說明： 【發明所屬之技術領域】 本發明係有關-種修整n及其製法，尤其是有關CMP抛光塾 的組合式修整器及其製法。 【先前技術】 化學機械拋光（Chemical Mechanical Planarizati〇n，CMP) 是目前半導體晶圓表面平坦化的製程中最受矚目的技術。在化學 Ο 機械拋光製程中，拋光墊的功能是將拋光液穩定而均勻地輸送至 晶圓與拋光墊之間，在化學蝕刻與機械磨削兩者相互作用下，將 晶片上凸出的沈積層移除。 為了達到晶圓加工量產的需求及維持品質的穩定性，必須利 用鑽石修整器（Diamond dresser)在化學機械拋光的過程中適 時地對拋光墊進行修整，除了移除表面之拋光副產物，恢復拋光 墊的粗糙面，改善其容納漿料的能力，並恢復拋光墊表面的孔 Ο 及其把持、運送拋光液之能力，如此可以節省拋光墊成本，並可 達到晶圓量產時品質穩定的需求。 傳統的鑽石修整器是將平均粒徑的鑽石粒固定在金屬盤 上，這種鑽石修整器適合修整硬式的拋光墊(如IC1000等）。傳 統修整器的功能不僅要移除拋光晶圓時產生的廢料，更進一步的 需要切削一層拋光塾’使拋光塾恢復一定的粗糙度，但是這種傳 統類型的鑽石修整器並不適用於45奈米（nm)以下的CMP製程。 3 201038362 由於積體電路的線寬日趨微小，例如2q〇6年開始執行65奈米 (nm)的製程，晶圓表面平坦化及平滑度的要求就越來越高，相 對修整拋光墊的修整器要求也愈來愈高。預計於2〇1〇年之45刪 的製程’必須以極低的壓力進行拋光才能避免磨穿奈米級的銅線 及脆弱的低介電常數(L〇w K)電阻層。因此修整後的拋光墊需要 更高的平整性，且需配合大尺吋晶圓之需求重新設計。未來的鑽 石修整器除了修整器之鑽石顆粒分佈規則外’尖錐的頂點高度 O 要求也更高；除此之外’修整器也需要在拋光墊上刻 劃出更細微更均勻的刻紋，但相反的，修整器對拋光墊的移除率 更低’這樣的要求是傳統修整器無法做到的。 有各種不同修整器的專利，例如台灣專利1228〇66揭示一種 研磨布用修整器及其使用之研磨布的修整方法，包括一金屬台設 置有调郎機構’以调卽全部或一部分的磨石顆粒群中以多數個磨 石顆粒的前端所分別形成的基準面的高低差。 Ο 台灣公開專利200821093揭示的鑽石修整器，包括在各鑽石 低粒黏接部上’各自黏接有不同種類的鑽石砥粒，鑽石砥粒黏接 部與修整器基板之間是藉由螺栓固定或黏接劑固定。 美國專利US6, 054,183、揭示的修整器，是在一基板上形成 複數鑽石粒及一層CVD鑽石；複數鑽石粒被CVD鑽石包覆而被固 定於基板表面。 國際專利公開號WO00/64630 ’揭示一研磨層包括多數磨粒， 該磨粒包含有機樹脂（Organic resin)、金屬鹽（Metal salt) 201038362 及平均散佈於多數磨粒之間的鑽石磨粒。 美國公開專利US20060128288揭示的修整器，包括多數鑽石 顆粒被一金屬黏結劑層固定於一金屬基板。 曰本公開專利JP2006-315088揭示的修整器，包括一圓盤狀 基台結合多數圓形的PCD鑽石片。 一般修整器的直徑約是108公厘(刪)的大盤子，因為面積大 所以變形量也大，較不容易結合各種不同大小、形狀、材料的磨 〇粒’且使多數研磨顆粒的頂點在同一高度，且大面積的修整器的 價錢較高。 【發明内容】 為了使較大面積的修整ϋ更容易結合各種獨大小、形狀、 材料的磨粒’且使多數研磨顆粒的頂點在同-高度，而提出本發 明。 本發㈣主要目的，在提供—馳合式修絲及其製法，使 〇—絲板的同-研磨端面結合多數具有磨粒的小基板，較容易使 多數磨粒_肖《在同-高度，且更容躲合各種不同大小、形 狀、材料的磨粒。 …本發明的另—目的’在提供—馳合式修整器及其製法，可 卽省整修n的製造成本，且可視需要變化不同的磨粒。 如下，發㈣其他目的、功效’請參職式及實施例，詳細說明 【實施方式】 圖1 2所7^本發明第—實施例的組合式整修器】，尤 5 201038362 其是作為CMP拋光墊的修整器者，包括_大基板u、複數研磨 單元12及複數彈性單元13所組成。 如圖2所示，大基板U設有一結合面11〇及突出結合面ιι〇 周圍的環壁111 ;結合面110設有對應於研磨單元12的複數凹 槽112;複數研磨單元12分別與複數彈性單元13相疊且分別置 於複數凹槽112内’·每―補單元12與大基板u之間有一彈 性單元⑴研磨單元12可全部或一部分突出凹槽112。 ο 研磨單元12包括一小基板12〇及複數磨粒121’·小基板120 的-面122肖合複數磨粒121;磨粒121具有一可對一工件進行 切削的切削端123，·从板12〇的相對於設有該複數磨粒⑵ 的另一面m細·單元13。勤複數彈性單元13分別彈性 調整複數_端123突出大基板11的高度差異㈣微米内’ 賴數切削端123與-平面15的高度差異在20微米内，然後 ο 藉由釔合劑層14使大基板u及複數研磨單元12的小紐⑽ 固定結合。201038362 VI. Description of the Invention: [Technical Field] The present invention relates to a trimming method and a method thereof, and more particularly to a combined dresser for a CMP polishing crucible and a method of manufacturing the same. [Prior Art] Chemical Mechanical Planarization (CMP) is currently the most attractive technology in the process of flattening the surface of semiconductor wafers. In the chemical Ο mechanical polishing process, the function of the polishing pad is to stably and evenly transfer the polishing liquid between the wafer and the polishing pad. Under the interaction of chemical etching and mechanical grinding, the protrusion on the wafer is formed. The layer is removed. In order to meet the demand for wafer processing and to maintain the stability of the quality, it is necessary to use a diamond dresser to trim the polishing pad in a timely manner during the chemical mechanical polishing process, except to remove the polishing by-products of the surface. The rough surface of the polishing pad improves its ability to hold the slurry and restores the pores on the surface of the polishing pad and its ability to hold and transport the polishing liquid. This saves the cost of the polishing pad and achieves stable quality when the wafer is mass-produced. demand. The traditional diamond dresser is to fix the average particle size of the diamond particles on a metal plate. This diamond dresser is suitable for trimming hard polishing pads (such as IC1000). The function of the traditional dresser is not only to remove the waste generated when polishing the wafer, but further to cut a layer of polished 塾 'to restore the roughness of the polished enamel, but this traditional type of diamond dresser is not suitable for 45 奈CMP process below m (nm). 3 201038362 Due to the increasingly small line width of integrated circuits, such as the implementation of 65 nanometer (nm) process in 2q〇6 years, the wafer surface flattening and smoothness requirements are getting higher and higher, and the trimming polishing pad is trimmed. The requirements for the device are also getting higher and higher. It is expected that the process of deleting in the year of 2005 will be polished at a very low pressure to avoid wear through the nano-scale copper wire and the fragile low dielectric constant (L〇w K) resistance layer. As a result, the finished polishing pad requires higher flatness and needs to be redesigned to meet the needs of large-size wafers. In the future, the diamond dresser has a higher vertex height O requirement than the dresser's diamond particle distribution rule; in addition, the trimmer also needs to scribe a finer and more uniform engraving on the polishing pad, but Conversely, the dresser removes the polishing pad at a lower rate, a requirement that traditional trimmers cannot. There are various kinds of trimmer patents, for example, Taiwan Patent No. 1228〇66 discloses a dressing device for a polishing cloth and a dressing method for the abrasive cloth used therefor, including a metal table provided with a singular mechanism to sift all or part of the grindstone. The height difference of the reference plane formed by the front ends of the plurality of grindstone particles in the particle group.钻石 The diamond dresser disclosed in Taiwan Patent No. 200821093 includes 'bonding different types of diamond enamels on each diamond low-grain bonding part. The diamond 黏 grain bonding part and the dresser substrate are fixed by bolts. Or the adhesive is fixed. A trimmer disclosed in U. International Patent Publication No. WO 00/64630' discloses that an abrasive layer comprises a plurality of abrasive particles comprising an organic resin, a metal salt 201038362 and diamond abrasive particles interspersed between a plurality of abrasive particles. The finisher disclosed in U.S. Patent No. 2,060,128,288, the disclosure of which is incorporated herein by reference to the entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire portion The finisher disclosed in the laid-open patent JP2006-315088 includes a disc-shaped abutment combined with a plurality of circular PCD diamond pieces. Generally, the diameter of the dresser is about 108 mm (deleted). Because the area is large, the amount of deformation is large, and it is not easy to combine the abrasive grains of various sizes, shapes and materials, and the apex of most abrasive particles is The same height, and the large area of the dresser is more expensive. SUMMARY OF THE INVENTION The present invention has been made in order to make it easier to combine a large area of trimmed enamel with abrasive grains of various sizes, shapes, and materials and to have the apexes of most of the abrasive particles at the same height. The main purpose of the present invention is to provide a self-assembling wire and a manufacturing method thereof, so that the same-grinding end face of the wire-and-silk plate is combined with a plurality of small substrates having abrasive grains, which makes it easier for most abrasive grains to be in the same height. It is also more suitable to avoid abrasive grains of various sizes, shapes and materials. The other object of the present invention is to provide a self-contained dresser and a method of manufacturing the same, which can save the manufacturing cost of the trimming n and vary the different abrasive grains as needed. (4) Other purposes and functions 'Please refer to the application form and examples, and explain in detail. [Embodiment] FIG. 1 2 is a combined refurbiator of the first embodiment of the present invention, especially 5 201038362 which is used as CMP polishing The pad conditioner includes a large substrate u, a plurality of polishing units 12, and a plurality of elastic units 13. As shown in FIG. 2, the large substrate U is provided with a joint surface 11A and a ring wall 111 around the protruding joint surface ιι; the joint surface 110 is provided with a plurality of grooves 112 corresponding to the grinding unit 12; the plurality of grinding units 12 and the plurality The elastic units 13 are stacked and placed in the plurality of grooves 112 respectively. Each of the complementary units 12 and the large substrate u has an elastic unit. (1) The grinding unit 12 may protrude all or part of the grooves 112. ο The grinding unit 12 includes a small substrate 12 〇 and a plurality of abrasive grains 121 ′ - a small surface 120 of the small substrate 120 is crossed with a plurality of abrasive grains 121; the abrasive grains 121 have a cutting end 123 capable of cutting a workpiece, and the secondary plate 12 〇 is relative to the other surface of the plurality of abrasive grains (2) m fine unit 13. The frequency complex elastic unit 13 elastically adjusts the complex number _ end 123 to protrude the height difference of the large substrate 11 (4) within the micrometer. The difference between the height of the cutting end 123 and the - plane 15 is within 20 micrometers, and then ο by the chelating agent layer 14 The substrate u and the small (10) of the plurality of grinding units 12 are fixedly coupled.
圖3所示’本發明第一實施例的組合式修整器1的製 法，包括如下步驟： D ⑴使複數單元13分別置於—絲板_結合面HO 的複數凹槽112内； ('使複數研磨單元12分別與複數彈性單元13相疊；複 數彈性早70 13分觀予複數研磨單元_大基板11的力量； 其中研磨單元12具有—小基請，小基請的-面戰 201038362 有複數磨粒121;複數磨粒121的切削端123分別突出凹槽112; (3) 使一平板16同一水平方向的施予複數磨粒121的切削 端123靠向大基板11的力量，藉由平板16的施予研磨單元12 的壓力及複數彈性單元13推頂研磨單元12的彈力呈相等的狀 態’使複數切削端123突出大基板11的高度差異在20微米内， 使複數切削端123與一平面15的高度差異在20微米内； (4) 藉由結合劑層14使大基板11固定結合複數研磨單元 〇 12的小基板120，即可使複數切削端123被固定，形成一組合 式修整器1。 如圖1、2、4、5、6所示’本發明第二實施例的組合式整 修器2、第三實施例的組合式修整器3、第四實施例的組合式修 整器4分別與上述第一實施例的組合式修整器丨的結構相比 較，除了複數研磨單元12結合大基板11呈現的排列方式不同 外’其餘結構大致相同。第二實施例的組合式修整器2的複數 C) 研磨單元12呈具有一中心及圍繞中心的複數同心環排列的形 狀’如圖4所示。第三實施例的組合式修整器3的複數研磨單 元12呈矩陣式排列的形狀，如圖5所示。第四實施例的組合式 修整器4的複數研磨單元12呈環狀排列的形狀，如圖6所示。 如圖卜2、7、8、9、10所示，本發明第一研磨單元21、 第二研磨單元22、第三研磨單元23及第四研磨單元24與圖1、 2所示的研磨單元12的結構相比較，除了複數磨粒211、221、 231、24卜121結合小基板210、220、230、240、120呈現的排 201038362 列形狀不同外，其餘結構大致相同。複數磨粒m、221、23ι、 24卜121的排列方式可視需要有多種不同的排列形狀。第一研 磨單元21的複數磨粒211呈由中心向四周輕射狀的形狀，如圖 7所示。f二研磨單元22的複數磨粒221呈同心圓的排列形 狀’如圖8所示。第三研磨單元23的複數磨粒231呈矩陣式的 排列形狀’如圖9所示。第四研磨單元24的複數練241呈對 稱式的排列形狀，如圖1〇所示。 〇 如圖1卜12所示，本發明第五實施例的組合式整修器5， 尤其是作為CMP拋光墊的修整器者，包括一大基板51、複數研 磨單元52及複數彈性單元53所組成。 大基板51包括一第一支架511及結合劑層512;第一支架 511架置於-第-模具54内；第一模具54設有複數凹槽541 ; 第一支架511設有容納複數彈性單元53的複數穿透孔513 ;複 數研磨單分職魏雜私則目分職於複數凹 ° 槽541内，使每一研磨單元52與第一模具54之間有一彈性單 兀53 ;研磨單元52可全部或一部分突出凹槽541。研磨單元兕 包括一小基板520結合複數磨粒521 ;磨粒521具有可對一 CMp 拋光墊17進行切削的切削端522。藉由複數彈性單元53分別彈 性調整複數切削端522突出大基板51的高度差異在2〇微米内， 使複數切削端522與一平面15的高度差異在2〇微米内，然後 藉由結合劑層512使第-支架511及複數研磨單元52的小基板 520固定結合。第-支架511包覆結合劑層512以增加大基板 8 201038362 51整體的強度，但亦可不需第一支架511，直接由結合劑層512 構成大基板51。 如圖11、12、13所示，本發明第五實施例的組合式修整器 5的製法，包括如下步驟： (1) 使一第一支架511置於一第一模具54内，再使複數彈 性單元53分別置於第一模具54的複數凹槽541内； (2) 使複數研磨單元52分別與複數彈性單元53相疊；複 Ο 數彈性單元53分別施予複數研磨單元52離開第一模具54的力 量，其中研磨單元52具有一小基板520，小基板520設有複數 磨粒521 ;複數磨粒521的切削端522分別突出第一支架511 ; (3) 使一平板16同一水平方向的施予複數磨粒521的切削 端522靠向第一模具54的力量，藉由平板55的施予研磨單元 52的壓力及複數彈性單元53推頂研磨單元52的彈力呈相等的 狀態，使複數切削端522與一平面15的高度差異在2〇微米内； €) (4)藉由結合劑層512結合第一支架511及複數小基板 520，使大基板51固定結合複數研磨單元52，即可使複數切削 端522被固定’形成一組合式修整器5。 如圖14、15、16所示’本發明第六實施例的組合式修整器 6的製法，包括如下步驟： (1) 使相疊的一固定模具61及一彈性單元62置於一第二 模具63内； (2) 使複數研磨單元64的複數磨粒64〇的切削端641分別 201038362 穿過固定模具61的複數孔611接觸彈性單元62;其中研磨單元 64具有-小基板642，小基板642設有複數磨粒_ ; (3) 使-平板16同-水平方向的施予複數磨粒_的切削 端641刺入可刺入單元62,切削端641可接觸第二模具63的一 底壁631，使複數切削端641與一平面15的高度差在2〇微米 内，如圖15所示； (4) 藉由結合劑層652使-第二支架651目定結合複數研 〇 磨單元64的小基板642，使複數切削端641被固定； (5) 使可刺入單元62分離複數切削端，形成一組合式 修整器6;其中第二支架651及結合劑層652構成一大基板阳， 如圖15所示。 上述步驟(5)也可進一步使固定模具61分離複數研磨單元 64，使如圖15所示的組合式修整器6不包括固定模具以。可刺 入單元62可為雙面膠帶。 〇 本發明第六實施例的組合式修整器6,包括一大基板65、複 數研磨單元64及一固定模具61所組成。大基板65包括一第二 支架651及結合劑層652 ;研磨單元64具有一小基板642，小 基板642設有複數磨粒640;複數磨粒640的切削端641分別穿 過固定模具61的複數孔6Π ;結合劑層652使第二支架651固 定結合複數研磨單元64的小基板642，使複數切削端641被固 定且與—平面15的高度差異在20微米内，如圖15所示；組合 式修整器6也可不包括固定模具61。 201038362 本發明的絲的材料可為人造鱗人補石、Μ鑽石 ⑽）、立方晶氣化侧_、多晶立方氮化家βν)、最硬結 晶體、多晶材料、或上述材料的混合材料等所組成。 本發_大基板、第-核、第二支架可為任何形狀、厚度、 或材貝’而具有支撐磨粒的能力，能達成支撐、固定磨粒的功 效者；該基板可由堅固的材料所組成、由製程中形成堅固的粉 狀或膠狀材料所組成、或由具有彈性的材料所組成；典型的大 °基板的材料包含金屬、金屬合金、塑膠材料⑽幫）、陶製品、 碳製品、及上述材料的混合物，以狐不錢鋼材料為佳。 本發明的固定模具可為任何形狀、厚度、或材質，而具有固 定磨粒的能力’能達朗定磨粒的功效者；典型_定模具的 呌匕3金屬金屬合金、塑膠材料⑽卿r)、陶製材料、碳 材料、及上述材料的混合物’其中以不錄鋼為實施例代表。 本發明的結合劑層的材料包含金屬、金屬合金、塑膠材料 ◎ (P〇iy_、陶紐料、碳材料、及上述材料的混合物，其中以 塑膠材料為實施例代表’此外也可包含焊接合金材料。 本發明的大基板可為圓盤狀，直徑約8〇_12〇厘米（麵）。 小基板可為圓盤狀，直徑約10_30厘采，以2〇厘米較佳。磨粒 的大小為100-500微米（micr〇n)，以勝2〇〇微米較佳。本發明 =基板的較佳實施例可為不錄鋼材質、或為環氧樹脂材質，不需 ^ σ ^層直接轉氧樹卿成大紐顧結該複數小基板；結合 U的車乂佳貫知例可為樹脂材料；磨粒與小基板固定方式的較佳 201038362 實施例可H由樹轉合賴由含有鉻、鈦_鋅合金結合；小某 板的外表面有-含錄的賴層。彈性單元的較佳實施例;以是ς 膠材料、彈簧、半凝_塑膠、梦膠、半凝_膠水或泡棉等材 料製成者。 本發明利驗合式的方法，先製作複數研縣元，小的研 磨^元較容易使多數磨粒的_端在同—高度，再組合複數研 磨單元成為一大面積的組合式修整器，較容易使大面積組合式 〇 的錢絲的蝴端在同—高度。本發明的優點是製作 小的研磨單元成本較低，且組合式健器可視需要變化不同的 磨粒，例如組合式修㈣的外圈可以脉度較Α輯石，内圈 可以用粒度較小_石；或是義可以用_能力差，但較耐 磨，晶形完整的鑽石，内圈可以用切削能力好，但是不耐磨， 晶形較不好的鑽石。同一小研磨單元的鑽石顆粒大小、形狀、 材料相同，但組合式修整器内的複數研磨單元的鑽石顆粒大 〇 小、形狀、材料可相同或不相同。利用複數研磨單元組合成一 較大的組合式修整器，可控制組合式修整器的切削速度及磨耗 率。 以上所§己載，僅為利用本發明技術内容之實施例，任何熟 悉本項技藝者運用本發明所為之修飾、變化，皆屬本發明主張 之專利範圍，而不限於實施例所揭示者。 12 201038362 【圖式簡單說明】 圖1為本發明第一實施例的組合式修整器的示意圖。 圖2為圖1的AA剖面及一平板的示意圖。 圖3為本發明第一實施例的組合式修整器製法的流程圖。 圖4為本發明第二實施例的組合式修整器的示意圖。 圖5為本發明第三實施例的組合式修整器的示意圖。 圖6為本發明第四實施例的組合式修整器的示意圖。 圖7為本發明第一研磨單元的示意圖。 Q 圖8為本發明第二研磨單元的示意圖。 圖9為本發明第三研磨單元的示意圖。 圖10為本發明第四研磨單元的示意圖。 圖11為製作本發明第五實施例的組合式修整器的示意圖。 圖12為本發明第五實施例的組合式修整器及工件的示意圖。 圖13為本發明第五實施例的組合式修整器製法的流程圖。 圖14為製作本發明第六實施例的組合式修整器的示意圖。 圖15為本發明第六實施例的組合式修整器的示意圖。 〇 圖16為本發明第六實施例的組合式修整器製法的流程圖。 【主要元件符號說明】 1 ' 2 ' 3 ' 4、5、6組合式修整器 11、51、65大基板 111環壁FIG. 3 shows a method of manufacturing the combined dresser 1 of the first embodiment of the present invention, comprising the steps of: D (1) placing the plurality of cells 13 in the plurality of grooves 112 of the wire-bonding surface HO; The plurality of grinding units 12 are respectively overlapped with the plurality of elastic units 13; the plurality of elastics are 70 to 13 minutes before the weight of the plurality of grinding units _ large substrate 11; wherein the grinding unit 12 has a small base, a small base please - face war 201038362 a plurality of abrasive grains 121; the cutting ends 123 of the plurality of abrasive grains 121 respectively protrude from the grooves 112; (3) the force of the cutting end 123 of the plurality of abrasive grains 121 applied to the large substrate 11 in the same horizontal direction by a flat plate 16 The pressure applied to the polishing unit 12 of the flat plate 16 and the elastic force of the plurality of elastic units 13 pushing the polishing unit 12 are in an equal state 'the plurality of cutting ends 123 protrude from the height difference of the large substrate 11 within 20 micrometers, so that the plurality of cutting ends 123 and The height difference of a plane 15 is within 20 micrometers; (4) the large substrate 11 is fixed to the small substrate 120 of the plurality of polishing units 12 by the bonding layer 14, so that the plurality of cutting ends 123 are fixed to form a combined type. Dresser 1. As shown in Figures 1, 2, and 4. 5, 6 respectively, the combined trimmer 2 of the second embodiment of the present invention, the combined dresser 3 of the third embodiment, and the combined dresser 4 of the fourth embodiment are respectively combined with the above-described first embodiment. Comparing the structure of the dresser ,, except for the arrangement of the plurality of grinding units 12 in combination with the large substrate 11, the remaining structures are substantially the same. The complex number of the combined dresser 2 of the second embodiment C) The grinding unit 12 has a center And the shape of the plurality of concentric rings arranged around the center is as shown in FIG. The plurality of grinding units 12 of the combined dresser 3 of the third embodiment are in the form of a matrix arrangement as shown in FIG. The plurality of grinding units 12 of the combined dresser 4 of the fourth embodiment have an annular array shape as shown in FIG. As shown in Figures 2, 7, 8, 9, and 10, the first polishing unit 21, the second polishing unit 22, the third polishing unit 23, and the fourth polishing unit 24 of the present invention and the polishing unit shown in Figs. The structure of 12 is substantially the same except that the plurality of abrasive grains 211, 221, 231, and 24 are combined with the shape of the row 201038362 of the small substrates 210, 220, 230, 240, and 120. The arrangement of the plurality of abrasive grains m, 221, 23, and 24 can be varied as needed. The plurality of abrasive grains 211 of the first grinding unit 21 have a shape that is lightly radiated from the center to the periphery, as shown in Fig. 7. The plurality of abrasive grains 221 of the f-grinding unit 22 are arranged in a concentric circle as shown in Fig. 8. The plurality of abrasive grains 231 of the third polishing unit 23 are arranged in a matrix shape as shown in Fig. 9. The plurality of 241 of the fourth polishing unit 24 has a symmetrical arrangement shape, as shown in FIG. As shown in FIG. 1 and 12, the combined refiner 5 of the fifth embodiment of the present invention, in particular, as a dresser for a CMP polishing pad, comprises a large substrate 51, a plurality of polishing units 52 and a plurality of elastic units 53. . The large substrate 51 includes a first bracket 511 and a bonding agent layer 512; the first bracket 511 is placed in the -th mold 54; the first mold 54 is provided with a plurality of grooves 541; and the first bracket 511 is provided with a plurality of elastic units. a plurality of penetrating holes 513 of 53; a plurality of grinding machines are divided into a plurality of concave grooves 541, such that each of the grinding units 52 and the first die 54 has an elastic single turn 53; the grinding unit 52 The groove 541 may be protruded in whole or in part. The polishing unit 包括 includes a small substrate 520 in combination with a plurality of abrasive grains 521; the abrasive particles 521 have a cutting end 522 that can cut a CMp polishing pad 17. The height difference between the plurality of cutting ends 522 and the large substrate 51 is elastically adjusted by the plurality of elastic units 53 to be within 2 μm, so that the difference between the height of the plurality of cutting ends 522 and the plane 15 is within 2 μm, and then by the bonding agent layer. 512 causes the first bracket 511 and the small base plate 520 of the plurality of polishing units 52 to be fixedly coupled. The first holder 511 covers the bonding layer 512 to increase the overall strength of the large substrate 8 201038362 51. However, the large substrate 51 may be directly formed of the bonding agent layer 512 without the first holder 511. As shown in FIGS. 11, 12 and 13, the manufacturing method of the combined dresser 5 of the fifth embodiment of the present invention comprises the following steps: (1) placing a first bracket 511 in a first mold 54 and then making a plurality of The elastic units 53 are respectively placed in the plurality of grooves 541 of the first mold 54; (2) the plurality of grinding units 52 are respectively overlapped with the plurality of elastic units 53; the plurality of elastic units 53 are respectively applied to the plurality of grinding units 52 to leave the first The force of the mold 54, wherein the grinding unit 52 has a small substrate 520, and the small substrate 520 is provided with a plurality of abrasive grains 521; the cutting ends 522 of the plurality of abrasive grains 521 respectively protrude from the first bracket 511; (3) the same horizontal direction of a flat plate 16 The force of the cutting end 522 of the plurality of abrasive grains 521 against the first mold 54 is equalized by the pressure applied to the polishing unit 52 of the flat plate 55 and the elastic force of the plurality of elastic units 53 pushing the polishing unit 52. The difference between the height of the plurality of cutting ends 522 and a plane 15 is within 2 μm; (4) by bonding the first bracket 511 and the plurality of small substrates 520 by the bonding agent layer 512, the large substrate 51 is fixedly coupled to the plurality of grinding units 52, The plurality of cutting ends 522 can be fixed Into a combined dresser 5. As shown in Figs. 14, 15, and 16, the manufacturing method of the combined dresser 6 of the sixth embodiment of the present invention comprises the following steps: (1) placing a fixed mold 61 and an elastic unit 62 which are stacked one on another (2) The cutting ends 641 of the plurality of abrasive grains 64 of the plurality of grinding units 64 are respectively passed through the plurality of holes 611 of the fixed mold 61 to contact the elastic unit 62; wherein the grinding unit 64 has a small substrate 642, a small substrate 642 is provided with a plurality of abrasive grains _; (3) the cutting end 641 of the plurality of abrasive grains _ in the same-horizontal direction is pierced into the pierceable unit 62, and the cutting end 641 can contact the bottom of the second mold 63 The wall 631 has a height difference between the plurality of cutting ends 641 and a plane 15 within 2 μm, as shown in FIG. 15; (4) the second bracket 651 is combined with the plurality of grinding units by the bonding layer 652 a small substrate 642 of 64, the plurality of cutting ends 641 are fixed; (5) separating the plurality of cutting ends of the pierceable unit 62 to form a combined dresser 6; wherein the second bracket 651 and the bonding agent layer 652 constitute a large substrate Yang, as shown in Figure 15. The above step (5) can also further separate the fixed mold 61 from the plurality of grinding units 64 so that the combined dresser 6 as shown in Fig. 15 does not include the fixed mold. The pierceable unit 62 can be a double sided tape. The combined dresser 6 of the sixth embodiment of the present invention comprises a large substrate 65, a plurality of polishing units 64 and a fixed mold 61. The large substrate 65 includes a second holder 651 and a bonding agent layer 652. The polishing unit 64 has a small substrate 642. The small substrate 642 is provided with a plurality of abrasive grains 640. The cutting ends 641 of the plurality of abrasive grains 640 respectively pass through the fixed mold 61. The bonding layer 652 fixes the second bracket 651 to the small substrate 642 of the plurality of grinding units 64 such that the plurality of cutting ends 641 are fixed and the height difference from the plane 15 is within 20 micrometers, as shown in FIG. 15; The dresser 6 may also not include the fixed mold 61. 201038362 The material of the yarn of the present invention may be an artificial scale stone, a diamond (10), a cubic gasification side, a polycrystalline cubic nitride (βν), a hard crystal, a polycrystalline material, or a mixed material of the above materials. Composition. The hair _ large substrate, the first core, and the second stent may have any shape, thickness, or material, and have the ability to support abrasive grains, and can achieve the function of supporting and fixing the abrasive grains; the substrate can be made of a solid material. Composition, consisting of a solid powdery or gelatinous material formed in the process, or composed of elastic materials; typical large-diameter materials include metals, metal alloys, plastic materials (10), ceramics, carbon products And a mixture of the above materials, preferably fox steel materials. The fixed mold of the present invention can be of any shape, thickness, or material, and has the ability to fix the abrasive particles' ability to achieve the effect of the Langerding abrasive; typical _3 metal metal alloy of the fixed mold, plastic material (10) Qing r) , ceramic materials, carbon materials, and mixtures of the above materials, which are represented by unrecorded steel. The material of the bonding agent layer of the present invention comprises a metal, a metal alloy, a plastic material ◎ (P〇iy_, a ceramic material, a carbon material, and a mixture of the above materials, wherein the plastic material is represented by an embodiment), and a solder alloy may also be included. The large substrate of the present invention may be in the shape of a disk having a diameter of about 8 〇 12 〇 cm (face). The small substrate may be in the shape of a disk, and the diameter is about 10 -30 psi, preferably 2 〇 cm. It is preferably 100-500 micrometers (micror 〇n), preferably 2 〇〇 micrometers. The preferred embodiment of the present invention = substrate can be a non-recorded steel material or an epoxy resin material, without requiring a σ layer directly The oxygen-transfer tree is formed into a large number of small substrates; the combination of U and ruthenium can be a resin material; the preferred method of fixing the abrasive grains and the small substrate is 201038362. The embodiment can be converted from a tree to a chromium-containing layer. Titanium-zinc alloy combination; the outer surface of a small plate has a layer containing a layer. The preferred embodiment of the elastic unit; is a silicone material, a spring, a semi-condensed plastic, a dream gel, a semi-condensed glue or A manufacturer of materials such as foam. The method of the present invention is to produce a complex method. Yuan, small grinding ^ yuan is easier to make the _ end of most abrasive grains in the same - height, and then combine the multiple grinding units into a large area of the combined dresser, it is easier to make the large-area combined 〇 钱 钱In the same-height. The invention has the advantages that the small grinding unit is low in cost, and the combined health device can change different abrasive grains as needed, for example, the outer ring of the combined repair (4) can be more pulsed than the inner ring, the inner ring It can be used with smaller particle size _ stone; or it can be used with _ poor ability, but it is more wear-resistant, crystal-shaped complete diamond, the inner ring can be used with good cutting ability, but it is not wear-resistant, the crystal shape is not good diamond. The same small grinding The diamond particle size, shape and material of the unit are the same, but the diamond particles in the multiple grinding unit in the combined dresser are large and small, the shape and material can be the same or different. The composite grinding unit is combined into a larger combined dresser. The cutting speed and the wear rate of the combined dresser can be controlled. The above description is only for the embodiment using the technical content of the present invention, and any person skilled in the art using the present invention Modifications and variations are within the scope of the claimed invention and are not limited to the embodiments disclosed. 12 201038362 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a combined dresser according to a first embodiment of the present invention. Fig. 3 is a flow chart of a method of manufacturing a combined dresser according to a first embodiment of the present invention. Fig. 4 is a schematic view of a combined dresser according to a second embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 6 is a schematic view of a combined dresser according to a fourth embodiment of the present invention. Fig. 7 is a schematic view of a first grinding unit of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 9 is a schematic view of a third polishing unit of the present invention, Fig. 10 is a schematic view of a fourth polishing unit of the present invention, and Fig. 11 is a schematic view of a combined dresser according to a fifth embodiment of the present invention. Figure 12 is a schematic view of a combined dresser and workpiece in accordance with a fifth embodiment of the present invention. Figure 13 is a flow chart showing the method of manufacturing the combined dresser of the fifth embodiment of the present invention. Figure 14 is a schematic view showing the manufacture of a combined dresser of a sixth embodiment of the present invention. Figure 15 is a schematic view of a combined dresser in accordance with a sixth embodiment of the present invention. Figure 16 is a flow chart showing the method of manufacturing the combined dresser of the sixth embodiment of the present invention. [Main component symbol description] 1 ' 2 ' 3 ' 4, 5, 6 combined dresser 11, 51, 65 large substrate 111 ring wall
12卜21卜221、23卜24卜52卜640磨粒 110結合面 112凹槽12 Bu 21 Bu 221, 23 Bu 24 Bu 52 Bu 640 abrasive grain 110 joint surface 112 groove
512、652結合劑層15平面 123、522、641 切削端 13、53彈性單元 13 201038362 16平板 511第一支架 54第一模具 61固定模具 62可刺入單元 631底壁 651第二支架 17CMP拋光墊 513穿透孔 541凹槽 611穿透孔 63第二模具512, 652 bond layer 15 plane 123, 522, 641 cutting end 13, 53 elastic unit 13 201038362 16 plate 511 first bracket 54 first mold 61 fixed mold 62 can pierce unit 631 bottom wall 651 second bracket 17CMP polishing pad 513 penetration hole 541 groove 611 penetration hole 63 second mold
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