CN113211334A - Self-sharpening resin binder diamond grinding wheel and preparation method thereof - Google Patents
Self-sharpening resin binder diamond grinding wheel and preparation method thereof Download PDFInfo
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- CN113211334A CN113211334A CN202110573059.XA CN202110573059A CN113211334A CN 113211334 A CN113211334 A CN 113211334A CN 202110573059 A CN202110573059 A CN 202110573059A CN 113211334 A CN113211334 A CN 113211334A
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- 238000000227 grinding Methods 0.000 title claims abstract description 137
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 49
- 239000010432 diamond Substances 0.000 title claims abstract description 49
- 229920005989 resin Polymers 0.000 title claims abstract description 19
- 239000011347 resin Substances 0.000 title claims abstract description 19
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000011230 binding agent Substances 0.000 title abstract description 9
- 239000006260 foam Substances 0.000 claims abstract description 20
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 19
- 239000007822 coupling agent Substances 0.000 claims abstract description 19
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000080 wetting agent Substances 0.000 claims abstract description 15
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 9
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910000423 chromium oxide Inorganic materials 0.000 claims abstract description 9
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 9
- 239000010439 graphite Substances 0.000 claims abstract description 9
- 239000005011 phenolic resin Substances 0.000 claims abstract description 9
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 9
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 9
- 239000011787 zinc oxide Substances 0.000 claims abstract description 9
- 238000009966 trimming Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 238000005303 weighing Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000012778 molding material Substances 0.000 claims description 6
- 238000007873 sieving Methods 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229930003836 cresol Natural products 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000000748 compression moulding Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 125000000853 cresyl group Chemical group C1(=CC=C(C=C1)C)* 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000003906 humectant Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000007767 bonding agent Substances 0.000 abstract description 5
- 238000005520 cutting process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 239000002245 particle Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 235000020985 whole grains Nutrition 0.000 abstract 1
- 238000003754 machining Methods 0.000 description 9
- 230000003746 surface roughness Effects 0.000 description 5
- 229910001651 emery Inorganic materials 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/285—Reaction products obtained from aldehydes or ketones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2251—Oxides; Hydroxides of metals of chromium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a self-sharpening resin binder diamond grinding wheel and a preparation method thereof, wherein the formula of the grinding wheel is as follows: 15-65% of foamed diamond, 15-45% of phenolic resin powder, 2-15% of chromium oxide, 0-15% of zinc oxide, 2-10% of graphite, 16-50% of silicon carbide, 0-3% of pore-forming agent, 0-3% of coupling agent and 0-5% of wetting agent. Compared with the existing grinding wheel, the self-sharpening resin bonding agent diamond grinding wheel prepared by the invention adopts the addition of the foam diamond, the pore-forming agent, the wetting agent and the coupling agent, utilizes the increase of the effective contact area between the foam diamond and the bonding agent and the embedding effect of the foam structure and the bonding agent, the abrasive particles cannot fall off in a whole grain manner, the diamond grinding wheel is uniformly consumed in the use process, the trimming times can be effectively reduced, the good grinding force can be kept, the self-sharpening performance of the grinding tool can be improved, the cutting damage can be effectively reduced, and the processing quality of the surface of a workpiece can be improved.
Description
Technical Field
The invention relates to the technical field of grinding tool processing, in particular to a self-sharpening resin binder diamond grinding wheel and a preparation method thereof.
Background
In the diamond compact abrasive machining process, the passivation can appear in the resin bond diamond grinding wheel and lead to the condition that the self-sharpening nature weakens, in order to keep the sharpness and the machining efficiency of emery wheel, just need frequent repairment emery wheel, and frequent repairment can reduce the life of emery wheel, also can reduce machining efficiency. According to the invention, foam diamond, a pore-forming agent and a coupling agent are added into the grinding wheel abrasive material, and the diamond abrasive particles can generate new micro cutting edges through local self crushing, and the capacity of accommodating chips is enhanced. The diamond grinding wheel has higher porosity and uniform and controllable gap size, can effectively improve the chip containing space of the diamond grinding wheel, improve the heat dissipation performance of the diamond grinding wheel, reduce the temperature of a grinding area, and better enhance the cutting capability and self-sharpening performance of the diamond grinding wheel.
Disclosure of Invention
In order to solve the technical problems, the invention provides a self-sharpening resin binder diamond grinding wheel and a preparation method thereof, and the self-sharpening resin binder diamond grinding wheel is specifically realized by the following technical scheme:
the invention relates to a self-sharpening resin binder diamond grinding wheel and a preparation method thereof, wherein the formula of the grinding wheel is as follows: 15-65% of foamed diamond, 15-45% of phenolic resin powder, 2-15% of chromium oxide, 0-15% of zinc oxide, 2-10% of graphite, 16-50% of silicon carbide, 0-3% of pore-forming agent, 0-3% of coupling agent and 0-5% of wetting agent.
Preferably, the pore-forming agent is an alumina hollow sphere with the diameter of 0.2-0.5 mm.
Preferably, the coupling agent is KH 792.
Preferably, the humectant is cresol.
Preferably, the foam diamond is a mixture of a bare material and a plating dressing, and the volume ratio of the bare material to the plating dressing is 1: 1, the plating layer of the plating dressing is nickel.
A self-sharpening resin bond diamond grinding wheel and a preparation method thereof comprise the following steps:
(1) weighing phenolic resin powder, chromium oxide, zinc oxide, graphite and silicon carbide according to the volume ratio, stirring for 1-3 hours in a three-dimensional mixer, taking out and sieving with a 100-mesh sieve for three times, and taking out undersize;
(2) weighing the foam diamond, the coupling agent and the wetting agent according to the volume ratio, mixing the foam diamond, the coupling agent and the wetting agent with the undersize material mixed in the step (1), uniformly stirring the mixture in a three-dimensional mixer for 1 to 3 hours, taking out the mixture, sieving the mixture for three times by using a 100-mesh sieve, and taking the undersize material to obtain a molding material;
(3) weighing the pore-forming agent according to the volume ratio, and uniformly stirring the pore-forming agent and the molding material obtained in the step (2) to obtain a standby material;
(4) putting the spare material obtained in the step (3) and the processed substrate into a mould for compression molding, wherein the pressure is 2-8Mpa, the compression temperature is 180-230 ℃, and the pressure maintaining time is 40-120 minutes;
(5) placing the grinding wheel blank obtained in the step (4) in an oven, heating to 180 ℃ and 230 ℃ at the heating rate of 1 ℃/min, preserving the heat for 12-24h, and then cooling to room temperature to obtain the required grinding wheel blank;
(6) and (5) carrying out matrix processing, inner and outer circle and grinding wheel layer trimming on the grinding wheel blank obtained in the step (5) to obtain a finished grinding wheel.
The invention has the beneficial effects that: the self-sharpening resin bonding agent diamond grinding wheel prepared by the invention takes foam diamond, phenolic resin powder, chromium oxide, zinc oxide, graphite, silicon carbide, pore-forming agent, coupling agent and wetting agent as main raw materials, takes alumina hollow spheres as the pore-forming agent, takes cresol as the wetting agent and selects the coupling agent with the model of KH 792. Compared with the existing grinding wheel, the grinding wheel has the advantages that the foam diamond, the pore-forming agent, the wetting agent and the coupling agent are added, the effective contact area between the foam diamond and the binding agent is increased, the embedding effect of the foam structure and the binding agent is utilized, the whole abrasive particles cannot fall off, the consumption of the diamond grinding wheel is uniform in the using process, the trimming times can be effectively reduced, the good grinding force can be kept, the self-sharpening performance of the grinding tool is improved, the cutting damage is effectively reduced, and the processing quality of the surface of a workpiece is improved.
Detailed Description
The formula of the self-sharpening resin bonding agent diamond grinding wheel comprises the following components: 15-65% of foamed diamond, 15-45% of phenolic resin powder, 2-15% of chromium oxide, 0-15% of zinc oxide, 2-10% of graphite, 16-50% of silicon carbide, 0-3% of pore-forming agent, 0-3% of coupling agent and 0-5% of wetting agent. The pore-forming agent is alumina hollow ball with diameter of 0.2-0.5, the coupling agent is preferably KH792, and the wetting agent is cresol.
The self-sharpening resin bond diamond grinding wheel prepared by the invention comprises the following steps:
(1) weighing phenolic resin powder, chromium oxide, zinc oxide, graphite and silicon carbide according to the volume ratio, stirring for 1-3 hours in a three-dimensional mixer, taking out and sieving with a 100-mesh sieve for three times, and taking out undersize;
(2) weighing the foam diamond, the coupling agent and the wetting agent according to the volume ratio, mixing the foam diamond, the coupling agent and the wetting agent with the undersize material mixed in the step (1), uniformly stirring the mixture in a three-dimensional mixer for 1 to 3 hours, taking out the mixture, sieving the mixture for three times by using a 100-mesh sieve, and taking the undersize material to obtain a molding material;
(3) weighing the pore-forming agent according to the volume ratio, and uniformly stirring the pore-forming agent and the molding material obtained in the step (2) to obtain a standby material;
(4) putting the spare material obtained in the step (3) and the processed substrate into a mould for compression molding, wherein the pressure is 2-8Mpa, the compression temperature is 180-230 ℃, and the pressure maintaining time is 40-120 minutes;
(5) placing the grinding wheel blank obtained in the step (4) in an oven, heating to 180 ℃ and 230 ℃ at the heating rate of 1 ℃/min, preserving the heat for 12-24h, and then cooling to room temperature to obtain the required grinding wheel blank;
(6) and (5) carrying out matrix processing, inner and outer circle and grinding wheel layer trimming on the grinding wheel blank obtained in the step (5) to obtain a finished grinding wheel.
For step (4) where the grinding wheel has an abrasive layer on top and a substrate on the bottom, the treated substrate is rough machined.
The foam diamond selected by the invention is a mixture of a bare material and a plating dressing, and the volume ratio of the foam diamond is 1: 1. the granularity of the foam diamond is 140/170, the granularity of the silicon carbide is W20, the granularity of the phenolic resin powder is 1000 meshes, the granularity of the chromium oxide is 800 meshes, the granularity of the zinc oxide is 1000 meshes, the granularity of the graphite is 2000 meshes (the mesh refers to the crushing fineness), and the diameter of the alumina hollow sphere is 0.2-0.3 mm.
Six grinding wheels with different specifications are prepared under different volume ratios and conditions, and are shown in table 1.
Table 1 shows grinding wheels of examples 1 to 6 prepared under different volume ratios and conditions
Example 1 a grinding wheel having a radius of 150mm and a thickness of 6mm was produced under the volume ratio and conditions of example 1, and workpieces of the same specification were ground under the same machining conditions, and the grinding performance of the grinding wheel was compared with that of a conventional grinding wheel, as shown in table 2:
table 2 shows the comparison of the grinding performance of the grinding wheel of the present invention and that of a conventional grinding wheel
Example 2 the grinding wheel produced under the volume ratio and conditions of example 2, having a radius of 200mm and a thickness of 5mm, was used to grind workpieces of the same specification under the same machining conditions and the grinding performance of the grinding wheel was compared with that of a conventional grinding wheel, as shown in table 3:
table 3 shows the comparison of the grinding performance of the grinding wheel of the present invention and that of a conventional grinding wheel
| Common grinding wheel | The invention relates to a grinding wheel | |
| Grinding life of grinding wheel (number of grindable workpieces) | 25 ten thousand | 38 ten thousand |
| Single feed (mm) | 0.4 | 0.6 |
| Temperature (. degree. C.) of grinding work | 55 | 35 |
| Durable grinding wheel | 4500 | 8500 |
| Surface roughness (Ra) | 0.7 | 0.3 |
Example 3 a grinding wheel having a radius of 300mm and a thickness of 5mm was produced under the volume ratio and conditions of example 3, and workpieces of the same specification were ground under the same machining conditions, and the grinding performance of the grinding wheel was compared with that of a conventional grinding wheel, as shown in table 4:
table 4 shows the comparison of the grinding performance of the grinding wheel of the present invention and that of a conventional grinding wheel
| Common grinding wheel | The invention relates to a grinding wheel | |
| Grinding life of grinding wheel (number of grindable workpieces) | 28 ten thousand | 43 ten thousand |
| Single feed (mm) | 0.25 | 0.45 |
| Temperature (. degree. C.) of grinding work | 40 | 20 |
| Durable grinding wheel | 7000 | 12000 |
| Surface roughness (Ra) | 0.55 | 0.25 |
Example 4 the grinding wheel produced under the volume ratio and conditions of example 4 has a radius of 350mm and a thickness of 8mm, and workpieces of the same specification are ground under the same machining conditions, and the grinding performance of the grinding wheel is compared with that of a common grinding wheel, as shown in table 5:
table 5 shows the comparison of the grinding performance of the grinding wheel of the present invention and that of a conventional grinding wheel
| Common grinding wheel | The invention relates to a grinding wheel | |
| Grinding life of grinding wheel (number of grindable workpieces) | 60 ten thousand | 90 ten thousand |
| Single feed (mm) | 0.35 | 0.6 |
| Temperature (. degree. C.) of grinding work | 50 | 30 |
| Durable grinding wheel | 5000 | 9000 |
| Surface roughness (Ra) | 0.65 | 0.3 |
Example 5 the grinding wheel produced under the volume ratio and conditions of example 5, having a radius of 400mm and a thickness of 4mm, was used to grind workpieces of the same specification under the same machining conditions and the grinding performance of the wheel was compared with that of a conventional grinding wheel, as shown in table 6:
table 6 shows the comparison of the grinding performance of the grinding wheel of the present invention and that of a conventional grinding wheel
| Common grinding wheel | The invention relates to a grinding wheel | |
| Grinding life of grinding wheel (number of grindable workpieces) | 50 ten thousand | 80 ten thousand |
| Single feed (mm) | 0.38 | 0.65 |
| Temperature (. degree. C.) of grinding work | 55 | 30 |
| Durable grinding wheel | 6000 | 9500 |
| Surface roughness (Ra) | 0.62 | 0.32 |
Example 6A grinding wheel having a radius of 450mm and a thickness of 3mm was produced under the volume ratio and conditions of example 6, and workpieces of the same specification were ground under the same machining conditions, and the grinding performance of the grinding wheel was compared with that of a conventional grinding wheel, as shown in Table 7:
table 7 shows the comparison of the grinding performance of the grinding wheel of the present invention and that of a conventional grinding wheel
| Common grinding wheel | The invention relates to a grinding wheel | |
| Grinding life of grinding wheel (number of grindable workpieces) | 35 ten thousand | 60 ten thousand |
| Single feed (mm) | 0.25 | 0.4 |
| Temperature (. degree. C.) of grinding work | 53 | 28 |
| Durable grinding wheel | 5500 | 8800 |
| Surface roughness (Ra) | 0.5 | 0.25 |
The table 2 to the table 7 show that under the same processing conditions, workpieces with the same specification are ground, compared with a common grinding wheel, the grinding wheel made of the foam diamond, the pore-forming agent and the coupling agent is added, the grinding performance and the self-sharpening performance of the grinding wheel are good, the durability and the grinding efficiency of the grinding wheel are improved, meanwhile, the temperature of a grinding processing area is low, burning can be avoided, the grinding surface quality is greatly improved, the roughness of the ground workpiece surface is reduced, the grinding wheel is superior to the common grinding wheel on the market, and in the actual processing process, the cost is saved, and the overall quality of the workpiece is also improved.
Finally, the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all of them should be covered in the claims of the present invention.
Claims (6)
1. A self-sharpening resin bond diamond grinding wheel and a preparation method thereof are characterized in that: the formula of the grinding wheel is as follows: 15-65% of foamed diamond, 15-45% of phenolic resin powder, 2-15% of chromium oxide, 0-15% of zinc oxide, 2-10% of graphite, 16-50% of silicon carbide, 0-3% of pore-forming agent, 0-3% of coupling agent and 0-5% of wetting agent.
2. The self-sharpening resin bonded diamond grinding wheel and the preparation method thereof as claimed in claim 1, wherein: the pore-forming agent is an alumina hollow sphere with the diameter of 0.2-0.5 mm.
3. The self-sharpening resin bonded diamond grinding wheel and the preparation method thereof as claimed in claim 1, wherein: the coupling agent is preferably KH 792.
4. The self-sharpening resin bonded diamond grinding wheel and the preparation method thereof as claimed in claim 1, wherein: the humectant is cresol.
5. The self-sharpening resin bonded diamond grinding wheel and the preparation method thereof as claimed in claim 1, wherein: the foam diamond is a mixture of a bare material and a plating dressing, and the volume ratio of the bare material to the plating dressing is 1: 1, the plating layer of the plating dressing is nickel.
6. A self-sharpening resin bonded diamond grinding wheel and its manufacturing method as claimed in any one of claims 1 to 5, comprising the steps of:
(1) weighing phenolic resin powder, chromium oxide, zinc oxide, graphite and silicon carbide according to the volume ratio, stirring for 1-3 hours in a three-dimensional mixer, taking out and sieving with a 100-mesh sieve for three times, and taking out undersize;
(2) weighing the foam diamond, the coupling agent and the wetting agent according to the volume ratio, mixing the foam diamond, the coupling agent and the wetting agent with the undersize material mixed in the step (1), uniformly stirring the mixture in a three-dimensional mixer for 1 to 3 hours, taking out the mixture, sieving the mixture for three times by using a 100-mesh sieve, and taking the undersize material to obtain a molding material;
(3) weighing the pore-forming agent according to the volume ratio, and uniformly stirring the pore-forming agent and the molding material obtained in the step (2) to obtain a standby material;
(4) putting the spare material obtained in the step (3) and the processed substrate into a mould for compression molding, wherein the pressure is 2-8Mpa, the compression temperature is 180-230 ℃, and the pressure maintaining time is 40-120 minutes;
(5) placing the grinding wheel blank obtained in the step (4) in an oven, heating to 180 ℃ and 230 ℃ at the heating rate of 1 ℃/min, preserving the heat for 12-24h, and then cooling to room temperature to obtain the required grinding wheel blank;
(6) and (5) carrying out matrix processing, inner and outer circle and grinding wheel layer trimming on the grinding wheel blank obtained in the step (5) to obtain a finished grinding wheel.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110573059.XA CN113211334A (en) | 2021-05-25 | 2021-05-25 | Self-sharpening resin binder diamond grinding wheel and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110573059.XA CN113211334A (en) | 2021-05-25 | 2021-05-25 | Self-sharpening resin binder diamond grinding wheel and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114833733A (en) * | 2022-04-25 | 2022-08-02 | 亳州市鑫磊超硬材料有限责任公司 | Diamond resin grinding wheel and preparation method thereof |
| CN116551584A (en) * | 2023-05-08 | 2023-08-08 | 海安玻克超硬材料有限公司 | High-strength phenolic resin binder diamond grinding wheel |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112536733A (en) * | 2020-12-03 | 2021-03-23 | 郑州磨料磨具磨削研究所有限公司 | Ultra-precise grinding wheel and preparation method and application thereof |
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| EP2567784A1 (en) * | 2011-09-08 | 2013-03-13 | 3M Innovative Properties Co. | Bonded abrasive article |
| CN104308755A (en) * | 2014-10-21 | 2015-01-28 | 苏州赛力精密工具有限公司 | Resin CBN (cubic boron nitride) grinding wheel for machining saw blade base body |
| CN106826591A (en) * | 2017-03-17 | 2017-06-13 | 衢州学院 | A kind of rubber resin combined binder grinding tool and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114833733A (en) * | 2022-04-25 | 2022-08-02 | 亳州市鑫磊超硬材料有限责任公司 | Diamond resin grinding wheel and preparation method thereof |
| CN114833733B (en) * | 2022-04-25 | 2024-03-08 | 亳州市鑫磊超硬材料有限责任公司 | Diamond resin grinding wheel and preparation method thereof |
| CN116551584A (en) * | 2023-05-08 | 2023-08-08 | 海安玻克超硬材料有限公司 | High-strength phenolic resin binder diamond grinding wheel |
| CN116551584B (en) * | 2023-05-08 | 2023-12-01 | 海安玻克超硬材料有限公司 | Preparation process of high-strength phenolic resin binder diamond grinding wheel |
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