JP2014233830A - Abrasive pad dresser and production method thereof, abrasive pad dressing device, and polishing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an abrasive pad dresser which gives preferable polishing effect and fracture toughness resistance to polishing particles.SOLUTION: The abrasive pad dresser comprises: polishing particles 110 which are polyhedra and have a regulated shape respectively; and a base part body 120 having a polishing face S1. The polishing face S1 has certain roughness so that the polishing face S1 has unevenness, and the polishing particles 110 are fixed to the polishing face S1, at least parts of the polishing particles 110 are embedded to dents on the polishing face S1, and at least some of projections T of the polishing particles 110 in the dents face the opposite direction of the polishing face S1.

Description

(Cross-reference of related applications)
The present application claims priority based on Chinese Patent Application No. 201310217161.1 filed on June 3, 2013, “a polishing pad dresser and a method for manufacturing the same, a polishing pad dressing apparatus, and a polishing system”. The entire disclosure of which is incorporated herein by reference.

  The present disclosure relates generally to the field of chemical mechanical polishing, and in particular, to a polishing pad dresser and a method for manufacturing the same, a polishing pad dressing apparatus including the polishing pad dresser, and a polishing system including the polishing pad dressing apparatus.

  Chemical mechanical polishing (CMP) technology, which plays an important role in the surface treatment of semiconductor wafers and is used for surface planarization at various stages in the manufacture of integrated circuits, has been widely used in recent years. During the CMP process, the polishing pad can be used for retention and transfer of polishing acid, removal of residues, transmission of mechanical loads, maintenance of the polishing environment, and the like. As the CMP process continues, the physical and chemical properties of the polishing pad may change. In particular, residue is generated on the surface of the polishing pad, reducing the size and number of micropores on the surface, reducing the roughness of the surface of the polishing pad, and constant recombination at the molecular level occurring on the surface. A glazing layer having a thickness of 1 mm may be formed on the glazing layer, thereby reducing the polishing rate and the polishing quality. Accordingly, there is a need to dress the polishing pad to improve the polishing effect, extend the useful life of the polishing pad, and reduce the cost of polishing.

  In recent years, a general dresser is a diamond dresser. FIG. 1 schematically shows a cross-sectional view of a conventional diamond dresser. As shown in FIG. 1, the dresser 1 includes a base body 2 and a plurality of diamond abrasive particles 3 fixed to the polishing surface S of the base body 2. The polishing surface S is flat and parallel to the surface of the polishing pad while the polishing pad is being dressed. While dressing the polishing pad, the dresser 1 is rotating and reciprocating. On the other hand, the dresser 1 is pressed against the surface of the polishing pad with a constant pressure so that the diamond abrasive particles 3 come into contact with the surface of the polishing pad and the polishing pad is cut. Therefore, the surface of the polishing pad is dressed to achieve the desired surface roughness.

  Diamond abrasive particles 3 play an important role in affecting the dressing effect. The diamond abrasive particles 3 are natural. Natural diamond abrasive particles are generally irregular in shape and have sharp protrusions T. When the dresser 1 is employed and the polishing pad is dressed, the protrusions T of natural diamond abrasive particles face the polishing pad so that a better polishing effect is achieved. However, due to the irregular shape, natural diamond abrasive particles are prone to breakage when impacted, and also cause the silicon slice to be scratched.

  In order to solve the above problem, another dresser 1 is provided in the conventional solution. As shown in FIG. 2, the diamond abrasive particles 3 in the dresser 1 are single crystal artificial diamond abrasive particles formed at high pressure, which are generally perfect and have few internal defects, Has a regular shape. This type of diamond abrasive particle 3 has excellent fracture toughness, which reduces the possibility of scratching the silicon slice due to the diamond abrasive particle 3 breaking. However, when the dresser 1 is used for dressing a polishing pad, the flat surface P1 of the diamond abrasive particles 3 faces the polishing pad, resulting in poor polishing effect.

  It is difficult to impart good polishing effect and good fracture toughness to the abrasive particles in a conventional polishing pad dresser.

In one embodiment,
Abrasive particles having a regular shape with a polyhedron;
A base body having a polished surface;
With
The polishing surface has a certain roughness, and the polishing surface is uneven, the abrasive particles are fixed on the polishing surface, and at least a part of the polishing particles are embedded in the recess of the polishing surface, A polishing pad dresser is provided in which the protrusions of at least a portion of the abrasive particles therein are opposite to the polishing surface.

  Optionally, the roughness of the polished surface is in the range of 100 μm to 300 μm.

  Optionally, the abrasive particles are regular octahedral, regular dodecahedron, regular icosahedron, prismatic or pyramidal.

  Optionally, the original surface of the polishing surface is a flat surface or comprises an edge polishing surface and a central polishing surface that are interconnected. The edge polishing surface surrounds the center polishing surface, and the center polishing surface is flat and higher than the edge polishing surface. The original surface is a polished surface before the roughening treatment is performed.

  Optionally, the edge polishing surface is a convex curved surface or connects a plurality of surfaces including at least one convex curved surface and at least one flat surface not parallel to the central polishing surface. Is formed.

  Optionally, if the edge polishing surface is a convex curved surface, the edge polishing surface is in contact with the central polishing surface, and if the edge polishing surface is formed by connecting multiple surfaces, The surface of the edge polishing surface connected to the polishing surface is a convex curved surface in contact with the central polishing surface.

  Optionally, the curved surface is an arcuate surface.

  Optionally, it is preferred that the base body further comprises a non-polished surface that is lower than the polished surface. The polishing surface is annularly provided on the base body, and the convex portion of the polishing surface on the surface where the non-polishing surface is located surrounds the non-polishing surface.

  Optionally, if the original surface of the polishing surface includes an edge polishing surface and a central polishing surface that are interconnected, the edge polishing surface includes an inner edge polishing surface and an outer edge polishing surface, and the central polishing surface The surface is disposed between the inner edge polishing surface and the outer edge polishing surface.

  Optionally, the base body is disk-shaped.

  Optionally, the abrasive particles comprise diamond or cubic boron nitride (CBN).

In one embodiment,
Providing a base body and abrasive particles;
Performing a roughening treatment on the polishing surface of the base body, giving a certain roughness to the polishing surface so that the polishing surface is uneven;
Laying the abrasive particles on the polishing surface of the base body, burying at least a portion of the abrasive particles in a recess in the polishing surface, with the protrusions of at least a portion of the abrasive particles in the recess facing upward,
Fixing abrasive particles on the polishing surface;
A method of manufacturing a polishing pad dresser is provided.

  Optionally, the roughening process is blasting.

  Optionally, the abrasive particles are affixed onto the polishing surface by an electroplating process, chemical brazing process, metal sintering process or chemical vapor deposition process.

  In one embodiment, a polishing pad dressing apparatus comprising the above polishing pad dresser is provided.

  Optionally, the polishing pad dressing apparatus further comprises a drive structure configured to drive the polishing pad dresser.

In one embodiment,
A polishing apparatus comprising a polishing pad;
The polishing pad dressing apparatus configured to dress the polishing pad;
A polishing system is provided.

  Compared to conventional solutions, the present disclosure has the following advantages.

  In the polishing pad dresser provided in the present disclosure, the roughness of the polishing surface is increased, and abrasive particles having a regular shape with a polyhedron are employed. The projections of at least a part of the abrasive particles in the recess are opposite to the polishing surface. When a diamond dresser is used for dressing the polishing pad, the protrusions of the abrasive particles face the polishing pad, thereby improving the polishing effect. In addition, because the abrasive particles have a regular shape, they have excellent fracture toughness, which reduces the possibility of scratching the silicon slices due to the diamond abrasive particles breaking. Moreover, since the roughness of the polished surface is large, the adhesion between the binder and the base body is improved.

  When the polishing pad dresser provided in the present disclosure is formed, the abrasive particle protrusions are laid on the polishing surface of the base body, and the protrusions of the abrasive particles maintain a balance without any external force. It can be pointed up in a leaned state. After the abrasive particles are affixed onto the polishing surface, the protrusions of at least a portion of the abrasive particles in the recesses of the polishing surface are opposite to the polishing surface. Accordingly, no extra tool or processing is required to make the protrusions of the abrasive particles upward, and the manufacture of the polishing pad dresser can be made simple and easy.

It is a figure which shows schematically the sectional view of the conventional diamond dresser. It is a figure which shows roughly the cross-sectional view of another conventional diamond dresser. It is a figure showing roughly a sectional view of a polishing pad dresser concerning a 1st embodiment of this indication. FIG. 3 is a diagram schematically showing a vertical view of the polishing pad dresser according to the first embodiment of the present disclosure, and FIG. 3 is a cross-sectional view of the polishing pad dresser along the AA direction in FIG. 4. It is a figure which shows schematically the partial enlarged view of the reverse direction of Q part in FIG. It is a figure showing roughly a sectional view of a base part main part of a polishing pad dresser concerning a 2nd embodiment of this indication, and here, a polish side of a base part main part is an original surface. FIG. 6 is a diagram schematically illustrating a vertical view of a base body of a polishing pad dresser according to a second embodiment of the present disclosure, and FIG. 6 is a cross-sectional view of the polishing pad dresser along the BB direction in FIG. 7. . It is a figure which shows schematically the elements on larger scale of the M section in FIG. FIG. 6 is a diagram schematically illustrating a cross-sectional view of a polishing pad dresser according to a second embodiment of the present disclosure. FIG. 9 is a diagram schematically showing a vertical view of a polishing pad dresser according to a second embodiment of the present disclosure, and FIG. 9 is a cross-sectional view of the polishing pad dresser along the CC direction in FIG. 10. It is a figure showing roughly the structure figure of the polish system concerning one embodiment of this indication.

  As described above, it is difficult to impart both good polishing effect and good fracture toughness to the abrasive particles in the conventional polishing pad dresser.

  The reason why the polishing effect by the diamond abrasive particles in the second conventional diamond dresser is inferior is as described below. Still referring to FIG. 2, the polishing surface S is flat. Since the polishing surface S has a relatively small roughness (Rz) of generally 1 μm to 2 μm, it can be said that the polishing surface S is an ideal flat surface. The diamond abrasive particles 3 are polyhedral and have a regular shape. Diamond abrasive particles 3 having a hexagonal column shape are an example. When the diamond dresser 1 is formed, a base body 2 that satisfies the requirements is prepared. The base body 2 is placed on a support base with the polishing surface S of the base body 2 facing upward, and the diamond abrasive particles 3 are formed. It is laid on the polishing surface S. The diamond abrasive particles 3 can maintain a balance between the gravity and the holding force by the polishing surface S. Since the polishing surface S is an ideal flat surface, the flat surface P2 of the diamond polishing particle 3 may coincide with the polishing surface S in a balanced state. Then, the other flat surface P1 of the diamond abrasive particle 3 opposite to the flat surface P2 is parallel to the polishing surface S. After the diamond abrasive particles 3 are fixed on the polishing surface S, the flat surface P1 is still parallel to the polishing surface S. That is, the flat surface P1 is on the side opposite to the polishing surface S. Therefore, when the diamond dresser 1 is used for dressing the polishing pad, the flat surface P1 of the diamond abrasive particles 3 faces the polishing pad, and the polishing effect is inferior.

  A new polishing pad dresser is provided in an embodiment of the present disclosure. The polishing surface of the base body of the polishing pad dresser is uneven due to the increased roughness of the polishing surface, and abrasive particles having a regular shape with a polyhedron are employed. Therefore, the protrusions of the abrasive particles fixed on the polishing surface are opposite to the polishing surface. When a diamond dresser is used for dressing the polishing pad, the protrusions of the abrasive particles face the polishing pad, thereby improving the polishing effect. In addition, because the abrasive particles have a regular shape, they have excellent fracture toughness, which reduces the possibility of scratching the silicon slices due to the diamond abrasive particles breaking.

  In order to clarify the objects, features and advantages of the present disclosure, details of embodiments of the present disclosure will be described in conjunction with the accompanying drawings.

  As described above, the abrasive particles fixed on the polishing surface of the base body of the diamond dresser are in a state where the flat surface of the abrasive particles is opposite to the polishing surface, and the protrusions of the abrasive particles are opposite to the polishing surface. It has two states: state. In the latter state, a better polishing effect is achieved. In the embodiment of the present disclosure, the flat surface of the abrasive particles being on the side opposite to the polishing surface is defined as follows. The abrasive particles are polyhedral. When a polishing pad dresser is used for dressing the polishing pad, the portion of the abrasive particles that will first contact the polishing pad is a flat surface that is parallel to the surface of the polishing pad. Correspondingly, it is defined as follows that the protrusions of the abrasive particles are opposite to the polishing surface. The abrasive particles are polyhedral. When a polishing pad dresser is used for dressing the polishing pad, the portion of the abrasive particles that first comes into contact with the polishing pad is a projection of the abrasive particles, not a flat surface.

<Embodiment 1>
Referring to FIG. 3, the polishing pad dresser 100 includes a plurality of abrasive particles 110 and a base body 120. The abrasive particles 110 are polyhedral and have a regular shape. The base body 120 has a polishing surface S1. Referring to FIG. 5, the polishing surface S1 is uneven due to the roughness (Rz) of the polishing surface S1. The abrasive particles 110 are fixed on the polishing surface S1.

  The abrasive particle 110 has a regular octahedron shape, a regular dodecahedron shape, a regular icosahedron shape, a prismatic shape, a pyramid shape, or the like. However, the shape of the abrasive particles 110 is not limited to the embodiment of the present disclosure.

  The polishing surface S1 is uneven when the polishing surface S1 has a certain roughness, and the polishing surface S1 is formed so that at least one polishing particle 110 can be embedded in the recess of the polishing surface S1. It is formed by performing a roughening process on the surface of the configured base body 120. In an embodiment of the present disclosure, the surface of the base body 120 configured to form the polishing surface S1 defines the original surface of the polishing surface S1. That is, before the roughening treatment is performed, the polished surface S1 is called the original surface. In some embodiments, the original surface of the polishing surface S1 is flat. When the polishing pad dresser 100 is used for dressing the polishing pad, the original surface of the polishing surface S1 is parallel to the surface of the polishing pad.

  Referring further to FIG. 5, after the diamond abrasive particles 110 are laid on the polishing surface S1, the abrasive particles 110 can be balanced by their gravity and the holding force by the polishing surface S1. Since the polishing surface S1 is uneven, at least a plurality of portions of the abrasive particles 110 in a balanced state are embedded in the recess S1 of the polishing surface, and one (or more) of each polishing particle is flat. The surface is brought into contact with the indentation S1 of the polishing surface. The flat surface in contact with the recess S1 of the polishing surface may not be parallel to the original surface S0 of the polishing surface S1, and therefore the surface opposite the flat surface in contact with the recess S1 of the polishing surface (from the polishing surface). The farthest surface) may also not be parallel to the original surface S0 of the polishing surface S1. Accordingly, the highest portion of the abrasive particle 110 is the protrusion of the abrasive particle 110, that is, the protrusion T of the abrasive particle 110 is opposite to the polishing surface S1. When the polishing pad dresser 100 is used for dressing the polishing pad, at least one portion of the protrusion T of the abrasive particle 110 faces the polishing pad, thereby improving the polishing effect.

  From the above, it is possible to increase the roughness of the polishing surface S1 and use any external force after the polishing particles 110 are laid on the polishing surface S1 of the base body 120 by using the polyhedral and regular abrasive particles 110. It is understood that the protrusions T of the abrasive particles 110 can be directed upward without being balanced. After the abrasive particles 110 are fixed on the polishing surface S1, at least a part of the protrusions T of the abrasive particles 110 in the recess S1 of the polishing surface is opposite to the polishing surface S1. When the polishing pad dresser 100 is used for dressing the polishing pad, the protrusions T of the polishing particles 110 face the polishing pad, thereby improving the polishing effect. In addition, since the abrasive particles 110 have a regular shape, they have excellent fracture toughness, which reduces the possibility of scratching the silicon slice due to the abrasive particles 110 being broken.

  In some embodiments, one abrasive particle 110 may be embedded in one recess of the polishing surface S1. In some embodiments, two or more abrasive particles 110 may be embedded in one recess of the polishing surface S1. The number of abrasive particles embedded in the recesses in the polishing surface may be related not only to the roughness of the polishing surface but also to the size of the polishing particles.

  When the shape of the abrasive particles 110 is constant, the cutting angle of the abrasive particles 110 can be changed by changing the roughness of the polishing surface S1, thereby affecting the polishing effect of the abrasive particles 110. When the roughness of the polished surface S1 remains constant, the cutting angle of the abrasive particles 110 can be changed by changing the shape of the abrasive particles 110, thereby affecting the polishing effect.

  In some embodiments, the roughness of the polishing surface S1 ranges from 100 μm to 300 μm, which makes the polishing surface S1 uneven. However, the roughness of the polishing surface S1 is not limited to this, and other suitable values that make the polishing surface S1 uneven and allow at least one abrasive particle 110 to be embedded in one recess of the polishing surface S1. It may be.

  In some embodiments, with further reference to FIGS. 3 and 4, the base body 120 further has a non-abrasive surface S2. The polished surface S1 is higher than the non-polished surface S2. Therefore, when the polishing pad dresser 100 is used for dressing the polishing pad, the polishing surface S1 contacts the surface of the polishing pad before the non-polishing surface S2. The polishing surface S1 may be distributed annularly in the base body 120, and the convex portion of the polishing surface S1 on the surface where the non-polishing surface S2 is located may surround the non-polishing surface S2.

  In some embodiments, the base body 120 is disk-shaped and has a radius in the range of 100 nm to 300 nm. In some embodiments, the base body 120 may have other shapes suitable for dressing a polishing pad. In some embodiments, the base body 120 is made of stainless steel.

  In some embodiments, the abrasive particles 110 comprise diamond or cubic boron nitride (CBN). In some embodiments, the abrasive particles 110 are diamond abrasive particles. In other embodiments, the abrasive particles 110 are made of other materials suitable for dressing a polishing pad.

  The polishing pad dresser 100 may further include a binder 130 configured to fix the abrasive particles 110 on the polishing surface S <b> 1 of the base body 120. There are various methods for fixing the abrasive particles 110 on the base body 120. The abrasive particles 110 are secured to the base body by electroplating, chemical brazing, metal sintering or chemical vapor deposition.

  Since the roughness of the polished surface S1 is large, the adhesion between the binder 130 and the base body 120 is enhanced.

  The distribution of the polishing surface S1 on the base body 120 is not limited to the above embodiment. Persons skilled in the art can make adjustments and modifications based on the embodiments of the present disclosure. In some embodiments, the polishing surface S1 can be distributed annularly on the base body 120.

<Embodiment 2>
Several improvements have been made to Embodiment 1 and Embodiment 2 is provided. As shown in FIGS. 6 to 8, the polishing pad dresser 100 is different from the polishing pad dresser 100 in the first embodiment. In the second embodiment, the original surface S0 of the polishing surface is a convex surface. The original surface S0 includes an edge polishing surface S12 and a central polishing surface S11 that are connected to each other. The edge polishing surface S12 surrounds the center polishing surface S11, and the center polishing surface S11 is flat and higher than the edge polishing surface S12. In the first embodiment, the original surface S0 of the polishing surface S1 is flat.

  Specifically, in some embodiments, the central polishing surface S11 is connected to the edge polishing surface S12 at all of the boundaries, and the convex portion of the edge polishing surface S12 on the surface on which the central polishing surface S11 is located. The central polishing surface S11 is surrounded. The edge polishing surface S12 includes an outer edge polishing surface S121 and an inner edge polishing surface S122 connected to the central polishing surface S11. The central polishing surface S11 is located between the inner edge polishing surface and the outer edge polishing surface.

  In some embodiments, the central polishing surface S11 is a flat surface defined as follows. When the polishing pad dresser 100 is used for dressing the polishing pad, the flat surface is parallel to the surface of the polishing pad. The central polishing surface S11 is higher than the edge polishing surface S12 when the polishing pad dresser 100 is used for dressing the polishing pad. The central polishing surface S11 is the polishing pad before the edge polishing surface S12. Means contact with the surface. That is, the original surface S0 of the polishing surface S1 is convex.

  In some embodiments, the inner edge polishing surface S122 and the outer edge polishing surface S121 are convex arcuate surfaces that are in contact with the central polishing surface S11. Therefore, the inner edge polishing surface S122 and the outer edge polishing surface S121 are smoothly connected to the central polishing surface S11. With respect to the convex arcuate surface, the center of the arcuate surface is above the polishing surface S1 while the polishing pad dresser 100 is used for dressing the polishing pad.

  The central polishing surface S11 has a suitable width W. On the other hand, the width W forms a sufficient contact area between the polishing pad dresser 100 and the polishing pad, thereby making it possible to distribute the load by each of the polishing particles 110 and to separate the polishing particles 110. Should be as large as possible so that is reduced. On the other hand, the width W is excessively increased in order to prevent the size of the polishing pad dresser 100 from becoming excessively large and to prevent the abrasive particles 110 on the outer edge of the central polishing surface S11 from peeling off. Should not. In some embodiments, the width W ranges from 1 mm to 30 mm. If the size of the polishing pad dresser 100 is large, the width W may be relatively large, and if not, the width may be relatively small.

  When the shape is an arc shape, the outer edge polishing surface S121 has a suitable radius R1. On the other hand, the radius R1 forms a sufficient contact area between the polishing pad dresser 100 and the polishing pad, thereby making it possible to distribute the load by each of the abrasive particles 110, and the abrasive particles 110 may be peeled off. Should be as large as possible so that is reduced. On the other hand, the radius R1 should not be excessively large in order to prevent the size of the contact area between the outer edge polishing surface S121 and the polishing pad from becoming excessively large. When the contact area between the outer edge polishing surface S121 and the polishing pad is excessively large, the abrasive particles 110 on the outer edge (relatively away from the central polishing surface S11) of the outer edge polishing surface S121 easily peel off. There is a possibility. For example, when the width W and the radius R1 are very small, the contact area between the polishing pad dresser 100 and the polishing pad becomes small, and thus the abrasive particles 110 may easily peel off. In some embodiments, the radius R1 ranges from 15mm to 25mm.

  When the shape is an arc, the inner edge polishing surface S122 has a suitable radius R2. On the other hand, the radius R2 forms a sufficient contact area between the polishing pad dresser 100 and the polishing pad, thereby making it possible to distribute the load by each of the polishing particles 110 and to separate the polishing particles 110. Should be as large as possible so that is reduced. On the other hand, the radius R2 should not be excessively large to prevent the inner edge polishing surface S122 from becoming substantially flat. When the inner edge polishing surface S122 is substantially flat, the inner edge polishing surface S122 (which is relatively close to the non-polishing surface S2) when the polishing pad dresser 100 moves along the direction toward the center of the polishing pad. The diamond polishing particles 110 at the inner edge are relatively close to the surface of the polishing pad, which may increase the possibility of collision between the diamond polishing particles 110 at the inner edge and the polishing pad edge. There is sex. In some embodiments, radius R2 ranges from 15 mm to 25 mm.

  In some embodiments, the original surface S0 of the polishing surface S1 may be formed by connecting the central polishing surface S11, the inner edge polishing surface S122, and the outer edge polishing surface S121. The center polishing surface S11 is a flat surface, and the inner edge polishing surface and the outer edge polishing surface are convex arcuate surfaces in contact with the center polishing surface S11. Therefore, on the one hand, since the original surface S0 of the polishing surface S1 is a smooth curved surface, stress concentration on the polishing surface S1 can be prevented, and on the other hand, the manufacturing process of the polishing surface S1 can be simplified.

  However, the shapes of the outer edge polishing surface S121 and the inner edge polishing surface S122 are not limited to this.

  In some embodiments, the outer edge polishing surface S121 and the inner edge polishing surface S122 that are arcuate surfaces may not be in contact with the central polishing surface S11.

  In other embodiments, the outer edge polishing surface S121 and the inner edge polishing surface S122 may be other types of curved surfaces.

  In some embodiments, the outer edge polishing surface S121 and the inner edge polishing surface S122 may be formed by connecting a plurality of surfaces. The plurality of surfaces may include at least one convex curved surface and at least one flat surface that is not parallel to the central polishing surface S11. In order to ensure that the outer edge polishing surface S121 is a smooth curved surface, the surface of the outer edge polishing surface S121 connected to the central polishing surface S11 may be a convex curved surface in contact with the central polishing surface S11. Similarly, the surface of the inner edge polishing surface S122 connected to the central polishing surface S11 may be a convex curved surface in contact with the central polishing surface S11 so that the inner edge polishing surface S122 is a smooth curved surface. Moreover, in order to simplify the manufacturing process of the outer edge polishing surface S121 and the inner edge polishing surface S122, the curved surfaces of the outer edge polishing surface S121 and the inner edge polishing surface S122 are arc-shaped surfaces, and the center of the arc-shaped surface is polished. You may make it comprise above surface S1.

  In some embodiments, the outer edge polishing surface S121 and the inner edge polishing surface S122 may be formed by connecting an arcuate surface and a flat surface. The arcuate surface is connected to and in contact with the central polishing surface S11. The flat surface is not parallel to the central polishing surface S11 and is in contact with the arcuate surface. In some embodiments, the outer edge polishing surface S121 and the inner edge polishing surface S122 may be formed by connecting two arcuate surfaces and a flat surface. The flat surface is disposed between the two arcuate surfaces, is in contact with the two arcuate surfaces, and is not parallel to the central polishing surface S11. One of the two arcuate surfaces is connected to and in contact with the central polishing surface S11.

  When the outer edge polishing surface S121 and the inner edge polishing surface S122 are smooth surfaces formed by an arcuate surface and a flat surface, the original surface S0 of the polishing surface S1 is also a smooth curved surface, and stress concentration on the polishing surface S1 To prevent.

  The shapes of the outer edge polishing surface S121 and the inner edge polishing surface S122 are not limited to the above embodiment. Persons skilled in the art can make adjustments and modifications based on the embodiments of the present disclosure.

  The distribution of the polishing surface S1 on the base body 120 is not limited to the above embodiment. Those skilled in the art can make adjustments and modifications based on the embodiments of the present disclosure. In some embodiments, the polishing surface S1 may be distributed annularly on the base body 120, and the convex portion of the processed edge polishing surface S12 ′ on the surface where the processed central polishing surface S11 ′ is located is Surrounding the treated central polishing surface S11 ′.

  In the second embodiment, differences between the polishing pad dresser 100 in the second embodiment and the polishing pad dresser 100 in the first embodiment will be described in detail, but other similar techniques can be found by referring to the first embodiment. Therefore, these are not described in detail here.

  With reference to FIGS. 9 and 10, in some embodiments, after roughening the original surface S0 of the polishing surface S1, a polishing surface S1 having an uneven surface is obtained. After the processing, the inner edge polishing surface S122 becomes the processed inner edge polishing surface S122 ′, the outer edge polishing surface S121 becomes the processed outer edge polishing surface S121 ′, and the central polishing surface S11 becomes the processed central polishing surface S11 ′. .

  Compared to the first embodiment, the second embodiment provides the following advantages. When the polishing pad dresser 100 is used for dressing the polishing pad, both the abrasive particles 110 on the treated outer edge polishing surface S121 ′ and the abrasive particles 110 on the treated inner edge polishing surface S122 ′ are treated. Higher than that on the finished central polishing surface S11. When the indentation depth of the polishing pad dresser 100 into the polishing pad is relatively small, the polishing particles 110 on the processed central polishing surface S11 ′, the processed outer edge polishing surface S121 ′, and the processed inner edge polishing surface S122 ′. Only the abrasive particles 110 on a small portion may be used for polishing, while most of the abrasive particles 110 on the outer and inner edges may not be used for polishing. Therefore, the use efficiency of the abrasive particles 110 on the outer edge and the inner edge is reduced, and the possibility of peeling is reduced.

  When the polishing pad dresser 100 is used for dressing the polishing pad, the abrasive particles 110 on the processed inner edge polishing surface S122 'are higher than the abrasive particles 110 on the processed central polishing surface S11'. When the polishing pad dresser 100 moves along the direction toward the center of the polishing pad, the diamond abrasive particles 110 on the inner edge and the outer edge are above the surface of the polishing pad, thereby causing the upper edge on the inner edge and the outer edge. The possibility of collision between the abrasive particles 110 and the abrasive particles 110 on the edge of the polishing pad is reduced.

  In some embodiments, a method of manufacturing a polishing pad dresser is provided. Referring to FIG. 3, the method includes the following steps.

  A base body 120 and a plurality of abrasive particles 110 are provided. A roughening process is performed on the polishing surface S <b> 1 of the base body 120. Referring to FIG. 5, the abrasive particles 110 are laid on the polishing surface S <b> 1 of the base body 120. The abrasive particles 110 maintain a balance between the gravity and the holding force by the polishing surface S1. In a state where the balance is maintained, at least a part of the abrasive particles 110 is embedded in the recess S1 of the polishing surface. The highest portion of the abrasive particle 110 is not a flat surface but a protrusion T of the abrasive particle 110. That is, the protrusion T is directed upward. Next, the abrasive particles 110 are fixed on the polishing surface S <b> 1 by the binder 130. Further details regarding the method of securing the abrasive particles 110 onto the polishing surface S1 can be found by reference to conventional methods of manufacturing polishing pad dressers. Even after the abrasive particles 110 are fixed on the polishing surface S1, the protrusions T of the abrasive particles 110 are maintained upward.

  In the manufacturing method of the polishing pad dresser described above, no extra tool or processing is required to keep the protrusions T of the abrasive particles 110 facing upward, which makes the method simple and easy to implement.

  In some embodiments, a polishing pad dressing apparatus is provided, which comprises a polishing pad dresser 100 according to any one of the above embodiments. In some embodiments, as shown in FIG. 11, the polishing pad dressing apparatus 200 further comprises a drive structure configured to drive the polishing pad dresser 100. In some embodiments, the drive structure is connected to the polishing pad dresser 100 and is configured to be rotatably connected to the drive shaft 210 and a drive shaft 210 configured to drive and rotate the polishing pad dresser 100. A swing arm 220, a swing shaft 230 configured to support the swing arm 220 and drive and move the swing arm 220, and a dressing liquid nozzle 240 are provided. An electric motor is provided on the swing arm 220, and is connected to the drive shaft 210 to drive and rotate it, thereby rotating the polishing pad dresser 100. The swing shaft 230 is connected to a swing electric motor. The swing electric motor swings the swing shaft 230 to move the polishing pad dresser 100 along the radial direction of the surface of the polishing pad 310 on the surface of the polishing pad 310. While dressing the polishing pad 310, the polishing pad dresser 100 is pressed against the polishing pad 310, and the polishing table 320 and the polishing pad dresser 100 are driven and rotated, so that the dressing liquid is applied to the surface of the polishing pad 310 to be polished. Supplied.

  In some embodiments, the polishing pad dressing apparatus 200 may further include other structures besides the polishing pad dresser 100.

  With further reference to FIG. 11, a polishing system 300 is provided. The polishing system 300 includes a polishing apparatus including the polishing pad 310 and the polishing pad dressing apparatus 200 according to any one of the above embodiments, and the polishing pad dressing apparatus 200 is configured to dress the polishing pad 310. The

  In some embodiments, the polishing apparatus is configured to fix the silicon slice and press the silicon slice onto the surface of the polishing pad 310, with the polishing table 320 configured to support the polishing pad 310. The grinding head 330, the rotary shaft 340 connected to the upper surface of the grinding head 330, the abrasive nozzle 350, the swing arm 360 rotatably connected to the rotary shaft 340, and the swing arm 360 are supported. A rocking shaft 370 is further provided. The electric motor is provided on the swing arm 360 and is connected to the rotating shaft 340 to drive and rotate the rotating shaft 340 to rotate the grinding head 330. The swing shaft 370 is connected to a swing electric motor. The swing electric motor swings the swing shaft 370 and moves the grinding head 330 on the surface of the polishing pad 310 along the radial direction of the surface of the polishing pad 310.

  As noted above, the present disclosure has been disclosed with reference to preferred embodiments thereof, but is not limited thereto. Those skilled in the art can modify and change the embodiments without departing from the spirit and scope of the present disclosure. Therefore, any simple and equivalent changes shall fall within the protection scope of the technical outline of the present invention without departing from the scope of the technical outline of the present invention.

DESCRIPTION OF SYMBOLS 100 Polishing pad dresser 110 Abrasive particle S1 Polishing surface S2 Non-polishing surface T Protrusion

Optionally, the roughness (ten-point average roughness) of the polished surface is in the range of 100 μm to 300 μm.

In some embodiments, the base body 120 is disk-shaped and has a radius in the range of 100 mm to 300 mm . In some embodiments, the base body 120 may have other shapes suitable for dressing a polishing pad. In some embodiments, the base body 120 is made of stainless steel.

Claims (17)

Abrasive particles having a regular shape with a polyhedron;
A base body having a polished surface;
A polishing pad dresser comprising:
The polishing surface has a certain degree of roughness so that the polishing surface is uneven, the abrasive particles are fixed on the polishing surface, and at least a portion of the polishing particles are in the recesses of the polishing surface. A polishing pad dresser, wherein the polishing pad dresser is embedded and at least a part of the protrusions of the polishing particles in the recess is opposite to the polishing surface.   The polishing pad dresser according to claim 1, wherein the roughness of the polishing surface is in a range of 100 μm to 300 μm.   The polishing pad dresser according to claim 1, wherein the abrasive particles have a regular octahedral shape, a regular dodecahedron shape, a regular icosahedron shape, a prismatic shape, or a pyramid shape.   An original surface of the polishing surface is a flat surface, or includes an edge polishing surface and a center polishing surface that are connected to each other, the edge polishing surface surrounding the center polishing surface, and the center polishing surface The polishing pad dresser according to claim 1, wherein the polishing surface is a flat surface and higher than the edge polishing surface, and the original surface is the polishing surface before the roughening treatment is performed. .   The edge polishing surface is a convex curved surface or connects a plurality of surfaces including at least one convex curved surface and at least one flat surface not parallel to the central polishing surface. The polishing pad dresser according to claim 4, wherein the polishing pad dresser is formed by: When the edge polishing surface is a convex curved surface, the edge polishing surface is in contact with the central polishing surface,
When the edge polishing surface is formed by connecting a plurality of surfaces, the surface of the edge polishing surface connected to the central polishing surface is a convex curved surface in contact with the central polishing surface. The polishing pad dresser according to claim 5, wherein:   The polishing pad dresser according to claim 6, wherein the curved surface is an arcuate surface.   The base body further includes a non-polishing surface lower than the polishing surface, the polishing surface is annularly provided on the base body, and the polishing surface on the surface where the non-polishing surface is located The polishing pad dresser according to claim 4, wherein the convex portion surrounds the non-polishing surface.   When the raw surface of the polishing surface includes an edge polishing surface and a central polishing surface that are interconnected, the edge polishing surface includes an inner edge polishing surface and an outer edge polishing surface, and the central polishing surface is The polishing pad dresser according to claim 8, wherein the polishing pad dresser is disposed between the inner edge polishing surface and the outer edge polishing surface.   The polishing pad dresser according to claim 1, wherein the base body has a disk shape.   The polishing pad dresser according to claim 1, wherein the abrasive particles include diamond or cubic boron nitride. Providing a base body and abrasive particles;
Performing a roughening treatment on the polishing surface of the base body, and imparting a certain roughness to the polishing surface such that the polishing surface is uneven;
Laying the abrasive particles on the polishing surface of the base body, burying at least a portion of the abrasive particles in a recess in the polishing surface, and making a projection of at least a portion of the abrasive particle in the recess face upward ,
Fixing the abrasive particles on the polishing surface;
The manufacturing method of the polishing pad dresser containing this.   The method according to claim 12, wherein the roughening treatment is blasting.   The method of claim 12, wherein the abrasive particles are secured onto the base body by electroplating, chemical brazing, metal sintering or chemical vapor deposition.   A polishing pad dressing apparatus comprising the polishing pad dresser according to claim 1.   The polishing pad dressing apparatus according to claim 15, further comprising a drive structure configured to drive the polishing pad dresser. A polishing apparatus comprising a polishing pad;
The polishing pad dressing device according to claim 15 configured to dress the polishing pad;
A polishing system comprising: