TW201022481A - Shield plate and electroplating apparatus - Google Patents

Shield plate and electroplating apparatus Download PDF

Info

Publication number
TW201022481A
TW201022481A TW098116445A TW98116445A TW201022481A TW 201022481 A TW201022481 A TW 201022481A TW 098116445 A TW098116445 A TW 098116445A TW 98116445 A TW98116445 A TW 98116445A TW 201022481 A TW201022481 A TW 201022481A
Authority
TW
Taiwan
Prior art keywords
anode
plate
plating
substrate
electrolytic
Prior art date
Application number
TW098116445A
Other languages
English (en)
Chinese (zh)
Inventor
Dal-Hyun Yoo
Chang-Hwan Choi
Hee-Soo Yoon
Chang-Hwan Park
Yunn-Hong Choi
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of TW201022481A publication Critical patent/TW201022481A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW098116445A 2008-12-15 2009-05-18 Shield plate and electroplating apparatus TW201022481A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080127194A KR20100068737A (ko) 2008-12-15 2008-12-15 차폐판 및 전해도금장치

Publications (1)

Publication Number Publication Date
TW201022481A true TW201022481A (en) 2010-06-16

Family

ID=42348852

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098116445A TW201022481A (en) 2008-12-15 2009-05-18 Shield plate and electroplating apparatus

Country Status (3)

Country Link
JP (1) JP2010138483A (ja)
KR (1) KR20100068737A (ja)
TW (1) TW201022481A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112504327A (zh) * 2020-11-23 2021-03-16 中国电子科技集团公司第十八研究所 一种观测电解液流动轨迹的装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011096628A (ja) 2009-09-30 2011-05-12 Hirose Electric Co Ltd 電気コネクタ
CN102477576A (zh) * 2010-11-30 2012-05-30 加贺开发科技有限公司 电镀装置及其电镀槽中的电极板结构
KR20130045081A (ko) * 2011-10-25 2013-05-03 삼성전기주식회사 전기도금 장치
KR102194716B1 (ko) * 2014-03-06 2020-12-23 삼성전기주식회사 도금 장치
KR101603503B1 (ko) * 2015-03-09 2016-03-15 김종학 롤투롤 공정의 인쇄회로기판 수직 도금에서 플러드 박스를 이용한 도금 장치
KR102036966B1 (ko) * 2016-09-26 2019-10-25 노바테크인더스트리 주식회사 금속 메쉬의 미세 선폭 도금용 진공 및 차폐 척
CN108004575B (zh) * 2017-12-29 2024-04-16 上海新阳半导体材料股份有限公司 电镀用屏蔽装置
JP7070012B2 (ja) * 2018-04-17 2022-05-18 住友金属鉱山株式会社 電解めっき装置、および金属張積層板の製造方法
CN110344102A (zh) * 2019-08-14 2019-10-18 重庆方正高密电子有限公司 陪镀板以及电镀线
CN117552071B (zh) * 2024-01-11 2024-03-29 宁波惠金理化电子有限公司 一种五金电镀设备及其使用方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000256891A (ja) * 1999-03-04 2000-09-19 Oki Electric Ind Co Ltd 電解めっき方法および陽極構造体
JP2002054000A (ja) * 2000-08-02 2002-02-19 Nitto Denko Corp 基板の電解めっき方法
JP3352081B2 (ja) * 2001-02-01 2002-12-03 株式会社アスカエンジニアリング プリント基板の銅めっき装置
JP2002302799A (ja) * 2001-04-05 2002-10-18 Sumitomo Metal Mining Co Ltd 電気めっき方法および電気めっき方法で用いる遮へい板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112504327A (zh) * 2020-11-23 2021-03-16 中国电子科技集团公司第十八研究所 一种观测电解液流动轨迹的装置

Also Published As

Publication number Publication date
KR20100068737A (ko) 2010-06-24
JP2010138483A (ja) 2010-06-24

Similar Documents

Publication Publication Date Title
TW201022481A (en) Shield plate and electroplating apparatus
TWI228781B (en) Method and apparatus for controlling local current to achieve uniform plating thickness
TW200803675A (en) Method and process for embedding conductive elements in a dielectric layer
US6827827B2 (en) Metal plating apparatus and process
TWI383475B (zh) 電鍍裝置
CN106358379A (zh) 印刷电路板及其制造方法
CN101466206A (zh) 一种印刷线路板的导通孔电镀的方法
CN101460017B (zh) 一种印刷线路板的导通孔电镀方法
KR101198005B1 (ko) 전해 도금장치
JP2014210959A (ja) めっき装置、めっき方法、配線回路基板の製造方法および配線回路基板
KR100956685B1 (ko) 도금장치
CN110938861B (zh) 退锡设备
JP2013091844A (ja) 電気めっき装置
JP2014196540A (ja) 電気めっき方法およびそれに用いるマスク部材
CN103582306A (zh) 印刷电路板的制造方法
TW200938048A (en) Method for manufacturing wire substrate
KR100716545B1 (ko) 균일 두께 도금을 위한 도금 장치
CN203015285U (zh) 具有选择性局部电镀厚金印制线路板
TWM381635U (en) Electroplate apparatus for plating copper on a printed circuit board
KR20140025223A (ko) 도금 장치
JP4443649B2 (ja) 電気めっきパターン
JP2014019946A (ja) めっき装置
KR101146740B1 (ko) 주석 도금 장치
CN103403228A (zh) 贯通孔镀敷方法以及利用该贯通孔镀敷方法制造的基板
CN116669321A (zh) 镀金辅助引线、镀金板件制备方法、板件基板和镀金板件