201015141 九、發明說明： 【相關申請案之交互參照】 本申请案主張2008年1〇月6曰申請之韓國專利申請案 10-2008-0097723號，其揭露整體結合於此作為參考。 【發明所屬之技術領域】 本發明係關鱗酬試||’用以伽形成於基板上之電極 之電缺陷。 〇 【先前技術】 光電裝置為接收電能且發射光之裝置，其包含平面板顯示 器，例如液晶顯示器(LCDs)、電漿顯示面板(PDPs)、以及類似 者。 一般而言，光電裝置包含其上形成有複數個電極之基板。 舉例而言，薄膜電晶體(TFT)液晶顯示基板包含TFT基板、彩 ® 色濾光片及共用電極形成於其上且相對於TFT基板之彩色基 板、插入於TFT基板及彩色基板間之液晶、以及背光。土 形成於基板上之電極的缺陷，利用陣列測試器來偵測。此 類陣列測試器包含調變器塊。調變器塊包含用以與基板電極形 成電場之調變器電極’以及根據電場強度改變物理性質之物理 性質改變單元。 5 201015141 當調變器塊在基板上方自基板之一部分移動到另一部分 時，調變器塊偵測基板上電極的任何缺陷。 在陣列測試期間，調變器塊應設置最接近基板，以與基板 之電極形成電場，且當調變器塊移動時，亦應與基板分開，以 避免調變H塊刮傷基板。g此，機H塊可提升軸接到固定 塊。。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical defect of an electrode formed on a substrate. 〇 [Prior Art] An optoelectronic device is a device that receives electric energy and emits light, and includes flat panel displays such as liquid crystal displays (LCDs), plasma display panels (PDPs), and the like. In general, an optoelectronic device includes a substrate having a plurality of electrodes formed thereon. For example, a thin film transistor (TFT) liquid crystal display substrate includes a TFT substrate, a color-color filter, and a color substrate on which a common electrode is formed and which is interposed between the TFT substrate and the color substrate, and a liquid crystal that is interposed between the TFT substrate and the color substrate. And backlighting. The defects of the electrodes formed on the substrate are detected by an array tester. This type of array tester contains a modulator block. The modulator block includes a modulator electrode ' for forming an electric field with the substrate electrode and a physical property changing unit that changes physical properties according to the electric field strength. 5 201015141 When the modulator block moves from one part of the substrate to another over the substrate, the modulator block detects any defects in the electrodes on the substrate. During the array test, the modulator block should be placed closest to the substrate to form an electric field with the electrodes of the substrate, and when the modulator block is moved, it should also be separated from the substrate to avoid tampering the H-block to scratch the substrate. g This, the machine H block can lift the shaft to the fixed block.
然而’當調變器塊移動時，調變器塊因與固定塊雛 的轉矩而側向振動。 因此，從調變器塊到達待測基板上方到調變器塊完全停 止，耗費太多的安頓時間，而造成測試時間拉長。 再者，當測試大型基板時，調變器塊必須比小型基板移動 更多次’在這樣的情況下，由於安頓時間增加而使得 的拉長變得更嚴重。 ’ 【發明内容】 以下說明關於-種陣列測試器’其中當移動時調變 動小，因而降低安頓時間。 ° 根據一例示觀點，提供一種陣列測試器，包含：水平移動 於至少一方向之固定塊；可提升地耦接固定塊之下部之調變器 6 201015141 塊’其與开> 成在基板上之電極形成電場，且根據電場的強度偵 測基板之任何缺陷；以及至少一空氣軸承，插置於固定塊及調 變器塊之間，且當調變器塊移動時避免調變器塊振動，其中在 調變器塊墟固定塊後，至少一冑氣轴奴喷射流中心之高度 等於調變器塊之重心之高度。 本發明額外觀點將於以下說明中提出，且部分將因說明而 _ 顯明’或可由施行本發明而得知。 應了解前述一般說明及以下詳細說明為例示性及說明 性，且忍欲對所主張之發明提供進一步的解釋。 【實施方式】 於後參照顯示本發明例示實施例之伴隨圖式，更完整地說 明本發明。然而，本發明可以不同的形式實施，且不應以此所 述之例示實施例為限制。所提供之實施例使揭露更完全，且將 ❹ 使熟此技藝者更加清楚本發明範》#。於圖式中，為清楚說明可 旎誇示層及區域的尺寸及相對尺寸。圖式中類似的參考符號表 示類似的元件。 圖1為根據實施例之陣列測試器100之透視圖，其中陣列 測試器100用以偵測形成於基板1〇上之電極之電缺陷。 基板10可為平顯示面板所包含之面板。舉例而言，基板 201015141 10為薄膜電晶體液晶顯示(TFT LCD)基板之TFT面板。 〇〇陣列測試器1⑻包含裝載單元110、測試單元120、卸載 單元130、以及至少一測試模組14〇。 裝载單元110可包含至少兩個裝載板lu。裝載板U1以 預定間隔並排配置，使得待測試基板由裝載板U1所支撐而移 動到測試單元120。 測試單元120放置於裝載單元no之一侧，且偵測透過裝 載板111傳送之面板的電缺陷。 卸載單元130放置於測試單元120之一侧，且接收測試完 的基板並將其傳送到外界。卸載單元13〇可包含卸載板，其上 供女置測試過的基板且基板於其上漂浮預定間距而被移動到 外界。 於此案例中，裝載單元110之裝載板U1及卸載單元13〇 之卸載板具有複數個氣孔112及132，朝通過的基板供給壓力 而移動基板。再者，裝載單元11〇及卸載單元13〇可各包含至 少一吸附板101，用以吸附基板於其上。 測試模組140置於測試單元120之上及/或之下，且偵測 置於測試板上之基板電極的電缺陷。 8 201015141 再者’測試模組14〇可沿X軸轨道102移動於χ轴方向。 再者，基板可移動於γ軸方向而經由裝載單元11〇、測試單元 120、以及卸載單元13〇。因此，當相對於基板移動時，測試 模組140可測試基板的電極。然而，亦可能讓基板固定放置於 固定支撐板上，而測試模組14〇移動於X及γ軸方向來偵測 形成在基板上之電極的缺陷。 以下參考圖2將詳細說明測試模組140。如圖2所示，測 • 試模組140包含固定塊⑷以及調變器塊146。固定塊141可 為空管的形狀，使得調變器塊146可暴露於外部造影裝置，而 造影裝置149可置於固定塊141上。 調變器塊146可提升地麵接固定塊141 ’且與基板電極形 成電場’並根據電場強度偵測電極的任何缺陷。 亦即’當調變器塊146置於鄰近基板時，若施加預定電壓 φ 到調變器塊146之調變器電極以及基板的電極，在調變器塊 146之調變器電極以及基板的電極間產生電場。當基板電極有 缺陷時所產生的電場強度，低於基板沒有缺陷時所產生的電場 強度。因此，基於電場強度來決定基板電極是否有缺陷存在。 當偵測基板電極的任何缺陷時，為了在調變器電極及基板 電極間形成足夠的電場’且避免調變器塊146刮傷基板，調變 益塊146必須放置成最接近基板且具有數微米（#m)或數十微 9 201015141 米的間隙 份的調變器塊146移動以測試基板另一部 時，土板及調變器塊間的間隙必須加寬。 包含調變器塊146間的間隙，調變器塊146 氣。喷射^祕板魏具有財壓力的空 健^對軸時，所有的 之間㈣㈣ 例而，變ft ΊΓ可以各種方式可提升地搞接固定塊141。舉 :，圖A及圖3B所示，導引構件151固 =，，導引構件151插入形成於固定塊146 = 亦即，導引構件151的下部藉由螺絲 =導:丨構件⑸的上部插入導槽 151的上邛可自由地在導槽142中提升。 鎖顯I43形成於導槽⑷上，使得調變器塊】46不從固定 201015141 塊141偏離。導引構件151的上部彎折而被鎖顎143扣住。因 此’導引構件151的上部沿導槽142在預定區域内自由地提 升，且調變器塊146不會從固定塊141偏離，而可調整固定塊 141及調變器塊146間的間隙K1或K2。However, when the modulator block moves, the modulator block vibrates laterally due to the torque of the fixed block. Therefore, from the modulator block to the top of the substrate to be tested until the modulator block is completely stopped, it takes too much settling time, which causes the test time to lengthen. Furthermore, when testing large substrates, the modulator block must be moved more times than the small substrate. In such a case, the elongation becomes more severe due to the increase in the settling time. SUMMARY OF THE INVENTION The following description relates to an array tester in which the modulation is small when moving, thereby reducing the settling time. According to an exemplary aspect, an array tester is provided, comprising: a fixed block horizontally moved in at least one direction; a modulator 6 that can be liftably coupled to a lower portion of the fixed block; 201015141 block 'its and open> on the substrate The electrode forms an electric field and detects any defects of the substrate according to the intensity of the electric field; and at least one air bearing is interposed between the fixed block and the modulator block, and avoids vibration of the modulator block when the modulator block moves After the block of the transformer block is fixed, the height of the center of at least one of the xenon slave jets is equal to the height of the center of gravity of the modulator block. Additional points of the invention will be set forth in the description which follows, and in part <RTIgt; It is to be understood that the foregoing general descriptions [Embodiment] The present invention will be described more fully hereinafter with reference to the accompanying drawings which illustrate the embodiments of the invention. However, the invention may be embodied in different forms and should not be construed as being limited by the illustrated embodiments. The examples provided are intended to provide a more complete disclosure and will be apparent to those skilled in the art. In the drawings, the size and relative dimensions of the layers and regions are exaggerated for clarity. Like reference symbols in the drawings indicate like elements. 1 is a perspective view of an array tester 100 in accordance with an embodiment in which an array tester 100 is used to detect electrical defects of electrodes formed on a substrate 1 . The substrate 10 can be a panel included in a flat display panel. For example, the substrate 201015141 10 is a TFT panel of a thin film transistor liquid crystal display (TFT LCD) substrate. The 〇〇 Array Tester 1 (8) includes a loading unit 110, a testing unit 120, an unloading unit 130, and at least one test module 14A. The loading unit 110 can include at least two loading plates lu. The loading plates U1 are arranged side by side at predetermined intervals so that the substrate to be tested is supported by the loading plate U1 and moved to the test unit 120. The test unit 120 is placed on one side of the loading unit no and detects electrical defects of the panel transmitted through the loading board 111. The unloading unit 130 is placed on one side of the test unit 120, and receives the tested substrate and transmits it to the outside. The unloading unit 13A may include an unloading plate on which the substrate is tested and the substrate is floated to a predetermined space to be moved to the outside. In this case, the loading plate U1 of the loading unit 110 and the unloading plate of the unloading unit 13A have a plurality of air holes 112 and 132, and the substrate is moved toward the passing substrate to move the substrate. Furthermore, the loading unit 11 and the unloading unit 13 may each include at least one adsorption plate 101 for adsorbing the substrate thereon. The test module 140 is placed on and/or under the test unit 120 and detects electrical defects placed on the substrate electrodes on the test board. 8 201015141 Furthermore, the test module 14A can be moved along the x-axis track 102 in the x-axis direction. Further, the substrate can be moved in the γ-axis direction via the loading unit 11A, the test unit 120, and the unloading unit 13A. Thus, the test module 140 can test the electrodes of the substrate as it moves relative to the substrate. However, it is also possible to mount the substrate on the fixed support plate, and the test module 14 is moved in the X and γ axis directions to detect defects of the electrodes formed on the substrate. The test module 140 will be described in detail below with reference to FIG. As shown in FIG. 2, the test module 140 includes a fixed block (4) and a modulator block 146. The fixed block 141 can be in the shape of an empty tube such that the modulator block 146 can be exposed to an external contrast device and the contrast device 149 can be placed on the fixed block 141. The modulator block 146 can lift the ground-attached fixed block 141' and form an electric field with the substrate electrode and detect any defects of the electrode based on the strength of the electric field. That is, when the modulator block 146 is placed adjacent to the substrate, if a predetermined voltage φ is applied to the modulator electrode of the modulator block 146 and the electrodes of the substrate, the modulator electrode of the modulator block 146 and the substrate An electric field is generated between the electrodes. The electric field intensity generated when the substrate electrode is defective is lower than the electric field intensity generated when the substrate has no defect. Therefore, it is determined whether or not the substrate electrode has a defect based on the electric field strength. When detecting any defects of the substrate electrode, in order to form a sufficient electric field between the modulator electrode and the substrate electrode and avoiding the modulator block 146 from scratching the substrate, the modulation block 146 must be placed closest to the substrate and have a number When the modulator block 146 of the micrometer (#m) or tens of micro 9 201015141 meters is moved to test the other part of the substrate, the gap between the soil plate and the modulator block must be widened. The gap between the modulator blocks 146 is included, and the modulator block 146 is vented. When the jets are in the air, when there is a pressure on the shaft, all of them (4) and (4), the ft ΊΓ can be lifted and fixed in various ways. As shown in Fig. A and Fig. 3B, the guiding member 151 is fixed, and the guiding member 151 is inserted and formed on the fixing block 146 = that is, the lower portion of the guiding member 151 is screwed to the upper part of the 丨 member (5) The upper jaw of the insertion guide groove 151 is freely lifted in the guide groove 142. The lock display I43 is formed on the guide groove (4) such that the modulator block 46 does not deviate from the fixed 201015141 block 141. The upper portion of the guiding member 151 is bent and caught by the lock 143. Therefore, the upper portion of the guiding member 151 is freely lifted along the guide groove 142 in a predetermined region, and the modulator block 146 does not deviate from the fixed block 141, and the gap K1 between the fixed block 141 and the modulator block 146 can be adjusted. Or K2.
至少二個導槽142形成於固定塊141的至少三側，使得調 變器塊146可穩定地與固定塊141耦接，且至少三個導引構件 151可分別安裝於對應的三個導槽142。 複數個空氣軸承156插置於固定塊141與調變器塊146 之間。以下將參相4及圖5說輕氣軸承156。线轴承156 用以避免調變器塊146移動時發生振動。 ^即’當霞H塊146在部麵基城行職後移動到下 z一調變器塊146可能因與固域141的耦接部份在 降而振動。空氣轴承丨56用以最小化纖動並 以將空氣軸承156於绸變器塊， 界供應的二乳向外朝調變器塊146的四個侧邊喷射。 固定:固:ί 承156之複數個管件157 別容置於形成於_塊14心=氣== 11 201015141 147可分別形成於靠近調變器塊146上侧的角落。再者，當空 氣軸承156分別容置於容置孔147時，空氣軸承156的喷射方 向面對調變器塊146的四個侧邊。 因此，調變器塊146由於Z軸方向之轉矩的振動，可藉 由自空氣軸承156喷射出的空氣來最小化，因此可降低安頓時 間。 再者，空氣軸承156分別容置於調變器塊146之容置孔 147並向外朝調變器塊丨46的四個侧邊喷射空氣之結構，有助 於降低固定塊141的尺寸及重量^ 〜以比較例而言’若固定塊具有圍繞調變器塊且空氣軸承固 定於’塊的四侧邊以_翻變^塊喷射空氣之結構，則 需要非常笨重又大_定塊。因此，相較於錄例，根據本實 施例之固定塊141在尺寸及重量上有其優勢。 再者’由於空氣轴承I%的空氣喷射方向為朝外在 及調變器塊146間流入外來物質的可能性，比空氣喷射方向朝 内的案例還要低。因此，可更穩定地執行基板電極的缺陷偵測。 的s，時二置孔147 成對形成於靠近調變器塊146兩對角 洛。’肋穩疋支撐空氣轴承156之支撐構件158 可插置於找軸承丨56及妓孔147_㈣。 12 201015141 當調變器塊146耦接固定塊141時’空氣軸承156放置於 對應調變器塊146之重心C1的高度。於此，各空氣抽承15^ 的喷射流中心C2放置於對應調變器塊146之重心C1的高 度。因此’可降低調變器塊146由於轉矩而在z轴方向及5 Y軸方向的振動，因此可降低安頓時間。 ’ 將本實施例與空氣轴承156之噴射流中心C2低於或高於 φ 調變器塊146之重心C1的高度之案例相比較時，將可輕^ 了 解這些效果。於比較例中，調變器塊146可因空氣軸承 喷射的空氣壓力造成的轉矩，而在X及/或γ軸方向受到影 響。此類轉矩會加到當調變器塊146移動時所產生的轉^ 此加速了調變器塊146的振動，而造成安頓時間增加。 同時，根據本實施例，由於空氣轴承156的噴射流中、 C2設置於對應調變器塊146重心C1的高度，因而可=小= 空氣軸承156喷射出空氣的壓力所造成的轉矩效應。因此，'可 β 最小化調變器塊146的振動並降低安頓時間。 同時，可進一步提供重心調整單元16〇，以改變調變器塊 146重心C1的高度。組合空氣軸承156後，當空氣轴承156 之喷射流中心C2低於或高於調變器塊146的重心ο 心調整單元_改_變n塊146，並使調變器 146的重心cl等於空氣軸承156之喷射流中心^2。 13 201015141 如圖4所示’重心調整單元160可包含桿耦接器161及調 整重心之桿件162。桿耦接器161可形成於調變器塊146上。 桿件162可具有可拆卸地搞接桿耦接器161之結構。以下將詳 述利用重心調整單元16〇，改變調變器塊146之重心ci言声 的程序。 间又 首先^矛干件162與桿耦接器161轉接時，決定調變器塊 參 146重心C1力高度，且對應重心α的設定高度組合空氣轴 承1561在組合空氣轴承156後，若空氣軸承156的喷射流中 心C2咼於或低於調變器塊146的重心Cb將桿件162與 耦接器161分離。 、干 然後’將另-個更輕或更重的桿件162輕接到桿搞接器 16W吏得調變器塊146的重心C1可匹配空氣轴承156的喷 射流中心CH’因此可改變調變器塊146重心ci的高产。同 時，重心調整單幻60 *限於上述齡卜再者，兩個=調整 β 單元160可分別安裝於調變器塊146的兩侧，以平衡調變器塊 146 〇 根據本實施例，藉由提供空氣軸承於調 度，當調變器移動時可降低調變器塊的振動。再者^於= 了安頓時間’而可尚速執行陣列測試。 熟此技術賴者_瞭在不轉本發明申請專利範圍界 14 201015141 可有各種修改及變化。因此本發明意欲涵蓋 圍之範疇及其均等物所提供之各種變化及修 定之精神與範疇 所述申請專利範 改。 【圖式簡單說明】 :匕3所附圖式以提供本發明進一步的了解，並結合且構成 說明書之一部份’說明本發明之例示實施例，並與說明一起解 ❸ 釋本發明觀點。 圖1為根據實施例之陣列測試器之透視圖； 圖2為根據實施例圖1所示之測試模組之透視圖； 圖3A及圖3B為說明圖2所示之調變器塊相對固定塊提 升之結構之截面圖； 圖4為圖2所示之調變器之爆炸透視圖；以及 圖5為沿圖2之V-V線切截之截面圖。 【主要元件符號說明】 基板 陣列測試器 吸附板 X轴轨道 裝載單元 裝載板 氣孔 測試單元 © 10 100 101 102 110 111 112 120 15 201015141 130 132 140 141 142 143 146 147 ❿ 149 151 156 157 158 160 161 162 卸載單元 氣孔 測試模組 固定塊 導槽 鎖顎 調變器塊 容置孔 造影裝置 導引構件 空氣軸承 管件 支撐構件 重心調整單元 桿耦接器 桿件At least two guiding grooves 142 are formed on at least three sides of the fixing block 141, so that the modulator block 146 can be stably coupled with the fixing block 141, and at least three guiding members 151 can be respectively mounted on the corresponding three guiding slots. 142. A plurality of air bearings 156 are interposed between the fixed block 141 and the modulator block 146. The light gas bearing 156 will be described below with reference to Fig. 4 and Fig. 5. The wire bearing 156 is used to avoid vibration when the modulator block 146 is moved. ^ That is, when the Xia H block 146 moves to the lower z-modulator block 146 after the postal base, it may vibrate due to the coupling portion with the solid domain 141. The air bearing bore 56 is used to minimize fiber movement and to inject the air bearing 156 into the filament block, and the two supplied milk is directed outwardly toward the four sides of the modulator block 146. Fixed: Solid: 复 The plurality of tubes 157 of the 156 are placed in the _ block 14 core = gas == 11 201015141 147 can be formed in the corner near the upper side of the modulator block 146, respectively. Furthermore, when the air bearings 156 are respectively received in the accommodating holes 147, the ejection direction of the air bearing 156 faces the four sides of the modulating block 146. Therefore, the vibration of the torque of the modulator block 146 due to the Z-axis direction can be minimized by the air ejected from the air bearing 156, so that the settling time can be lowered. Moreover, the air bearing 156 is respectively received in the receiving hole 147 of the modulator block 146 and is configured to inject air to the four sides of the modulator block 46 to help reduce the size of the fixing block 141 and Weight ^ ~ In the comparative example, if the fixed block has a structure around the modulator block and the air bearing is fixed to the four sides of the block to blast the air, it is very bulky and large. Therefore, the fixing block 141 according to the present embodiment has an advantage in size and weight as compared with the recording example. Furthermore, since the air injection direction of the air bearing I% is the possibility of inflowing foreign matter between the outside and the modulator block 146, it is lower than the case where the air injection direction is inward. Therefore, defect detection of the substrate electrode can be performed more stably. The s, the second holes 147 are formed in pairs adjacent to the modulator block 146 in two diagonals. The support member 158 of the rib-stable support air bearing 156 can be inserted into the seek bearing bore 56 and the bore 147_(d). 12 201015141 When the modulator block 146 is coupled to the fixed block 141, the 'air bearing 156 is placed at the height of the center of gravity C1 of the corresponding modulator block 146. Here, the jet center C2 of each air pumping unit 15 is placed at the height of the center of gravity C1 of the corresponding modulator block 146. Therefore, the vibration of the modulator block 146 in the z-axis direction and the 5 Y-axis direction due to the torque can be reduced, so that the settling time can be reduced. These effects can be easily understood when the present embodiment is compared with the case where the jet flow center C2 of the air bearing 156 is lower or higher than the height of the center of gravity C1 of the φ modulator block 146. In the comparative example, the modulator block 146 may be affected in the X and/or γ-axis direction due to the torque caused by the air pressure of the air bearing injection. Such torque is added to the rotation produced by the modulator block 146 as it accelerates the vibration of the modulator block 146, resulting in an increase in settling time. Meanwhile, according to the present embodiment, since the jet of the air bearing 156, C2 is disposed at the height of the center of gravity C1 of the corresponding modulator block 146, it is possible to = = the torque effect caused by the pressure of the air bearing 156 ejecting the air. Therefore, 'β can minimize the vibration of the modulator block 146 and reduce the settling time. At the same time, the center of gravity adjustment unit 16A may be further provided to change the height of the center of gravity C1 of the modulator block 146. After combining the air bearing 156, when the jet flow center C2 of the air bearing 156 is lower or higher than the center of gravity of the modulator block 146, the centering unit _ changes the n block 146, and the center of gravity cl of the modulator 146 is equal to the air. The jet flow center ^2 of the bearing 156. 13 201015141 As shown in FIG. 4, the center of gravity adjustment unit 160 may include a lever coupler 161 and a lever 162 that adjusts the center of gravity. A lever coupler 161 can be formed on the modulator block 146. The lever member 162 may have a structure in which the lever coupler 161 is detachably engaged. The procedure for changing the center of gravity ci of the modulator block 146 by the center of gravity adjustment unit 16A will be described in detail below. Firstly, when the spear dry member 162 and the rod coupling 161 are transferred, the height of the center of gravity C1 of the modulator block 146 is determined, and the set height of the center of gravity α is combined with the air bearing 1561 after the air bearing 156 is combined, if air The jet flow center C2 of the bearing 156 is at or below the center of gravity Cb of the modulator block 146 to separate the rod 162 from the coupler 161. Dry and then 'slightly connect another lighter or heavier rod 162 to the rod adapter 16W. The center of gravity C1 of the modulator block 146 can match the jet center CH' of the air bearing 156. The transformer block 146 has a high yield of center of gravity ci. At the same time, the center of gravity adjustment is limited to the above-mentioned age, and the two = adjustment β units 160 can be respectively installed on both sides of the modulator block 146 to balance the modulator block 146. According to the embodiment, The air bearing is provided for scheduling to reduce the vibration of the modulator block as the modulator moves. Furthermore, ^ is = settling time' and the array test can be performed quickly. Those who are familiar with this technology _ have not changed the scope of the patent application of the present invention 14 201015141 There are various modifications and changes. It is intended that the present invention cover the scope of the invention and the scope of the inventions BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings illustrate the embodiments of the invention, and are in the 1 is a perspective view of an array tester according to an embodiment; FIG. 2 is a perspective view of the test module shown in FIG. 1 according to an embodiment; FIGS. 3A and 3B are diagrams showing a relatively fixed block of the modulator shown in FIG. FIG. 4 is an exploded perspective view of the modulator shown in FIG. 2; and FIG. 5 is a cross-sectional view taken along line VV of FIG. 2. [Description of main component symbols] Substrate array tester adsorption plate X-axis rail loading unit Loading plate air hole testing unit © 10 100 101 102 110 111 112 120 15 201015141 130 132 140 141 142 143 146 147 ❿ 149 151 156 157 158 160 161 162 Unloading unit vent test module fixed block guide groove lock 颚 modulator block accommodating hole angiography device guide member air bearing pipe support member center of gravity adjustment unit rod coupling rod