CN101258437A - Apparatus for sensing substrate - Google Patents
Apparatus for sensing substrate Download PDFInfo
- Publication number
- CN101258437A CN101258437A CNA2006800292361A CN200680029236A CN101258437A CN 101258437 A CN101258437 A CN 101258437A CN A2006800292361 A CNA2006800292361 A CN A2006800292361A CN 200680029236 A CN200680029236 A CN 200680029236A CN 101258437 A CN101258437 A CN 101258437A
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- China
- Prior art keywords
- sensing
- substrate
- ultrasonic
- glass substrate
- support frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2553/00—Sensing or detecting means
- B65H2553/30—Sensing or detecting means using acoustic or ultrasonic elements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Controlling Sheets Or Webs (AREA)
- Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
Abstract
Provided is a substrate detection apparatus. The substrate detection apparatus includes: a sensor support frame disposed adjacent to a vertically elongated cassette in which a plurality of substrates are stacked; and a plurality of ultrasonic sensors installed at one surface of the sensor support frame, emitting ultrasonic waves in parallel to the substrates, and detecting the ultrasonic waves reflected by the substrates to detect the presence of each substrate. Therefore, since an operation for detecting whether substrates such as glass substrates or wafers are positioned in a cassette can be simplified, the detection process can be sped up.
Description
Technical field
The present invention is about a kind of apparatus for sensing substrate, and more particularly the present invention about a kind of apparatus for sensing substrate that can use the existence of ultrasonic sensing method sensing glass substrate or wafer.
Background technology
By and large, LCD has liquid crystal material, and it is the intermediate materials between solid and the liquid and injects between two thin glass substrates.Use arrangement that a voltage difference changes liquid crystal molecule forming light and shade, thereby form image.
In the manufacture process of LCD, a plurality of glass substrates are stacked in the brilliant casket, and a brilliant casket glass substrate transfer equipment to be used is sent to a device that is used to carry out a predetermined processing procedure.In order accurately also promptly to transmit glass substrate, glass substrate detection device should determine whether glass substrate is stacked in the pre-position in the brilliant casket.
Fig. 1 illustrates the example of an existing glass substrate detection apparatus.
As shown in Figure 1, brilliant casket 10 is through forming to have hexahedral shape, and wherein relative to each other open two sides, and a plurality of glass substrate support stage 11 is to be installed on the front portion and the posterior face place of brilliant casket 10 corresponding to height each other.The periphery of the lower surface of glass substrate support stage 11 support glass substrate G is so that glass substrate G level is stacked in the brilliant casket 10.
In addition, glass substrate detection device 20 is through installing to be adjacent to two surfaces (left-hand face among Fig. 1) of opening the side of brilliant casket 10.Whether glass substrate detection device 20 exists glass substrate G to be stacked in the brilliant casket in order to sensing, and comprises a sensor support frame 21 and a plurality of infrared sensors 23 that are installed on a surface of sensor support frame 21.
Simultaneously, a plurality of infrared sensors 23 be installed on surface of sensor support frame 21 and with predetermined space between glass substrate support stage 11.Meaning promptly, when sensor support frame 21 when brilliant casket 10 moves, infrared sensor 23 is placed in glass substrate G below respectively.Subsequently, infrared sensor 23 emission infrared lights are to the lower surface of glass substrate G, and sensing glass substrate G infrared light existing with sensing glass substrate G of being reflected.
Hereinafter will describe the process of using existing glass substrate detection device 20 sensing glass substrate G in detail.
At first, move on it and pile up the brilliant casket 10 that glass substrate G is arranged so that the open surface of brilliant casket 10 is adjacent to glass substrate detection device 20.Under this state, sensor support frame 21 is moved to brilliant casket 10, so that infrared sensor 23 is placed in glass substrate G below.
Subsequently, the infrared light that infrared sensor 23 emission infrared lights to the lower surface of glass substrate G is reflected with sensing glass substrate G, thereby and the existence of sensing glass substrate G.Herein, infrared sensor 23 emissions are perpendicular to the infrared light of glass substrate G.
For example, when not being stacked in the brilliant casket 10 corresponding to any one the glass substrate G in the infrared sensor 23, infrared light from infrared sensor 23 emissions is reflected by the glass substrate G corresponding to the infrared sensor 23 that is positioned the last layer rank, and sensed subsequently.Do not exist the infrared sensor 23 of glass substrate G to expend the light that the glass substrate G of sensing of many time from the last layer rank slightly reflected herein.
Yet existing glass substrate detection device 20 has following problem.
As mentioned above, brilliant casket 10 moves to and is adjacent to sensor support frame 21 places, and sensor support frame 21 moves to brilliant casket 10 places subsequently.Meaning promptly since brilliant casket 10 and sensor support frame 21 both all move towards each other, so the whole operation of sensing glass substrate G is too complicated.
In addition, the mobile infrared sensor 23 that causes of sensor support frame 21 is inserted between the glass substrate G via the open surface of brilliant casket 10, and therefore is placed in glass substrate G below.In this process, infrared sensor 23 may collide with the side of brilliant casket 10 or glass substrate G and cause damage.
Summary of the invention
For solving aforementioned and/or other problem, the invention provides a kind of apparatus for sensing substrate that can more simplify the operation.
The present invention also provides a kind of apparatus for sensing substrate of damage that can minimum production.
The present invention also provides a kind of also apparatus for sensing substrate of the damage of minimum production that can more simplify the operation.
An aspect of the present invention provides a kind of apparatus for sensing substrate, and it comprises: a sensor support frame, and it is through settling to be adjacent to the brilliant casket that wherein piles up the vertical elongated that a plurality of substrates are arranged; And a plurality of ultrasonic sensing methods, it is installed on a surface of sensor support frame, and emission is parallel to the ultrasonic of substrate, and sensing substrate ultrasonic existing with each substrate of sensing of being reflected.
In another embodiment, each ultrasonic sensing method can be placed in the layer rank identical with counterpart substrate.
In another embodiment, apparatus for sensing substrate can more comprise a pair of analog bracket, and it is used for sensor support frame is fixed in the pre-position.
In another embodiment, ultrasonic sensing method can be placed in a surface of sensor support frame in a longitudinal direction with predetermined space.Herein, substrate can be wafer.
Another aspect of the present invention provides a kind of glass substrate detection apparatus, and it comprises: a sensor support frame, and it is through settling to be adjacent to the brilliant casket that wherein piles up the vertical elongated that a plurality of glass substrates are arranged; And a plurality of ultrasonic sensing methods, it is installed on a surface of sensor support frame, and emission is parallel to the ultrasonic of glass substrate, and sensing glass substrate ultrasonic existing with each glass substrate of sensing of being reflected.
In another embodiment, each ultrasonic sensing method can be placed in the layer rank identical with corresponding glass substrate.
In another embodiment, glass substrate detection apparatus can more comprise a pair of analog bracket, and it is used for sensor support frame is fixed in the pre-position.
Description of drawings
Fig. 1 is the sectional view of an example of existing glass substrate detection apparatus.
Fig. 2 is the decomposition diagram according to the apparatus for sensing substrate of an exemplary embodiments of the present invention.
Fig. 3 is the sectional view of first embodiment of apparatus for sensing substrate shown in Figure 2.
Fig. 4 is the skeleton view of second embodiment of apparatus for sensing substrate shown in Figure 2.
Fig. 5 is the skeleton view of the 3rd embodiment of apparatus for sensing substrate shown in Figure 2.
10,40: brilliant casket 11,11 ': glass substrate support stage
20: glass substrate detection device 21,31: sensor support frame
23: infrared sensor 30: apparatus for sensing substrate
32: fastener hole 33: analog bracket
35: ultrasonic sensing method 37: control module
41,41 ': wafer support stage G: glass substrate
S: fastener hole W: wafer
Embodiment
Now describe the present invention hereinafter more fully referring to accompanying drawing, wherein accompanying drawing is showed preferred embodiment of the present invention.Yet the present invention can multi-formly implement, and should not be construed as and be limited to the embodiment that this paper states.On the contrary, provide these embodiment so that this disclosure for thoroughly and completely, and fully conveys the scope of the invention to and has the knack of this skill person.Whole instructions and graphic in, similar reference number is represented like.
Fig. 2 is the decomposition diagram according to the apparatus for sensing substrate of an exemplary embodiments of the present invention.
As shown in Figure 2, apparatus for sensing substrate 30 according to the present invention comprises: a sensor support frame 31; One ultrasonic sensing method 35, it is installed on sensor support frame 31 and sentences the sensing substrate; And a control module 37, it is installed in the sensor support frame 31 and control basal plate sensing apparatus 30 fully.Apparatus for sensing substrate is stacked in a plurality of substrates in the brilliant casket etc. in order to rapid sensing.Substrate can be the glass substrate that is used for LCD, or is used to make the wafer of semiconductor equipment.Finally, apparatus for sensing substrate 30 can be used as glass substrate detection apparatus or wafer sensing apparatus.
More particularly, sensor support frame 31 is through forming to have rectangular shape, and it goes up elongation at longitudinal direction (that is, vertical).In addition, sensor support frame 31 has a hollow structure, and it is used to hold control module 37.Simultaneously, sensor support frame 31 can be fixed in the pre-position by independent stationary carriage 33.In one embodiment, analog bracket 33 can be fastened to the top and the lower end of sensor support frame 31 respectively.Therefore, sensor support frame 31 can be fixed in precalculated position or predetermined equipment place by analog bracket 33.For example, sensor support frame 31 can be by analog bracket 33 vertical fixing in the precalculated position or the predetermined equipment place.In addition, sensor support frame 31 can have a plurality of fastener holes 32 at its side surface place.In such cases, sensor support frame 31 can be fastened to precalculated position or predetermined equipment via the media of a plurality of fastener holes 32, and can omit analog bracket.
In addition, a plurality of ultrasonic sensing methods 35 that are installed on sensor support frame 31 places can the mode identical with the substrate in being stacked in brilliant casket be settled, so that the corresponding one to one substrate in being stacked in brilliant casket of sensor.For example, when substrate when being stacked in the brilliant casket on the longitudinal direction (meaning promptly, vertical), a plurality of ultrasonic sensing methods 35 also can be along the length direction positioned vertical of sensor support frame 31.In such cases, sensor support frame 31 can be by analog bracket 33 and fastener hole 32 vertical fixing in the precalculated position or the predetermined equipment place.In addition, when substrate flatly (meaning promptly, when in a lateral direction) being stacked in the brilliant casket, but 35 horizontal settings of a plurality of ultrasonic sensing method.In such cases, sensor support frame 31 can be by analog bracket 33 or fastener hole 32 horizontal fixed in the precalculated position or the predetermined equipment place.
In addition, ultrasonic sensing method 35 emission ultrasonics are to the substrate that is stacked in the brilliant casket, and the ultrasonic that reflected of sensing substrate, thus the existence of sensing substrate.In one embodiment, when the precalculated position that ultrasonic sensing method emission ultrasonic to imaginary substrate is located, and ultrasonic is during by the substrate reflection and by ultrasonic sensing method 35 sensings, based on the existence of the substrate of a sensing value sensing pre-position.Yet, when in ultrasonic is not being treated schedule time of sensing, returning, sense the pre-position and do not have substrate.In this process, ultrasonic sensing method 35 is placed in identical with the substrate layer rank (meaning promptly, in same level), and with the spaced apart preset distance in a surface (being called sidewall) of substrate periphery.Therefore, the ultrasonic sensing method 35 emission ultrasonic that is parallel to substrate to a surface of substrate periphery with the sensing substrate.Ultrasonic from ultrasonic sensing method 35 emission can have the frequency of hundreds of kHz (kilohertz), and for example 400 to 800kHz so that ultrasonic sensing method 35 can be under the situation of not disturbing other substrate the thin substrate of its correspondence of sensing only.
Simultaneously, control module 37 is electrically connected to a plurality of ultrasonic sensing methods 35 with complete control basal plate sensing apparatus 30.Specific, ultrasonic sensing method 35 in order to the ultrasonic of launching a preset frequency to the substrate that is stacked in the brilliant casket, and sensing substrate ultrasonic existing of being reflected with the sensing substrate.And control module 37 is connected to ultrasonic sensing method 35 with the existing of sensing substrate, and shows sensing value to the outside, or the transmission sensing value is to another equipment.In addition, control module 37 can optionally drive a plurality of ultrasonic sensing methods 35 based on predetermined value or from the outside predetermined signal of importing.In such cases, apparatus for sensing substrate 30 can link to another external device (ED).
Reference number S represents fastener hole, and it is used for analog bracket 33 is fixed to precalculated position or predetermined equipment.
Below will describe a plurality of embodiment in detail according to apparatus for sensing substrate of the present invention.
Fig. 3 is the sectional view of first embodiment that is used for the device of sensing substrate shown in Figure 2.
The glass substrate G that can be used for as shown in Figure 3, LCD in order to sensing according to apparatus for sensing substrate 30 of the present invention.Anticipate promptly, apparatus for sensing substrate 30 according to the present invention can be used as glass substrate detection apparatus.In such cases, be installed on ultrasonic sensing method 35 emissions in the apparatus for sensing substrate 30 have corresponding to the ultrasonic of the frequency of about 400kHz of thin glass substrate G to glass substrate G with sensing glass substrate G.
At first, brilliant casket 10 is ready to pile up a plurality of glass substrate G to use apparatus for sensing substrate 30 sensing glass substrate G of the present invention.At this moment, a plurality of glass substrate G support by the glass substrate support stage 11 that is installed in the brilliant casket 10, thereby level is stacked in the brilliant casket 10.
Subsequently, move to the position that is close to the apparatus for sensing substrate 30 that is fixed in a pre-position with piling up the brilliant casket 10 that glass substrate G is arranged on it.At this moment, an open surface of brilliant casket 10 is towards the ultrasonic sensing method 35 of apparatus for sensing substrate 30, and a spaced preset distance of ultrasonic sensing method 35 and glass substrate G periphery.
Subsequently, when brilliant casket 10 through settling when being adjacent to apparatus for sensing substrate 30, ultrasonic sensing method 35 has the ultrasonic of frequency of about 400kHz to a surface of glass substrate G periphery through driving with emission under the control of control module 37.When the ultrasonic from ultrasonic sensing method 35 emission was incident on the surface of glass substrate G periphery and reflexes to ultrasonic sensing method 35, the ultrasonic that ultrasonic sensing method 35 sensings are reflected was stacked in pre-position in the brilliant casket 10 to sense glass substrate G.Yet, when glass substrate G is not stacked in glass substrate support stage 11 in the glass substrate support stage 11 that is installed on brilliant casket 10 places ' when going up, from the ultrasonic corresponding to ultrasonic sensing method 35 emissions of glass substrate G continue to propagate and and no reflection events.Therefore, ultrasonic sensing method 35 does not sense ultrasonic, and sense glass substrate G be not positioned in the brilliant casket 10 glass substrate support stage 11 ' on.
Simultaneously, when ultrasonic sensing method 35 did not sense ultrasonic and therefore determines not have glass substrate G, the control module 37 that is connected to ultrasonic sensing method 35 showed sensing value to the outside, or the transmission sensing value is installed to another.Subsequently, user or glass substrate supply equipment via displayed value or transmission value recognize glass substrate G be not stacked in glass substrate support stage 11 ' on, and in addition glass substrate G is stacked to glass substrate support stage 11 ' on.
When brilliant casket 10 was filled glass substrate G, detection procedure was finished, and brilliant casket 10 is loaded into the device that is used for carrying out another process.
Simultaneously, Fig. 4 and Fig. 5 show other example according to apparatus for sensing substrate of the present invention.
Fig. 4 is the skeleton view of second embodiment that is used for the device of sensing substrate shown in Figure 2, and Fig. 5 is the skeleton view of the 3rd embodiment that is used for the device of sensing substrate shown in Figure 2.
As Fig. 4 and shown in Figure 5, can be used to make the wafer W of semiconductor equipment according to apparatus for sensing substrate 30 of the present invention in order to sensing.Anticipate promptly, apparatus for sensing substrate 30 according to the present invention can be used as the wafer sensing apparatus.In such cases, be installed on ultrasonic sensing method 35 emissions in the apparatus for sensing substrate 30 have corresponding to the ultrasonic of the frequency of about 800kHz of thin wafer W to wafer W with sensing wafer W.In addition, apparatus for sensing substrate 30 according to the present invention is placed in wherein to pile up the brilliant casket of wafer W 40 the place aheads (as shown in Figure 4), is stacked in wafer W in the brilliant casket 40 so that go up sensing at a forward direction (the A direction of Fig. 4).Perhaps, apparatus for sensing substrate 30 can be placed in wherein to pile up the brilliant casket of wafer W 40 rears (as shown in Figure 5), is stacked in wafer W in the brilliant casket 40 so that go up sensing in a back to direction (the B direction of Fig. 5).
At first, brilliant casket 40 is ready to pile up a plurality of wafer W to use apparatus for sensing substrate 30 sensing wafer W of the present invention.A plurality of wafer W support by the wafer support stage 41 that is installed in the brilliant casket 40, thereby level is stacked in the brilliant casket 40.
Subsequently, move to the position that is close to the apparatus for sensing substrate 30 that is fixed in a pre-position with piling up the brilliant casket 40 that wafer W is arranged on it.At this moment, an open surface of brilliant casket 40 is towards the ultrasonic sensing method 35 of apparatus for sensing substrate 30, and a spaced preset distance of ultrasonic sensing method 35 and wafer W periphery.
Subsequently, when brilliant casket 40 through settling when being adjacent to apparatus for sensing substrate 30, ultrasonic sensing method 35 has the ultrasonic of frequency of about 800kHz to a surface of wafer W periphery through driving with emission under the control of control module 37.Therefore, when the ultrasonic from ultrasonic sensing method 35 emission is incident on the surface of wafer W periphery and when reflexing to ultrasonic sensing method 35, the ultrasonic that ultrasonic sensing method 35 sensings are reflected is stacked in the pre-position of brilliant casket 40 to sense wafer W.Yet, when wafer W is not stacked in wafer support stage 41 in the wafer support stage 41 that is installed on brilliant casket 40 ' when going up, from the ultrasonic corresponding to ultrasonic sensing method 35 emissions of wafer W continue to propagate and and no reflection events.Therefore, ultrasonic sensing method 35 does not sense ultrasonic, and definite wafer W be not positioned in the brilliant casket 40 wafer support stage 41 ' on.
Simultaneously, thereby do not sense ultrasonic when determining there is not wafer W when ultrasonic sensing method 35, the control module 37 that is connected to ultrasonic sensing method 35 shows sensing value to the outside, or the transmission sensing value is installed to another.Subsequently, user or wafer supply equipment via displayed value or transmission value recognize decide wafer W be not stacked in wafer support stage 41 ' on, and in addition wafer W is stacked to wafer support stage 41 ' on.
When brilliant casket 40 was filled wafer W, detection process was finished, and brilliant casket 40 is loaded into the device that is used for carrying out another process.
Though with reference to exemplary embodiments of the present invention and describe the present invention, have the knack of this skill person will understand, can in adding spirit of the present invention that claim states and category, make multiple modification to description embodiment.
As seen aforementioned, can have the following advantages according to apparatus for sensing substrate of the present invention.
The first, wherein stacking have brilliant casket such as the substrate of glass substrate or wafer through settling to be adjacent to Be fixed in the apparatus for sensing substrate of pre-position, and the ultrasonic that will have a preset frequency is emitted to Brilliant casket, thus can whether be stacked in the brilliant casket by the sensing substrate. Therefore, owing to can simplify the sensing substrate Operation, so can carry out fast the sensing of substrate. Owing to can use the rapid sensing of apparatus for sensing substrate The existence of substrate is so can increase detection process efficient.
The second, apparatus for sensing substrate according to the present invention comprises a ultrasonic sensing method, and it is used for sensing Such as the existence of the substrate of glass substrate or wafer, this sensor is through settling to be adjacent to substrate periphery A surface and be not to be between the substrate. Therefore, can prevent from damaging at the duration of existence of sensing substrate Substrate. In addition, owing to do not need to use an independent mobile device, for example in the existing apparatus for sensing substrate Employed independent mobile device is so can reduce total manufacturing cost.
Claims (8)
1. apparatus for sensing substrate is characterized in that comprising:
Sensor support frame is through settling to be adjacent to the brilliant casket of the vertical elongated that wherein stacks a plurality of substrates; And
A plurality of ultrasonic sensing methods are installed on a surface of described sensor support frame, and emission is parallel to the ultrasonic of described substrate, and the described substrate of sensing described ultrasonic existing with each described substrate of sensing of being reflected.
2. apparatus for sensing substrate according to claim 1 is characterized in that wherein each described ultrasonic sensing method is placed in the layer rank identical with corresponding described substrate.
3. apparatus for sensing substrate according to claim 1 is characterized in that more comprising a pair of analog bracket, is used for described sensor support frame is fixed in the pre-position.
4. apparatus for sensing substrate according to claim 1, it is characterized in that wherein said ultrasonic sensing method in a longitudinal direction with the predetermined space positioned vertical on a surface of described sensor support frame.
5. apparatus for sensing substrate according to claim 1 is characterized in that wherein said substrate is a wafer.
6. glass substrate detection apparatus is characterized in that comprising:
Sensor support frame is through settling to be adjacent to the brilliant casket of the vertical elongated that wherein stacks a plurality of glass substrates; And
A plurality of ultrasonic sensing methods are installed on a surface of described sensor support frame, and emission is parallel to the ultrasonic of described glass substrate, and the described glass substrate of sensing described ultrasonic existing with each described glass substrate of sensing of being reflected.
7. glass substrate detection apparatus according to claim 6 is characterized in that wherein each described ultrasonic sensing method is placed in the layer rank identical with corresponding described glass substrate.
8. glass substrate detection apparatus according to claim 6 is characterized in that more comprising a pair of analog bracket, is used for described sensor support frame is fixed in the pre-position.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20050072505 | 2005-08-08 | ||
| KR1020050072505 | 2005-08-08 | ||
| KR20060049887A KR100658520B1 (en) | 2005-08-08 | 2006-06-02 | Apparatus for sensing substrate |
| KR1020060049887 | 2006-06-02 | ||
| PCT/KR2006/002337 WO2007018350A1 (en) | 2005-08-08 | 2006-06-19 | Apparatus for sensing substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101258437A true CN101258437A (en) | 2008-09-03 |
Family
ID=37727507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006800292361A Pending CN101258437A (en) | 2005-08-08 | 2006-06-19 | Apparatus for sensing substrate |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2009503885A (en) |
| KR (1) | KR100658520B1 (en) |
| CN (1) | CN101258437A (en) |
| TW (1) | TWI302140B (en) |
| WO (1) | WO2007018350A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102502109A (en) * | 2011-11-18 | 2012-06-20 | 友达光电股份有限公司 | Substrate box and adjustable sensing device thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101701419B1 (en) * | 2016-08-17 | 2017-02-02 | 주식회사 오토닉스 | Reflective type image detecting sensor |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244268A (en) * | 1993-02-16 | 1994-09-02 | Tokyo Electron Tohoku Ltd | Transfer equipment |
| JPH11214484A (en) * | 1998-01-27 | 1999-08-06 | Nikon Corp | Substrate detector |
| KR100278807B1 (en) * | 1998-05-01 | 2001-01-15 | 신덕교 | Wafer inspection system |
| KR100570228B1 (en) * | 2003-09-17 | 2006-04-11 | 동부아남반도체 주식회사 | Cassette stage of processing unit and method for confirming alignment and dimension of cassette using it |
-
2006
- 2006-06-02 KR KR20060049887A patent/KR100658520B1/en not_active IP Right Cessation
- 2006-06-19 WO PCT/KR2006/002337 patent/WO2007018350A1/en active Application Filing
- 2006-06-19 CN CNA2006800292361A patent/CN101258437A/en active Pending
- 2006-06-19 JP JP2008524878A patent/JP2009503885A/en not_active Withdrawn
- 2006-06-22 TW TW95122424A patent/TWI302140B/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102502109A (en) * | 2011-11-18 | 2012-06-20 | 友达光电股份有限公司 | Substrate box and adjustable sensing device thereof |
| CN102502109B (en) * | 2011-11-18 | 2013-12-25 | 友达光电股份有限公司 | Substrate box and adjustable sensing device thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007018350A1 (en) | 2007-02-15 |
| KR20060069417A (en) | 2006-06-21 |
| KR100658520B1 (en) | 2006-12-15 |
| TW200706477A (en) | 2007-02-16 |
| JP2009503885A (en) | 2009-01-29 |
| TWI302140B (en) | 2008-10-21 |
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Open date: 20080903 |