200933178 九、發明說明： 【相關申請案之交互參照】 本申請案主張2008年1月28曰申請之韓國專利申請案 10-2008-0008665號，其揭露整體結合於此作為參考。' 【發明所屬之技術領域】 本發明係關於測試形成於基板上之電極是否有電缺陷之 陣列測試器所含之調變器，尤其是關於陣列測試器之調變器， 其設置成與基板相距預定距離’並根據在基板之電極與調變器 之電極間所形成之電場的強度來改變特定性質。 【先前技術】 光電裝置為以提供的電能來產生光之裝置，且包含平面板 顯示器’例如液晶顯示器(LCDs)及電細*面板(pDps)。光電 裝置通常具有電鄉成於上基板及下紐之間。舉例而言薄 膜電晶體(TFT)液晶顯示基板包含TFT基板、彩色遽光片及共 ❹ 帛雜戦於其上且面對TFT基板之彩色濾、光基板 、插入於 土板及於色滤光基板間之液晶、以及背光。 雪搞例令’陣列測試器偵測TFT基板上之薄臈電晶體 u、、陷。陣列測試器包含調變$ ’其包含調變器電極單元 i、產生電場於TFT電極與其之間。 因此，當調變器靠近TF丁面板時，施加預定·到各調 5 200933178 變器電極與TFT電極，而於調變器電極射f 場。此時，當TFT面板上之電極有缺陷時，電場的触會小 於沒有缺崎㈣度，因此可基於所_ TFT電極衫有缺陷。 於執行測試基板電極是否有缺陷發生之__，調㈣ 的電極及基板電極應彼此平行。再者，為了 ❹ 板間形成足_場時因基減調魏郎顧或接^而造^ 到痕或損壞，基減機H變得最靠収如具有約數微米 (//m)至數十微米的距離。 此外’當機H減於基板飾以峨其他基板上的電極 時，基板及調變器應彼此分離得夠開。 習知上，為了調整基板及調變器間的距離，調變器包含複 數個喷嘴單元，用以在基板方向排出預定壓力的空氣。於此案 e 例中，喷嘴單元包含低壓噴嘴單元及高壓喷嘴單元，且以交替 方式設置於調變器的一侧及另一側。 因此，當基板及調變器相對於彼此移動時，低壓噴嘴單元 及咼壓喷嘴單元皆同時作動，以增加基板及調變器間之距離， 而當調變器測試基板電極的缺陷時，僅低壓喷嘴單元作用以最 小化基板及調變器間之距離。於此案例中，調變器設置成在排 出空氣之噴嘴單元的控制下可自由地上升及下降。 6 200933178 然=當利用喷嘴單元調整基板及調變器間的距離時，喷 定^ΐί蓋的區域有限，因此使基板及調變器間彼此 達到穩疋千仃所需的時間增加。再者，在調變器與 前’由於調變訂降錄難避免賴器搖晃。尤，合 ΐ低壓喷嘴單元作動使爾狀基板撕於彼此_時:及 ==高壓噴嘴單元而僅有低壓喷嘴單元操作來測試基板 :得Ϊ嚴ΐ綠板及調變器間的距離變成最短時’上述問題。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a modulator for testing an array tester for detecting whether an electrode formed on a substrate has an electrical defect, particularly a modulator for an array tester, which is disposed in a substrate The predetermined distance is 'and the specific property is changed according to the intensity of the electric field formed between the electrode of the substrate and the electrode of the modulator. [Prior Art] An optoelectronic device is a device that generates light with supplied electrical energy, and includes flat panel displays such as liquid crystal displays (LCDs) and electro-fine* panels (pDps). Photovoltaic devices typically have an electrical circuit between the upper substrate and the lower button. For example, a thin film transistor (TFT) liquid crystal display substrate comprises a TFT substrate, a color light-emitting sheet, and a color filter on the TFT substrate, a light substrate, an optical plate, an earth plate, and a color filter. Liquid crystal between substrates, and backlight. Snow made an example. The array tester detects thin germanium transistors on the TFT substrate, and traps. The array tester includes a modulation $' that contains the modulator electrode unit i, generating an electric field between the TFT electrodes and between them. Therefore, when the modulator is close to the TF panel, the predetermined electrode is applied to the transducer electrode and the TFT electrode, and the modulator electrode is exposed to the f field. At this time, when the electrode on the TFT panel is defective, the electric field touch is smaller than the absence of the sacrificial (four) degree, and thus it is possible to be defective based on the TFT electrode. In the case where the test substrate electrode is defective, the electrode and the substrate electrode of the adjustment (4) should be parallel to each other. Furthermore, in order to form a foot_field between the plates, the base reduction machine H becomes the most compact, such as having a few micrometers (//m) to several numbers, due to the reduction of the Weilang Gu or the connection. Ten micrometers in distance. In addition, when the machine H is reduced from the substrate to the electrodes on the other substrate, the substrate and the modulator should be separated from each other. Conventionally, in order to adjust the distance between the substrate and the modulator, the modulator includes a plurality of nozzle units for discharging air of a predetermined pressure in the direction of the substrate. In the case of the case, the nozzle unit includes a low pressure nozzle unit and a high pressure nozzle unit, and is disposed on one side and the other side of the modulator in an alternating manner. Therefore, when the substrate and the modulator move relative to each other, the low pressure nozzle unit and the pressure nozzle unit are simultaneously operated to increase the distance between the substrate and the modulator, and when the modulator tests the defects of the substrate electrode, only The low pressure nozzle unit acts to minimize the distance between the substrate and the modulator. In this case, the modulator is arranged to freely rise and fall under the control of the nozzle unit that discharges air. 6 200933178 However, when the distance between the substrate and the modulator is adjusted by the nozzle unit, the area of the nozzle is limited, so that the time required for the substrate and the modulator to reach each other is increased. Moreover, it is difficult to avoid the shaker in the modulator and the front. In particular, the combined low-pressure nozzle unit acts to tear the slabs to each other _ when: and == high-pressure nozzle unit and only the low-pressure nozzle unit operates to test the substrate: the distance between the green board and the modulator becomes the shortest When the above question
a此時’由於高壓空氣不會自高壓喷嘴單元分散到基板，使 得調變器朝基板之方向下降。由於τ降使賴器變得嚴重搖 晃’而低壓噴嘴單元的空氣賴蓋的區琳足以 變器的搖晃。 ^ 田調變n顯著地搖晃時’調龍可能碰撞或 ，社 果可能使基板或調㈣產生麻或損壞。 板、，，σ 【發明内容】 〇揭露—種偵測形成於基板上之電極的電缺陷之陣列測試 器所含之調變器。調變器包含：調變器本體，以可提升方式耦 ，於固定塊之下表面，且包含在其本身與基板之電極間產生電 場之調變ϋ電極單元，以及改變預定性質之性質?文變單元；複 =多孔性單元’至少其—是設置於輕ϋ本體之各侧，且包 吞夕孔!·生材料單元，其各於基板之方向透過複數個細孔排出真 7 200933178 空壓力；以及至少一或更多負壓供應管，穿過多孔性材料單元 之至少其一’並於基板之方向透過穿管之一端排出預定負壓。 料單元 夕孔性單元可包含低壓多孔性材料單元，其各設置於調變 器本體之一側及另一侧，且基於調變器本體之令心位於虛擬三 角=之頂點之位置，而負壓供應管可配置成穿過低壓多孔性材 在調變器本體變得靠近基板之一刻，到在變得靠近後而調 變器本體與基板間之距離為穩定之一刻，負壓供應管可 壓到基板。 =調變器可更包含：複數個高壓多孔性材料單元，各置於調 變器本體之一外側及另一外側，且基於調變器本體之中心位於 虛擬倒三角形之頂點之位置’排出高於低壓多孔性材 、 壓力到基板。a At this time, since the high-pressure air is not dispersed from the high-pressure nozzle unit to the substrate, the modulator is lowered toward the substrate. Since the τ drop causes the heat sink to become severely shaken, the area of the air of the low-pressure nozzle unit is sufficient to shake the transformer. ^ When the field modulation is significantly shaken, the dragon may collide or the fruit may cause numbness or damage to the substrate or tune. Plate,,, σ [Disclosed] A modulator included in an array tester for detecting electrical defects of electrodes formed on a substrate. The modulator includes: a modulator body coupled to the lower surface of the fixed block in a liftable manner, and including a tunable ϋ electrode unit that generates an electric field between itself and the electrodes of the substrate, and a property of changing a predetermined property Variable unit; complex = porous unit 'at least - is disposed on each side of the flick body, and wraps the hole! · Raw material unit, each of which is discharged through the plurality of pores in the direction of the substrate. And at least one or more negative pressure supply tubes passing through at least one of the porous material units and discharging a predetermined negative pressure through one end of the through tube in the direction of the substrate. The cell unit may comprise a low-pressure porous material unit, each of which is disposed on one side and the other side of the modulator body, and based on the position of the modulator body at the apex of the virtual triangle=negative The pressure supply tube can be configured to pass through the low-pressure porous material in the vicinity of the modulator body to be close to the substrate, and the distance between the modulator body and the substrate is stabilized after being brought close, and the negative pressure supply tube can be Press onto the substrate. The modulator may further comprise: a plurality of high-pressure porous material units, each of which is disposed outside one side of the modulating body and the other outside, and based on the position of the center of the modulating body at the apex of the virtual inverted triangle In low pressure porous materials, pressure to the substrate.
當需要在調變器及基板間得到足夠距離時，可自低壓多孔 性材料單元及高壓多孔性材料單元排出真空壓力之氣體^芙 板，且當調變器本體接近基板時，或當執行陣列測試之一 時’可自低壓多孔性材料單元及負壓供應管排出真空^力到美 板。 土 各置於調變器本體 調變器可更包含：複數個高壓供應管 200933178 之一外側及另一外側’且基於調變器本體之中心位於對應虛擬 倒三角形之頂點之位置。 低壓多孔性材料單元可沿調變器本體之一外侧及另一外 側延伸，且高壓供應管可配置成穿過低壓多孔性材料單元。 當需要在調變器及基板間得到足夠距離時，可自低壓多孔 ❹ 轉料單元及紐乡錄材料單AS壓力之氣體到基 板，且當調變器本體接近基板時，或當執行陣列測試之一刻 時’可自低壓多孔性材料單元及負壓供應管排出真空壓力 板。 土 參考以下詳細說明並配合所附圖式揭露本發明例 例，將使熟此技藝者清楚本發明其他特徵。 &實施 【實施方式】 提供以下詳細說明以助於讀者了解於此所述之方法、裝 置、及/或系統。因此，熟此技藝者應了解於此所述之系統: 裝置、及/或方法有各種變化、修改、及均等物。再者，為增 如清楚性及簡潔性，省略熟知功能及結構之說明。 一曰 圖1為根據例示實施例包含調變器100之陣列測試器1〇 之遷視示意圖。陣列測試器10為測試基板2上電極的電缺陷 之襄置。 、曰 9 ❹ ❹ 200933178 基板、可為平顯“板之面板，例如可為賴電晶體液晶 顯示(TFT-LCD)基板之薄膜電晶體面板。 陣列測試器10可包含測試模組5〇、裝載單元2〇、測試單 元30、及卸載單元40。 裝載單元2〇可包含至少兩個或更多裝載板仏裝載板η 彼此間隔配置成-線’使得待_基板被支撐而移動到測試單 兀30 〇 測試單元30設置於裝載單元2〇之 22傳送之面板的電缺陷。 ⑽~裝载板 下部置制試單元％之上部、或下部、或上部及 50可更勺人制測试板上之基板電極的電缺陷。測試模組 更匕3配置於鄰近基板電極之調變5|1()()，1^;^%%10 否通過調變器刚之拍攝單元55。避㈣〇’以及拍攝先是 卸載單元4G放置於職單元3 的基板傳铜外界。於此_ ^且將似元傳來 其移動安置於其上之基板，且容許^置42， 浮預定間距。 置於，、上的基板於其上漂 於此案例中，裝載單元20 之裴載板22及卸載單元4〇 之 10 200933178 卸載板42可各具有複數個氣孔24及44 壓力而移動基板。再者，裝解元2〇及:"板的方向供給 步包含吸板70 ’用以貼附基板。 早凡40可各進一 測試模組50可沿X軸軌道6〇水平移動於 者’各基板移祕γ軸方向通過裝鮮元2g : 5向。再 以及卸載單元40。因此，基板麵試模組5 30、 動，而可測試基板的電極。 、：彼此移 然而，適用於本實施例之陣列測試器1〇不限於圖】所干 。基板可固定於固定支撐板上，_試模租50 ==方？方向來偵測基板上之電極，或測試模:㈣ 付向，而基板可移動於Μ γ軸方向來偵測基 圖2為根據例示實施例之陣列測試器之調變器100之透視 〇 圖。如圖2所示，調變器100包含調變器本體120、多孔性單 兀130、以及至少一負壓供應管24〇。 s周變器本體12〇以可提升方式耦接於固定塊11〇之下表 固定塊110可形成中空管，以容許調變器本體12〇暴露於 外部拍攝裝置。拍攝裝置55(參考圖1)可設置於固定塊11〇之 200933178 上側上。 於此案例令，調變器本體12〇耦接在調變器本體〗2〇外之 框架160，而框架160可以可提升方式耦接固定塊。 —有各種工具可將調變器本體120以可提升方式耦接到固 ，塊110。舉例而言’如圖3A及3B所示，導槽112形成於固 定塊110的下表面，鉤孔162形成於框架16〇，以及 丰 140插人導槽120及鉤孔162。 焉牛 鉤孔162可包含形成於框架16〇下部之下釣孔部163，以 及以梯狀方式形成之上釣孔部164，其具有小於下鉤孔部⑹ 之直控。導引構件140 &含插人導槽112而連接之連接單元 141、具有小於上釣孔部164之直徑及比上鉤孔部164還長之 軸142、以及止階部143 ’其形成於導軸142的下部 14二於上釣孔部164之直徑。因此，容許縣160沿導軸 絲圍區域中上升及下降，且可調整框架16()及固定 塊110間之間隙Κ1或Κ2。 110上升及下降 然而’容許調變器本體12〇相對於固定塊 之工具不限於上述。 ㈣ϊΐίί圖2 ’調變器本體12G包含調變器電極單元m 及f·生貝改變單元125。調變^ g _ β欠态电極早兀123在其本身與基板之 12 200933178 電極間產生電場。調變器電極單元123可由氧化銦錫(IT〇)或 碳奈米管(CNT)形成，通常作為共用電極。 一 性質改變單元125根據調變器電極單元123及基板電極間 之電場強度改變其性質。性質改變單元125可為聚合物分散液 β曰(PDLC)薄膜。聚合物分散液晶薄膜設置於調變器電極單元 123及基板電極之間，且根據調變器電極單元123及基板電極 間之電場強度偏極化光’以改變通過聚合物分散液晶薄膜之入 射光的量。 於此案例中’調變器本體120更可包含透明基板cl。透 明基板121容許光通過’且由硬度大於預定值之材料形成。調 變器電極單元123及性質改變單元125可耦接到透明基板121 之一侧。 反射構件及/或保護膜127可形成於性質改變單元125的 〇 下部。 圖4為調變器本體120及多孔性單元之平面圖，圖5為沿 V-V線之截面圖。如圖2、圖4、及圖5所示，多孔性單元包 含多孔性材料單元134。於此案例中，多孔性單元可提供於框 架 160 〇 多孔性材料單元134藉由至少一個接著一個地設置於調 13 ❹ ❹ 200933178 藉由自多孔性材料單元134排出到基板之真空壓力可於 調變器本體120及基板間建立最佳距離。多孔性材料單元可為 多孔性陶瓷。 多孔性材料單元134可連接腔室單元133。腔室單元133 提供有外界壓力，並賴力轉侧纽性材 ;，固定塊110可具有間件加及m以及形成於其上之連接 管 117 及 119。 多孔性材料單元l34之細孔的直徑p介於約i至獅 ^當多孔性材料單元l34之細孔的直徑p ^ ι _時形 成《孔性材料早兀134之材料不認為是多孔性，而#多孔性材 =單兀134 U田孔的直徑p大於3〇〇_時，此材料不認為是 多孔性’ S為氣孔的尺寸A到降低了提供於基板方向的壓力。 多孔性材料單元134可具有體積小於4〇%之孔隙度。 夕孔1·生材料單元134具有均勻形成於其上的細孔^4a。 口此自夕孔性材料單幻34提供的虔力透過像多孔性材料單 元134表φ樣大的區域均勻地傳送到基板，因此可確保調變 器本體120及基板間將有預定距離之穩定位置。 14 200933178 土尤其疋’ s調變器本體12〇及基板為了陣列測試變得彼此 越罪近時’多孔性材料單元m透過多孔性材料單元134表面 釋出真空壓力。因此’完全避免調變器本體12〇晃動，並容許 調變器本體120與基板平行於預定位置。因此，避免調變器本 體120碰撞或接觸基板，而可避免調變器本體12〇或基板括傷 或損壞。 各負壓供應管240穿過多孔性材料單元134之至少其一， 並於基板之方向透過穿管之一端排出負壓。自多孔性材料單元 134排出之真空壓力，從調變器本體12〇及基板之間排到外 界。於此案例中’由於調變器本體120之内部及外部的壓差， 調變器本體120發生搖晃’而負壓供應管240吸收至少某些排 到外界的壓力，避免調變器本體12〇搖晃。 結果，當負壓供應管240施加負壓到基板時，可迅速地停 止调變器本體120的搖晃，而可維持調變器本體12〇及基板間 φ 的平行狀態。 於此案例中’固定塊110可包含負壓閥114及負壓連接管 115 ’以施加負壓到負壓供應管240。When a sufficient distance between the modulator and the substrate is required, the vacuum pressure gas can be discharged from the low pressure porous material unit and the high pressure porous material unit, and when the modulator body is close to the substrate, or when the array is executed In one of the tests, the vacuum can be discharged from the low-pressure porous material unit and the negative pressure supply tube to the US plate. The soil is placed on the modulator body. The modulator may further comprise: a plurality of high pressure supply pipes 200933178 one of the outer sides and the other outer side' and based on the center of the modulator body at the position corresponding to the apex of the virtual inverted triangle. The low pressure porous material unit can extend along one of the outer sides and the other outer side of the modulator body, and the high pressure supply tube can be configured to pass through the low pressure porous material unit. When it is necessary to obtain a sufficient distance between the modulator and the substrate, the gas from the low pressure porous crucible transfer unit and the New Zealand recording material single AS pressure can be applied to the substrate, and when the modulator body is close to the substrate, or when the array test is performed At one moment, the vacuum pressure plate can be discharged from the low pressure porous material unit and the negative pressure supply tube. The other features of the invention will be apparent to those skilled in the art from this description. & Implementations [Embodiment] The following detailed description is provided to assist the reader in understanding the methods, devices, and/or systems described herein. Thus, those skilled in the art will recognize that the system described herein has various variations, modifications, and equivalents in the device and/or method. Further, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted. 1 is a schematic diagram of a relocation of an array tester 1A including a modulator 100 in accordance with an exemplary embodiment. The array tester 10 is a device for testing electrical defects of the electrodes on the substrate 2.曰9 ❹ ❹ 200933178 The substrate can be a flat panel, such as a thin film transistor panel that can be a TFT-LCD substrate. The array tester 10 can include a test module 5〇, loading The unit 2〇, the test unit 30, and the unloading unit 40. The loading unit 2〇 may include at least two or more loading plates 仏 loading plates η are spaced apart from each other to be configured as a line - such that the substrate to be supported is moved to the test unit The 〇 test unit 30 is disposed on the electrical defect of the panel that is transported by the loading unit 2 。 22 (10) ~ the upper part of the test board is placed on the upper part, or the lower part, or the upper part, and the 50 can be further used on the test board. The electrical defect of the substrate electrode. The test module is further arranged in the adjacent substrate electrode modulation 5|1 () (), 1 ^; ^%% 10 No through the modulator just the shooting unit 55. Avoid (four) 〇 'And the first unloading unit 4G is placed on the substrate of the unit 3 to transfer the copper outside. Here, the substrate is transferred to the substrate on which it is moved, and the predetermined spacing is floated. The upper substrate is floated thereon in this case, and the loading unit 20 is loaded. The plate 22 and the unloading unit 4 10 200933178 The unloading plate 42 can each have a plurality of air holes 24 and 44 to move the substrate. Further, the loading unit 2: and the direction supply step of the plate includes the suction plate 70' In order to attach the substrate, the test module 50 can be moved horizontally along the X-axis track 6〇 horizontally in the direction of the γ-axis of each substrate through the loaded 2g: 5 direction and then the unloading unit 40. The substrate interview module 5 30 moves, and the electrodes of the substrate can be tested.:: Move away from each other. However, the array tester 1 applicable to the embodiment is not limited to the drawings. The substrate can be fixed on the fixed support plate. _ test mode rent 50 == square direction to detect the electrode on the substrate, or test mode: (4) direction, and the substrate can be moved in the γ γ axis direction to detect the base Figure 2 is an array tester according to an exemplary embodiment A perspective view of the modulator 100. As shown in Fig. 2, the modulator 100 includes a modulator body 120, a porous unit 130, and at least one negative pressure supply tube 24〇. The table fixing block 110 is coupled to the fixed block 11 可 in a liftable manner to form a hollow tube. To allow the modulator body 12A to be exposed to an external camera. The camera device 55 (refer to FIG. 1) can be disposed on the upper side of the fixed block 11〇200933178. In this case, the modulator body 12 is coupled to the modulation. The frame body 160 is externally coupled to the frame 160, and the frame 160 can be coupled to the fixed block in a liftable manner. - There are various tools to couple the modulator body 120 to the solid, block 110 in a liftable manner. For example, ' As shown in FIGS. 3A and 3B, the guide groove 112 is formed on the lower surface of the fixed block 110, and the hook hole 162 is formed in the frame 16A, and the flange 140 is inserted into the guide groove 120 and the hook hole 162. The yak hook hole 162 may include a hole portion 163 formed below the lower portion of the frame 16, and an upper hole portion 164 formed in a ladder-like manner having a direct control smaller than the lower hook hole portion (6). The guiding member 140 & includes a connecting unit 141 connected to the insertion guide groove 112, a shaft 142 having a diameter smaller than the upper fishing hole portion 164 and longer than the upper hook hole portion 164, and a stop portion 143' formed on the guide The lower portion 14 of the shaft 142 is diametrically opposed to the diameter of the upper fishing hole portion 164. Therefore, the county 160 is allowed to rise and fall along the guide wire surrounding area, and the gap Κ1 or Κ2 between the frame 16() and the fixed block 110 can be adjusted. 110 ascending and descending However, the means for allowing the modulator body 12 to be opposed to the fixed block is not limited to the above. (4) ϊΐίί图图 2' The modulator body 12G includes a modulator electrode unit m and an f·baker changing unit 125. Modulation ^ g _ β under-state electrode early 兀 123 generates an electric field between itself and the substrate 12 200933178 electrode. The modulator electrode unit 123 may be formed of indium tin oxide (IT〇) or a carbon nanotube (CNT), usually as a common electrode. A property changing unit 125 changes its properties according to the electric field strength between the modulator electrode unit 123 and the substrate electrode. The property changing unit 125 may be a polymer dispersion β曰 (PDLC) film. The polymer dispersed liquid crystal film is disposed between the modulator electrode unit 123 and the substrate electrode, and polarizes the light according to the electric field intensity between the modulator electrode unit 123 and the substrate electrode to change the incident light of the liquid crystal film dispersed through the polymer. The amount. In this case, the modulator body 120 may further include a transparent substrate cl. The transparent substrate 121 allows light to pass through ' and is formed of a material having a hardness greater than a predetermined value. The modulator electrode unit 123 and the property changing unit 125 may be coupled to one side of the transparent substrate 121. The reflective member and/or the protective film 127 may be formed on the lower portion of the property changing unit 125. 4 is a plan view of the modulator body 120 and the porous unit, and FIG. 5 is a cross-sectional view taken along line V-V. As shown in Figs. 2, 4, and 5, the porous unit includes a porous material unit 134. In this case, the porous unit may be provided to the frame 160. The porous material unit 134 is disposed at least one by one after the adjustment of 13 ❹ ❹ 200933178 by the vacuum pressure discharged from the porous material unit 134 to the substrate. An optimum distance is established between the modulator body 120 and the substrate. The porous material unit may be a porous ceramic. The porous material unit 134 can be coupled to the chamber unit 133. The chamber unit 133 is provided with external pressure and is responsive to the side material; the fixed block 110 may have a member plus m and connecting tubes 117 and 119 formed thereon. The diameter p of the pores of the porous material unit l34 is between about i and the diameter of the pores of the porous material unit l34, p ^ ι _, and the material forming the porous material 兀 134 is not considered to be porous. When the diameter p of the porous material = single 兀 134 U field hole is larger than 3 〇〇 _, this material is not considered to be porous 'S is the size A of the pores to reduce the pressure provided in the direction of the substrate. The porous material unit 134 can have a porosity of less than 4% by volume. The hole 1 material 1 has a fine hole ^4a uniformly formed thereon. The force provided by the singular material 34 is uniformly transmitted to the substrate through the area of the porous material unit 134 which is φ-like, thereby ensuring a stable distance between the modulator body 120 and the substrate. position. 14 200933178 The soil, especially the 's modulator body 12 〇 and the substrate, become more sinful for the array test. The porous material unit m transmits the vacuum pressure through the surface of the porous material unit 134. Therefore, the damper body 12 is completely prevented from swaying, and the modulator body 120 is allowed to be parallel to the substrate at a predetermined position. Therefore, the modulator body 120 is prevented from colliding or contacting the substrate, and the modulator body 12 or the substrate is prevented from being damaged or damaged. Each of the negative pressure supply pipes 240 passes through at least one of the porous material units 134 and discharges a negative pressure through one end of the through pipes in the direction of the substrate. The vacuum pressure discharged from the porous material unit 134 is discharged from the modulator body 12 and the substrate to the outside. In this case, the damper body 120 is shaken due to the pressure difference between the inside and the outside of the modulator body 120, and the negative pressure supply pipe 240 absorbs at least some of the pressure discharged to the outside to avoid the modulator body 12〇. shake. As a result, when the negative pressure supply pipe 240 applies a negative pressure to the substrate, the shake of the modulator body 120 can be quickly stopped, and the parallel state of the modulator body 12 and the substrate φ can be maintained. In this case, the fixed block 110 may include a negative pressure valve 114 and a negative pressure connection pipe 115' to apply a negative pressure to the negative pressure supply pipe 240.
多孔性單元131可包含低壓多孔性材料單元134L及低壓 腔室單元133L。於此案例中，各低壓多孔性材料單元134L放 置於調變器本體120的每個外側，且低壓多孔性材料單元134L 15 200933178 之位置為基於調變器本體12〇之中心之虛擬三角形之頂點。再 者’固定塊110具有低壓閥116及低壓連接管117，以提供負 壓到低壓多孔性材料單元134L。 低壓腔室單元133與低壓多孔性材料單元J34L卡合。 當執行陣列測試而調變器本體120靠近基板時，由於低壓 多孔性材料單元134L排出真空壓力，調變器本體12〇及基板 2之間的距離G2保持靠近彼此，例如介於約1〇至2〇以m之 距離。 於此案例中’負壓供應管240可配置成穿過低壓多孔性材 料單元134L。於陣列測試期間，自負壓供應管24〇產生負壓， 而，變器本體12G及基板間之至少某些高壓空氣透過負壓供 應官240排出。因此，可避免可導致調變器本體12〇搖晃之突 然空氣外流。 可自負壓供應管240排出負遷’直到調變器本體12〇靠近 基板，或直到調變器本體m及基板在彼此足夠靠近後穩定。 亦即’當調變器本體m及基板靠猶，制的空氣壓力增 氣傾向快速地釋出到外界。此時自負壓供應管240 排出負糾’至少某些釋出到外界的空氣進到負壓供庫管 240 ’其避免調變器搖晃。亦即，負壓供應管㈣侧為阻二匕。 16 200933178 多孔性單元130更可包含高壓多孔性材料單元134H。 高壓多孔性材料單元134H可與高壓腔室單元133H卡 合。各高壓多孔性材料單元134H設置於調變器本體12〇之各 外侧，且咼壓多孔性材料單元134H之位置為基於調變器本體 120之中心之虛擬倒三角形之頂點。 亦即’低壓多孔性材料單元134L及高壓多孔性材料單元 134H、以及低壓多孔性材料單元134L依序設置於調變器本體 120之一外側’而高壓多孔性材料單元134H、低壓多孔性材 料單元134L、以及高壓多孔性材料單元134H依序設置於調 變器本體120之另一外侧。低壓多孔性材料單元134L及高壓 多孔性材料單元134H的配置形成三角形，因此可安全地放置 調變器本體120。 於此案例中，固定塊110可具有高壓閥118及高壓連接管 ❹ I19形成於其上。 因此’如圖6A所示，當調變器本體12〇及基板間需要得 到足夠距離時，將來自高壓多孔性材料單元134H及低壓多孔 性材料單元134L之壓力排到基板之方向。因此，調變器本體 120及基板2間之距離G1可維持足夠近，例如約8〇至12〇私 m ° 17 200933178 如圖所示’當調變器本體120靠近基板2或執行陣列 測試時，壓力不是自高壓多孔性材料單元134H排出，而是自 低壓多孔性材料單元134L及負壓供應管240排出。結果，調 變器本體120及基板2間之距離G2維持靠近，例如^ 1〇至 20ym ’且於此狀態執行陣列測試。 同時’如圖7所示，可實施複數個高壓供應管25〇取代高 壓多孔性材料單元134H。 高壓供應管250可設置於靠近低壓多孔性料單元134L。 選替地’如圖7所示’各低壓多孔性料單元134L沿調變器本 體120之一外側及另一外侧延伸，而高壓供應管25〇可形成為 穿過低壓多孔性料單元134L。 固定塊110可具有高壓閥253以及高壓連接管254,以提 供高壓供應管比低壓多孔性料單元134L還高的壓力。 各高壓供應管250可放置在基於調變器本體120之中心對 應虛擬倒三角形之各頂點之位置附近。 因此，如圖8A所示，自高壓供應管250及低壓多孔性材 料單元134L排出預定壓力空氣到基板，以容許調變器本體120 及基板水平移動。因此，調變器本體120及基板2間之距離 G1維持在例如80至20#m。 18 200933178 再者’如圖8B所示’當調變器本體i20變得靠近基板2 時’或於基板2執行陣列測試時，射不自高驗應管25〇 排出，而是自低愿多孔性材料單元】3礼及負顧應管24〇排 出。因此’調變器本體120及基板2間接近的距離G2維持在 例如10至2〇0m，且於此狀態下執行陣列測試。 ❹ 根據例示實❹i，透過具有大表面之多雜㈣單元之細 孔’提供Μ力縣板。結果’敢物件之分舰賴得更大， 使得基板料榻更快歡，謂免由於下降造成調變器 搖晃，因此降低陣列測試的整體時間。 再者，陣列測試時提供預定量的負壓到基板 調變器_平行性得以維持，藉此能射地測試。 ^熟此技術領域者應明瞭在不悻離本發明申請專利範圍界 戶 齡下可有各種修改及變化。因此本發明意欲涵蓋 =迷申料聰圍之齡及其鱗物所提供之各種變化及修 【圖式簡單說明】 -立圖1為根據例示實施地含觀^之陣湘懷器之透視 F意圖。 圖2為根據例示實施例之陣列測試器之調變器之透視圖。 圖3A及圖3B為圖2之A部分的放大圖。 19 200933178 圖4為圖2中調變器本體、多 之平面圖。 多孔性單元、以及負壓供應督 圖5為沿V-V線之截面圖。 圖6A及圖6B為顯示圖2 負麗供應管之操叙透棚。。變料多孔性材料單元及 = 為自圖2之調變器修改之調變器之平面圖。 ❺ 圖及圖8B為顯不圖7之調變器中多孔性材料單元、 負壓供應管、以及南壓供應單元之操作之截面圖。 【主要元件符號說明】 2 基板 10 陣列測試器 20 裝載單元 22 裝載板 24 氣孔 30 測試單元 40 卸載單元 42 卸載板 44 氣孔 50 測試模組 55 拍攝單元 60 X轴軌道 70 吸板 100 調變器 20 200933178The porous unit 131 may include a low pressure porous material unit 134L and a low pressure chamber unit 133L. In this case, each low pressure porous material unit 134L is placed on each outer side of the modulator body 120, and the position of the low pressure porous material unit 134L 15 200933178 is the apex of the virtual triangle based on the center of the modulator body 12〇 . Further, the fixed block 110 has a low pressure valve 116 and a low pressure connecting pipe 117 to provide a negative pressure to the low pressure porous material unit 134L. The low pressure chamber unit 133 is engaged with the low pressure porous material unit J34L. When the array test is performed and the modulator body 120 is close to the substrate, since the low pressure porous material unit 134L discharges the vacuum pressure, the distance G2 between the modulator body 12 and the substrate 2 is kept close to each other, for example, between about 1 Torr to 2〇 is the distance of m. In this case, the negative pressure supply pipe 240 may be configured to pass through the low pressure porous material unit 134L. During the array test, a negative pressure is generated from the negative pressure supply tube 24, and at least some of the high pressure air between the transformer body 12G and the substrate is discharged through the negative pressure supplier 240. Therefore, sudden air outflow which can cause the modulator body 12 to sway can be avoided. The negative displacement can be discharged from the negative pressure supply tube 240 until the modulator body 12 is close to the substrate, or until the modulator body m and the substrate are sufficiently close to each other. That is, when the modulator body m and the substrate are pressed against each other, the air pressure increasing tendency of the system is quickly released to the outside. At this time, the negative pressure supply pipe 240 discharges the negative correction, and at least some of the air released to the outside enters the negative pressure supply pipe 240' to prevent the modulator from shaking. That is, the side of the negative pressure supply pipe (four) is the resistance. 16 200933178 The porous unit 130 may further comprise a high pressure porous material unit 134H. The high pressure porous material unit 134H is engageable with the high pressure chamber unit 133H. Each of the high-pressure porous material units 134H is disposed outside each of the modulator body 12, and the position of the rolled porous material unit 134H is the apex of the virtual inverted triangle based on the center of the modulator body 120. That is, the low-pressure porous material unit 134L and the high-pressure porous material unit 134H, and the low-pressure porous material unit 134L are sequentially disposed outside one of the modulator body 120', and the high-pressure porous material unit 134H, the low-pressure porous material unit The 134L and the high-pressure porous material unit 134H are sequentially disposed on the other outer side of the modulator body 120. The arrangement of the low pressure porous material unit 134L and the high pressure porous material unit 134H forms a triangle, so that the modulator body 120 can be safely placed. In this case, the fixed block 110 may have a high pressure valve 118 and a high pressure connecting pipe ❹ I19 formed thereon. Therefore, as shown in Fig. 6A, when a sufficient distance is required between the modulator body 12 and the substrate, the pressure from the high-pressure porous material unit 134H and the low-pressure porous material unit 134L is discharged to the direction of the substrate. Therefore, the distance G1 between the modulator body 120 and the substrate 2 can be maintained close enough, for example, about 8 〇 to 12 〇 private m ° 17 200933178 as shown in the figure 'When the modulator body 120 is close to the substrate 2 or performing an array test The pressure is not discharged from the high pressure porous material unit 134H, but is discharged from the low pressure porous material unit 134L and the negative pressure supply pipe 240. As a result, the distance G2 between the modulator body 120 and the substrate 2 is maintained close, for example, from 1 〇 to 20 μm ′ and the array test is performed in this state. Meanwhile, as shown in Fig. 7, a plurality of high-pressure supply pipes 25A can be implemented instead of the high-pressure porous material unit 134H. The high pressure supply pipe 250 may be disposed adjacent to the low pressure porous material unit 134L. Alternatively, as shown in Fig. 7, each of the low-pressure porous material units 134L extends along one outer side and the other outer side of the modulator body 120, and the high-pressure supply pipe 25'' is formed to pass through the low-pressure porous material unit 134L. The fixed block 110 may have a high pressure valve 253 and a high pressure connecting pipe 254 to provide a higher pressure of the high pressure supply pipe than the low pressure porous material unit 134L. Each of the high pressure supply tubes 250 can be placed near the position of each vertex corresponding to the virtual inverted triangle based on the center of the modulator body 120. Therefore, as shown in Fig. 8A, predetermined pressure air is discharged from the high pressure supply pipe 250 and the low pressure porous material unit 134L to the substrate to allow the modulator body 120 and the substrate to move horizontally. Therefore, the distance G1 between the modulator body 120 and the substrate 2 is maintained at, for example, 80 to 20 #m. 18 200933178 Furthermore, as shown in FIG. 8B, 'when the modulator body i20 becomes close to the substrate 2' or when the array test is performed on the substrate 2, the shot is not discharged from the high-pressure test tube 25, but is self-reduced porous. Sex material unit] 3 rituals and negative care should be managed 24 〇 discharge. Therefore, the distance G2 approaching between the modulator body 120 and the substrate 2 is maintained at, for example, 10 to 2 〇 0 m, and the array test is performed in this state. ❹ According to the example ❹i, the Μ力县板 is provided through the pores of the multi-cell (four) unit with a large surface. As a result, the division of the Dare Objects is even bigger, which makes the substrate material bed faster, which means that the transformer is not shaken due to the drop, thus reducing the overall time of the array test. Furthermore, the array test provides a predetermined amount of negative pressure to the substrate modulator - parallelism is maintained, whereby the ground test can be performed. It will be apparent to those skilled in the art that various modifications and changes can be made without departing from the scope of the invention. Therefore, the present invention is intended to cover various changes and repairs provided by the age of the sci-fi and its scales. [Fig. 1 is a perspective view of the embodiment of the sacred intention. 2 is a perspective view of a modulator of an array tester in accordance with an illustrative embodiment. 3A and 3B are enlarged views of a portion A of Fig. 2. 19 200933178 Figure 4 is a plan view of the modulator body of Figure 2. The porous unit and the negative pressure supply supervisor are shown in cross section along the line V-V. 6A and 6B are diagrams showing the operation of the negative supply tube of Fig. 2. . The variable porosity material unit and = are plan views of the modulator modified from the modulator of Figure 2. FIG. 8B is a cross-sectional view showing the operation of the porous material unit, the negative pressure supply pipe, and the south pressure supply unit in the modulator of FIG. [Main component symbol description] 2 Substrate 10 Array tester 20 Loading unit 22 Loading plate 24 Air hole 30 Test unit 40 Unloading unit 42 Unloading plate 44 Air hole 50 Test module 55 Photographing unit 60 X-axis rail 70 Suction plate 100 Modulator 20 200933178
110 固定塊 112 導槽 114 負壓閥 115 負壓連接管 116 低壓閥 117 低壓連接管 118 高壓閥 119 高壓連接管 120 調變器本體 121 透明基板 123 調變器電極單元 125 性質改變單元 127 保護膜 130 多孔性單元 133 腔室單元 133H 高壓腔室單元 133L 低壓腔室單元 134 多孔性材料單元 134a 細孔 134H 高壓多孔性材料單元 134L 低壓多孔性材料單元 140 導引構件 141 連接單元 142 導軸 200933178 143 止階部 160 框架 162 鉤孔 163 下鉤孔部 164 上鉤孔部 240 負壓供應管 250 高壓供應管 253 高壓閥 254 高壓連接管110 Fixed block 112 Guide groove 114 Negative pressure valve 115 Negative pressure connection pipe 116 Low pressure valve 117 Low pressure connection pipe 118 High pressure valve 119 High pressure connection pipe 120 Modulator body 121 Transparent substrate 123 Modulator electrode unit 125 Property change unit 127 Protective film 130 Porosity unit 133 Chamber unit 133H High pressure chamber unit 133L Low pressure chamber unit 134 Porous material unit 134a Fine hole 134H High pressure porous material unit 134L Low pressure porous material unit 140 Guide member 141 Connection unit 142 Guide shaft 200933178 143 Stop section 160 frame 162 hook hole 163 lower hook hole portion 164 upper hook hole portion 240 negative pressure supply pipe 250 high pressure supply pipe 253 high pressure valve 254 high pressure connecting pipe