JP2009043837A - Substrate bonding apparatus - Google Patents

Substrate bonding apparatus Download PDF

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JP2009043837A
JP2009043837A JP2007205624A JP2007205624A JP2009043837A JP 2009043837 A JP2009043837 A JP 2009043837A JP 2007205624 A JP2007205624 A JP 2007205624A JP 2007205624 A JP2007205624 A JP 2007205624A JP 2009043837 A JP2009043837 A JP 2009043837A
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substrate
holding
substrates
bonding
holding means
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JP5115082B2 (en
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Yasuaki Tanaka
康明 田中
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Nikon Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate bonding apparatus capable of uniformly bonding the whole surfaces of substrates while preventing an air reservoir from occurring between the bonded substrates. <P>SOLUTION: The substrate bonding apparatus includes a first substrate holding means for holding a first substrate, a second substrate holding means for holding a second substrate, a pressing means for pressing a set of the first and second substrates via the first and second holding means, a control means for controlling pressing force of the pressing means and a position detecting means for detecting positions of the first and second substrates. At least one of surfaces of the first and second holding means for holding the substrate is formed to be convex. The control means controls, when bonding the first and second substrates, the pressing force based on a contact area calculated from substrate position information from the position detecting means, curvature of the convex and an elastic modulus of the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、複数の基板を位置合わせして接合させる基板接合装置に関する。   The present invention relates to a substrate bonding apparatus for aligning and bonding a plurality of substrates.

半導体集積回路を使用するノートパソコンや携帯電話などは、近年、ますます高度の機能を備えるようになっている。この結果、半導体集積回路の高密度化、高機能化の要求が高まっている。半導体集積回路の高密度化、高機能化のための一つの方法は、ウエハなどの基板を接合し、基板を積層させることである。   In recent years, notebook computers and mobile phones that use semiconductor integrated circuits have become increasingly sophisticated. As a result, there is an increasing demand for higher density and higher functionality of semiconductor integrated circuits. One method for increasing the density and functionality of semiconductor integrated circuits is to bond substrates such as wafers and stack the substrates.

基板を接合させる場合には、たとえば、ウエハの電極同士を接合させる必要があるので、互いに位置合わせして接合する必要があり、一対の基板保持手段を備える基板接合装置が提案されている（例えば、特許文献１参照）。
特開２００５−３０２８５８号公報 When bonding substrates, for example, since it is necessary to bond the electrodes of the wafer, it is necessary to align and bond the substrates, and a substrate bonding apparatus including a pair of substrate holding means has been proposed (for example, , See Patent Document 1).
JP 2005-302858 A

従来の基板接合装置では、一対の基板を接合させる際に、基板(たとえば、ウエハ)表面の平坦度のばらつきや塗布した樹脂の厚みむらなどにより、接合した基板の間に空気だまり(ボイド)が発生することがある。このような空気だまりを発生させないように、基板表面の中央部分が凸になるような状態で基板を接触させ、中央部分から徐々に接触面積を広げる接合方法が知られている。ところが、基板表面の中央部分が凸になるような状態で接合を行った場合、接合のために加える力が中央部分(接触部分)のみに集中し、基板の面全体にわたり接合が均一に行われないという問題があった。   In a conventional substrate bonding apparatus, when bonding a pair of substrates, air pockets (voids) are formed between the bonded substrates due to variations in the flatness of the surfaces of the substrates (for example, wafers) and uneven thickness of the applied resin. May occur. There is known a bonding method in which the substrate is brought into contact with the substrate so that the central portion of the substrate surface is convex so as to prevent such air accumulation and the contact area is gradually increased from the central portion. However, when bonding is performed in such a way that the central part of the substrate surface is convex, the force applied for bonding is concentrated only on the central part (contact part), and bonding is performed uniformly over the entire surface of the substrate. There was no problem.

上記課題を解決するために、本発明は、第１の基板を保持する第１の基板保持手段と、第２の基板を保持する第２の基板保持手段と、前記第１および前記第２の基板保持手段を介して前記第１の基板および前記第２の基板を加圧する加圧手段と、前記加圧手段の前記加圧力を制御する制御手段と、前記第１及び前記第２の基板位置を検出する位置検出手段とを備え、前記第１および前記第２の基板保持手段の前記基板を保持する少なくとも一方の面は凸状に形成され、前記制御手段は、前記第１および第２の基板を接合させる際に、前記凸状の頂点近傍の前記基板部分が最初に接触し、前記加圧力の増加に伴い前記基板の接触面積が広がるように、前記位置検出手段からの基板位置情報と、前記凸状の曲率、及び前記基板の弾性率に基づき算出された接触面積から前記加圧力を制御することを特徴とする基板接合装置を提供する。   In order to solve the above-mentioned problems, the present invention provides a first substrate holding means for holding a first substrate, a second substrate holding means for holding a second substrate, the first and the second A pressurizing unit that pressurizes the first substrate and the second substrate via a substrate holding unit; a control unit that controls the pressurizing force of the pressurizing unit; and the first and second substrate positions. And at least one surface of the first and second substrate holding means that holds the substrate is formed in a convex shape, and the control means includes the first and second surfaces. When the substrates are joined, the substrate portion information near the convex apex first comes into contact with the substrate position information from the position detection means so that the contact area of the substrate increases with the increase in the applied pressure. , Based on the convex curvature and the elastic modulus of the substrate Providing a substrate bonding apparatus characterized by controlling the pressure from the contact area that is.

本発明によれば、接合した基板の間に空気だまりが発生しないようにしながら、基板の面全体にわたり接合を均一に行うことのできる基板接合装置を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the board | substrate joining apparatus which can perform joining uniformly over the whole surface of a board | substrate can be provided, preventing an air clogging between the joined board | substrates.

以下、本発明の一実施の形態にかかる基板接合装置について図面を参照しつつ説明する。   Hereinafter, a substrate bonding apparatus according to an embodiment of the present invention will be described with reference to the drawings.

図１は、実施の形態にかかる基板接合装置の概略構成図を示す。図２は基板接合装置に用いられる基板ホルダの概略構成図を示す。   FIG. 1 is a schematic configuration diagram of a substrate bonding apparatus according to an embodiment. FIG. 2 shows a schematic configuration diagram of a substrate holder used in the substrate bonding apparatus.

図１において、基板接合装置１は、上部フレーム１１と下部フレーム１２とを備える。上部フレーム１１に上プレート１３が設置され、上プレート１３に第1の基板ホルダ１４が設置される。第１の基板ホルダ１４は、第１の基板Ｗｌを保持する。下部フレーム１２に加圧装置１５が設置され、加圧装置１５に下プレート１６が配置され、下プレート１６に第２の基板ホルダ１７が設置される。第２の基板ホルダ１７は、第２の基板Ｗ２を保持する。また、加圧装置１５には、不図示のロードセルが内蔵され、印加される加圧力の
測定を可能にしている。 In FIG. 1, the substrate bonding apparatus 1 includes an upper frame 11 and a lower frame 12. An upper plate 13 is installed on the upper frame 11, and a first substrate holder 14 is installed on the upper plate 13. The first substrate holder 14 holds the first substrate Wl. A pressure device 15 is installed on the lower frame 12, a lower plate 16 is disposed on the pressure device 15, and a second substrate holder 17 is installed on the lower plate 16. The second substrate holder 17 holds the second substrate W2. Further, the pressurizing device 15 has a load cell (not shown) built in, and enables measurement of the applied pressure.

第１及び第２の基板ホルダ１４、１７は、静電吸着により基板を吸着保持する機構を有しており、このための配線１４ａ、１７ａがそれぞれ設けられている。   The first and second substrate holders 14 and 17 have a mechanism for attracting and holding the substrate by electrostatic attraction, and wirings 14a and 17a for this purpose are provided.

また、下部フレーム１２には、加圧装置１５による加圧に伴う下プレート１６の移動量を検出する位置検出部１８が配置されている。また、静電吸着のＯＮ／ＯＦＦ、位置検出部１８、及び加圧装置１５（ロードセルを含む）等の信号処理及び駆動を制御する制御装置２０が配置されている。   Further, the lower frame 12 is provided with a position detector 18 that detects the amount of movement of the lower plate 16 due to pressurization by the pressurizer 15. In addition, a control device 20 that controls signal processing and driving such as ON / OFF of electrostatic attraction, a position detection unit 18, and a pressurizing device 15 (including a load cell) is disposed.

また、基板接合装置１は、不図示のアライメント機構を有し、第１の基板Ｗ１と第２の基板Ｗ２とをアライメントした後、制御装置２０のコントロールに基づき、加圧装置１５が下プレート１６を上昇させることにより、第２の基板ホルダ１７が上昇し、第１の基板ホルダ１４に保持された第１の基板Ｗｌと第２の基板ホルダ１７に保持された第２の基板Ｗ２とが接合される。   Further, the substrate bonding apparatus 1 has an alignment mechanism (not shown), and after aligning the first substrate W1 and the second substrate W2, the pressurizing device 15 moves the lower plate 16 based on the control of the control device 20. Is raised, the second substrate holder 17 is raised, and the first substrate Wl held by the first substrate holder 14 and the second substrate W2 held by the second substrate holder 17 are joined. Is done.

なお、基板の接合には、予めウエハの接合面に樹脂を塗布しておき、ウエハによって樹脂を挟み込むことでウエハを接合してもよし、対向する電極を接合してもよい。また、基板接合装置１の内部を真空チャンバで構成し、基板接合時にチャンバ内を真空にするように構成してもよい。   For bonding the substrates, a resin may be applied to the bonding surface of the wafer in advance, and the wafer may be bonded by sandwiching the resin between the wafers, or opposing electrodes may be bonded. Further, the inside of the substrate bonding apparatus 1 may be constituted by a vacuum chamber, and the inside of the chamber may be evacuated at the time of substrate bonding.

図２は、基板接合装置１に用いられる基板ホルダの一例を示す。   FIG. 2 shows an example of a substrate holder used in the substrate bonding apparatus 1.

第１の基板ホルダ１４および第２の基板ホルダ１７、静電チャック用の電極１４ｂ、１７ｂを有する。なお、静電チャック以外の真空チャックによって基板を保持するように構成してもよい。   The first substrate holder 14 and the second substrate holder 17 and electrodes 14b and 17b for electrostatic chuck are provided. Note that the substrate may be held by a vacuum chuck other than the electrostatic chuck.

第１の基板ホルダ１４の基板を保持する面は平面であるが、第２の基板ホルダ１７の基板を保持する面は凸面状に形成されている。このため、基板を接合する際に、第２の基板ホルダ１４に保持される第２の基板Ｗ２が凸に変形し、第２の基板Ｗ２の凸部と第１の基板Ｗｌとが最初に接触し、加圧と共に第２の基板Ｗ２が第１の基板Ｗ１押圧され、次第に接触面積が広がるように接合される。   The surface of the first substrate holder 14 that holds the substrate is a flat surface, but the surface of the second substrate holder 17 that holds the substrate is formed in a convex shape. For this reason, when the substrates are bonded, the second substrate W2 held by the second substrate holder 14 is deformed into a convex shape, and the convex portion of the second substrate W2 and the first substrate Wl first contact each other. Then, the second substrate W2 is pressed with the first substrate W1 together with the pressurization, and bonded so that the contact area gradually increases.

なお、基板の接合が円滑に行われるように、第２の基板ホルダ１７の基板を保持する面の曲率は面全体にわたり大きく変化しないのが好ましい。また基板を保持する面の曲率は、基板の弾性率を考慮して基板の変形がスムーズに行われるような形状とし、空気だまりを生じることがないように定めることが好ましい。   In addition, it is preferable that the curvature of the surface which hold | maintains the board | substrate of the 2nd board | substrate holder 17 does not change large over the whole surface so that joining of a board | substrate can be performed smoothly. In addition, it is preferable that the curvature of the surface holding the substrate is determined so that the substrate is smoothly deformed in consideration of the elastic modulus of the substrate so as not to cause air accumulation.

なお、第１の基板ホルダ１４の基板を保持する面が凸になるように構成してもよい。あるいは、両方の基板ホルダの基板を保持する面が凸になるように構成してもよい。   In addition, you may comprise so that the surface holding the board | substrate of the 1st board | substrate holder 14 may become convex. Or you may comprise so that the surface holding the board | substrate of both board | substrate holders may become convex.

また、一方または両方の基板ホルダの基板を保持する面の周縁部の少なくとも一部を
除く部分が凸になるように構成し、基板を接合させる際に、該凸の部分に対応する基板の
部分が最初に接触し、凸でない周縁部の少なくとも一部から空気が除かれるようにしても
よい。 Further, a portion of one or both of the substrate holders is configured so that a portion excluding at least a part of a peripheral portion of the surface holding the substrate is convex, and the substrate portion corresponding to the convex portion when the substrates are joined May be contacted first and air may be removed from at least a portion of the non-convex periphery.

実施の形態にかかる基板接合装置１では、制御装置２０は、加圧装置１５が上昇し第１の基板Ｗ１と第２の基板Ｗ２とが接した位置から第２の基板Ｗ２が上昇した距離を位置検出装置１８で検出し、第２の基板ホルダ１７の凸面の曲率、基板の弾性率、及び上昇した記距離を用いて、基板接触部の面積を算出する。この算出された面積を用いて、単位面積あたりの加圧力がほぼ一定になるように加圧装置１５の加圧力を制御する。これにより、接合初期から接合終了時まで単位面積あたりの加圧力をほぼ一定にすることができ、より均一な接合を行うことができる。また、接合中、基板の一部に過大な加圧力が加わらないため、基板の破損等を防ぐことができる。   In the substrate bonding apparatus 1 according to the embodiment, the control device 20 determines the distance by which the second substrate W2 is lifted from the position where the pressurizing device 15 is lifted and the first substrate W1 and the second substrate W2 are in contact with each other. The area of the substrate contact portion is calculated using the curvature of the convex surface of the second substrate holder 17, the elastic modulus of the substrate, and the increased recording distance as detected by the position detection device 18. Using this calculated area, the pressing force of the pressurizing device 15 is controlled so that the pressing force per unit area becomes substantially constant. Thereby, the applied pressure per unit area can be made substantially constant from the initial stage of bonding to the end of bonding, and more uniform bonding can be performed. In addition, since an excessive pressure is not applied to a part of the substrate during bonding, the substrate can be prevented from being damaged.

なお、位置検出部１８に代えて、基板Ｗ１と基板Ｗ２とのギャップを測定可能に構成し、ギャップの変化から接触面積を算出するようにしてもよい。或いは、ガラス基板のような透明な基板の場合は、基板ホルダを透明な部材で構成し、裏面から光学的に基板間の距離を測定するように構成してもよい。   Instead of the position detector 18, a gap between the substrate W1 and the substrate W2 may be configured to be measurable, and the contact area may be calculated from the change in the gap. Alternatively, in the case of a transparent substrate such as a glass substrate, the substrate holder may be composed of a transparent member, and the distance between the substrates may be optically measured from the back surface.

（基板ホルダの変形例）
図３は、実施の形態にかかる基板接合装置１に使用する基板ホルダの変形例を示す。 (Variation of substrate holder)
FIG. 3 shows a modification of the substrate holder used in the substrate bonding apparatus 1 according to the embodiment.

図３において、第１の基板ホルダ１４は図２と同等であるが、第２の基板ホルダ２７は、基板Ｗ２を保持する面に弾性部材２７ａを配置し、基板Ｗ２の変形を容易にするよう形成されている。   In FIG. 3, the first substrate holder 14 is the same as that in FIG. 2, but the second substrate holder 27 has an elastic member 27a disposed on the surface holding the substrate W2 to facilitate deformation of the substrate W2. Is formed.

この例の場合の接触面積は、制御装置２０が上記と同様に算出するが、算出において弾性部材の弾性率も考慮して接触面積を算出することが上記と異なっている。   The contact area in this example is calculated by the control device 20 in the same manner as described above, but the calculation of the contact area in consideration of the elastic modulus of the elastic member is different from the above.

なお、弾性部材２７ａの代わりに、内部に気体或いは液体を充填した風船状の部材を配置してもよい。この場合も、風船状の部材の弾性率を考慮して接触面積を算出することは言うまでもない。   Instead of the elastic member 27a, a balloon-like member filled with gas or liquid may be disposed. Also in this case, it goes without saying that the contact area is calculated in consideration of the elastic modulus of the balloon-shaped member.

以上述べたように、実施の形態にかかる基板接合装置によれば、基板接合の際に、基板間に空気だまりを生じさせることなく均一な基板接合を達成することが可能となる。   As described above, according to the substrate bonding apparatus according to the embodiment, it is possible to achieve uniform substrate bonding without causing air accumulation between the substrates during substrate bonding.

なお、上述の実施の形態は例に過ぎず、上述の構成や形状に限定されるものではなく、本発明の範囲内において適宜修正、変更が可能である。   The above-described embodiment is merely an example, and is not limited to the above-described configuration and shape, and can be appropriately modified and changed within the scope of the present invention.

実施形態にかかる、基板接合装置の概略構成図を示す。1 is a schematic configuration diagram of a substrate bonding apparatus according to an embodiment. 基板接合装置に用いられる基板ホルダの概略構成図を示す。The schematic block diagram of the substrate holder used for a substrate bonding apparatus is shown. 実施の形態にかかる基板接合装置に使用する基板ホルダの変形例を示す。The modification of the substrate holder used for the substrate bonding apparatus concerning an embodiment is shown.

符号の説明Explanation of symbols

１ 基板接合装置
１１ 上部フレーム
１２ 下部フレーム
１３ 上プレート
１４ 第１基板ホルダ
１５ 加圧装置
１６ 下プレート
１７、２７ 第２基板ホルダ
１８ 位置検出部
２０ 制御装置
Ｗ１、Ｗ２ 基板 DESCRIPTION OF SYMBOLS 1 Board | substrate joining apparatus 11 Upper frame 12 Lower frame 13 Upper plate 14 1st board | substrate holder 15 Pressurization apparatus 16 Lower plate 17, 27 2nd board | substrate holder 18 Position detection part 20 Control apparatus W1, W2 Board | substrate

Claims (4)

第１の基板を保持する第１の基板保持手段と、
第２の基板を保持する第２の基板保持手段と、
前記第１および前記第２の基板保持手段を介して前記第１の基板および前記第２の基板を加圧する加圧手段と、
前記加圧手段の前記加圧力を制御する制御手段と、
前記第１及び前記第２の基板位置を検出する位置検出手段と、を備え、
前記第１および前記第２の基板保持手段の前記基板を保持する少なくとも一方の面は凸状に形成され、
前記制御手段は、前記第１および前記第２の基板を接合させる際に、前記凸状の頂点近傍の前記基板部分が最初に接触し、前記加圧力の増加に伴い前記基板の接触面積が広がるように、前記位置検出手段からの基板位置情報と、前記凸状の曲率、及び前記基板の弾性率に基づき算出された接触面積から前記加圧力を制御することを特徴とする基板接合装置。 First substrate holding means for holding the first substrate;
A second substrate holding means for holding the second substrate;
Pressurizing means for pressurizing the first substrate and the second substrate via the first and second substrate holding means;
Control means for controlling the applied pressure of the pressurizing means;
Position detecting means for detecting the first and second substrate positions;
At least one surface for holding the substrate of the first and second substrate holding means is formed in a convex shape,
When the control means joins the first and second substrates, the substrate portion in the vicinity of the convex apex first comes into contact, and the contact area of the substrate increases with an increase in the applied pressure. As described above, the substrate pressure is controlled from the contact area calculated based on the substrate position information from the position detecting means, the convex curvature, and the elastic modulus of the substrate. 前記制御手段は、単位面積当りの前記加圧力を略一定値に制御することを特徴とする請求項１に記載の基板接合装置。   The substrate bonding apparatus according to claim 1, wherein the control unit controls the applied pressure per unit area to a substantially constant value. 前記第１および前記第２の基板保持手段の少なくとも一方が弾性材料を備え、前記接触面積の算出に前記弾性部材の弾性率を更に含むことを特徴とする請求項１または２に記載の基板接合装置。   3. The substrate bonding according to claim 1, wherein at least one of the first and second substrate holding means includes an elastic material, and the elastic modulus of the elastic member is further included in the calculation of the contact area. apparatus. 前記第１および前記第２の基板保持手段の少なくとも一方に、気体または液体が充填され、前記接触面積の算出に前記充填材の弾性率を更に含むことを特徴とする請求項１または２に記載の基板接合装置。   3. At least one of the first and second substrate holding means is filled with gas or liquid, and the elastic modulus of the filler is further included in the calculation of the contact area. Substrate bonding equipment.
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