KR20060069417A - Apparatus for sensing substrate - Google Patents

Abstract

The present invention provides a substrate sensing device. The substrate sensing device includes a sensor support which is formed vertically long and positioned adjacent to a cassette on which a plurality of substrates are stacked, and is provided on one surface of the sensor support and irradiates ultrasonic waves in a direction parallel to the substrate, and is reflected by the substrate. It includes a plurality of ultrasonic sensors for detecting the presence of the ultrasonic wave to detect the presence of the substrate. Therefore, according to the provided substrate sensing device, the operation for detecting the presence or absence of a substrate such as glass or wafer becomes very simple, and thus the speed of sensing a substrate such as glass or wafer becomes very fast.

LCD, Glass, Sensor, Ultrasonic Sensor, Substrate, Wafer

Description

Substrate sensing device {Apparatus for sensing substrate}

1 is a schematic view showing an example of use of the glass sensor according to the prior art.

Figure 2 is an exploded perspective view showing a preferred embodiment of the substrate detection apparatus according to the present invention.

3 is a schematic view showing a first use example of the substrate sensing device shown in FIG.

4 is a schematic view showing a second use example of the substrate sensing device shown in FIG. 2;

5 is a schematic view showing a third use example of the substrate sensing device shown in FIG.

Explanation of symbols on the main parts of the drawings

30: glass detector 31: sensor support

33: fixing bracket 35: ultrasonic sensor

The present invention relates to a substrate sensing device, and more particularly to a substrate sensing device for detecting the presence of glass or wafer using an ultrasonic sensor.

In general, a liquid crystal display device injects a liquid crystal material, which is a liquid crystal material that is an intermediate between solid and liquid, between two specially glass-treated thin glasses, and changes the arrangement of liquid crystal molecules using a voltage difference to form a contrast. Will be displayed.

In the manufacturing process of the liquid crystal display device, the cassette is loaded into a device for a predetermined process in a state where a plurality of glasses are loaded in a cassette, and a predetermined process is performed on the glass loaded in the cassette using a glass transfer device. Transfer to the device for. In this case, in order to accurately and quickly transfer the glass, it is necessary to determine whether a plurality of glasses are loaded at a predetermined position of the cassette. A glass sensing device is used to determine whether such glass is loaded.

Figure 1 shows an example of the use of the glass sensor according to the prior art.

As shown in FIG. 1, the cassette 10 is formed in a hexahedral shape in which both side surfaces facing each other are opened, and a plurality of glass support ends 11 are provided on the front and rear surfaces of the cassette 10 at corresponding heights. do. The glass support end 11 supports the bottom edge of the glass G so that the glass G is horizontally loaded in the cassette 10.

The glass sensor 20 is provided at a position adjacent to one surface (left side in the drawing) of the opened both sides of the cassette 10. The glass detecting device 20 serves to detect the presence or absence of the glass G loaded on the cassette 10, and includes a plurality of sensors provided on one surface of the sensor support 21 and the sensor support 21. It consists of an infrared sensor 23.

The sensor support 21 has a rectangular parallelepiped shape that is formed vertically long and has a height approximately corresponding to that of the cassette 10. The sensor support 21 is positioned such that one surface of the infrared sensor 23 is adjacent to the opened surface of the cassette 10, and is moved toward the cassette 10 by moving means (not shown). It is installed to be movable.

On the other hand, the infrared sensor 23 is provided with a plurality on one surface of the sensor support (21). At this time, the infrared sensor 23 is spaced apart from each other by a predetermined interval so as to be located between the glass support end (11). That is, the infrared sensor 23 is positioned below the glass G by moving the sensor support 21 toward the cassette 10. The infrared sensor 23 irradiates infrared rays toward the bottom of the glass G, and detects the presence or absence of the glass G by detecting the infrared rays reflected by the glass G.

Hereinafter, a process of detecting the glass by the glass sensor 20 according to the related art will be described in more detail.

First, the cassette 10 on which the glass G is loaded is moved so that the opened one side thereof is adjacent to the glass sensing device 20. In this state, the sensor support 21 is moved toward the cassette 10 so that the infrared sensor 23 is positioned below the glass G, respectively.

The infrared sensor 23 irradiates infrared rays toward the bottom of the glass G and detects the infrared rays reflected by the glass G to detect the presence of the glass G. In this case, the infrared sensor 23 irradiates infrared rays in a direction orthogonal to the glass G.

For example, when the glass G corresponding to any one of the infrared sensors 23 is not loaded in the cassette 10, the infrared rays irradiated from the infrared sensors 23 are located directly above them. Reflected on the bottom surface of the glass (G) corresponding to the infrared sensor 23 is detected by the infrared sensor (23). Therefore, since the infrared sensor 23 detects infrared rays longer than the other infrared sensors 23, the presence of glass G can be detected.

However, the glass sensor 20 according to the related art has the following problems.

As described above, in the state where the cassette 10 is moved to be adjacent to the sensor support 21, the sensor support 21 moves toward the cassette 10. That is, since both the cassette 10 and the sensor support 21 are moved to detect the glass G, an operation for detecting the glass G becomes complicated.

In addition, by moving the sensor support 21, the infrared sensor 23 is substantially inserted below the glass (G) by being inserted between the glass (G) through an open surface of the cassette (10). do. Therefore, in the process of detecting the glass G, the infrared sensor 23 may be damaged by hitting the cassette 10 or one side of the glass G.

The present invention is to solve such a conventional problem, the object of the present invention is to provide a substrate sensing device configured to operate more simply.

Another object of the present invention is to provide a substrate sensing device configured to minimize damage to a product.

Still another object of the present invention is to provide a glass sensing device which is configured to operate more simply and to minimize damage of a product.

According to a first aspect of the present invention for achieving the above object, the sensor support is formed long up and down, and positioned adjacent to the cassette on which a plurality of substrates are stacked; A substrate sensing device is provided on one surface of the sensor support and includes a plurality of ultrasonic sensors that detect ultrasonic waves reflected by the substrate and irradiate ultrasonic waves in a direction parallel to the substrate. .

In another embodiment, the ultrasonic sensors may be located on the same plane as the corresponding substrate, respectively.

In another embodiment, the substrate sensing device may further include a pair of fixing brackets for fixing the sensor support to a predetermined position.

In another embodiment, the ultrasonic sensor is disposed long on the one surface of the sensor support vertically, it may be arranged at equal intervals. In this case, the substrate may be a wafer.

On the other hand, according to a second aspect of the present invention for achieving the above object, the sensor support is formed long and vertically positioned adjacent to the cassette is stacked a plurality of glass; Provided on one surface of the sensor support, there is provided a glass sensing device including a plurality of ultrasonic sensors for detecting the presence of the glass by irradiating the ultrasonic wave in a direction parallel to the glass and detecting the ultrasonic wave reflected by the glass.

In another embodiment, the ultrasonic sensors may be located on the same plane as the corresponding glass.

In another embodiment, the glass sensing device may further include a pair of fixing brackets for fixing the sensor support in a predetermined position.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed subject matter is thorough and complete, and that the scope of the invention to those skilled in the art will fully convey. Like numbers refer to like elements throughout.

2 shows a preferred embodiment of the substrate sensing apparatus according to the present invention.

As shown in FIG. 2, the substrate detecting apparatus 30 according to the present invention includes a sensor support 31, an ultrasonic sensor 35 provided on the sensor support 31, and a sensor support 31. 31 is provided inside the control unit 37 for controlling the overall substrate sensing device 30, and serves to quickly detect a plurality of substrates loaded on the cassette. In this case, the substrate may be a glass for a liquid crystal display or a wafer for manufacturing a semiconductor device. As a result, the substrate sensing device 30 may be used as a glass sensing device or a wafer sensing device.

In more detail, the sensor support 31 is formed in a rectangular parallelepiped shape that is elongated in the longitudinal direction, for example, in the vertical direction. In addition, the sensor support 31 is formed in a hollow so that the control unit 37 is provided therein. On the other hand, the sensor support 31 may be fixed at a predetermined position by a separate fixing bracket (33). In one embodiment, the fixing bracket 33 may be coupled to the upper and lower ends of the sensor support 31, respectively. Therefore, the sensor support 31 can be fixed to a predetermined position or a predetermined equipment by the fixing bracket 33. For example, the sensor support 31 may be fixed to the predetermined position or predetermined equipment in the vertical direction long by the fixing bracket 33. In addition, a plurality of coupling holes 32 may be formed on the side of the sensor support 31. In this case, the sensor support 31 may be coupled to a predetermined position or a predetermined device through the plurality of coupling holes 32, the fixing bracket 33 is at the upper and lower ends of the sensor support 31. It may not be provided respectively.

The ultrasonic sensor 35 is provided on one surface of the sensor support 31 to detect a substrate loaded on a cassette. In one embodiment, the ultrasonic sensor 35 may be provided on one surface in the longitudinal direction of the sensor support (31). The ultrasonic sensor 35 may be installed so that one sensor detects one substrate. Accordingly, the ultrasonic sensor 35 may be provided on the sensor support 31 in the same number as the maximum number of substrates that can be loaded in the cassette so as to sense a plurality of substrates loaded in the cassette at one time. As a result, the number of the ultrasonic sensors 35 provided on one surface of the sensor support 31 may be determined differently according to the size of the cassette or device to be used.

In addition, the plurality of ultrasonic sensors 35 provided in the sensor support 31 may be arranged in the same form as the arrangement of the substrates loaded in the cassette so as to correspond one-to-one to the substrates loaded in the cassette. For example, when the substrate is loaded in the cassette in a vertical direction, that is, in a vertical direction, the plurality of ultrasonic sensors 35 may also be disposed in the vertical direction on the sensor support 31. In this case, the sensor support 31 is preferably fixed to the predetermined position or predetermined equipment long by the fixing bracket 33 or the coupling hole 32 long in the vertical direction. In addition, when the substrate is loaded in the cassette in a horizontal direction, that is, in a horizontal direction, the plurality of ultrasonic sensors 35 may also be disposed in the horizontal direction on the sensor support 31. In this case, the sensor support 31 is preferably fixed in a horizontal direction to a predetermined position or a predetermined equipment by the fixing bracket 33 or the coupling hole (32).

In addition, the ultrasonic sensor 35 oscillates the ultrasonic wave toward the substrate loaded on the cassette, and detects the presence of the substrate by detecting the ultrasonic wave reflected by the substrate again. In one embodiment, the ultrasonic sensor 35 oscillates the ultrasonic wave to a certain position where the substrate is to be located, the ultrasonic wave is reflected on the substrate located at the predetermined position is reflected back to the ultrasonic sensor 35 When detected, the detection value detects which state the substrate is located at. However, even when the ultrasonic wave is oscillated to a certain position where the substrate is to be positioned, if the ultrasonic wave is not reflected again within a predetermined time, the ultrasonic sensor 35 does not detect the ultrasonic wave again. It is detected that the substrate is not positioned at the position. Here, the ultrasonic sensor 35 is provided on the same level as the substrate, that is, on the same plane, and spaced apart from one surface (referring to the sidewall of the substrate) by a predetermined distance from the edge of the substrate. Can be. Accordingly, the ultrasonic sensor 35 irradiates ultrasonic waves toward one edge of the substrate to detect the substrate corresponding thereto, but irradiates ultrasonic waves in a direction parallel to the substrate. At this time, the ultrasonic wave oscillated by the ultrasonic sensor 35 is not malfunctioned by other substrates adjacent to each other in close proximity to each other, and only a few hundred khz, for example, can sense only a very thin substrate corresponding thereto. It can have a frequency of 400 ~ 800 khz.

Meanwhile, the control unit 37 is electrically connected to the plurality of ultrasonic sensors 35, respectively, and serves to control the substrate sensing device 30 as a whole. Specifically, the ultrasonic sensor 35 serves to detect the presence of the substrate by again detecting the ultrasonic wave reflected by the substrate after oscillating a predetermined khz ultrasonic wave toward the substrate loaded on the cassette, etc., the control The unit 37 is connected to the ultrasonic sensor 35 to detect the presence or absence of the substrate, and to display the detected value to the outside or to transmit to another device. In addition, the control unit 37 may selectively drive the plurality of ultrasonic sensors 35 according to a predetermined value preset or a predetermined signal input from the outside. In this case, the substrate sensing device 30 may be linked with other external devices.

Reference numeral S is a fastener for fixing the fixing bracket 33 to a predetermined position or to a predetermined equipment.

Hereinafter, various use examples of the substrate sensing apparatus according to the present invention will be described in detail with reference to FIGS. 3 to 5.

3 is a schematic view showing a first use example of the substrate sensing apparatus shown in FIG. 2.

As shown in FIG. 3, the substrate sensing device 30 according to the present invention may be used to detect the glass G used in the liquid crystal display. In other words, the substrate sensing device 30 according to the present invention may be used as a glass sensing device. In this case, the ultrasonic sensor 35 provided in the substrate sensing device 30 may detect the glass G by oscillating an ultrasonic wave having a frequency of about 400khz toward the glass G side so as to correspond to the thin thickness of the glass G. Can be.

In order to explain the order of use, first, the glass gasket set 10 having the glass G loaded therein is provided to detect the glass G using the substrate sensing device 30 of the present invention. At this time, a plurality of glasses (G) in the glass casing set 10 is horizontally loaded by being supported by the glass support end 11 provided in the cassette 10, respectively.

Thereafter, the glass set 10 is moved to a position adjacent to the substrate sensing device 30 fixed at a predetermined position while the glass G is loaded. At this time, the opened one side of the glass set 10 is directed to the ultrasonic sensor 35 of the substrate sensing device 30, the ultrasonic sensor 35 from any one of the edge surface of the glass (G) Spaced by a predetermined distance.

Next, when the glass set 10 is positioned adjacent to the substrate sensing device 30, the ultrasonic sensor 35 is driven by the control of the control unit 37 for controlling the ultrasonic sensor 35, the glass An ultrasonic wave having a frequency of about 400 khz is oscillated toward one of the edges of (G). Therefore, when the ultrasonic wave oscillated by the ultrasonic sensor 35 hits one of the edge surfaces of the glass G and is reflected back to the ultrasonic sensor 35, the ultrasonic sensor 35 receives the reflected ultrasonic wave. By detecting, the glass G is detected to be loaded at a predetermined position of the glass set 10. However, if the glass G is not loaded on one of the glass support ends 11 ′ provided in the glass set 10, the ultrasonic sensor 35 corresponding thereto may not be loaded. Ultrasonic wave oscillated at) is not reflected and continues to proceed. Therefore, since the oscillated ultrasonic wave is not detected by the ultrasonic sensor 35 again, the glass support end 11 ′ in the glass set 10 can detect that the glass G is not loaded. do.

On the other hand, when the ultrasonic wave reflected by the ultrasonic sensor 35 is not detected and the glass G is not loaded, the control unit 37 connected to the ultrasonic sensor 35 sends the detected value to the outside. Display or transfer to another device. At this time, the user or the glass supply device detects that the glass G is not loaded on the glass support end 11 'through the displayed value or the transmitted value, and the glass support end 11' The glass G is further loaded into the container.

Thereafter, when the glass G is loaded in the glass set 10, the cassette 10 is loaded into a device for a predetermined process, and the glass G is completed.

Meanwhile, the substrate sensing apparatus according to the present invention may be used as another example as shown in FIGS. 4 and 5.

4 is a schematic view showing a second use example of the substrate sensing device shown in FIG. 2, and FIG. 5 is a schematic view showing a third use example of the substrate sensing device shown in FIG. 2.

As shown in FIG. 4 and FIG. 5, the substrate sensing device 30 according to the present invention may be used to sense a wafer W used in the manufacture of a semiconductor device. In other words, the substrate sensing device 30 according to the present invention may be used as a wafer sensing device. In this case, the ultrasonic sensor 35 of the substrate sensing device 30 detects the wafer W by oscillating an ultrasonic wave having a frequency of about 800 khz toward the wafer W so as to correspond to a very thin thickness of the wafer W. can do. Subsequently, the substrate sensing apparatus 30 according to the present invention is disposed in the front direction of the wafer cassette 40 on which the wafers W are loaded as shown in FIG. The wafer W loaded on the cassette 40 may be sensed, and as shown in FIG. 5, the wafer W is disposed in the rearward direction of the loaded wafer cassette 40 and then the rearward direction (of FIG. 5). The wafer W loaded on the wafer cassette 40 can be detected from the B direction).

In order to explain the order of use, first, a wafer cassette 40 in which a wafer W is loaded therein is provided to detect the wafer W using the substrate sensing device 30 of the present invention. In this case, a plurality of wafers W are horizontally loaded in the wafer cassette 40 by being supported by the wafer support ends 41 provided in the wafer cassette 40.

Thereafter, the wafer cassette 40 is moved to a position adjacent to the substrate sensing device 30 fixed at a predetermined position in the state where the wafer W is loaded. In this case, the opened one side surface of the wafer cassette 40, for example, the front side and the rear side of the wafer cassette 40 faces the ultrasonic sensor 35 of the substrate sensing device 30, and the ultrasonic sensor 35 is the wafer ( It is spaced apart from any one of the edge surfaces of W) by a predetermined distance.

Next, when the wafer cassette 40 is positioned adjacent to the substrate sensing device 30, the ultrasonic sensor 35 is driven by the control of the control unit 37 which controls the ultrasonic sensor 35. An ultrasonic wave having a frequency of about 800 khz is oscillated toward one of the edges of (W). Therefore, when the ultrasonic wave oscillated by the ultrasonic sensor 35 hits one surface of the edge surface of the wafer W and is reflected toward the ultrasonic sensor 35, the ultrasonic sensor 35 detects the reflected ultrasonic wave. As a result, the wafer W is sensed to be loaded at a predetermined position of the wafer cassette 40. However, if the wafer W is not loaded on any one of the wafer support ends 41 ′ of the wafer support ends 41 provided in the wafer cassette 40, the ultrasonic sensor 35 corresponding thereto may not be loaded. Ultrasonic wave oscillated at) is not reflected and continues to proceed. Accordingly, since the oscillated ultrasonic wave is not detected by the ultrasonic sensor 35 again, the wafer support end 41 ′ in the wafer cassette 40 can detect that the wafer W is not loaded. do.

On the other hand, if it is detected that the wafer W is not loaded because the ultrasonic wave reflected by the ultrasonic sensor 35 after oscillation is not detected, the control unit 37 connected to the ultrasonic sensor 35 adjusts the detected value. It will be displayed externally or transmitted to other devices. Accordingly, the user or the wafer supply device detects that the wafer W is not loaded on the wafer support end 41 ′ through the displayed value or the transmitted value, and detects the wafer W at the wafer support end 41 ′. The wafer W is further loaded.

Thereafter, when all of the wafers W are loaded into the wafer cassette 40, the wafer cassette 40 is loaded into a device for a predetermined process, and the wafer W sensing operation is completed.

As mentioned above, although the present invention has been described with reference to the illustrated embodiments, it is only an example, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the scope of the present invention should be defined by the appended claims and their equivalents.

As described above, according to the substrate sensing apparatus according to the present invention as described above can obtain the following effects.

First, by placing a cassette on which a substrate such as glass or wafer is placed adjacent to a substrate sensing device fixed at a predetermined position, and then generating an ultrasonic wave having a predetermined frequency toward the cassette side, a substrate such as glass or wafer in the cassette The presence or absence of the load can be detected. Therefore, according to the present invention, since the operation for detecting the presence or absence of a substrate such as glass or wafer becomes very simple as compared with the related art, the speed of detecting a substrate such as glass or wafer becomes very fast. Therefore, using the substrate sensing device of the present invention, it is possible to quickly detect the presence or absence of a substrate such as glass or wafer, it is possible to increase the efficiency of the process.

Second, the substrate detecting apparatus according to the present invention is not the ultrasonic sensor for detecting the presence of the substrate such as the glass or wafer is not located between the substrate such as the glass or wafer, the edge surface of the substrate such as the glass or wafer It is located adjacent to one side of either. Therefore, according to the substrate sensing apparatus according to the present invention, it is possible to prevent the substrate sensing apparatus or the substrate such as the glass or the wafer from being damaged in the process of detecting the presence of the substrate such as the glass or the wafer. In addition, compared to the existing infrared sensor, the time required for moving the substrate and a separate moving device are unnecessary, thereby reducing the overall manufacturing cost.

Claims (8)

A sensor support formed vertically long and positioned adjacent to a cassette on which a plurality of substrates are stacked; And a plurality of ultrasonic sensors provided on one surface of the sensor support and configured to irradiate ultrasonic waves in a direction parallel to the substrate, and detect ultrasonic waves reflected by the substrate to detect the presence or absence of the substrate. The method of claim 1, And the ultrasonic sensors are each positioned on the same plane as the corresponding substrate. The method of claim 1, And a pair of fixing brackets for fixing the sensor support to a predetermined position. The method of claim 1, The ultrasonic sensor is disposed on one surface of the sensor support vertically long, the substrate sensing device, characterized in that arranged at equal intervals. The method of claim 1, And the substrate is a wafer. A sensor support formed vertically long and positioned adjacent to a cassette on which a plurality of glasses are stacked; And a plurality of ultrasonic sensors provided on one surface of the sensor support and configured to irradiate ultrasonic waves in a direction parallel to the glass and detect ultrasonic waves reflected by the glass to detect the presence or absence of the glass. The method of claim 6, And the ultrasonic sensors are each positioned on the same plane as the corresponding glass. The method of claim 6, And a pair of fixing brackets for fixing the sensor support to a predetermined position.

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