201105988 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種偵測顯示裝置的裝置，特別係關於 一種陣列檢測裝置，偵測形成在顯示基板上之電極的電性 缺陷。 【先前技術】 近年來’顯示面板已經逐漸薄型化，且新型平面顯示 器的類型亦愈趨多樣性，包括液晶顯示器（liquid crystal displays，LCD)、電聚顯示器（piasma display panels，PDP) 及有機發光二極體顯示器（organic light emitting diode displays, OLED)。一般而言，薄膜電晶體液晶顯示器（thin film transistor LCD，TFT LCD )包含一薄膜電晶體基板、 一彩色濾光基板、液晶及一背光單元，其中，彩色濾光基 板是以面對薄膜電晶體基板之方式設置，且具有一彩色遽 光片及一共同電極，而液晶則設置於薄膜電晶體基板及彩 色濾光基板之間。 陣列檢測裝置用於檢測形成於薄膜電晶體基板上之 薄膜電晶體電極的缺陷。 詳細而言，同時供應一預設電壓至設置於陣列檢測裴 置及薄膜電晶體電極中之一調變模組，並且調變模組鄰設 於薄膜電晶體基板，因此調變模組與薄膜電晶體電極間可 形成一電場。此時，薄膜電晶體基板上之薄膜電晶體電極 若有缺陷，將導致電場的強度比沒有缺陷時的電場強度為 201105988 f。據此’測量所得的電場強度可作 極是否具有缺陷的依據。 ％㈣電曰曰體電 習知的陣列檢測裝置包含一探針組件。 二形=板上的電極。提供-驅動訊號至= 物會板時，異 :=τ清潔’其他外來的異物仍有可能會 =:，而此些異物將導致每次檢測的可信度以及精 【發明内容】 穿置有?:上:課題，本發明之目的為提供-種陣列檢測 ^雷= 件以及—清潔單元，探針組件用以提 ^電^形成於-基板上之一電極，以檢測電極中之缺 ，且清潔單元設置於探針組件之一側。 、 依據本發明較佳實施例，探針崎可包含 雷探針桿包含一探針接腳，以提供電 於 ==針架與探針桿連接，使得探針桿舆基板 此以相时向移動，針架與清潔單元連接。 依據本發明難實施例，陣舰縣置包含複數 拆卸式清潔單元。 201105988 依據本發明較佳實施例，清潔單元沿探針架之一長軸 方向運作。 依據本發明較佳實施例，清潔單元包含一剝除單元， 以剝除基板上之異物。 元 中 腳 依據本發明較佳實施例，清潔單元可包含一抽吸單 吸取基板表面上或其周圍空氣中之異物。在此實施例 抽吸單元包含複數個朝向基板延伸並垂直基板之針 依據本發明較佳實施例，清潔單元包含一用以產生超 曰波之超音波單元。在本實施射，清潔單元可更包含一 罩體’設置於超音波單元之外圍，以便與超音波軍元間形 成一預設之間隙，俾使氣體得以通過間隙。 依據本發明較佳實施例，清潔單元包含一磁性單元， 移除基板表面或其周圍空氣中的金屬異物。 據此，具有探針組件之清潔單元可在 驅動元件的情況下，有效地蒋^ 日叹巧為早兀 生的異物。 有放地移除在檢测過程中可能額外產 以下將揭露本發明之較佳實_並⑨ ^ 明本發明之其他性f，俾使本技術:二’心田說 以清楚瞭解。 -中一通㊉知識者得 【實施方式】 以下將參照相關圖式，說明依據本發明較佳實施例之 201105988 具有π /t單元之卩㈣檢測裝置，其巾相_元件將以相同 的參照符號加以說明。 一陣列檢測裝置包含—探針組件及-清潔單元，探針 組件提供一電麗至形成於一基板上之一電極，以檢測電極 之-缺陷，且探針組件包含一清潔單元，設置於探針組件 之御卜设置於探針組件中之清潔單元可移除基板上的異 物，藉此以有效地移除在運送基板或驅動探針組件時可能 產生的微小異物。 以下將配合所附之圖示 測裝置的技術特徵。 說明具有清潔單元之陣列檢 圖1 示意圖， 視圖。 為依據本發明較佳實施例之陣列檢測裝置1〇〇的 而圖2為具有清潔單元之陣列檢測裝i 100的側 請參考圖1及圖2 罕'元70、卸載單元80 源30及探針組件3〇〇。 所示’陣列檢測裝置100具有襄載 、調變模組20、偵測單元60、一光 置！ 〇 ^單姑元7 〇裝載待檢測之一基㈣進入陣列檢測 直1〇〇。由裝載單元70載入基 方的檢測區域。各C 光源3° 孔71。二裝載早兀7〇可具有-裝載板及複數 當基板將严高壓空氣喷出至基板9〇之底部，因 持件％運送基板：空氣 卸载單元80 1 〇〇外 將檢測完成的基板運送出陣列檢測裝置 卸载單元8G可具有―卸载板及複數氣孔81。 201105988 卸載單元80之作用方式與裝載單元70相同，不再贅述。 氣孔81.可將高壓空氣喷出至基板9〇之底部，因而當基板 90藉由高壓空氣而浮於卸載板上時，可透過一支持件（圖 中未示）運送基板90。 調變模組20位於基板90之上方，且兩者距離十分接 近。各調變模組20可包含一電極層及一光電層。各調變 模組20之電極層與基板90之一電極層91共同形成一電 % ’且各調變模組20之電極層可由銦錫氧化物（Indium Tin Oxide，ITO)、碳奈米管（Carbon Nano Tubes，CNT)或其 他相似材料形成。光電層乃是依據一電場的強度，而改變 穿過本身的光量’且光電層可由液晶（crystal，LC )、 無機電致光（inorganic electro luminance ( EL )以及高分 子色政液晶（polymer dispersed liquid crystal，PDLC )形成。 舉例而言，若供應一電壓至基板9〇之電極層91及調 變模組20之電極層，調變模組2〇之特定性質會因為基板 90之缺陷而發生變化。當形成於待檢測基板上之電極 層未有缺陷時，電場可形成於各調變模組2〇中，並調變 杈組20中之分子會依一特定方向排列，使得光線穿過調 變模組20。反之，若形成於基板9〇上之電極層有缺陷時， 電場便無法於調變模組20中形成，而調變模組2〇之分子 排列亦無法改變，造成光線無法穿過調變模組2〇。 陣列檢測裝置1〇〇可更包含一光學吸盤（圖中未示）。 光學吸盤設置於待檢測之基板9〇之下方，換言之，基板 9〇設置於光學吸盤上。光學吸盤5〇是由透光性材料形成， 201105988 例如玻璃。此外，光學吸盤50可具有複數氣孔，可以抽 吸之方式使基板90浮起或吸附於光學吸盤50上。 各偵測單元60設置於各調變模組20之上側。偵測單 元60測量調變模組20之特定性質的變化，藉以偵測基板 90之電極層中的之缺陷。舉例而言，偵測單元6〇可依據 形成於基板90上之電極層的狀態，測量透射過電極層之 光線的光量並輸出測量資料至一訊號處理單元進行處 理’藉以偵測基板90上是否具有缺陷。 光源30是相對於調變模組2〇設置，且基板9〇失設 於兩者之間。光源30發出一光線以照射調變模組2〇。由 光源30發出的光於依序穿遶光學吸盤5〇、基板9〇以及調 變模組2 0後，照射到偵測部6 〇。光源3 〇之類型並無限制， 可例如為氙氣燈（Xenon lamp )、鈉燈（s〇dium iamp )、鹵 素燈（crystal halogen lamp)及/或雷射光源單元。 各探針組件300包含一探針桿31〇及一探針架32〇。 探針桿包含探針接腳312，各探針接腳312提供電壓 至形成於基板90上之電極。探針架32〇與探針桿31〇連 接，使得探針桿31〇可相對於基板9〇在一方向上移動。 詳細而言，探針架320包含一線性馬達32卜其沿X 軸方向設置並固定於探針架32〇上。線性馬達321與二 轴滑動元件311連接，且χ軸滑動元件m能ς 架320沿X軸方向滑動。 、探针 X #滑動兀件311與 神滑動元件315連接，曰 針桿31〇與Ζ軸滑動元件315連接。再者，探針架幼 201105988 一 Y軸滑動元件330連接。Y軸滑動元件330則與一 γ軸 導引軌道340 (Y_axis guide rail)連接，且能沿γ軸方向 滑動。 因此，探針架320可相對於探針架320沿γ軸方向移 動，且探針桿31〇可相對於基板9〇沿x、丫及z軸方向 移動。探針接腳312可在基板90之上沿X及γ軸方向移 動沿移動，且亦可沿Z轴方向移動以接觸基板之電極。 詳細而言，清潔單元200可與探針架32〇連接。據此， 清潔單元200及探針架32〇可一併被驅動，以將基板9〇 之上表面的異物移除。由此可知，在本實施例中，僅需提 供一驅動裝置，用以對探針架320提供一驅動動力，便可 移動清潔單元200，而不需再增設額外的驅動裝置。 因此，在本實施例中，能利用可拆卸的方式連接一定 數量之清潔單元200於探針架32〇上。若基板尺寸夠大， 清潔單兀200可以一預設間距成列設置’如此基板90的 清潔便可於基板90通過清潔單元2〇〇時徹底完成。另外， 由於清潔單元200能自探針架32〇上取下，清潔單元2〇〇 的替換及維護可簡易輕便地實施。 再者’清潔單元2〇〇相對於探針架32〇具有至少一定 的自由度’所以單一清潔單元200的設置方式是與探針架 320連接並可沿X軸方向移動。因而當單一清潔單元2〇〇 在X軸方向上沿探針架320移動時，可有效地移除基板90 之上表面的異物》在本實施例中，清潔單元可通過在 χ、γ及z軸方向上的移動，以移除整個基板9〇上的異物。 201105988 a田探針架320在基板9〇之上移動時，清潔單元200 =用^凊潔基板90上之異物。據&，在進行基板檢測時， /月潔單元200能於每次探針架32〇朝向一畫素電極移動 時’重複清潔基板一 或者，在基板90朝向探針桿31〇移動時，清潔單元 2〇〇,亦可使用一般方式清潔基板90。據此，當基板90於 運送並通過探針架32〇時，可有效地移除基板9〇之上表 面的異物。 此外，陣列檢測裝置100可更包含一感測單元。感測 單兀偵測附著於基板90上之異物。在本實施例中，當感 測單元偵測到異物時，清潔單元200便可開始作動。更進 一步而言’感測單元亦可用以指示異物的所在位置。 圖3為因異物附著於基板9〇而產生之檢測誤差的示 意圖。請參考圖3所示，基板90緊鄰設置於調變模組20 之下’且複數個電極92、93及94形成於基板90之上表 面上。首先’假若電極93是為一缺陷電極，而其餘的電 極92及94則沒有缺陷，在此情況中，以下將先說明缺陷 電極的積測’而後解釋異物對偵測的影響。複數液晶分子 1、2及3散佈於調變模組2〇内，且透明電極21設置於調 變模組20之一表面上。 當供應—電壓至調變模組20之透明電極21以及基板 90之各電極92、93及94時，將於調變模組20以及非缺 陷電極92及94間形成一電場8。因此，圍繞電場8之液 日曰刀子1及3的排列方式會產生變化，至於位於沒有電場 11 201105988 形成之一區域的液晶分子2，其排列方式則不會產生變 化。由光源30發出的光線5、6及7可以穿透排列方式產 生變化的液晶分子1及3，但卻無法穿透排列方式未發生 變化的液晶分子2。據此，可藉由測量穿透光的光量以偵 測基板90上之電極的缺陷。 換言之，由於部分由光源30發出的光線5及7可直 線前進並穿透液晶分子1及3，但其他光線6無法順利穿 透液晶分子2，因此可偵測出電極93是為缺陷電極。 然而，若基板90上有異物9附著，將使得自光源30 發出之光線7在前進時受到影響，而發生散射或折射。在 習知的陣列檢測裝置中，便有可能因為此些異物的存在， 而產生將正常電極94判斷為一缺陷電極的誤差。 依據本發明之陣列檢測裝置100，清潔單元200移除 基板90之表面上的異物，藉以降低檢測誤差及提高檢測 可信度。 圖4為依據本發明較佳實施例之剝除單元180的部分 剖面圖。請參考圖4所示，清潔單元200可包含一剝除單 元180，以剝除基板90上之異物。剝除單元180可為一氣 體喷射器，朝向基板90之上表面噴射氣體，以分離基板 90之表面上的異物。 圖5為依據本發明較佳實施例之清潔單元200的部分 剖面圖。請參考圖5所示，清潔單元200可包含一抽吸單 元170，以吸取異物或周圍空氣。因此，由基板90上分離 的異物不會漂浮於空氣中，而將徹底移除至陣列檢測裝置 12 201105988 100 外。 圖6為圖5所示之清潔單元200之另一態樣的部分剖 面圖’圖7為圖5所示之清潔單元2〇〇之又一態樣的部分 剖面圖’而圖8為圖5所示之清潔單元200之又一態樣的 部分剖面圖。 請參考圖6所示，剝除單元180及抽吸單元170可彼 此相鄰設置。請參考圖7所示，又或者，兩個抽吸單元170 可分別設置於剝除單元180之兩侧。據此，藉由剝除單元 180以及抽吸單元Π0可徹底地吸取附著於基板90上之異 物以及空氣中的塵埃顆粒，以維持作業環境的乾淨清潔。 此外，請參考圖8所示，亦可為兩個剝除單元18〇分別設 置於抽吸單元170之兩側。 口圖9為依據本發明較佳實施例之具有針腳171之清邊 ，元200的部分剖面圖。請參考圖9所示，抽吸單元pi 可包含複數針腳17卜各針腳以垂直於基板⑽之上表面# 乂（Z軸方向）朝向基板9G之上表面延伸。設置於抽殘 ::170上之針腳171可透過一抽吸開口的抽吸作用，產 直氣流，此，藉由水平氣流及垂直氣流，可 周圍之異物輕易地自基板90之表面 單元m中。 上移除並吸入抽吸 90 圖為依據本發明較佳實施例之超 叫丄兵物，進而將其移除。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for detecting a display device, and more particularly to an array detecting device for detecting an electrical defect of an electrode formed on a display substrate. [Prior Art] In recent years, 'display panels have been gradually thinned, and the types of new flat panel displays have become more diverse, including liquid crystal displays (LCDs), piasma display panels (PDPs), and organic light-emitting displays. Organic light emitting diode displays (OLEDs). In general, a thin film transistor (LCD) includes a thin film transistor substrate, a color filter substrate, a liquid crystal, and a backlight unit. The color filter substrate is a thin film transistor. The substrate is disposed in a manner of having a color light-emitting sheet and a common electrode, and the liquid crystal is disposed between the thin film transistor substrate and the color filter substrate. The array detecting device is for detecting defects of the thin film transistor electrode formed on the thin film transistor substrate. In detail, a predetermined voltage is simultaneously supplied to one of the array detecting device and the thin film transistor electrode, and the modulation module is adjacent to the thin film transistor substrate, so the modulation module and the film An electric field can be formed between the transistor electrodes. At this time, if the thin film transistor electrode on the thin film transistor substrate is defective, the intensity of the electric field is higher than that of the case where there is no defect, and the electric field intensity is 201105988 f. According to this, the measured electric field strength can be used as a basis for whether or not the pole has defects. % (4) Electro-Electrical Body The conventional array detection device includes a probe assembly. Dimension = electrode on the board. When providing - drive signal to = object board, different: = τ cleaning 'other foreign objects may still be =:, and these foreign objects will lead to the credibility of each test and fine [invention] ?:Top: The object of the present invention is to provide an array detection device and a cleaning unit for forming an electrode on the substrate to detect a defect in the electrode. And the cleaning unit is disposed on one side of the probe assembly. According to a preferred embodiment of the present invention, the probe can include a probe rod including a probe pin to provide electrical connection to the needle holder and the probe rod, so that the probe rod and the substrate are aligned with each other. Move, the needle holder is connected to the cleaning unit. In accordance with a difficult embodiment of the present invention, the Ship County includes a plurality of detachable cleaning units. 201105988 In accordance with a preferred embodiment of the present invention, the cleaning unit operates along a long axis of the probe holder. According to a preferred embodiment of the invention, the cleaning unit includes a stripping unit for stripping foreign matter on the substrate. Meta-Foot Foot In accordance with a preferred embodiment of the present invention, the cleaning unit can include a suction unit to pick up foreign matter in the air on or around the surface of the substrate. In this embodiment, the suction unit comprises a plurality of needles extending toward the substrate and perpendicular to the substrate. According to a preferred embodiment of the invention, the cleaning unit comprises an ultrasonic unit for generating super-chopper. In the present embodiment, the cleaning unit may further include a cover disposed at the periphery of the ultrasonic unit to form a predetermined gap with the ultrasonic unit to allow gas to pass through the gap. In accordance with a preferred embodiment of the present invention, the cleaning unit includes a magnetic unit that removes metallic foreign matter in the air on or near the surface of the substrate. Accordingly, the cleaning unit having the probe assembly can effectively invade the foreign matter that is early in the case of the driving member. The removal of the ground may be additional during the testing process. The following will disclose the preferred embodiment of the present invention and the other features of the present invention, such that the present technology: - Embodiments of the first embodiment of the present invention [Embodiment] Hereinafter, a 卩 (4) detecting device having a π / t unit according to a preferred embodiment of the present invention will be described with reference to the related drawings, and the components of the same phase will be denoted by the same reference symbols. Explain. An array detecting device comprises a probe assembly and a cleaning unit. The probe assembly provides a battery to an electrode formed on a substrate to detect an electrode-defect, and the probe assembly includes a cleaning unit. The cleaning unit disposed in the probe assembly removes foreign matter on the substrate, thereby effectively removing minute foreign matter that may be generated when the substrate is transported or the probe assembly is driven. The following will be accompanied by the technical features of the attached graphic device. Description Array inspection with cleaning unit Figure 1, schematic view. For the array detecting device 1 according to the preferred embodiment of the present invention, and FIG. 2 is the side of the array detecting device 100 having the cleaning unit, please refer to FIG. 1 and FIG. 2, the '70 element, the unloading unit 80, and the source 30. Needle assembly 3〇〇. The array detection device 100 shown has an on-load, modulation module 20, detection unit 60, and a light! 〇 ^单姑元 7 〇 Load one of the bases to be tested (4) into the array detection straight 1〇〇. The base detection area is loaded by the loading unit 70. Each C light source has a 3° aperture 71. The second loading port 7 can have a loading plate and a plurality of substrates. The substrate is sprayed with high-pressure air to the bottom of the substrate 9〇, and the substrate is transported by the holding member: the air unloading unit 80 1 The array detecting device unloading unit 8G may have an "unloading plate" and a plurality of air holes 81. 201105988 The unloading unit 80 functions in the same manner as the loading unit 70, and will not be described again. The air hole 81 can eject high-pressure air to the bottom of the substrate 9, so that when the substrate 90 floats on the unloading plate by high-pressure air, the substrate 90 can be transported through a support member (not shown). The modulation module 20 is located above the substrate 90, and the distance between the two is very close. Each modulation module 20 can include an electrode layer and a photovoltaic layer. The electrode layer of each of the modulation modules 20 and the electrode layer 91 of the substrate 90 together form an electricity %′ and the electrode layers of each of the modulation modules 20 can be made of Indium Tin Oxide (ITO) or carbon nanotubes. (Carbon Nano Tubes, CNT) or other similar materials are formed. The photoelectric layer changes the amount of light passing through itself according to the intensity of an electric field, and the photovoltaic layer can be composed of liquid crystal (LC), inorganic electroluminescence (EL), and polymer dispersed liquid. For example, if a voltage is supplied to the electrode layer 91 of the substrate 9 and the electrode layer of the modulation module 20, the specific properties of the modulation module 2 may change due to defects of the substrate 90. When the electrode layer formed on the substrate to be inspected is not defective, an electric field may be formed in each of the modulation modules 2, and the molecules in the modulation group 20 are arranged in a specific direction so that the light passes through the tone. The module 20 is changed. Conversely, if the electrode layer formed on the substrate 9 is defective, the electric field cannot be formed in the modulation module 20, and the molecular arrangement of the modulation module 2 cannot be changed, resulting in light failure. The array detecting device 1 〇〇 further includes an optical chuck (not shown). The optical chuck is disposed under the substrate 9 待 to be detected, in other words, the substrate 9 〇 is disposed on the optical chuck The optical chuck 5 is formed of a light transmissive material, such as glass. In addition, the optical chuck 50 may have a plurality of pores, and the substrate 90 may be floated or adsorbed on the optical chuck 50. 60 is disposed on the upper side of each modulation module 20. The detecting unit 60 measures the change of the specific property of the modulation module 20, thereby detecting defects in the electrode layer of the substrate 90. For example, the detecting unit 6〇 The amount of light transmitted through the electrode layer can be measured according to the state of the electrode layer formed on the substrate 90, and the measurement data can be output to a signal processing unit for processing 'to detect whether there is a defect on the substrate 90. The light source 30 is relative to the tone The variable module 2 is disposed, and the substrate 9 is offset between the two. The light source 30 emits a light to illuminate the modulation module 2〇. The light emitted by the light source 30 sequentially passes through the optical chuck 5〇, the substrate After 9〇 and the modulation module 20, the detection unit 6 照射 is irradiated. The type of the light source 3 并无 is not limited, and may be, for example, a xenon lamp, a sodium lamp (s〇dium iamp), or a halogen lamp (crystal). Halogen lamp) and / or The probe unit 300 includes a probe rod 31 and a probe holder 32. The probe rod includes probe pins 312, and each probe pin 312 supplies a voltage to the electrodes formed on the substrate 90. The probe holder 32 is connected to the probe rod 31, so that the probe rod 31 can be moved in a direction relative to the substrate 9. In detail, the probe holder 320 includes a linear motor 32 along its X-axis direction. It is disposed and fixed to the probe holder 32. The linear motor 321 is coupled to the two-axis slide member 311, and the x-axis slide member m is slidable in the X-axis direction. The probe X #sliding member 311 is coupled to the god sliding member 315, and the needle bar 31 is coupled to the x-axis sliding member 315. Furthermore, the probe holder young 201105988 is connected to a Y-axis sliding member 330. The Y-axis sliding member 330 is coupled to a γ-axis guide rail 340 and is slidable in the γ-axis direction. Therefore, the probe holder 320 can be moved in the γ-axis direction with respect to the probe holder 320, and the probe lever 31 can be moved in the x, 丫, and z-axis directions with respect to the substrate 9 。. The probe pin 312 is movable over the substrate 90 in the X and γ axis directions, and is also movable in the Z axis direction to contact the electrodes of the substrate. In detail, the cleaning unit 200 can be coupled to the probe holder 32A. Accordingly, the cleaning unit 200 and the probe holder 32 can be driven together to remove foreign matter on the upper surface of the substrate 9A. Therefore, in the present embodiment, it is only necessary to provide a driving device for providing a driving power to the probe holder 320 to move the cleaning unit 200 without adding an additional driving device. Therefore, in the present embodiment, a certain number of cleaning units 200 can be attached to the probe holder 32 by detachable means. If the substrate size is large enough, the cleaning unit 200 can be arranged in a row at a predetermined pitch. Thus, the cleaning of the substrate 90 can be completely completed when the substrate 90 passes through the cleaning unit 2 . In addition, since the cleaning unit 200 can be removed from the probe holder 32, the replacement and maintenance of the cleaning unit 2 can be carried out simply and lightly. Further, the cleaning unit 2 has at least a certain degree of freedom with respect to the probe holder 32, so that the single cleaning unit 200 is disposed in such a manner as to be connected to the probe holder 320 and movable in the X-axis direction. Therefore, when the single cleaning unit 2 is moved along the probe holder 320 in the X-axis direction, the foreign matter on the upper surface of the substrate 90 can be effectively removed. In the present embodiment, the cleaning unit can pass through χ, γ, and z. Movement in the axial direction to remove foreign matter on the entire substrate 9. 201105988 When the field probe frame 320 moves over the substrate 9〇, the cleaning unit 200=cleans the foreign matter on the substrate 90. According to &, when performing substrate inspection, the /month cleaning unit 200 can 'repeat the substrate one repeatedly as each probe holder 32 〇 moves toward a pixel electrode or when the substrate 90 moves toward the probe rod 31 , The cleaning unit 2 can also clean the substrate 90 in a conventional manner. Accordingly, when the substrate 90 is transported and passed through the probe holder 32, the foreign matter on the surface above the substrate 9 can be effectively removed. In addition, the array detecting device 100 may further include a sensing unit. The sensing unit detects the foreign matter attached to the substrate 90. In this embodiment, when the sensing unit detects a foreign object, the cleaning unit 200 can start to operate. Further, the sensing unit can also be used to indicate the location of the foreign object. Fig. 3 is a view showing a detection error caused by foreign matter adhering to the substrate 9〇. Referring to FIG. 3, the substrate 90 is disposed immediately below the modulation module 20 and a plurality of electrodes 92, 93 and 94 are formed on the upper surface of the substrate 90. First, if the electrode 93 is a defective electrode and the remaining electrodes 92 and 94 are free from defects, in this case, the following will explain the integration of the defective electrode and then explain the influence of the foreign matter on the detection. The plurality of liquid crystal molecules 1, 2, and 3 are dispersed in the modulation module 2, and the transparent electrode 21 is disposed on one surface of the modulation module 20. When the voltage-to-voltage is applied to the transparent electrode 21 of the modulation module 20 and the electrodes 92, 93 and 94 of the substrate 90, an electric field 8 is formed between the modulation module 20 and the non-defective electrodes 92 and 94. Therefore, the arrangement of the liquid coring knives 1 and 3 around the electric field 8 changes, and the arrangement of the liquid crystal molecules 2 in a region where no electric field 11 201105988 is formed does not change. The light rays 5, 6 and 7 emitted from the light source 30 can pass through the arrangement to produce varying liquid crystal molecules 1 and 3, but cannot penetrate the liquid crystal molecules 2 whose arrangement is not changed. Accordingly, the defect of the electrode on the substrate 90 can be detected by measuring the amount of light passing through the light. In other words, since the light rays 5 and 7 partially emitted by the light source 30 can advance straight and penetrate the liquid crystal molecules 1 and 3, the other light rays 6 cannot smoothly penetrate the liquid crystal molecules 2, so that the electrode 93 can be detected as a defective electrode. However, if foreign matter 9 adheres to the substrate 90, the light 7 emitted from the light source 30 will be affected while being propagated, and scattering or refraction will occur. In the conventional array detecting device, it is possible to cause the error of judging the normal electrode 94 as a defective electrode due to the presence of such foreign matter. According to the array detecting device 100 of the present invention, the cleaning unit 200 removes foreign matter on the surface of the substrate 90, thereby reducing detection errors and improving detection reliability. 4 is a partial cross-sectional view of a stripping unit 180 in accordance with a preferred embodiment of the present invention. Referring to FIG. 4, the cleaning unit 200 may include a stripping unit 180 for stripping foreign matter on the substrate 90. The stripping unit 180 may be a gas injector that ejects gas toward the upper surface of the substrate 90 to separate foreign matter on the surface of the substrate 90. Figure 5 is a partial cross-sectional view of a cleaning unit 200 in accordance with a preferred embodiment of the present invention. Referring to Figure 5, the cleaning unit 200 can include a suction unit 170 for absorbing foreign matter or ambient air. Therefore, the foreign matter separated by the substrate 90 does not float in the air, but is completely removed to the array detecting device 12 201105988 100. Figure 6 is a partial cross-sectional view showing another aspect of the cleaning unit 200 shown in Figure 5, Figure 7 is a partial cross-sectional view of another aspect of the cleaning unit 2 shown in Figure 5, and Figure 8 is Figure 5 A partial cross-sectional view of yet another aspect of the cleaning unit 200 is shown. Referring to Figure 6, the stripping unit 180 and the suction unit 170 can be disposed adjacent to each other. Referring to FIG. 7 , or alternatively, two suction units 170 may be respectively disposed on both sides of the stripping unit 180 . Accordingly, the foreign matter adhering to the substrate 90 and the dust particles in the air can be thoroughly absorbed by the stripping unit 180 and the suction unit Π0 to maintain clean and clean working environment. In addition, as shown in FIG. 8, two stripping units 18A may be respectively disposed on both sides of the suction unit 170. Port 9 is a partial cross-sectional view of a blank, element 200 having stitches 171 in accordance with a preferred embodiment of the present invention. Referring to FIG. 9, the suction unit pi may include a plurality of pins 17 extending toward the upper surface of the substrate 9G perpendicular to the upper surface #乂 (Z-axis direction) of the substrate (10). The stitch 171 disposed on the pumping::170 can generate a straight air flow through the suction of a suction opening, and the horizontal foreign air and the vertical air flow can easily pass the foreign matter from the surface unit m of the substrate 90. . The upper removable and inhaled suction 90 is shown in the preferred embodiment of the present invention and is removed.
13 ί .S 201105988 潔單元200的部分剖面圖。請參考圖11所示，清潔單元 200可更包含罩體160。 罩體160圍繞超音波單元150設置，且與超音波單元 150間形成一預設間隙。罩體160之一側與一氣體喷射器 連接，而另一側則具有一喷射開口 161，以朝向基板90之 表面噴射氣體。 因此，附著於基板90之表面的異物主要是藉由超音 波單元150移除，其次才是藉由通過罩體160之開口 161 的高壓空氣移除。據此，可更有效地實施清潔作用。 圖12為圖10所示之清潔單元200之另一態樣的部分 剖面圖，而圖13為圖11所示之清潔單元200之另一態樣 的部分剖面圖。 請參考圖12所示，兩個超音波單元150可分別設置 於抽吸單元170之兩側。請參考圖13所示，兩個抽吸單 元170亦可分別設置於具有罩體160之超音波單元150的 兩側。 清潔單元200可更包含一靜電吸收元件（圖中未示）， 用以消除附著於基板90上之異物的靜電，藉此降低異物 的吸附力，使得清潔模組200可更易於抽吸異物。 圖14為依據本發明較佳實施例之具有磁性單元172 之清潔單元200的剖面圖。請參考圖14所示，清潔單元 200可更包含一磁性單元172。磁性單元172可為一永久 磁鐵或一電磁鐵。 請再參考圖3所示，金屬異物可能影響調變模組20 14 201105988 之透明電極21與電極92及94間的電場形成。因此，藉 由清潔單元200之磁性單元172移除金屬異物，以降低在 檢測過程中發生誤差的機率，且提高檢測可信度。 據此’在陣列檢測過程中，清潔單元可移除因運送基 板或操作探針組件時所產生之異物，進而減少檢測誤差並 提向檢測可信度。 再者’由於陣列檢測裝置中並不需要增設清潔單元， 可節省空間，即便是針對大型基板的檢測，亦不需要增設 其他的清潔單元驅動元件。 除此之外，自基板上分離的塵埃顆粒不會漂浮於基板 周圍’而將徹底地移除至陣列檢測襞置外。 以上所述僅為舉例性’而非為限制性者。任何未脫離 本發明之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 201105988 【圖式簡單說明】 圖1為依據本發明較佳實施例之陣列檢測裝置的示意 圖； 圖2為具有清潔單元之陣列檢測裝置的侧視圖； 圖3為因異物附著於基板而產生之檢測誤差的示意 圖， 圖4為依據本發明較佳實施例之剝除單元的部分剖面 圖， 圖5為依據本發明較佳實施例之清潔單元的部分剖面 圖， 圖6為圖5所示之清潔單元之另一態樣的部分剖面 圖， 圖7為圖5所示之清潔單元之又一態樣的部分剖面 圖， 圖8為圖5所示之清潔單元之又一態樣的部分剖面 圖， 圖9為依據本發明較佳實施例之具有針腳之清潔單元 的部分剖面圖； 圖10為依據本發明較佳實施例之超音波單元的部分 剖面圖； 圖11為依據本發明較佳實施例之具有罩體之清潔單 元的部分剖面圖； 圖12為圖10所示之清潔單元之另一態樣的部分剖面 圖， 16 201105988 圖13為圖11所示之清潔單元之另一態樣的部分剖面 圖；以及 圖14為依據本發明較佳實施例之具有磁性單元之清 潔單元的剖面圖。 【主要元件符號說明】 1、2、3 :液晶分子 1〇〇 :陣列檢測裝置 150 :超音波單元 160 :罩體 161 :開口 170 :抽吸單元 171 :針腳 172 :磁性單元 180 :剝除單元 20 :調變模組 200 :清潔單元 21 :透明電極 3 0 :光源 300 :探針組件 310 :探針桿 311、315、330 :滑動元件 312 :探針接腳 320 :探針架 17 20110598813 ί .S 201105988 Partial sectional view of the cleaning unit 200. Referring to FIG. 11, the cleaning unit 200 may further include a cover 160. The cover 160 is disposed around the ultrasonic unit 150 and forms a predetermined gap with the ultrasonic unit 150. One side of the cover 160 is connected to a gas injector, and the other side has an ejection opening 161 for ejecting gas toward the surface of the substrate 90. Therefore, the foreign matter attached to the surface of the substrate 90 is mainly removed by the ultrasonic unit 150, and secondarily by the high-pressure air passing through the opening 161 of the cover 160. According to this, the cleaning effect can be performed more effectively. Figure 12 is a partial cross-sectional view showing another aspect of the cleaning unit 200 shown in Figure 10, and Figure 13 is a partial cross-sectional view showing another aspect of the cleaning unit 200 shown in Figure 11. Referring to FIG. 12, two ultrasonic units 150 may be disposed on both sides of the suction unit 170, respectively. Referring to Figure 13, the two suction units 170 can also be disposed on both sides of the ultrasonic unit 150 having the cover 160, respectively. The cleaning unit 200 may further include an electrostatic absorbing member (not shown) for eliminating static electricity attached to the foreign matter on the substrate 90, thereby reducing the adsorption force of the foreign matter, so that the cleaning module 200 can more easily suck foreign matter. Figure 14 is a cross-sectional view of a cleaning unit 200 having a magnetic unit 172 in accordance with a preferred embodiment of the present invention. Referring to FIG. 14, the cleaning unit 200 may further include a magnetic unit 172. The magnetic unit 172 can be a permanent magnet or an electromagnet. Referring to FIG. 3 again, the metal foreign matter may affect the electric field between the transparent electrode 21 and the electrodes 92 and 94 of the modulation module 20 14 201105988. Therefore, the metal foreign matter is removed by the magnetic unit 172 of the cleaning unit 200 to reduce the probability of occurrence of an error in the detection process and to improve the detection reliability. According to this, in the array detecting process, the cleaning unit can remove foreign matter generated when the substrate is transported or the probe assembly is operated, thereby reducing the detection error and improving the reliability of the detection. Furthermore, since there is no need to add a cleaning unit in the array detecting device, space can be saved, and even for the detection of a large substrate, it is not necessary to add another cleaning unit driving element. In addition, dust particles separated from the substrate do not float around the substrate and will be completely removed outside the array detection device. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the present invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of an array detecting device according to a preferred embodiment of the present invention; FIG. 2 is a side view of an array detecting device having a cleaning unit; FIG. 3 is a view of detecting a foreign matter attached to a substrate. 4 is a partial cross-sectional view of a stripping unit in accordance with a preferred embodiment of the present invention, FIG. 5 is a partial cross-sectional view of the cleaning unit in accordance with a preferred embodiment of the present invention, and FIG. 6 is a cleaning view of FIG. FIG. 7 is a partial cross-sectional view showing another aspect of the cleaning unit shown in FIG. 5, and FIG. 8 is a partial cross-sectional view showing another aspect of the cleaning unit shown in FIG. 5. Figure 9 is a partial cross-sectional view of a cleaning unit having a stitch in accordance with a preferred embodiment of the present invention; Figure 10 is a partial cross-sectional view of an ultrasonic unit in accordance with a preferred embodiment of the present invention; and Figure 11 is a preferred embodiment of the present invention. 1 is a partial cross-sectional view of a cleaning unit having a cover; FIG. 12 is a partial cross-sectional view of another aspect of the cleaning unit shown in FIG. 10, 20110088. FIG. 13 is another aspect of the cleaning unit shown in FIG. A partial sectional view; and Figure 14 is a sectional view according to the preferred embodiment of the present invention having a cleaning means of the magnetic unit. [Description of main component symbols] 1, 2, 3: liquid crystal molecules 1 : array detecting device 150 : ultrasonic unit 160 : cover 161 : opening 170 : suction unit 171 : stitch 172 : magnetic unit 180 : stripping unit 20 : Modulation module 200 : cleaning unit 21 : transparent electrode 3 0 : light source 300 : probe assembly 310 : probe rod 311 , 315 , 330 : sliding element 312 : probe pin 320 : probe holder 17 201105988
321 :線性馬達 340 :導引轨道 5、6 ' 7 :光線 60 :偵測部 70 :裝載單元 7卜81 :氣孑L 8 ·電場 80 :卸載單元 9 :異物 92、93、94 :電極 95 :支持件 X、Y、Z :方向321 : Linear motor 340 : Guide rail 5 , 6 ' 7 : Light 60 : Detection portion 70 : Loading unit 7 卜 81 : Air 孑 L 8 · Electric field 80 : Unloading unit 9 : Foreign matter 92 , 93 , 94 : Electrode 95 : Support parts X, Y, Z: direction