KR20110013793A - Apparatus for array test with cleaner - Google Patents

Abstract

PURPOSE: An array test device including a cleaner is provided to reduce the error of the test and improve the reliability of the array test process by removing foreign substances which is generated when the substrate is transferred or probing assembly is driven through the cleaner. CONSTITUTION: A probing assembly(300) is composed of a probe bar(310) and a probe frame(320). The probe bar applies a voltage to the substrate electrode through a probe pin. The probe frame is connected to the probe bar. The probe bar is transferred in the one direction of the substrate. The probe frame is connected to the cleaner.

Description

Apparatus for array test with cleaner

This technology relates to an inspection apparatus for a display, and more particularly, to an array test apparatus for inspecting an electrical defect of an electrode formed on a display substrate.

Display panels include flat panel display devices such as LCDs, PDPs, and OLEDs. A general TFT (Thin Film Transister) LCD is composed of a TFT substrate, a color substrate on which color filters and a common electrode are formed to be disposed opposite to the TFT substrate, a liquid crystal formed between the TFT substrate and the color substrate, and a backlight unit.

In this case, the defect of the TFT electrode formed on the TFT substrate is inspected by an array tester.

In detail, in a state where a constant voltage is applied to the modulator and the TFT electrode installed in the array test apparatus, the modulator is brought close to the TFT substrate so that an electric field is generated therebetween. At this time, the case where there is a defect in the TFT electrode formed on the TFT substrate is smaller in size than the case where there is no defect. Therefore, it is possible to detect whether or not the TFT substrate is defective depending on the size of the detected electric field.

Conventional array test apparatus includes a probing assembly. Probing assembly is a means for applying a voltage to an electrode formed on a substrate. In order to perform some kind of functional test, a driving signal must be supplied to the substrate electrode. The probing assembly includes an electrical device for applying a drive voltage to the substrate and a mechanical device for moving or aligning the electrical device relative to the substrate.

However, the conventional array test apparatus has a problem in that foreign matter adheres to the surface of the substrate in the transfer or test process of the substrate. That is, the substrate loaded into the array test apparatus may be cleaned in a previous process, but there is a possibility that additional foreign matter may also be involved in the array test apparatus. Such foreign matters cause a decrease in the reliability of the test.

In order to solve such a conventional problem, by installing a cleaner in the probing assembly to remove the foreign matter adhering to the substrate surface, the foreign matter additionally generated in the test process is effectively removed without installing a separate cleaner driving means.

The present invention provides an array test apparatus including a probing assembly for applying a voltage to a substrate electrode to test a defect of an electrode formed on a substrate, and having a cleaner on one side of the probing assembly.

The probing assembly also includes a probe bar having a probe pin for applying a voltage to the substrate electrode, and a probe frame connected to the probe bar and driven to move in one direction with respect to the substrate and connected to a cleaner.

In this case, the cleaner may be provided with a plurality of detachable.

In addition, the cleaner may be driven longitudinally relative to the probe frame.

On the other hand, the cleaner may include a peeling unit for peeling off the foreign matter from the substrate.

In addition, the cleaner may include a suction unit that sucks in foreign matter or ambient atmosphere on the substrate surface.

In this case, the suction part may include a plurality of fins formed vertically toward the substrate.

On the other hand, the cleaner may include an ultrasonic head for generating ultrasonic waves.

In this case, the cleaner may further include a cover that forms a gap between the ultrasonic head so that air passes through the outer side of the ultrasonic head.

The cleaner may also include a magnetic force that attracts metal foreign matter from the substrate surface or the surrounding atmosphere.

In the array test process, additional debris that may occur during substrate transfer or driving of the probing assembly is removed by the cleaner, reducing errors in the test and improving reliability.

In addition, since no cleaner is separately installed in the array test apparatus, it is possible to perform cleaning of a large area substrate without requiring additional space for installing the cleaner and without driving means for driving the cleaner.

In addition, foreign matter separated from the substrate can be completely removed to the outside of the array test apparatus without floating in the atmosphere around the substrate.

The array test apparatus has a probing assembly. Probing assembly is a device that applies a voltage to a substrate electrode to test an array of electrodes formed on the substrate.

In particular, the probing assembly comprises a cleaner. The cleaner is installed in the probing assembly to remove debris attached to the substrate. Therefore, it is possible to efficiently remove the fine foreign matter that may occur during the transfer process of the substrate or the driving of the probing assembly.

Hereinafter, the technical configuration of an array test apparatus having a cleaner according to the accompanying drawings will be described in detail.

1 is a perspective view of an array test apparatus according to an embodiment, and FIG. 2 is a side view illustrating a state in which a cleaner according to an embodiment is installed.

As shown in FIGS. 1 and 2, the array test apparatus 100 includes a loading unit 70, an unloading unit 80, a modulator 20, a detection unit 60, a light source 30, And a probing assembly 300.

The loading unit 70 allows the substrate 90 to be tested to enter the array test apparatus 100. The substrate 90 introduced through the loading unit 70 is transferred to the upper portion of the light source 30 to be described later, which is tested. The loading unit 70 may include a loading plate and a plurality of air holes 71. The transfer of the substrate 90 is carried out by using the grip means 95 while injecting high pressure air from the air holes 71 on the lower surface of the substrate 90 to raise the substrate 90 from the loading plate. It may be achieved by a method such as.

The unloading unit 80 transfers the tested substrate 90 to be discharged to the outside of the array test apparatus 100. The unloading unit 80 may include an unloading plate and a plurality of air holes 81. The transfer of the substrate 90 is performed in the same manner as that of the loading unit 70. The substrate 90 is gripped in a state in which the substrate 90 is raised from the unloading plate by spraying high pressure air from the air holes 81 on the lower surface of the substrate 90. By means of conveying by means, or the like.

The modulator 20 is disposed above the substrate 90 and is located very close to the top surface of the substrate 90. The modulator 20 may include an electrode layer and an allergic material layer. The electrode layer of the modulator forms an electric field with the electrode layer of the substrate 90. Indium tin oxide (ITO) or carbon nano tube (CNT) material may be used. In addition, the all mineral layer of the modulator is to change the amount of light passing according to the intensity of the electric field, liquid crystal (LC), inorganic EL (electroluminescence), PDLC (Polymer Dispersed Liquid Crystal) may be used. .

For example, when a voltage is applied to the electrode layer of the substrate 90 and the electrode layer of the modulator 20, specific physical properties of the modulator 20 are changed according to whether the substrate 90 is defective. That is, in the modulator 20, when the electrode layer formed on the substrate 90 to be tested is normal, an electric field is formed therein, and the molecular array is arranged in a predetermined direction by the electric field so that light can pass therethrough. On the contrary, when the electrode layer formed on the substrate 90 is defective, light cannot pass through because no electric field is formed therein and the molecular arrangement is not changed.

The array test apparatus 100 may further include an optical chuck. The optical chuck is disposed below the substrate 90 to be tested and the substrate 90 rests on the optical chuck. The optical chuck is made of a light transmitting material such as glass that transmits light. The optical chuck may include a plurality of air holes that adsorb and float the substrate 90.

The detector 60 is disposed above the modulator 20. The detector 60 detects whether the electrode layer of the substrate 90 is defective by measuring the changed specific physical property of the modulator 20. For example, the detector 60 may detect the defect of the substrate 90 by capturing the amount of light transmitted according to whether the electrode layer formed on the substrate 90 is normal and determining the data through the signal processor.

The light source 30 is disposed on the side opposite to the modulator 20 with respect to the substrate 90. The light source 30 irradiates light toward the modulator 20. The light emitted from the light source 30 passes through the optical chuck, the substrate 90, and the modulator 20 in order to reach the detection unit 60. The light emitted from the light source 30 may be various kinds of light including xenon, sodium, quartz lamp, laser, and the like.

Meanwhile, the probing assembly 300 includes a probe bar 310 and a probe frame 320.

The probe bar 310 has a probe pin 312. The probe pin 312 applies a voltage to the electrode of the substrate 90. In addition, the probe frame 320 couples the probe bars 310, and the probe bars 310 are driven to move in at least one direction with respect to the substrate 90.

That is, the probe frame 320 includes a linear motor 321. The linear motor 321 is formed long in the X-axis direction and fixed to the probe frame 320. The X-axis slide member 311 is connected to the linear motor 321, and the X-axis slide member 311 is slidable in the X-axis direction with respect to the probe frame 320.

In addition, the Z-axis driving unit 315 is connected to the X-axis slide member 311, and the probe bar 310 is connected to the Z-axis driving unit 315. In addition, the probe frame 320 is coupled to the Y-axis slide member 330. The Y-axis slide member 330 is connected to the Y-axis guide rail 340 and slides in the Y-axis direction.

Accordingly, the probe frame 320 may be driven in the Y-axis direction with respect to the substrate 90, and the probe bar 310 may be driven in the X-axis, Y-axis, and Z-axis directions with respect to the substrate 90. The probe pin 312 formed on the probe bar 310 may contact the substrate 90 electrode while moving in the X-axis and Y-axis directions on the probe bar 310 and being elevated in the Z-axis direction.

In particular, the cleaner 200 is preferably connected to the probe frame 320. Therefore, the cleaner 200 may be interlocked with the probe frame 320 to remove the foreign matter attached to the upper surface of the substrate 90. As a result, the movement of the cleaner 200 uses the power of the driving device of the probe frame 320 without using the power of a separate driving device.

Therefore, additional foreign matter that may occur during the movement of the probe frame 320 may be removed by the cleaner 200.

Meanwhile, a plurality of cleaners 200 may be coupled to the probe frame 320 in a detachable manner. When the size of the substrate 90 is a large area, the cleaners 200 are preferably arranged in a line in a state spaced apart from each other at appropriate intervals. Therefore, the substrate 90 passing through the cleaner 200 may be cleaned without gaps. In addition, since the cleaner 200 is detachable from the probe frame 320, the cleaner 200 may be easily replaced and maintained.

In addition, the cleaner 200 may be driven with at least one degree of freedom with respect to the probe frame 320. That is, the cleaner 200 may be provided as a single piece and may be connected to the probe frame 320 so as to be movable in the X-axis direction. Therefore, one cleaner 200 may be moved along the probe frame 320 in the X-axis direction to efficiently remove foreign substances on the upper surface of the substrate 90. In this case, the cleaner 200 may be driven in the Y-axis and Z-axis directions as well as the X-axis with respect to the probe frame 320, and may remove foreign substances in the entire area of the substrate 90.

Meanwhile, the cleaner 200 may be implemented to operate when the probe frame 320 is driven on the substrate 90. Therefore, the substrate 90 may be repeatedly cleaned every time the probe frame 320 moved toward each pixel electrode during the test of the substrate 90.

In addition, the cleaner 200 may be implemented to operate periodically when the substrate 90 is transferred to the probe bar 310 side. Therefore, foreign matter on the upper surface of the substrate 90 passing through the probe frame 320 may be efficiently removed during the transfer of the substrate 90.

In addition, the array test apparatus 100 may include a sensing unit. The sensing unit detects a foreign matter attached to the substrate 90. In this case, the cleaner 200 may operate when the sensing unit detects a foreign substance. In addition, the sensing unit may be implemented to detect the position of the foreign matter.

On the other hand, Figure 3 shows that the error is caused by the foreign matter attached to the substrate.

Referring to FIG. 3, the substrate 90 is located adjacent to the bottom of the modulator 20. Electrodes 92, 93, 94 are formed on the upper surface of the substrate 90. In this case, it is assumed that one electrode 93 has a defect and the other electrodes 92 and 94 are normal. In the modulator 20, a plurality of liquid crystal molecules 1, 2, and 3 are dispersed, and a transparent electrode 21 is formed on one surface thereof.

When a voltage is applied to the transparent electrodes 21 of the modulator 20 and the electrodes 92, 93, 94 of the substrate 90, an electric field 8 is applied between the modulator 20 and normal electrodes 92, 94. ) Is formed. The arrangement of the liquid crystal molecules 1 and 3 at the portion where the electric field 8 is formed is changed, and the arrangement of the liquid crystal molecules 2 at the portion where the electric field is not formed is changed. The light 5, 6, 7 irradiated from the light source 30 can pass through the liquid crystal molecules 1 and 3 in which the arrangement is changed, and the liquid crystal molecules 2 in which the arrangement is not changed can not pass. . Therefore, the amount of light transmitted is measured to detect defects of the electrodes formed on the substrate.

That is, some of the light 5 and 7 irradiated from the light source 30 go straight to pass through the liquid crystal molecules 1 and 3, and the other light 6 does not pass through the liquid crystal molecules 2. Thus, it is possible to detect that the electrode 93 is defective.

However, when the foreign matter 9 is attached to the optical chuck 50, the light 7 irradiated from the light source 30 does not go straight but is refracted or scattered by the foreign matter 9. Thus, an error may be generated that determines that the electrode 94 that is normal is defective.

As a result, the cleaner 200 may remove the foreign matter 9 attached to the surface of the substrate 90, thereby reducing the error of the inspection and improving the reliability of the inspection.

4 is a partial sectional view of the cleaner which shows the peeling part. As shown in FIG. 4, the cleaner 200 may include a peeling unit 180. The peeling unit 180 functions to peel off foreign matter from the substrate 90. The peeling unit 180 may be an air injector that injects air toward the upper surface of the substrate 90. The air injector injects high pressure air to separate foreign matter attached to the surface of the substrate 90 from the surface of the substrate 90.

5 is a partial cross-sectional view of the cleaner showing the suction unit. As shown in FIG. 5, the cleaner 200 may include a suction unit 170. The suction unit 170 sucks a foreign substance on the surface of the substrate 90 or the surrounding atmosphere. Therefore, the foreign matter separated from the substrate 90 may be completely removed from the array test apparatus 100 without floating in the ambient atmosphere of the substrate 90.

6 is a partial cross-sectional view of the cleaner according to a modification of FIG. 5, FIG. 7 is a partial cross-sectional view of the cleaner according to another modification of FIG. 5, and FIG. 8 is a part of the cleaner according to another modification of FIG. 5. It is a cross section.

As illustrated in FIG. 6, the peeling unit 180 and the suction unit 170 may be arranged side by side with each other. In addition, as shown in FIG. 7, the suction parts 170 may be provided at both sides of one peeling part 180. Therefore, the foreign matter adhering to the substrate 90 and the foreign matter in the air can be adsorbed to maintain the clean state stably. In addition, as shown in FIG. 8, it is also possible to provide peeling units 180 on both sides of one suction unit 170.

9 is a partial sectional view of the cleaner provided with a pin. As shown in FIG. 9, the suction unit 170 may include a plurality of pins 171. The fin 171 is formed vertically (Z-axis direction) toward the substrate 90 on the upper surface of the suction unit 170. By installing the fins 171 in the suction unit 170, the flow in the vertical direction alternately occurs in the air flow sucked into the suction hole. Therefore, foreign matters around the substrate 90 are easily separated from the surface of the substrate 90 by the horizontal flow and the vertical flow.

10 is a partial cross-sectional view of the cleaner showing the ultrasonic head. As shown in FIG. 10, the cleaner 200 may include an ultrasonic head 150. The ultrasonic head 150 generates ultrasonic waves to separate foreign substances attached to the surface of the substrate 90 from the surface of the substrate 90 in an activated state.

11 is a partial cross-sectional view of a cleaner with a cover. As shown in FIG. 11, the cleaner 200 may further include a cover 160.

The cover 160 forms a predetermined gap between the ultrasonic head 150 and the outer surface of the ultrasonic head 150. One side of the cover 160 is connected to the air injector and the other side is formed with a jet port 161 to inject air toward the surface of the substrate (90). Air supplied from the air injector is injected to the surface of the substrate 90 through a gap formed between the ultrasonic head 150 and the cover 160.

Therefore, the foreign matter is first separated from the surface of the substrate 90 by the ultrasonic head 150, and the foreign matter is separated from the surface of the optical chuck 90 by the high pressure air injected from the injection hole 161 of the cover 160. Separation can be carried out on a secondary basis so that a more efficient cleaning operation can be performed.

12 is a partial cross-sectional view of the cleaner according to the modification of FIG. 10, and FIG. 13 is a partial cross-sectional view of the cleaner according to the modification of FIG. 11.

As shown in FIG. 12, the ultrasonic heads 150 may be provided at both sides of the suction unit 170. In addition, as shown in FIG. 13, it is also possible to provide suction portions 170 on both sides of the ultrasonic head 150 and the cover 160, respectively.

In addition, although not shown, the cleaner 200 may be provided with an electrostatic adsorption means. The electrostatic adsorption means desorbs foreign matter attached to the surface of the substrate 90 to attenuate the adsorption force. Therefore, the cleaner 200 may more easily carry out suction of the foreign matter.

14 is a partial sectional view of the cleaner provided with a magnetic force part. As shown in FIG. 14, the cleaner 200 may include a magnetic force part 172. The magnetic force portion 172 serves to attract metal foreign matter on the surface of the substrate 90 or in the surrounding atmosphere. The magnetic force unit 172 may be implemented as a permanent magnet, an electromagnet or the like.

Referring to FIG. 3, the metal foreign matter may prevent the electric field 8 from being formed between the transparent electrode 21 of the modulator 20 and the electrodes 92 and 94 of the substrate 90. As a result, the magnetic force unit 172 provided in the cleaner 200 removes the metal foreign matter, thereby reducing the error of the inspection and improve the reliability.

Up to now, the array test apparatus with cleaner has been described with reference to the embodiment shown in the drawings, but this is only illustrative, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope should be defined by the technical spirit of the appended claims.

1 is a perspective view of an array test apparatus according to an embodiment;

2 is a side view illustrating a state in which a cleaner according to the embodiment of FIG. 1 is installed;

Figure 3 shows that the error is caused by the foreign matter attached to the substrate,

4 is a partial cross-sectional view of the cleaner showing the peeling portion;

5 is a partial cross-sectional view of the cleaner showing the suction portion;

6 is a partial cross-sectional view of a cleaner according to a modification of FIG. 5,

7 is a partial cross-sectional view of a cleaner according to another modification of FIG. 5,

FIG. 8 is a partial cross-sectional view of a cleaner according to still another modification of FIG. 5;

9 is a partial cross-sectional view of a cleaner with a pin,

10 is a partial cross-sectional view of the cleaner showing the ultrasonic head,

11 is a partial cross-sectional view of a cleaner with a cover,

12 is a partial cross-sectional view of a cleaner according to a modification of FIG. 10,

FIG. 13 is a partial cross-sectional view of a cleaner according to a modification of FIG. 11;

14 is a partial cross-sectional view of a cleaner having a magnetic force portion.

<Description of the symbols for the main parts of the drawings>

20: modulator 30: light source

60: detection unit 70: loading unit

80: unloading unit 90: substrate

100: array test device 150: ultrasonic head

160: cover 170: suction

180: peeling unit 200: cleaner

Claims (10)

An array test apparatus comprising a probing assembly for applying a voltage to a substrate electrode to test a defect of an electrode formed on the substrate, Array test apparatus provided with a cleaner on one side of the probing assembly. The method of claim 1, The probing assembly is: A probe bar having a probe pin for applying a voltage to the substrate electrode; And Probe frame connected to the probe bar is driven to move in one direction with respect to the substrate bar; And the probe frame is connected to the cleaner. The method according to claim 1 or 2, Array cleaner device is provided with a plurality of the detachable. The method of claim 2, And the cleaner is driven in the longitudinal direction of the probe frame. The method according to claim 1 or 2, The cleaner is: An array test apparatus comprising a; peeling unit for peeling off foreign matter from the substrate. The method according to claim 1 or 2, The cleaner is: And an intake unit for sucking foreign substances or ambient air on the surface of the substrate. The method of claim 6, The suction unit: And a plurality of pins formed vertically toward the substrate. The method of claim 5, The cleaner is: And an ultrasonic head for generating ultrasonic waves. The method of claim 8, The cleaner is: And a cover for forming a gap between the ultrasonic head and air so that air passes out of the ultrasonic head. The method according to claim 1 or 2, The cleaner is: And a magnetic portion attracting metallic foreign substances on the surface of the substrate or the surrounding atmosphere.

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