CN110882966A - Device and method for cleaning excess on surface of high-density surface array welding column - Google Patents

Device and method for cleaning excess on surface of high-density surface array welding column Download PDF

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Publication number
CN110882966A
CN110882966A CN201910907599.XA CN201910907599A CN110882966A CN 110882966 A CN110882966 A CN 110882966A CN 201910907599 A CN201910907599 A CN 201910907599A CN 110882966 A CN110882966 A CN 110882966A
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China
Prior art keywords
cleaning
transmission table
brush
compressed air
screw shaft
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Application number
CN201910907599.XA
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Chinese (zh)
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CN110882966B (en
Inventor
吕晓瑞
林鹏荣
黄颖卓
黄莹
练滨浩
王勇
姚全斌
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Beijing Microelectronic Technology Institute
Mxtronics Corp
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Beijing Microelectronic Technology Institute
Mxtronics Corp
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Priority to CN201910907599.XA priority Critical patent/CN110882966B/en
Publication of CN110882966A publication Critical patent/CN110882966A/en
Application granted granted Critical
Publication of CN110882966B publication Critical patent/CN110882966B/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/10Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12Brushes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/30Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/30Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00Accessories or details of general applicability for machines or apparatus for cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02Cleaning by the force of jets, e.g. blowing-out cavities

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  • Cleaning In General (AREA)

Abstract

A device for cleaning the surface excess of a high-density surface array welding column comprises a compressed air cavity (1), a transmission table (2), a spiral shaft (4), a brush (5), a support rod (6), a spring (7) and a base (8); the compressed air cavity (1) is positioned above the transmission table (2), and the top of the compressed air cavity is provided with a valve (10) connected with a compressed air pipe; the transmission table (2) is provided with through holes corresponding to the four-corner support rods (6) and air holes (11) with the same positions as the array positions of the device welding columns, and the middle of each four air holes (11) is provided with a threaded hole (12); the screw shaft (4) is arranged in the threaded hole (12), and a brush (5) is arranged below the screw shaft (4); the transmission platform (2) is connected with a base (8) through support rods (6) at four corners, and springs (7) are sleeved on the support rods (6). The invention overcomes the problems of low efficiency and easy damage to welding columns in the manual cleaning of foreign matters on the surface of the existing high-density surface array welding spot.

Description

Device and method for cleaning excess on surface of high-density surface array welding column
Technical Field
The invention belongs to the field of machinery, and relates to a device and a method for cleaning excess.
Background
In order to ensure that the coplanarity of the solder columns of the high-density column grid array device is within a certain range, the end faces of the solder columns need to be leveled, and the leveling of the end faces of the solder columns is usually realized by adopting a mechanical polishing method. Foreign matters such as metal chips can remain on the end face and the side face of the welding column after leveling, can not be effectively removed by a conventional gas blowing method, and need to be cleaned by adopting modes such as brushing, stripping and the like. The traditional manual cleaning mode is extremely low in efficiency, and inevitably causes deformation damage to welding columns made of softer materials, so that the requirements of batch production and high-reliability processes cannot be met.
Disclosure of Invention
The invention aims to: the device and the method for cleaning the welding column surface excess can be compatible with devices with different thicknesses, sizes and materials, avoid secondary residue of foreign matters, improve the treatment efficiency of the foreign matters on the surface of the high-density column grid array welding column, realize a high-quality CCGA column planting packaging process, and obviously improve the quality of the welding spot of the column planting.
The above purpose of the invention is realized by the following technical scheme: a device for cleaning the surface excess of a high-density surface array welding column comprises a compressed air cavity, a transmission table, a spiral shaft, a brush, a support rod, a spring and a base; the compressed air cavity is positioned above the transmission table, and the top of the compressed air cavity is provided with a valve connected with a compressed air pipe; the transmission table is provided with through holes corresponding to the four-corner support rods and air holes with the same positions as the array positions of the device welding columns, and the middle position of every four air holes is provided with a threaded hole; the screw shaft is arranged in the threaded hole, and a brush is arranged below the screw shaft; the transmission platform is connected with the base through support rods at four corners, and springs are sleeved on the support rods.
The device for cleaning the surface redundancy of the high-density surface array welding column further comprises handles, and the handles are arranged on two sides of the transmission table.
The device for cleaning the surface redundancy of the high-density surface array welding column further comprises bolts, wherein four bolts capable of freely adjusting processes are arranged in the center of the periphery of a base, and the fixation of devices of different sizes is realized.
The compressed air chamber realizes leakproofness interconnection through welding mode and transmission platform, and the valve is opened when pushing down the transmission platform, and the compressed air chamber forms the malleation, and gas is used for the foreign matter jetting through the gas pocket blowout on the transmission platform.
The air holes are pneumatically formed into an air hole array, the distance P1 between every two adjacent air holes is 1.0mm or 1.27mm, and the diameter d1 of each air hole is 0.3 mm-0.6 mm.
The distance P2 between two adjacent threaded holes is 1.0mm or 1.27mm, and the diameter d2 of the threaded holes is 0.3 mm.
The screw thread arranged above the screw shaft is in transmission interconnection with the threaded hole of the transmission table, so that the up-and-down movement and the axial rotation can be realized; a hairbrush is fixed below the screw shaft in a clamping or bonding mode, and is made of an anti-static material and fixed on the screw shaft in a spiral mode; the length d4 of the outer diameter of the upper half section of the brush is 0.4 mm-0.5 mm, and the angle between the brush and the spiral shaft is 100-110 degrees; the outer diameter length d3 of the lower half section of the brush is 0.25 mm-0.30 mm, and the brush and the screw shaft are arranged alternately and crossly at 70-80 degrees and 100-110 degrees.
The inner diameter of the spring is 1 mm-2 mm larger than that of the support rod, the free length is 50 mm-100 mm, and the compression length is 10 mm-30 mm.
The diameter of the bolt is 3 mm-8 mm, the outer end of the bolt is provided with a frosted surface which is 20 mm-30 mm in length and convenient for manual rotation, and the diameter of the frosted part is 5 mm-10 mm.
The method for cleaning the excess on the surface of the high-density area array welding spot by using the device comprises the following steps:
firstly, placing a column grid array device to be subjected to weld column surface cleaning on a base;
fixing the device at one corner of the base by rotating the bolt;
step three, opening an air valve at the top of the compressed air cavity, and blowing foreign matters on the surface of the welding column for 3-5 seconds through an air hole in the transmission table;
and step four, pushing the transmission table up and down for 3-5 times, and repeating the action of the step (3) for 2-3 times.
Compared with the prior art, the invention has the following beneficial effects:
(1) the transmission table is provided with the brushes which are alternated with the welding column array and can simultaneously transmit up and down and axially rotate, so that foreign matters on the surface of the high-density column grid array welding column can be efficiently and effectively cleaned;
(2) according to the invention, the transmission table is provided with the compressed air cavity, and the transmission table connected with the compressed air cavity is provided with the air holes identical to the welding column array, so that the foreign matters on the surfaces of the welding columns can be brushed and blown simultaneously, the foreign matters can be cleaned in time, and the problem of secondary residue of the foreign matters is avoided;
(3) the springs are arranged on the four corner supporting rods of the transmission table, so that the brush can move up and down, the spiral shaft can axially rotate, and the combination of the springs and the spiral shaft can realize simultaneous vertical and horizontal sweeping of the brush, so that the foreign matter cleaning quality on the surface of a welding column can be obviously improved;
(4) the brush adopts the structural design that the upper section is longer, the lower section is shorter and the brush and the spiral shaft form a certain angle, so that the adhesive foreign matters on the end surface and the side surface of the welding column can be effectively removed; the brush at the bottom end of the screw shaft can effectively clean foreign matters, oxidation films and the like on the surfaces of the solder balls of the area array ball grid array device;
(5) the base is provided with the bolt capable of freely adjusting the process, so that the device with different sizes can be effectively fixed, and the device with different thicknesses, sizes and materials can be compatible;
(6) the method is suitable for cleaning foreign matters and removing oxide films on the surfaces of welding points of ball grid arrays and column grid array devices, and can effectively guarantee the welding quality of the welding points.
Drawings
FIG. 1 is a front view of a device for cleaning the excess on the surface of a solder column;
FIG. 2 is a top view of the drive table;
FIG. 3 is a view showing a structure of a brush;
FIG. 4 is a flowchart of a method for cleaning foreign matter on the surface of an area array solder column.
Detailed Description
The invention is described in further detail below with reference to the attached drawing figures:
the invention provides a device for cleaning the surface excess of a high-density surface array welding column, which is shown in figure 1 and comprises a compressed air cavity 1, a transmission table 2, a handle 3, a spiral shaft 4, a brush 5, a support rod 6, a spring 7, a base 8 and a bolt 9; the compressed air cavity 1 is positioned above the transmission table 2, and the top of the compressed air cavity is provided with an air valve opening which is connected with a compressed air pipe; the transmission table 2 comprises four through holes corresponding to the four-corner support rods 6 and air holes 11 identical to the device welding column array, and a threaded hole 12 is arranged in the middle of each four air holes 11; the screw shaft 4 is fixed through a threaded hole 12 on the transmission table 2, a thread corresponding to the threaded hole of the transmission table 2 is arranged above the screw shaft 4, and a circle of brush 5 is fixed below the screw shaft 4; the transmission table 2 is connected with a base 8 through support rods 6 at four corners, and springs 7 are sleeved on the support rods 6; four screw holes with bolts 9 are arranged at the center of the periphery of the base 8. Handles 3 are arranged on two sides of the transmission platform 2.
As shown in figure 1, the compressed air cavity 1 is connected with the transmission platform 2 in a sealing mode through welding, a valve 10 is arranged above the compressed air cavity 1 and connected with a compressed air pipe, the valve 10 is opened when the transmission platform 2 is pushed downwards, the compressed air cavity forms positive pressure, and air is ejected through an air hole 11 in the transmission platform 2 and used for blowing foreign matters.
As shown in fig. 2, the transmission table 2 is provided with air holes 11 identical to the device solder column array to form an air hole array, and a threaded hole 12 is arranged in the middle of every four air holes 11; the pitch P1 of the air holes 11 is 1.0mm or 1.27mm, the diameter d1 is 0.3 mm-0.6 mm, the pitch P2 of the threaded holes 12 is 1.0mm or 1.27mm, and the diameter d2 is 0.3 mm.
As shown in fig. 1, the screw thread arranged above the screw shaft 4 is in transmission interconnection with the screw thread hole of the transmission table 2, so that up-and-down movement and axial rotation can be realized; a circle of brushes are fixed below the screw shaft 4 in a clamping or bonding mode, and the arrangement mode of the brushes is a spiral mode.
As shown in fig. 3, the brush 5 is made of an antistatic material and is fixed on the screw shaft 4 in a spiral manner; the length d4 of the outer diameter of the brush of the upper half H2 is 0.4 mm-0.5 mm, and the brush 5 and the spiral shaft 4 form an angle of 100-110 degrees; the outer diameter length d3 of the brush of the lower half section H3 is 0.25 mm-0.30 mm, and the brushes 5 and the screw shaft 4 are alternately arranged in a crossed way at 70-80 degrees and 100-110 degrees.
As shown in figure 1, the transmission platform 2 is connected with the base 8 through the four-corner supporting rods 6, the transmission platform 2 is in contact interconnection with the supporting rods 6 through a hole shaft assembly mode, the base 8 is fixed with the supporting rods 6 through welding, casting and other modes, and the supporting rods 6 are sleeved with springs 7.
As shown in figure 1, the spring 7 is sleeved on the support rod 6, the inner diameter of the spring 7 is 1 mm-2 mm larger than that of the support rod 6, the free length is 50 mm-100 mm, and the compression length is 10 mm-30 mm.
As shown in figure 1, four screw holes with bolts 9 are arranged at the center of the periphery of a base 8, the diameter of each bolt 9 is 3-8 mm, the outer end of each bolt 9 is provided with a frosting surface which is 20-30 mm in length and convenient to rotate manually, and the diameter of the frosting part is 5-10 mm.
The transmission table 2 is provided with the brush 5 which is alternated with the welding column array and can simultaneously transmit up and down and axially rotate, so that foreign matters on the surface of the high-density column grid array welding column can be efficiently and effectively cleaned;
according to the invention, the transmission table 2 is provided with the compressed air cavity 1, and the transmission table 2 connected with the compressed air cavity 1 is provided with the air holes 11 which are the same as the welding column array, so that the foreign matters on the surfaces of the welding columns can be brushed and blown at the same time, the foreign matters can be cleaned in time, and the problem of secondary residue of the foreign matters is avoided;
the springs 7 are arranged on the four corner support rods 6 of the transmission table 1, so that the brush can move up and down, the spiral shaft can axially rotate, the brush can be simultaneously brushed up and down and horizontally by combining the four corner support rods and the spiral shaft, and the foreign matter cleaning quality on the surface of a welding column can be obviously improved;
the brush 5 adopts the structural design that the upper section is longer, the lower section is shorter, and the brush 5 and the screw shaft 4 form a certain angle, so that the adhesive foreign matters on the end surface and the side surface of the welding column can be effectively removed; the brush at the bottom end of the screw shaft 4 can effectively clean foreign matters, oxidation films and the like on the surfaces of the solder balls of the area array ball grid array device;
the base 8 of the invention is provided with the bolt 9 which can freely adjust the process, thus realizing the effective fixation of devices with different sizes and being compatible with devices with different thicknesses, sizes and materials;
the method is suitable for cleaning foreign matters and removing oxide films on the surfaces of welding points of ball grid arrays and column grid array devices, and can effectively guarantee the welding quality of the welding points.
The invention provides a method for cleaning foreign matters on the surface of an area array welding column according to the device, as shown in figure 4, the method comprises the following steps:
placing a device: placing a column grid array device to be subjected to weld column surface cleaning on a base 8;
fixing the device: aiming at different device size specifications, the device is fixed at one corner of the base by rotating a bolt 9;
foreign matter blowing: opening an air valve 10 at the top of the compressed air cavity 1, inflating high pressure in the compressed air cavity 1, and blowing foreign matters on the surface of the welding column for 3-5 s through an air hole 11 on the transmission table 2;
surface cleaning: the screw shaft is rotated 3-5 times while the transmission table 2 is pushed up and down, foreign matter injection is carried out for 3-5 s, and the actions are repeated for 2-3 times.
The above description is only for the best mode of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.
Those skilled in the art will appreciate that the details of the invention not described in detail in this specification are well within the skill of those in the art.

Claims (10)

1. A device for cleaning the surface excess of a high-density surface array welding column is characterized by comprising a compressed air cavity (1), a transmission table (2), a spiral shaft (4), a brush (5), a support rod (6), a spring (7) and a base (8); the compressed air cavity (1) is positioned above the transmission table (2), and the top of the compressed air cavity is provided with a valve (10) connected with a compressed air pipe; the transmission table (2) is provided with through holes corresponding to the four-corner support rods (6) and air holes (11) with the same positions as the array positions of the device welding columns, and the middle of each four air holes (11) is provided with a threaded hole (12); the screw shaft (4) is arranged in the threaded hole (12), and a brush (5) is arranged below the screw shaft (4); the transmission platform (2) is connected with a base (8) through support rods (6) at four corners, and springs (7) are sleeved on the support rods (6).
2. The device for cleaning the surface residues of the high-density area array welding column according to claim 1, characterized by further comprising handles (3), wherein the handles (3) are arranged on two sides of the transmission table (2).
3. The device for cleaning the surface residues of the high-density area array welding columns according to claim 2, characterized by further comprising bolts (9), wherein four bolts (9) capable of freely adjusting the process are arranged at the center of the periphery of the base (8), so that the fixation of devices with different sizes is realized.
4. The device for cleaning the surplus residues on the surfaces of the high-density area array welding columns according to claim 3, characterized in that a compressed air cavity (1) is hermetically connected with the transmission table (2) in a welding mode, a valve (10) is opened when the transmission table (2) is pushed downwards, the compressed air cavity forms positive pressure, and gas is ejected through an air hole (11) in the transmission table (2) for foreign matter blowing.
5. The device for cleaning the surface residues of the high-density area array welding column according to claim 4, wherein a plurality of pneumatics (11) form an air hole array, the distance P1 between two adjacent air holes (11) is 1.0mm or 1.27mm, and the diameter d1 of each air hole (11) is 0.3mm to 0.6 mm.
6. The device for cleaning the surface residues of the high-density area array welding column according to claim 5, wherein the pitch P2 between two adjacent threaded holes (12) is 1.0mm or 1.27mm, and the diameter d2 of the threaded holes (12) is 0.3 mm.
7. The device for cleaning the surface residues of the high-density surface array welding column according to claim 6, wherein threads are arranged above the screw shaft (4) to realize transmission interconnection with a threaded hole of the transmission table (2), so that up-and-down movement and axial rotation can be realized; a brush (5) is fixed below the screw shaft (4) in a clamping or bonding mode, and the brush (5) is made of an antistatic material and is fixed on the screw shaft (4) in a screw mode; the length d4 of the outer diameter of the upper half section of the brush is 0.4 mm-0.5 mm, and the brush (5) and the screw shaft (4) form an angle of 100-110 degrees; the outer diameter length d3 of the lower half section of the brush is 0.25 mm-0.30 mm, and the brush (5) and the screw shaft (4) are arranged alternately and crossly at 70-80 degrees and 100-110 degrees.
8. The device for cleaning the surface residues of the high-density surface array welding column according to claim 7, wherein the inner diameter of the spring (7) is 1-2 mm larger than that of the support rod (6), the free length is 50-100 mm, and the compression length is 10-30 mm.
9. The device for cleaning the surplus materials on the surface of the high-density surface array welding column according to claim 8, wherein the diameter of the bolt (9) is 3 mm-8 mm, the outer end of the bolt (9) is provided with a frosted surface which is 20 mm-30 mm in length and convenient to rotate manually, and the diameter of the frosted part is 5 mm-10 mm.
10. The method for cleaning the surface redundancy of the high-density area array welding spots by using the device according to any one of claims 1 to 9, which is characterized by comprising the following steps:
firstly, placing a column grid array device to be subjected to weld column surface cleaning on a base (8);
secondly, fixing the device at one corner of the base (8) by rotating the bolt (9);
step three, opening an air valve (10) at the top of the compressed air cavity (1), and blowing foreign matters on the surface of the welding column for 3-5 s through an air hole (11) in the transmission table (2);
and step four, pushing the transmission table (2) up and down for 3-5 times, and repeating the action of the step (3) for 2-3 times.
CN201910907599.XA 2019-09-24 2019-09-24 Device and method for cleaning excess on surface of high-density surface array welding column Active CN110882966B (en)

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Application Number Priority Date Filing Date Title
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CN110882966A true CN110882966A (en) 2020-03-17
CN110882966B CN110882966B (en) 2021-06-08

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020102767A1 (en) * 2001-01-31 2002-08-01 Sturcken Keith K. Ball grid array (BGA) to column grid array (CGA) conversion process
CN1700953A (en) * 2003-05-27 2005-11-23 松下电工株式会社 Plasma processing apparatus, method for producing reaction vessel for plasma generation, and plasma processing method
JP2007142314A (en) * 2005-11-22 2007-06-07 Mitsubishi Electric Corp Pretreatment device for solder joint, pretreatment method and electronic component mounting device using the pretreatment method, and electronic component
JP2008227053A (en) * 2007-03-12 2008-09-25 Mitsubishi Electric Corp Oxide film removal device, oxide film removing component housing tray, and oxide film removing method
KR20110013793A (en) * 2009-08-03 2011-02-10 주식회사 탑 엔지니어링 Apparatus for array test with cleaner
CN103721976A (en) * 2013-12-27 2014-04-16 昆山迈致治具科技有限公司 PCB (printed circuit board) positioning and blowing jig
CN204544895U (en) * 2014-10-31 2015-08-12 西南大学 A kind of floating seedling tray reciprocating vibrating type cleaning equipment
CN208555290U (en) * 2018-05-24 2019-03-01 长沙有德医药科技有限公司 A kind of clinical drug trial ultrasonic cleaning instrument
CN209006238U (en) * 2018-08-02 2019-06-21 江苏长电科技股份有限公司 A kind of cleaning device of thickness steel mesh

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020102767A1 (en) * 2001-01-31 2002-08-01 Sturcken Keith K. Ball grid array (BGA) to column grid array (CGA) conversion process
CN1700953A (en) * 2003-05-27 2005-11-23 松下电工株式会社 Plasma processing apparatus, method for producing reaction vessel for plasma generation, and plasma processing method
JP2007142314A (en) * 2005-11-22 2007-06-07 Mitsubishi Electric Corp Pretreatment device for solder joint, pretreatment method and electronic component mounting device using the pretreatment method, and electronic component
JP2008227053A (en) * 2007-03-12 2008-09-25 Mitsubishi Electric Corp Oxide film removal device, oxide film removing component housing tray, and oxide film removing method
KR20110013793A (en) * 2009-08-03 2011-02-10 주식회사 탑 엔지니어링 Apparatus for array test with cleaner
CN103721976A (en) * 2013-12-27 2014-04-16 昆山迈致治具科技有限公司 PCB (printed circuit board) positioning and blowing jig
CN204544895U (en) * 2014-10-31 2015-08-12 西南大学 A kind of floating seedling tray reciprocating vibrating type cleaning equipment
CN208555290U (en) * 2018-05-24 2019-03-01 长沙有德医药科技有限公司 A kind of clinical drug trial ultrasonic cleaning instrument
CN209006238U (en) * 2018-08-02 2019-06-21 江苏长电科技股份有限公司 A kind of cleaning device of thickness steel mesh

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