CN117697553B - Wafer processing device for chip manufacturing - Google Patents
Wafer processing device for chip manufacturing Download PDFInfo
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- CN117697553B CN117697553B CN202410161965.2A CN202410161965A CN117697553B CN 117697553 B CN117697553 B CN 117697553B CN 202410161965 A CN202410161965 A CN 202410161965A CN 117697553 B CN117697553 B CN 117697553B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 238000004140 cleaning Methods 0.000 claims abstract description 39
- 230000007246 mechanism Effects 0.000 claims abstract description 38
- 238000005498 polishing Methods 0.000 claims abstract description 35
- 238000001179 sorption measurement Methods 0.000 claims abstract description 18
- 238000000605 extraction Methods 0.000 claims abstract description 11
- 238000005192 partition Methods 0.000 claims description 23
- 238000007789 sealing Methods 0.000 claims description 8
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 7
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- 241001330002 Bambuseae Species 0.000 claims description 7
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 7
- 239000011425 bamboo Substances 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 244000309464 bull Species 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 54
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The invention discloses a wafer processing device for chip manufacturing, which comprises a bottom plate, wherein the bottom plate is symmetrically arranged, L-shaped plates are symmetrically arranged on the bottom plate, a vacuum adsorption fixing mechanism is arranged between the two bottom plates, an adjustable polishing mechanism is arranged on the bottom plate, a reciprocating type pressurizing and cleaning mechanism is arranged above the vacuum adsorption fixing mechanism, the vacuum adsorption fixing mechanism comprises a vacuum latch device and a vacuum extraction device, the vacuum latch device is arranged on the vacuum extraction device, the reciprocating type pressurizing and cleaning mechanism comprises a pressurizing and reciprocating control device and a reciprocating type cleaning device, and the reciprocating type cleaning device is arranged on the pressurizing and reciprocating control device; the invention belongs to the technical field of semiconductor processing, and solves the problems that in the prior art, when a wafer is fixed before polishing, the wafer is easy to be stressed and damaged, and the wafer is cleaned independently after polishing, so that the workload of the wafer processing operation is increased, and the production efficiency is reduced.
Description
Technical Field
The invention belongs to the technical field of semiconductor processing, and particularly relates to a wafer processing device for chip manufacturing.
Background
Thinning the back of a wafer is a common semiconductor processing technique used for reducing the thickness of the wafer; this process is typically performed during the manufacture of the wafer, primarily for the purpose of reducing material costs, improving the mechanical strength of the wafer, and reducing the impact on electrical performance; before thinning the back of the wafer, the wafer is usually placed on a platform for clamping and fixing and then polished, but the wafer is easily broken under stress in the clamping process due to the influence of the hardness of the material of the wafer, so that a large amount of waste is caused; the wafer is required to be cleaned on the surface after polishing, and the two steps are separated, so that the workload of wafer processing operation is increased, and the production efficiency is reduced; therefore, there is a need for a wafer processing apparatus that can simultaneously perform polishing and cleaning operations without damaging the wafer when the wafer is fixed.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the wafer processing device for chip manufacture, which solves the problems that the wafer is easy to be stressed and damaged when the wafer is fixed before polishing in the prior art, and the wafer is cleaned independently after polishing, so that the workload of the wafer processing operation is increased and the production efficiency is reduced.
The technical scheme adopted by the invention is as follows: the invention provides a wafer processing device for chip manufacturing, which comprises a bottom plate, wherein the bottom plate is symmetrically arranged, L-shaped plates are symmetrically arranged on the bottom plate, a vacuum adsorption fixing mechanism is arranged between the two bottom plates, an adjustable polishing mechanism is arranged on the bottom plate, a reciprocating type pressurizing and cleaning mechanism is arranged above the vacuum adsorption fixing mechanism, the vacuum adsorption fixing mechanism comprises a vacuum latch device and a vacuum extraction device, the vacuum latch device is arranged on the vacuum extraction device, the reciprocating type pressurizing and cleaning mechanism comprises a pressurizing and reciprocating control device and a reciprocating type cleaning device, and the reciprocating type cleaning device is arranged on the pressurizing and reciprocating control device.
Further, the vacuum latch device comprises a cylinder, a first spring, a second spring, a first control ball, a second control ball, a first clamping ring, a second clamping ring, a first round cover and a placing plate, wherein the first cylindrical cavity is arranged at the bottom of the cylinder, the second cylindrical cavity is arranged at the top of the cylinder and is arranged in a circular array, the first cross cavity is arranged at the center of the top of the cylinder, the first round cover is arranged above the first cross cavity, the first round cover is provided with an exhaust hole, the second cylindrical cavity is internally provided with the placing plate, the placing plate is provided with an arc-shaped opening, the first cross cavity is arranged between the first cylindrical cavity and the second cylindrical cavity, the first clamping ring is arranged in the first cross cavity, the first spring is arranged on the first clamping ring, the second clamping ring is arranged in the second cross cavity, the second spring is arranged on the second clamping ring, and the second control ball is arranged on the second spring.
Further, the vacuum extraction device comprises a circular ring, a piston, a connecting column, a sliding column, an elliptical groove, a rotating plate, a rectangular cylinder, a fixed plate and a motor I, wherein the circular ring is arranged at the bottom of the cylinder, the rectangular cylinder is arranged at the bottom of the circular ring, the motor I is arranged on the inner wall of the rectangular cylinder, the fixed plate is arranged in the rectangular cylinder, the piston is arranged in the circular ring, the connecting column penetrates through the fixed plate to be fixedly arranged at the bottom of the piston, the elliptical groove is arranged at the bottom of the connecting column, the rotating plate is arranged on a transmission shaft of the motor I, the sliding column is arranged in the elliptical groove, and the sliding column is connected with the rotating plate.
Further, the pressurizing reciprocating control device comprises a hollow column, an L-shaped pipe, a sealing cover, a motor II, a pressurizing plate, a clamping block, a screw rod I, a baffle II, a cylindrical gear I, a bevel gear II, a supporting plate, a rotating shaft, a fixed block, a round cover II, a rotating wheel, a T-shaped plate, a limiting plate, a sliding rod and a spring III.
Further, reciprocating type belt cleaning device includes column pipe, circular plate, column gear two, hexagon piece, dwang, convex piece, V-arrangement board, solid fixed ring, shower nozzle, hose, hollow section of thick bamboo and ring channel, the circular plate runs through hollow column bottom and hollow column block rotation and is connected, the array is equipped with the rectangular channel on the circular plate, column pipe runs through baffle one, baffle two and hollow column, column pipe and hollow column block rotation are connected, column gear two locates on the column pipe, column gear two and meshing of column gear one, the hexagon piece is located on the column pipe, the hexagon piece links to each other with the T-shaped board, the hollow section of thick bamboo is located column pipe bottom, the symmetry is equipped with the notch on the hollow section of thick bamboo, hollow section of thick bamboo bottom array is equipped with the hole for water spraying, the ring channel is located on the hollow section of thick bamboo, rectangular channel and hollow section of thick bamboo block rotation are connected, the convex piece bottom is located to the convex piece on the circular plate, gu fixed ring locates on the V-arrangement board, locate between hexagon piece and the convex piece, link to each other with the shower nozzle and hose.
Further, the adjustable polishing mechanism comprises a U-shaped block, a rectangular block, a screw rod II, a knob, a moving plate, a motor III, a belt clamping ring I, a belt clamping ring II, a transmission belt, a polishing disc and a rotating rod column, wherein the U-shaped block is arranged on a bottom plate, sliding grooves are symmetrically formed in the U-shaped block, the rectangular block is arranged on the U-shaped block, the screw rod II penetrates through the U-shaped block and is rotationally connected with the rectangular block in a clamping manner, the moving plate is arranged on the screw rod II, the motor III penetrates through the moving plate and is fixedly connected with the moving plate, the belt clamping ring I is arranged at the transmission end of the motor III, the rotating rod column penetrates through the moving plate and is rotationally connected with the moving plate in a clamping manner, the belt clamping ring II is arranged at the top of the rotating rod column, and the polishing disc is arranged at the bottom of the rotating rod column, and the transmission belt is arranged on the belt clamping ring I and the belt clamping ring II.
Further, the first round cover is connected with the bottom of the first screw rod, and supporting legs are symmetrically arranged at the bottom of the bottom plate.
Further, the width of the sliding groove is the same as the width of the moving plate.
The beneficial effects obtained by the invention by adopting the structure are as follows:
(1) The vacuum adsorption fixing mechanism can effectively avoid wafer damage caused in the fixing process by carrying out vacuum adsorption fixing on the wafer; the motor drives the sliding column to slide in the elliptical groove in a reciprocating manner, so that the piston is driven to reciprocate, when the piston moves downwards, the second control ball is forced to move downwards to extract gas below the wafer, when the piston moves upwards, the first control ball is forced to move upwards to enable the extracted gas to be discharged out of the first cross cavity, the vacuum state is formed below the wafer, and adsorption fixation is realized;
(2) The reciprocating type pressurizing cleaning mechanism can carry out covering type cleaning on the surface of the wafer during polishing, so that the wafer does not need to be cleaned independently after polishing, and the production efficiency is improved; the pressurizing plate is driven to move downwards through the rotation of the first screw rod, so that the interior of the hollow column is pressurized, and the cleaning effect of the cleaning solution is enhanced; meanwhile, the second round cover rotates to drive the T-shaped plate to reciprocate up and down, and the T-shaped plate drives the hexagonal block to reciprocate up and down, so that the V-shaped plate drives the spray head to reciprocate, and the cover type cleaning of the cleaning solution on the surface of the wafer is realized;
(3) The adjustable polishing mechanism can adjust the height of the polishing disc by rotating the knob, thereby realizing the control of the polishing thickness of the wafer and being very convenient; the knob is rotated to drive the second screw rod to rotate, and the second screw rod drives the moving plate to move up and down, so that the polishing disc can be driven to move up and down, and the polishing thickness of the wafer is controlled;
(4) The first round cover is arranged above the first cross cavity, so that the influence of air flow on the stability of the reciprocating type cleaning device can be avoided, and air flow can be blown to the surface of a polished wafer through the air exhaust hole to clean particles generated during polishing of the surface of the wafer.
Drawings
Fig. 1 is a perspective view of a wafer processing apparatus for chip manufacturing according to the present invention;
fig. 2 is a cross-sectional view of a wafer processing apparatus for chip manufacturing according to the present invention;
fig. 3 is a perspective view of a vacuum adsorption fixing mechanism of a wafer processing apparatus for chip manufacturing according to the present invention;
fig. 4 is a perspective view showing a vacuum adsorption fixing mechanism of a wafer processing apparatus for chip manufacturing according to the present invention;
FIG. 5 is a perspective view of a reciprocating pressurized cleaning mechanism of a wafer processing apparatus for chip fabrication according to the present invention;
FIG. 6 is a cross-sectional view of a reciprocating pressurized cleaning mechanism of a wafer processing apparatus for chip fabrication in accordance with the present invention;
FIG. 7 is a schematic diagram showing the internal structure of a reciprocating pressurized cleaning mechanism of a wafer processing apparatus for chip manufacturing according to the present invention;
fig. 8 is a perspective view showing a reciprocating type cleaning device of a wafer processing device for chip manufacturing according to the present invention;
fig. 9 is a perspective view of an adjustable polishing mechanism of a wafer processing apparatus for chip manufacturing according to the present invention.
Wherein 1, a bottom plate, 2, an L-shaped plate, 3, a vacuum adsorption fixing mechanism, 4, an adjustable polishing mechanism, 5, a reciprocating pressurizing cleaning mechanism, 6, a vacuum latch device, 7, a vacuum extraction device, 8, a pressurizing reciprocating control device, 9, a reciprocating cleaning device, 10, a cylinder, 11, a first spring, 12, a second spring, 13, a first control ball, 14, a second control ball, 15, a first clamping ring, 16, a second clamping ring, 17, a first round cover, 18, a placing plate, 19, a first columnar cavity, 20, a second columnar cavity, 21, a first cross cavity, 22, an exhaust hole, 23, an arc opening, 24, a second cross cavity, 25, a circular ring, 26, a piston, 27, a connecting column, 28, a sliding column, 29, an elliptic groove, 30, a rotating plate, 31, a rectangular cylinder, 32, a fixed plate, 33, a first motor, 34, a hollow column, 35, an L-shaped pipe, 36 and a sealing cover, 37, motor II, 38, pressurizing plate 39, fixture block, 40, screw II, 41, partition II, 42, partition II, 43, cylindrical gear I, 44, bevel gear I, 45, bevel gear II, 46, support plate, 47, rotation shaft 48, fixed block, 49, round cover II, 50, rotation wheel, 51, T-shaped plate, 52, stopper plate, 53, slide bar, 54, spring III, 55, slide groove, 56, cylindrical tube, 57, round plate, 58, cylindrical gear II, 59, hexagonal block, 60, rotation bar, 61, convex block, 62, V-shaped plate, 63, fixed ring, 64, shower nozzle, 65, hose, 66, hollow cylinder, 67, annular groove, 68, rectangular groove, 69, notch, 70, water jet hole, 71, U-shaped block, 72, rectangular block, 73, screw II, 74, knob, 75, moving plate 76, motor III, 77, belt clasp I, 78, belt clasp II, 79, drive belt, 80. grinding disc 81, rotating rod column 82, sliding groove 83 and supporting leg.
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention; all other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate orientation or positional relationships based on those shown in the drawings, merely to facilitate description of the invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
As shown in fig. 1 and 2, the invention provides a wafer processing device for chip manufacturing, which comprises a bottom plate 1, wherein the bottom plate 1 is symmetrically arranged, the bottom plate 1 is symmetrically provided with an L-shaped plate 2, the bottom of the bottom plate 1 is symmetrically provided with supporting legs 83, a vacuum adsorption fixing mechanism 3 is arranged between the two bottom plates 1, an adjustable polishing mechanism 4 is arranged on the bottom plate 1, a reciprocating type pressurizing and cleaning mechanism 5 is arranged above the vacuum adsorption fixing mechanism 3, the vacuum adsorption fixing mechanism 3 comprises a vacuum latch device 6 and a vacuum extraction device 7, the vacuum latch device 6 is arranged on the vacuum extraction device 7, the reciprocating type pressurizing and cleaning mechanism 5 comprises a pressurizing reciprocating control device 8 and a reciprocating type cleaning device 9, and the reciprocating type cleaning device 9 is arranged on the pressurizing reciprocating control device 8.
As shown in fig. 1, fig. 2, fig. 3 and fig. 4, the vacuum latch device 6 comprises a cylinder 10, a first spring 11, a second spring 12, a first control ball 13, a second control ball 14, a first clamp ring 15, a second clamp ring 16, a first round cover 17 and a placement plate 18, a first cylindrical cavity 19 is arranged at the bottom of the cylinder 10, a second cylindrical cavity 20 is arranged at the top of the cylinder 10, the second cylindrical cavity 20 is arranged in a circular array, a first cross cavity 21 is arranged at the center of the top of the cylinder 10, a first round cover 17 is arranged above the first cross cavity 21, an exhaust hole 22 is arranged in the first round cover 17 in an array, a placement plate 18 is arranged in the second cylindrical cavity 20, an arc-shaped opening 23 is arranged in the placement plate 18 in an array, a second cross cavity 24 is arranged between the first cylindrical cavity 19 and the second cylindrical cavity 20, the first clamp ring 15 is arranged in the first cross cavity 21, the first spring 11 is arranged on the first clamp ring 15, the first control ball 13 is arranged on the first clamp ring 11, the second clamp ring 16 is arranged in the second cross cavity 24, an exhaust hole 22 is arranged in the second cross cavity 12 is arranged in the center of the second cross cavity 16, an exhaust hole 22 is arranged on the second spring 12, the second control ball 16 is arranged on the second round cover 12, and is connected with the first control ball 14.
As shown in fig. 1, 2, 3 and 4, the vacuum pumping device 7 includes a ring 25, a piston 26, a connecting column 27, a sliding column 28, an oval groove 29, a rotating plate 30, a rectangular cylinder 31, a fixed plate 32 and a motor one 33, wherein the ring 25 is arranged at the bottom of the cylinder 10, the rectangular cylinder 31 is arranged at the bottom of the ring 25, the motor one 33 is arranged on the inner wall of the rectangular cylinder 31, the fixed plate 32 is arranged in the rectangular cylinder 31, the piston 26 is arranged in the ring 25, the connecting column 27 penetrates through the fixed plate 32 to be fixedly arranged at the bottom of the piston 26, the oval groove 29 is arranged at the bottom of the connecting column 27, the rotating plate 30 is arranged on a transmission shaft of the motor one 33, the sliding column 28 is arranged in the oval groove 29, and the sliding column 28 is connected with the rotating plate 30.
As shown in fig. 1, fig. 2, fig. 5, fig. 6 and fig. 7, the pressurizing reciprocation control device 8 comprises a hollow column 34, an L-shaped pipe 35, a sealing cover 36, a motor II 37, a pressurizing plate 38, a clamping block 39, a screw rod I40, a partition plate I41, a partition plate II 42, a cylindrical gear I43, a bevel gear I44, a bevel gear II 45, a supporting plate 46, a rotating shaft 47, a fixing block 48, a circular cover II 49, a rotating wheel 50, a T-shaped plate 51, a limiting plate 52, a slide rod 53 and a spring III 54, wherein the hollow column 34 is arranged on the L-shaped pipe 2, the L-shaped pipe 35 is arranged on the hollow column 34, the sealing cover 36 is arranged on the L-shaped pipe 35, the inner wall of the hollow column 34 is symmetrically provided with a sliding groove 55, the partition plate I41 and the partition II 42 are arranged in the hollow column 34, the motor II 37 is arranged at the top of the hollow column 34, the screw rod I40 penetrates through the hollow column 34 and is connected with the driving end of the motor II 37, the pressurizing plate 38 is arranged on the screw rod I40, the clamping block 48 is symmetrically arranged on the pressurizing plate 38, the circular cover II is arranged on the rotating shaft I43, the first partition plate 41 is arranged between the partition plate I42 and the partition plate II 42, the slide rod I45 is arranged on the partition plate 53, the first partition plate 45 is arranged on the rotating shaft 45, the circular cover 45 is arranged on the rotating shaft II 45, the circular cover 45 is arranged on the bottom of the partition plate 53, the circular cover 45 is arranged on the partition plate 53, the hollow plate 45 is arranged on the partition plate 53, and the partition plate 45 is arranged on the bottom of the partition plate 45, and is arranged on the partition plate 53.
As shown in fig. 1, fig. 2, fig. 6, fig. 7, fig. 8, the reciprocating washer 9 includes a cylindrical tube 56, a circular plate 57, a cylindrical gear two 58, a hexagonal block 59, a rotating rod 60, a convex block 61, a V-shaped plate 62, a fixed ring 63, a spray head 64, a hose 65, a hollow cylinder 66 and an annular groove 67, the circular plate 57 penetrates through the bottom of the hollow cylinder 34 and is rotationally connected with the hollow cylinder 34, a rectangular groove 68 is arranged on the circular plate 57 in an array manner, the cylindrical tube 56 penetrates through the first baffle 41, the second baffle 42 and the hollow cylinder 34, the cylindrical tube 56 is rotationally connected with the hollow cylinder 34, the cylindrical gear two 58 is arranged on the cylindrical tube 56, the cylindrical gear two 58 is meshed with the cylindrical gear one 43, the hexagonal block 59 is arranged on the cylindrical tube 56, the hexagonal block 59 is connected with the T-shaped plate 51, the hollow cylinder 66 is arranged on the bottom of the cylindrical tube 56, a notch 69 is symmetrically arranged on the hollow cylinder 66, a hole 70 is arranged on the bottom array of the hollow cylinder 66, the 67 is arranged on the hollow cylinder 66, the rectangular groove 68 is rotationally connected with the hollow cylinder 66, the hollow cylinder 68 penetrates through the first baffle 41, the second baffle 42 and the hollow cylinder 34, the cylindrical tube 34 is rotationally connected with the annular groove 67 is arranged in the annular groove 64, the annular groove 67 is connected with the cylindrical block 64, and is arranged in the annular groove 64, and is connected with the annular groove 67, and is connected with the cylindrical block 64, and is connected with the cylindrical groove, and the cylindrical head 66, and is connected.
As shown in fig. 1, fig. 2 and fig. 9, the adjustable polishing mechanism 4 includes a U-shaped block 71, a rectangular block 72, a second screw rod 73, a knob 74, a moving plate 75, a third motor 76, a first belt clamping ring 77, a second belt clamping ring 78, a driving belt 79, a polishing disc 80 and a rotating rod column 81, wherein the U-shaped block 71 is arranged on the bottom plate 1, sliding grooves 82 are symmetrically formed in the U-shaped block 71, the rectangular block 72 is arranged on the U-shaped block 71, the second screw rod 73 penetrates through the U-shaped block 71 and is rotationally connected with the rectangular block 72 in a clamping manner, the moving plate 75 is arranged on the second screw rod 73, the third motor 76 penetrates through the moving plate 75 and is fixedly connected with the moving plate 75, the first belt clamping ring 77 is arranged at the driving end of the third motor 76, the rotating rod column 81 penetrates through the moving plate 75 and is rotationally connected with the moving plate 75 in a clamping manner, the second belt clamping ring 78 is arranged at the top of the rotating rod column 81, the polishing disc 80 is arranged at the bottom of the rotating rod column 81, the driving belt 79 is arranged on the first belt clamping ring 77 and the second belt clamping ring 78, and the width of the sliding grooves 82 is identical to the width of the moving plate 75.
When the wafer storage device is specifically used, firstly, wafers with the same thickness are placed on a placement plate 18, then, a first motor 33 is started, the first motor 33 drives a rotating plate 30 to rotate, the rotating plate 30 drives a sliding column 28 to slide in an elliptical groove 29, meanwhile, the elliptical groove 29 is driven to reciprocate up and down, the elliptical groove 29 drives a connecting column 27 and a piston 26 to reciprocate up and down, when the piston 26 moves downwards, a second control ball 14 is forced to move downwards, a second spring 12 is compressed, a first control ball 13 is limited by a first cross cavity 21 and is static, and therefore gas below the wafers is pumped into a first columnar cavity 19 from a second columnar cavity 20; when the piston 26 moves upwards, the first control ball 13 is forced to move upwards, the first spring 11 stretches, the second control ball 14 is limited by the second cross cavity 24 and is static, so that the extracted gas is discharged from the first cross cavity 21 and the first round cover 17, a vacuum state is gradually formed below the wafer, and the wafer is adsorbed and fixed; then, the height of the polishing disc 80 is adjusted, the knob 74 is rotated, the knob 74 drives the screw rod II 73 to rotate, the screw rod II 73 drives the moving plate 75 to move downwards in the sliding groove 82, the moving plate 75 drives the polishing disc 80 to move downwards until the polishing disc 80 is attached to the surface of the wafer, and if the polishing disc 80 needs to move upwards, the knob 74 only needs to be rotated reversely; opening the sealing cover 36, adding a cleaning solution into the hollow column 34 through the L-shaped pipe 35, starting a polishing operation after the addition, simultaneously starting a motor II 37 and a motor III 76, driving a screw rod I40 to rotate by the motor II 37, driving a cylindrical gear I43, a bevel gear I44, the sealing cover 36I and a cylinder 10 to rotate by the screw rod I40, simultaneously driving a pressurizing plate 38 and a clamping block 39 to move downwards, pressurizing the cleaning solution, driving a plurality of wafers to be polished by the cylinder 10 to rotate, driving a belt clamping ring I77 by the motor III 76, driving a belt clamping ring II 78 to rotate by the belt clamping ring I77, driving a rotating column and a polishing disc 80 to rotate by the belt clamping ring I78, polishing the surfaces of each wafer, driving a cylindrical gear II 58 to rotate by the cylindrical gear II 58, driving a cylindrical pipe 56 to rotate by the cylindrical pipe 66, ejecting the cleaning solution from a water spraying hole 70, cleaning the center of the wafer to be polished by the bevel gear I44, driving the bevel gear II 45 to rotate by the rotating shaft 47, driving the bevel gear II 49 to rotate by the bevel gear II 49, driving a 50 to rotate on the inner wall of the wafer to be polished, driving a T-shaped block 51 to reciprocate by the bevel gear II 49, and driving a square-shaped rotating block 61 to reciprocate by the T-shaped block 51 to reciprocate, and a cylindrical plate 61 to perform a cleaning operation, and a cleaning operation by a reciprocating ring is realized by a reciprocating ring, and a reciprocating ring-shaped plate 61 is driven by a reciprocating plate 61 to reciprocate and a cleaning plate 61 to move; at the same time, the gas exhausted from the first dome 17 is blown to the surface of the polished wafer through the exhaust hole 22, and particles generated during polishing of the wafer surface are cleaned.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
The invention and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the invention as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the present invention.
Claims (6)
1. Wafer processingequipment for chip manufacturing, including bottom plate (1), its characterized in that: the base plate (1) is symmetrically arranged, L-shaped plates (2) are symmetrically arranged on the base plate (1), vacuum adsorption fixing mechanisms (3) are arranged between the base plate (1), an adjustable polishing mechanism (4) is arranged on the base plate (1), a reciprocating type pressurizing cleaning mechanism (5) is arranged above the vacuum adsorption fixing mechanism (3), the vacuum adsorption fixing mechanism (3) comprises a vacuum latch device (6) and a vacuum extraction device (7), the vacuum latch device (6) is arranged on the vacuum extraction device (7), the reciprocating type pressurizing cleaning mechanism (5) comprises a pressurizing reciprocating control device (8) and a reciprocating type cleaning device (9), the reciprocating type cleaning device (9) is arranged on the pressurizing reciprocating control device (8), the vacuum latch device (6) comprises a cylinder (10), a first spring (11), a second spring (12), a first control ball (13), a second control ball (14), a first clamp ring (15), a second clamp ring (16), a cylindrical cover (17) and a placing plate (18), a first cylindrical cavity (19) is arranged at the bottom of the cylinder (10), a second cylindrical cavity (20) is arranged at the top of the cylinder, a second cylindrical cavity (20), the cylinder (10) top center is equipped with cross cavity one (21), cross cavity one (21) top is equipped with dome one (17), array is equipped with exhaust hole (22) on dome one (17), be equipped with in column cavity two (20) and place board (18), place on board (18) array and be equipped with arc opening (23), be equipped with cross cavity two (24) between column cavity one (19) and column cavity two (20), snap ring one (15) is located in cross cavity one (21), snap ring one (11) are located on snap ring one (15), control ball one (13) are located on spring one (11), snap ring two (16) are located in cross cavity two (24), spring two (12) are located on snap ring two (16), control ball two (14) are located on spring two (12), vacuum extraction device (7) are including ring (25), piston (26), spliced pole (27), slide motor (28), elliptic motor (29), a rectangle barrel (31) are located in the bottom of cylinder (25), a rectangle barrel (31) are located in the cylinder one (25) bottom (31), the motor I (33) is arranged on the inner wall of the rectangular cylinder (31), the fixing plate (32) is arranged in the rectangular cylinder (31), the piston (26) is arranged in the circular ring (25), the connecting column (27) penetrates through the fixing plate (32) to be fixedly arranged at the bottom of the piston (26), the oval groove (29) is arranged at the bottom of the connecting column (27), the rotating plate (30) is arranged on the transmission shaft of the motor I (33), the sliding column (28) is arranged in the oval groove (29), and the sliding column (28) is connected with the rotating plate (30).
2. The wafer processing apparatus for chip manufacturing according to claim 1, wherein: the pressurizing reciprocating control device (8) comprises a hollow column (34), an L-shaped pipe (35), a sealing cover (36), a motor II (37), a pressurizing plate (38), a clamping block (39), a screw rod I (40), a partition board I (41), a partition board II (42), a cylindrical gear I (43), a bevel gear I (44), a bevel gear II (45), a supporting plate (46), a rotating shaft (47), a fixed block (48), a round cover II (49), a rotating wheel (50), a T-shaped plate (51), a limiting plate (52), a sliding rod (53) and a spring III (54), wherein the hollow column (34) is arranged on the L-shaped pipe (2), the L-shaped pipe (35) is arranged on the hollow column (34), the sealing cover (36) is arranged on the L-shaped pipe (35), sliding grooves (55) are symmetrically arranged on the inner wall of the hollow column (34), the partition board I (41) and the partition board II (42) are arranged in the hollow column (34), the motor II (37) is arranged at the top of the hollow column (34), the screw rod I (40) penetrates through the hollow column (34) and is connected with the driving end of the motor II (37), the screw rod I (38) is symmetrically arranged on the pressurizing plate (38), the cylinder (10) gear is arranged between the first baffle (41) and the second baffle (42), the first cylindrical gear (43) is arranged on the first screw rod (40), the first bevel gear (44) is arranged on the first screw rod (40), the supporting plate (46) is arranged at the bottom of the second baffle (42), the second bevel gear (45) is arranged on the supporting plate (46), the second bevel gear (45) is meshed with the first bevel gear (44), the fixed block (48) is arranged at the bottom of the second baffle (42), the rotating shaft (47) penetrates through the fixed block (48) to be arranged on the second bevel gear (45), the second circular cover (49) is arranged on the rotating shaft (47), the sliding rod (53) is arranged at the bottom of the second baffle (42), the limiting plate (52) is arranged at the bottom of the sliding rod (53), the T-shaped plate (51) is arranged on the sliding rod (53), the third spring (54) is arranged on the sliding rod (53), and the rotating wheel (50) is arranged in the second circular cover (49) to be connected with the T-shaped plate (51).
3. The wafer processing apparatus for chip manufacturing according to claim 2, wherein: the reciprocating type cleaning device (9) comprises a cylindrical pipe (56), a circular plate (57), a cylindrical gear II (58), a hexagonal block (59), a rotating rod (60), a convex block (61), a V-shaped plate (62), a fixed ring (63), a spray head (64), a hose (65), a hollow cylinder (66) and an annular groove (67), wherein the circular plate (57) penetrates through the bottom of the hollow column (34) to be rotationally connected with the hollow column (34), a rectangular groove (68) is arranged on the circular plate (57) in an array manner, the cylindrical pipe (56) penetrates through a first partition plate (41), a second partition plate (42) and the hollow column (34), the cylindrical pipe (56) is rotationally connected with the hollow column (34), the cylindrical gear II (58) is arranged on the cylindrical pipe (56), the cylindrical gear II (58) is meshed with the cylindrical gear I (43), the hexagonal block (59) is arranged on the cylindrical pipe (56), the hexagonal block (59) is connected with the T-shaped plate (51), the hollow cylinder (66) is arranged on the bottom of the cylindrical pipe (56), the hollow cylinder (66) is provided with a symmetrical notch (69), the hollow cylinder (66) is arranged on the bottom of the hollow cylinder (66) and is provided with an annular groove (70), rectangular groove (68) and hollow section of thick bamboo (66) block rotate and are connected, in rectangular groove (68) are located to convex piece (61), between hexagonal piece (59) and convex piece (61) are located to dwang (60), convex piece (61) bottom is located to V-arrangement board (62), on V-arrangement board (62) are located to solid fixed ring (63), in solid fixed ring (63) are located to shower nozzle (64), between ring channel (67) and shower nozzle (64) are located to hose (65), hose (65) link to each other with ring channel (67) and shower nozzle (64).
4. A wafer processing apparatus for chip manufacturing according to claim 3, wherein: grinding machanism (4) are including U-shaped piece (71), rectangle piece (72), lead screw two (73), knob (74), movable plate (75), motor three (76), belt snap ring one (77), belt snap ring two (78), drive belt (79), polishing dish (80) and bull stick post (81), on bottom plate (1) are located to U-shaped piece (71), the symmetry is equipped with sliding groove (82) on U-shaped piece (71), on U-shaped piece (71) are located to rectangle piece (72), lead screw two (73) run through U-shaped piece (71) and rectangle piece (72) block rotation and are connected, on lead screw two (73) are located to movable plate (75), motor three (76) run through movable plate (75) and movable plate (75) fixed connection, belt snap ring one (77) are located the driving end of motor three (76), bull stick post (81) run through movable plate (75) and movable plate (75) block rotation and are connected, belt snap ring two (78) are located top (81), belt snap ring two (80) and belt snap ring two (81) are located on the bottom plate (81).
5. The wafer processing apparatus for chip manufacturing according to claim 4, wherein: the first round cover (17) is connected with the bottom of the first screw rod (40), and supporting legs (83) are symmetrically arranged at the bottom of the bottom plate (1).
6. The wafer processing apparatus for chip manufacturing according to claim 5, wherein: the width of the sliding groove (82) is the same as the width of the moving plate (75).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410161965.2A CN117697553B (en) | 2024-02-05 | 2024-02-05 | Wafer processing device for chip manufacturing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410161965.2A CN117697553B (en) | 2024-02-05 | 2024-02-05 | Wafer processing device for chip manufacturing |
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| CN117697553A CN117697553A (en) | 2024-03-15 |
| CN117697553B true CN117697553B (en) | 2024-04-16 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10284448A (en) * | 1997-04-04 | 1998-10-23 | Disco Abrasive Syst Ltd | Polishing system for semiconductor wafer |
| CN113732851A (en) * | 2021-11-05 | 2021-12-03 | 四川明泰微电子有限公司 | Device for polishing back of semiconductor wafer |
| CN114012526A (en) * | 2021-09-23 | 2022-02-08 | 张永田 | Wafer semiconductor polishing device and using method thereof |
| CN114211329A (en) * | 2021-12-10 | 2022-03-22 | 浙江芯晖装备技术有限公司 | Be applied to two-sided attenuate equipment of hard and brittle sheet material |
| CN114800200A (en) * | 2022-03-16 | 2022-07-29 | 太原市致科胜工业设计有限公司 | Semiconductor silicon crystal column surrounding type cleaning equipment |
| CN116748998A (en) * | 2023-07-21 | 2023-09-15 | 苏州博宏源机械制造有限公司 | Multi-station edge polishing device for wafer |
| CN117444779A (en) * | 2023-12-22 | 2024-01-26 | 江苏中泓光电科技有限公司 | Grinding device for building glass processing |
-
2024
- 2024-02-05 CN CN202410161965.2A patent/CN117697553B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10284448A (en) * | 1997-04-04 | 1998-10-23 | Disco Abrasive Syst Ltd | Polishing system for semiconductor wafer |
| CN114012526A (en) * | 2021-09-23 | 2022-02-08 | 张永田 | Wafer semiconductor polishing device and using method thereof |
| CN113732851A (en) * | 2021-11-05 | 2021-12-03 | 四川明泰微电子有限公司 | Device for polishing back of semiconductor wafer |
| CN114211329A (en) * | 2021-12-10 | 2022-03-22 | 浙江芯晖装备技术有限公司 | Be applied to two-sided attenuate equipment of hard and brittle sheet material |
| CN114800200A (en) * | 2022-03-16 | 2022-07-29 | 太原市致科胜工业设计有限公司 | Semiconductor silicon crystal column surrounding type cleaning equipment |
| CN116748998A (en) * | 2023-07-21 | 2023-09-15 | 苏州博宏源机械制造有限公司 | Multi-station edge polishing device for wafer |
| CN117444779A (en) * | 2023-12-22 | 2024-01-26 | 江苏中泓光电科技有限公司 | Grinding device for building glass processing |
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| CN117697553A (en) | 2024-03-15 |
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