KR101009584B1 - Apparatus of cleaning a wafer - Google Patents

Apparatus of cleaning a wafer Download PDF

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Publication number
KR101009584B1
KR101009584B1 KR1020100111714A KR20100111714A KR101009584B1 KR 101009584 B1 KR101009584 B1 KR 101009584B1 KR 1020100111714 A KR1020100111714 A KR 1020100111714A KR 20100111714 A KR20100111714 A KR 20100111714A KR 101009584 B1 KR101009584 B1 KR 101009584B1
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South Korea
Prior art keywords
cleaning
cleaning tank
geared motor
high pressure
rotation
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KR1020100111714A
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Korean (ko)
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김명학
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주식회사 에이에스이
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE: A wafer cleaning device is provided to easily remove a foreign material which is attached to a wafer by spraying high pressure water and cleaning it. CONSTITUTION: A drainpipe is formed in the lower side of a cleaning bath(12). An overflow pipe(14) is formed in the side of the cleaning bath. A ball bearing(23) is connected to a different side. An ultrasonic generator(40) is installed in both walls in the longitudinal direction of the cleaning bath.

Description

웨이퍼 세정장치 {Apparatus of Cleaning a Wafer}Wafer cleaner {Apparatus of Cleaning a Wafer}

본 발명은 웨이퍼 세정장치에 관한 것으로, 더욱 상세히 설명하면, 복수매의 웨이퍼가 수납된 바스켓 지그를 세정조에 내부에 설치된 회동거치대에 수장한 다음 좌·우로 번갈아 가며 45°각도로 회동시킴과 동시에 고압분사관으로 고압수를 분사한 후에 세정조에 세정수를 채우고 하우징 내부에 설치된 승강발생부를 통해 바스켓 지그가 내재된 회동거치대를 승강시킴과 동시에 세정조 양측 벽면에 설치된 초음파 발생부를 통해 초음파 세정을 실시함으로써 이물질을 신속하고 깨끗하게 제거할 수 있도록 한 웨이퍼 세정장치에 관한 것이다.
The present invention relates to a wafer cleaning apparatus, and in more detail, a basket jig containing a plurality of wafers is stored in a rotation base installed inside a cleaning tank, and then rotated left and right alternately at a 45 ° angle and at a high pressure. After the high pressure water is injected into the injection pipe, the cleaning tank is filled with the cleaning water, and the lifting platform installed inside the housing is moved up and down to lift the pivoting base in which the basket jig is embedded, and ultrasonic cleaning is performed through the ultrasonic generators installed on both sides of the cleaning tank. The present invention relates to a wafer cleaning apparatus capable of quickly and cleanly removing foreign substances.

일반적으로 웨이퍼 제조공정 중 웨이퍼에 부착되어 있는 이물질을 제거하기 위한 세정공정에서 사용되는 세정장치는 세정액이 채워진 세정조에 바스켓 지그 수납한 복수매의 웨이퍼를 상기 세정부로 로봇 등의 이송장치를 통해 이송한 후, 로봇 암 등이 바스켓 지그에 수납한 복수매의 웨이퍼를 세정조에 침지시켜 이물질을 제거하는 베스식 액체세정이 주를 이루고 있다.
In general, the cleaning apparatus used in the cleaning process for removing foreign matter adhering to the wafer during the wafer manufacturing process transfers a plurality of wafers in which a basket jig is stored in the cleaning tank filled with the cleaning liquid to the cleaning unit through a transfer device such as a robot. After that, a bath-type liquid cleaning is performed in which a plurality of wafers stored in a basket jig by a robot arm or the like is immersed in a cleaning tank to remove foreign substances.

이러한 종래의 베스식 세정장치는 단순히 웨이퍼를 세정조에 일정시간 담궈 놓으면 세정액에 의해 이물질이 제거되도록 하는 형태가 대부분을 차지하고, 이보다 좀더 계량된 방법으로는 세정액에 압축공기를 가하여 세정조에 내부에 발생된 기포를 통해 이물질을 제거하거나, 초음파 장치를 별도로 설치하여 초음파에 의해 이물질을 제거하도록 구성되었다.
In the conventional bath cleaning apparatus, when the wafer is simply immersed in the cleaning tank for a predetermined time, most of the forms are used to remove foreign substances by the cleaning liquid.In a more metered method, compressed air is applied to the cleaning liquid to generate the inside of the cleaning tank. It is configured to remove the foreign matter through the bubble, or to install a separate ultrasonic device to remove the foreign matter by ultrasonic.

상기와 같은 종래의 베스식 세정장치를 통해 세정된 웨이퍼에는 어느 정도의 세정력은 기대할 수 있으나, 비교적 강하게 부착되어 있는 이물질은 제거되지 않아 결과적으로 제품의 불량으로 이어지는 문제점이 있었다.
A certain amount of cleaning power can be expected in the wafer cleaned through the conventional bath type cleaning apparatus as described above, but foreign matters that are relatively strongly adhered are not removed, resulting in a product defect.

이에 본 발명은 상기와 같은 문제점은 감안하여 발명된 것으로, 웨이퍼가 복수매 수납된 바스켓 지그를 이송 로봇을 이용하여 이송한 후, 세정조에 내부에 설치된 회동거치대에 바스켓 지그를 수장한 다음 좌·우로 번갈아 가며 45°각도로 회동시킴과 동시에 고압수를 분사하여 세정함으로써 웨이퍼에 강하게 부착되어 있는 이물질을 쉽게 제거할 수 있도록 함을 목적으로 한다.Therefore, the present invention was invented in view of the above problems, and after transferring a basket jig containing a plurality of wafers by using a transfer robot, the basket jig is stored in a rotation base installed inside the cleaning tank and then left and right. It rotates at an angle of 45 ° alternately and at the same time sprays high-pressure water to clean it so that it is easy to remove foreign matters that are strongly attached to the wafer.

또한, 고압샤워 후에 세정조에 세정수를 채우고 하우징 내부에 설치된 승강발생부를 통해 복수매의 웨이퍼가 수납된 바스켓 지그를 승강시킴과 동시에 세정조 양측 벽면에 설치된 초음파 발생부를 통해 초음파 세정을 실시함으로써 이물질을 더욱 빠르고 깨끗하게 제거할 수 있도록 함을 목적으로 한다.
In addition, after the high-pressure shower, the cleaning tank is filled with the washing water, and the basket jig containing the plurality of wafers is lifted and lifted through the lifting generating unit installed inside the housing, and the ultrasonic cleaning is performed through the ultrasonic generating units installed on both side walls of the cleaning tank. The goal is to make removal quicker and cleaner.

상기 과제 달성을 위해 창안된 본 발명은 크게 다섯 부분으로 구성되는바, 사각함체 형태의 하우징(11)의 내부로 세정조(12)가 설치되고, 세정조(12)의 하단으로는 배수관(13)이 형성되며, 세정조(12)의 측면으로는 오버플로우관(14)이 형성되고, 하우징(11)의 일측 하부에는 회수조(15)가 배수관(13) 및 오버플로우관(14)과 연결설치된 본체부(10)와; 상기 세정조(12)의 내부로 양측이 개방된 직육면체 형태의 회동거치대(21)가 설치될 수 있도록 일측단은 기어드 모터(22)의 축과 연결되고, 타측단은 볼베어링(23)과 연결되어 바스켓 지그(1)가 내재되는 회동거치대(21)를 좌우로 45°씩 회동시키도록 구성된 회동발생부(20)와; 상기 회동거치대(21)의 양측에 회동거치대(21)와 나란하게 길이방향으로 샤워노즐이 구비된 고압분사관(31)이 설치되되, 틸팅실린더(32)에 의해 수평방향으로 왕복운동이 가능하도록 구성된 세정부(30)와; 상기 세정조(12)의 길이방향 양측 벽면에 설치되어 초음파를 발생하도록 구성된 초음파 발생부(40)와; 하우징(11)의 바닥 중앙에 기어드 모터(51)가 설치되되, 기어드 모터(51)의 축과 직교하도록 수평바(52)가 설치되고, 수평바(52)의 양측단으로는 편심캠(53)이 설치되며, 편심캠(53)의 상부는 수직바(54)가 설치되고, 수직바(54)의 상단은 상기 회동거치대(21)의 양측 하부와 맞접하여 기어드 모터(51)가 회전함에 따라 회동거치대(21)가 승강하도록 구성된 승강발생부(50)로 이루어지는 대략적인 구성을 갖는다.
The present invention devised to achieve the above problem consists of five parts, the cleaning tank 12 is installed inside the housing 11 of the rectangular box form, the lower end of the cleaning tank 12, the drain pipe 13 ) Is formed, the overflow tube 14 is formed on the side of the cleaning tank 12, the recovery tank 15 at one lower portion of the housing 11 and the drain pipe 13 and the overflow tube 14 and A main body part 10 connected and installed; One end is connected to the shaft of the geared motor 22, the other end is connected to the ball bearing 23 so that the rotating support base 21 in the form of a rectangular parallelepiped open both sides into the cleaning tank 12 can be installed A rotation generating unit 20 configured to rotate the rotation base 21 in which the basket jig 1 is embedded by 45 ° from side to side; The high pressure injection pipe 31 having a shower nozzle in the longitudinal direction is installed on both sides of the rotation base 21 in parallel with the rotation base 21, so that the reciprocating motion can be performed in the horizontal direction by the tilting cylinder 32. A cleaning unit 30 configured; An ultrasonic generator 40 installed on both side walls of the cleaning tank 12 in the longitudinal direction and configured to generate ultrasonic waves; Geared motor 51 is installed in the center of the bottom of the housing 11, the horizontal bar 52 is installed so as to be orthogonal to the axis of the geared motor 51, the eccentric cam (53) at both ends of the horizontal bar (52) ) Is installed, the upper portion of the eccentric cam 53 is a vertical bar 54 is installed, the upper end of the vertical bar 54 is in contact with the lower side of the both sides of the pivot support 21 to rotate the geared motor 51 As a result, the pivoting base 21 has an approximate configuration consisting of the lifting generating unit 50 configured to move up and down.

상기와 같이 구성된 본 발명은, 웨이퍼가 복수매 수납된 바스켓 지그를 이송 로봇을 이용하여 이송한 후, 세정조에 내부에 설치된 회동거치대에 바스켓 지그를 수장한 다음 좌·우로 번갈아 가며 45°각도로 회동시킴과 동시에 고압수를 분사하여 세정함으로써 웨이퍼에 강하게 부착되어 있는 이물질을 쉽게 제거할 수 있는 효과가 있다.According to the present invention configured as described above, after transferring a basket jig containing a plurality of wafers by using a transfer robot, the basket jig is stored in a rotation base installed inside the cleaning tank, and then rotated at an angle of 45 ° alternately left and right. At the same time, by spraying high-pressure water, the foreign matter strongly attached to the wafer can be easily removed.

또한, 고압샤워 후에 세정조에 세정수를 채우고 하우징 내부에 설치된 승강발생부를 통해 복수매의 웨이퍼가 수납된 바스켓 지그를 승강시킴과 동시에 세정조 양측 벽면에 설치된 초음파 발생부를 통해 초음파 세정을 실시함으로써 이물질을 더욱 빠르고 깨끗하게 제거할 수 있는 효과가 있다.
In addition, after the high-pressure shower, the cleaning tank is filled with the washing water, and the basket jig containing the plurality of wafers is lifted and lifted through the lifting generating unit installed inside the housing, and the ultrasonic cleaning is performed through the ultrasonic generating units installed on both side walls of the cleaning tank. The effect is faster and cleaner removal.

도 1은 본 발명의 전체 사시도
도 2는 본 발명의 일부 분해 사시도
도 3은 본 발명의 정단면도
도 4는 본 발명의 측단면도
도 5는 본 발명의 평단면도
도 6은 본 발명의 사용상태 정단면도
도 7은 본 발명의 사용상태 측단면도1 is an overall perspective view of the present invention
2 is a partially exploded perspective view of the present invention
3 is a front cross-sectional view of the present invention.
4 is a side cross-sectional view of the present invention.
5 is a plan cross-sectional view of the present invention.
6 is a cross-sectional view of the state of use of the present invention
Figure 7 is a side cross-sectional view of the use state of the present invention

본 발명은 웨이퍼 세정장치에 관한 것으로, 복수매의 웨이퍼가 수납된 바스켓 지그를 세정조에 내부에 설치된 회동거치대에 수장한 다음 좌·우로 번갈아 가며 45°각도로 회동시킴과 동시에 고압분사관으로 고압수를 분사한 후에 세정조에 세정수를 채우고 하우징 내부에 설치된 승강발생부를 통해 바스켓 지그가 내재된 회동거치대를 승강시킴과 동시에 세정조 양측 벽면에 설치된 초음파 발생부를 통해 초음파 세정을 실시함으로써 이물질을 신속하고 깨끗하게 제거할 수 있도록 한 특징이 있다.
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer cleaning apparatus, wherein a basket jig containing a plurality of wafers is stored in a rotation base installed inside a cleaning tank, and then rotated at an angle of 45 ° alternately to the left and right, and at the same time, a high pressure water pipe is used. After spraying the water, the cleaning tank is filled with cleaning water, and the lifting platform installed inside the housing is moved up and down, and the ultrasonic support unit is installed on both sides of the cleaning tank. There is one feature that can be removed.

이하 본 발명의 실시 예를 예시도면을 통해 살펴보면 다음과 같다.
An embodiment of the present invention will be described below with reference to the accompanying drawings.

도 1은 본 발명의 전체 사시도를 나타낸 것이고, 도 2는 본 발명의 일부 분해 사시도를 나타낸 것이며, 도 3은 본 발명의 정단면도를 나타낸 것이고, 도 4는 본 발명의 측단면도를 나타낸 것이며, 도 5는 본 발명의 평단면도를 나타낸 것이고, 도 6 내지 도 7은 본 발명의 사용상태도를 나타낸 것으로, 도시한 바와 같이 본 발명은 크게 본체부(10)와 회동발생부(20), 세정부(30), 초음파발생부(40) 및 승강발생부(50)의 다섯 부분으로 구성된다.
Figure 1 shows an overall perspective view of the present invention, Figure 2 shows a partial exploded perspective view of the present invention, Figure 3 shows a front sectional view of the present invention, Figure 4 shows a side cross-sectional view of the present invention, Figure 5 is a cross-sectional view of the present invention, Figures 6 to 7 show a state diagram of the use of the present invention, as shown in the present invention is largely the main body portion 10, the rotation generating portion 20, the washing portion ( 30), the ultrasonic generator 40 and the lifting generator 50 is composed of five parts.

우선 본 발명의 본체부(10)의 구성을 살펴보면, 사각함체 형태의 하우징(11)의 내부로 세정조(12)가 설치되고, 세정조(12)의 하단으로는 배수관(13)이 형성되며, 세정조(12)의 측면으로는 오버플로우관(14)이 형성되고, 하우징(11)의 일측 하부에는 회수조(15)가 배수관(13) 및 오버플로우관(14)과 연결설치된다.
First, the configuration of the main body 10 of the present invention, the cleaning tank 12 is installed inside the housing 11 of the rectangular box form, the drain pipe 13 is formed at the lower end of the cleaning tank 12 The overflow tube 14 is formed on the side surface of the cleaning tank 12, and the recovery tank 15 is connected to the drain pipe 13 and the overflow pipe 14 at one lower side of the housing 11.

한편, 상기 하우징(11)의 내부에 설치되는 회동발생부(20)의 구성을 살펴보면, 하우징(11)의 내부 일측 상단에는 기어드 모터(22)가 설치되고, 세정조(12)의 내부로는 양측이 개방된 직육면체 형태의 회동거치대(21)가 설치되는바, 일측단은 상기 기어드 모터(22)의 축과 연결되고, 타측단은 볼베어링(23)과 결합설치된다.On the other hand, looking at the configuration of the rotation generating unit 20 is installed inside the housing 11, the geared motor 22 is installed on the upper end of the inner side of the housing 11, the cleaning tank 12 Rotating support base 21 in the form of a rectangular parallelepiped on both sides is installed, one end is connected to the shaft of the geared motor 22, the other end is coupled to the ball bearing 23.

이와 같이 설치되는 회동거치대(21)는 그 내부에 복수매의 웨이퍼가 수납된 바스켓 지그(1)가 내재되면 기어드 모터(22)가 번갈아 가면 좌·우로 45°씩 번갈아 가며 회동하도록 구성되는바, 회동거치대(21)가 45°기울어지면 후술하는 세정부(30)의 고압분사관(31)으로부터 세정수가 분사되어 웨이퍼를 세척하는 구성을 갖는다.
The rotating support base 21 installed as described above is configured to rotate by 45 ° alternately left and right when the geared motor 22 alternates when the basket jig 1 in which a plurality of wafers are stored therein is embedded. When the rotation base 21 is tilted at 45 degrees, the washing water is sprayed from the high-pressure spray pipe 31 of the washing unit 30 to be described later to wash the wafer.

그리고 상기 회동발생부(20)의 양측에 설치되되, 회동거치대(21)와 나란하도록 길이방향으로 설치되는 세정부(30)의 구성을 살펴보면, 회동발생부(20)의 양측으로 샤워노즐이 구비된 고압분사관(31)이 설치되되, 고압분사관(31)의 양끝단으로는 틸팅실린더(32)가 설치되어 고압분사관(31)이 수평방향으로 왕복하면서 세정수를 분사하게 된다.And looking at the configuration of the cleaning unit 30 which is installed on both sides of the rotation generating unit 20, the longitudinal installation side by side with the rotation base 21, the shower nozzle is provided on both sides of the rotation generating unit 20. The high pressure injection pipe 31 is installed, but the tilting cylinders 32 are installed at both ends of the high pressure injection pipe 31, and the high pressure injection pipe 31 reciprocates in the horizontal direction to spray the washing water.

다시 말해, 상기 회동거치대(21)가 45°기울어지면 고압분사관(31)에서 세정수가 분사되되, 틸팅실린더(32)의 실린더 로드가 왕복함에 따라 그와 결합된 고압분사관(31)이 수평방향으로 서서히 왕복하면서 세정수를 분사함으로써 웨이퍼 사이사이에 세정수가 강하게 분사되어 이물질을 효과적으로 제거하도록 구성된다.
In other words, when the rotation base 21 is tilted at 45 °, the washing water is injected from the high-pressure jet pipe 31, and the high-pressure jet pipe 31 coupled thereto is horizontal as the cylinder rod of the tilting cylinder 32 reciprocates. The cleaning water is strongly sprayed between the wafers by spraying the cleaning water while gradually reciprocating in the direction to effectively remove the foreign matter.

또한, 상기 세정조(12)의 길이방향 양측 벽면에 설치되는 초음파 발생부(40)는 통상적으로 사용되는 초음파 발생장치와 유사한 것으로, 세정조(12)에 세정수를 채운다음 후술하는 승강발생부(50)를 통해 승강시킴과 동시에 초음파를 발생하도록 하여 일층 효과적으로 이물질을 제거하도록 하는 구성을 갖는다.
In addition, the ultrasonic generator 40 is provided on both side walls in the longitudinal direction of the washing tank 12 is similar to the ultrasonic generator used in general, and after filling the washing water in the washing tank 12, the lifting generating unit to be described later Lifting through the 50 and at the same time to generate an ultrasonic wave has a configuration to effectively remove the foreign matter.

한편, 상기 하우징(11)의 바닥부에 설치되는 승강발생부(50)의 구성을 살펴보면, 하우징(11)의 바닥 중앙에 기어드 모터(51)가 설치되되, 기어드 모터(51)의 축과 직교하도록 설치된 수평바(52)가 설치되는바, 기어드 모터(51)의 회전력이 수평바(52)를 회전시키도록 기어로 결합된다.On the other hand, looking at the configuration of the elevating generating unit 50 is installed on the bottom of the housing 11, the geared motor 51 is installed in the center of the bottom of the housing 11, the orthogonal to the axis of the geared motor 51 The horizontal bar 52 is installed so that the bar, the rotational force of the geared motor 51 is coupled to the gear to rotate the horizontal bar (52).

그리고 상기 수평바(52)의 양측단으로는 원형의 편심캠(53)이 설치되며, 편심캠(53)의 상부는 편심캠(53)과 맞접하도록 수직바(54)가 설치된다A circular eccentric cam 53 is installed at both ends of the horizontal bar 52, and a vertical bar 54 is installed at an upper portion of the eccentric cam 53 to be in contact with the eccentric cam 53.

상기 수직바(54)는 두 개의 수직봉의 상·하부에 사각프레임이 가로로 결합된 형태로, 전체적으로는 상·하로 긴 사각틀 형태로 구성되어 각각의 수직바(54)의 하단은 편심캠(53)의 상부와 맞접하고, 일측 수직바(54)의 상단은 상기 회동발생부(20)의 볼베어링(23)의 하단과 맞접하며, 타측 수직바(54)의 상단은 상기 회동발생부(20)의 기어드 모터(22)축과 회동거치대(21)가 결합되는 커플링의 하단과 맞접하도록 설치된다.The vertical bar 54 is formed in the form of a square frame horizontally coupled to the upper and lower portions of the two vertical rods, the overall vertical bar 54 is formed in the form of a long rectangular frame, the lower end of each vertical bar 54 is an eccentric cam (53) A) the upper end of the vertical bar 54 is in contact with the lower end of the ball bearing 23 of the rotation generating unit 20, the upper end of the other vertical bar 54 is the rotation generating unit 20 The geared motor 22 of the shaft and the pivot support 21 is installed to be in contact with the lower end of the coupling.

상기와 같이 설치된 승강발생부(50)는 기어드 모터(51)가 회전함에 따라 수평바(52)가 회전하게 되고, 수평바(52)의 회전을 전달받은 편심캠(53)이 회전함에 따라 그에 맞접하여 설치된 수직바(54)가 승강하게 되어, 그에 따라 회동거치대(21)가 승강하는 작동을 갖는다.The lifting unit 50 installed as described above is rotated as the horizontal bar 52 rotates as the geared motor 51 rotates, and as the eccentric cam 53 received the rotation of the horizontal bar 52 rotates. The vertical bar 54, which is installed in contact with each other, moves up and down, and thus the pivoting base 21 moves up and down.

상기 수직바(54)의 승강에 의해 회동거치대(21)가 승강하는 구조를 보다 상세히 살펴보면, 일측의 수직바(54)와 볼베어링(23)의 하단이 접하여 승강하는 구조는 수직바(54)가 하우징(11)의 벽면에 설치된 브라켓을 관통하여 승강하도록 함으로써 수직바(54)가 브라켓에 의해 가이드 되어 넘어지거나 기울어지지 않도록 구성되며, 타측 수직바(54)와 커플링의 하단이 접하여 승강하는 구조는 커플링의 외주부 상면이 개방된 형태로 일정부분 기어드 모터(22)축과 회동거치대(21)축이 상승할 수 있도록 구성되며, 기어드 모터(22)축은 유연한 축을 사용하여 휠 수 있도록 함으로써 회동거치대(21)의 승강이 가능하도록 구성된다.
Looking in more detail the structure in which the pivot base 21 is elevated by the lifting of the vertical bar 54, the vertical bar 54 and the lower end of the ball bearing 23 is in contact with the vertical bar (54) The vertical bar 54 is guided by the bracket so as not to fall down or incline by moving up and down through the bracket installed on the wall of the housing 11, and the other vertical bar 54 and the lower end of the coupling are lifted up and down. The outer periphery of the coupling is formed in such a way that the geared motor 22 shaft and the pivoting base 21 shaft can be lifted up, and the geared motor 22 shaft can be bent using a flexible shaft. It is comprised so that raising / lowering of 21 is possible.

상기와 같이 구성된 본 발명의 조립 및 설치과정을 살펴보면, 하우징(11)의 상부에 세정조(12)를 설치하고, 세정조(12)의 하단과 측면에 각각 배수관(13)과 오버플로우관(14)을 회수조(15)와 연결설치한 후, 세정조(12)의 내부에 회동거치대(21)를 설치하되, 일측은 기어드 모터(22)와 결합하고 타측은 볼베어링(23)에 결합한다.Looking at the assembly and installation process of the present invention configured as described above, the cleaning tank 12 is installed on the upper portion of the housing 11, the drain pipe 13 and the overflow pipe ( 14) is connected to the recovery tank 15, and install the rotation support base 21 in the cleaning tank 12, one side is coupled to the geared motor 22 and the other side is coupled to the ball bearing 23. .

그런 다음, 회동거치대(21)의 길이방향 양측으로는 틸팅실린더(32)와 결합된 고압분사관(31)을 각각 설치하고, 세정조(12)의 내부 양측면에는 초음파발생부(40)를 각각 설치한다.Then, the high pressure injection pipe 31 coupled to the tilting cylinder 32 is installed on both sides of the rotation support base 21 in the longitudinal direction, respectively, and the ultrasonic generator 40 is provided on both inner sides of the cleaning tank 12, respectively. Install.

그 후, 하우징(11)의 바닥부 중앙에 기어드 모터(51)를 수평바(52)와 결합되게 설치하고, 수평바(52)의 양단에는 편심캠(53)을 결합하며, 편심캠(53)의 상부로는 수직바(54)가 입설하여 상기 회동거치대(21)의 양끝단 하부와 맞접하도록 함으로써 본 발명의 조립 및 설치를 완료한다.
Thereafter, the geared motor 51 is installed at the center of the bottom of the housing 11 to be coupled with the horizontal bar 52, and the eccentric cam 53 is coupled to both ends of the horizontal bar 52, and the eccentric cam 53 is provided. Vertical bar (54) is placed in the upper part of the) to be in contact with the lower end of both ends of the rotation support 21 to complete the assembly and installation of the present invention.

상기와 같이 설치된 본 발명의 작동과정을 살펴보면, 우선 회동거치대(21)의 내부로 복수개의 웨이퍼가 내재된 바스켓 지그(1)를 수장한 후, 기어드 모터(22)에 전원을 인가하여 회동거치대(21)가 좌·우측으로 45°씩 회동하도록 하는바, 좌측으로 45°회동한 후에는 좌측 고압분사관(31)으로 세정수를 분사하고, 이어서 우측으로 45°회동한 후에는 우측 고압분사관(31)으로 세정수를 분사하되, 고압분사관(31)과 결합된 틸팅실린더(32)를 통해 고압분사관(31)이 수평방향으로 움직이면서 세정수를 분사함으로써 웨이퍼 사이사이에 세정수가 고르게 분사될 수 있도록 한다.Looking at the operation of the present invention installed as described above, first the basket jig (1) in which a plurality of wafers are embedded in the interior of the rotation support base 21, and then applying power to the geared motor 22, the rotation support ( 21) is rotated by 45 ° left and right. After rotating 45 ° to the left, the washing water is sprayed to the left high-pressure jet pipe 31, and then after 45 ° to the right, the right high pressure jet pipe The washing water is sprayed to the (31), but the washing water is evenly sprayed between the wafers by spraying the washing water while the high-pressure spray pipe (31) moves horizontally through the tilting cylinder (32) combined with the high-pressure spray pipe (31). To be possible.

그런 다음, 고압분사세정이 완료되면, 세정조(12) 하단의 배수관(13)을 닫고 세정조(12) 내에 세정수를 채운 다음, 기어드 모터(51)에 전원을 인가하면 수평바(52)가 회전하게 되고, 그 양단에 결합된 편심캠(53)이 회전함에 따라 수직바(54)가 승강함으로써 그와 맞접한 회동거치대(21)가 승강하게 된다.Then, when the high-pressure jet cleaning is completed, the drain pipe 13 at the bottom of the washing tank 12 is closed and the washing water is filled in the washing tank 12, and then the power is applied to the geared motor 51, so that the horizontal bar 52 Is rotated, as the eccentric cam (53) coupled to both ends of the vertical bar 54 is raised and lowered by the rotation support base 21 in contact with it.

이와 동시에 세정조(12) 양측에 설치된 초음파 발생부(40)를 통해 초음파가 웨이퍼에 방출됨으로써 웨이퍼에 남은 이물질을 더욱 확실하게 제거할 수 있도록 하는 작동과정을 갖는다.
At the same time, the ultrasonic wave is discharged to the wafer through the ultrasonic generator 40 installed on both sides of the cleaning tank 12, so that the foreign matter remaining on the wafer can be more reliably removed.

1: 바스켓 지그 10: 본체부
11: 하우징 12: 세정조
13: 배수관 14: 오버플로우관
15: 회수조 20: 회동발생부
21: 회동거치대 22: 기어드 모터
23: 볼베어링 30: 세정부
31: 고압분사관 32: 틸팅실린더
40: 초음파발생부 50: 승강발생부
51: 기어드 모터 52: 수평바
53: 편심캠 54: 수직바1: basket jig 10: main body
11: housing 12: cleaning tank
13: drain pipe 14: overflow pipe
15: recovery tank 20: rotation generator
21: rotating platform 22: geared motor
23: ball bearing 30: cleaning part
31: high pressure injection pipe 32: tilting cylinder
40: ultrasonic generator 50: lift generator
51: geared motor 52: horizontal bar
53: eccentric cam 54: vertical bar

Claims (2)

웨이퍼 세정장치에 있어서,
사각함체 형태의 하우징(11)의 내부로 세정조(12)가 설치되고, 세정조(12)의 하단으로는 배수관(13)이 형성되며, 세정조(12)의 측면으로는 오버플로우관(14)이 형성되고, 하우징(11)의 일측 하부에는 회수조(15)가 배수관(13) 및 오버플로우관(14)과 연결설치된 본체부(10)와;
상기 세정조(12)의 내부로 양측이 개방된 직육면체 형태의 회동거치대(21)가 설치될 수 있도록 일측단은 기어드 모터(22)의 축과 연결되고, 타측단은 볼베어링(23)과 연결되어 바스켓 지그(1)가 내재되는 회동거치대(21)를 좌우로 45°씩 회동시키도록 구성된 회동발생부(20)와;
상기 회동거치대(21)의 양측에 회동거치대(21)와 나란하게 길이방향으로 설치되어 고압의 세정수가 분사되도록 구성된 세정부(30)와;
상기 세정조(12)의 길이방향 양측 벽면에 설치되어 초음파를 발생하도록 구성된 초음파 발생부(40)와;
하우징(11)의 바닥 중앙에 기어드 모터(51)가 설치되되, 기어드 모터(51)의 축과 직교하도록 수평바(52)가 설치되고, 수평바(52)의 양측단으로는 편심캠(53)이 설치되며, 편심캠(53)의 상부는 수직바(54)가 설치되고, 수직바(54)의 상단은 상기 회동거치대(21)의 양측 하부와 맞접하여 기어드 모터(51)가 회전함에 따라 회동거치대(21)가 승강하도록 구성된 승강발생부(50)로 이루어짐을 특징으로 하는 웨이퍼 세정장치.
In the wafer cleaning apparatus,
The cleaning tank 12 is installed inside the housing 11 of the rectangular box shape, the drain pipe 13 is formed at the lower end of the cleaning tank 12, the overflow pipe ( 14 is formed, the main body portion 10 having a recovery tank 15 is connected to the drain pipe 13 and the overflow pipe 14 in one lower portion of the housing 11;
One end is connected to the shaft of the geared motor 22, the other end is connected to the ball bearing 23 so that the rotating support base 21 in the form of a rectangular parallelepiped open both sides into the cleaning tank 12 can be installed A rotation generating unit 20 configured to rotate the rotation base 21 in which the basket jig 1 is embedded by 45 ° from side to side;
Washing unit 30 is installed on both sides of the pivot base 21 in the longitudinal direction in parallel to the pivot base 21 and configured to spray high pressure washing water;
An ultrasonic generator 40 installed on both side walls of the cleaning tank 12 in the longitudinal direction and configured to generate ultrasonic waves;
Geared motor 51 is installed in the center of the bottom of the housing 11, the horizontal bar 52 is installed so as to be orthogonal to the axis of the geared motor 51, the eccentric cam (53) at both ends of the horizontal bar (52) ) Is installed, the upper portion of the eccentric cam 53 is a vertical bar 54 is installed, the upper end of the vertical bar 54 is in contact with the lower side of the both sides of the pivot support 21 to rotate the geared motor 51 Wafer cleaning apparatus, characterized in that consisting of the lifting generating unit 50 is configured to move up and down the rotation base 21.
제 1항에 있어서,
세정부(30)는 샤워노즐이 구비된 원통형의 고압분사관(31)이 회동거치대(21)의 양측에 각각 설치되되, 고압분사관(31)의 양끝단으로는 틸팅실린더(32)가 설치되어 틸팅실린더(32)의 실린더 로드가 교대로 왕복함에 따라 고압분사관(31)이 수평방향으로 왕복하면서 세정수를 분사하도록 함을 특징으로 하는 웨이퍼 세정장치.
The method of claim 1,
The washing unit 30 is provided with a cylindrical high pressure injection pipe 31 having a shower nozzle on both sides of the rotation support base 21, respectively, and a tilting cylinder 32 is installed at both ends of the high pressure injection pipe 31. And the high pressure jet pipe (31) reciprocates in the horizontal direction as the cylinder rods of the tilting cylinder (32) alternately reciprocate to spray the cleaning water.
KR1020100111714A 2010-11-10 2010-11-10 Apparatus of cleaning a wafer KR101009584B1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101612032B1 (en) 2015-09-21 2016-04-12 (주)파인에코 Chip-size Silicon Cleaning Method and Apparatus
CN108889702A (en) * 2018-08-11 2018-11-27 山东联盛电子设备有限公司 A kind of double-station wafer cleaning machine
CN113305095A (en) * 2021-04-14 2021-08-27 浙江韩宇光电科技有限公司 High-performance ultrasonic cleaning machine for LED patch bracket
CN117316560A (en) * 2023-09-17 2023-12-29 瑞能光伏科技(句容)有限公司 Thermistor processing device
CN117324306A (en) * 2023-10-24 2024-01-02 安徽高芯众科半导体有限公司 Ultrasonic cleaning machine for semiconductor wafer

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JPH05291222A (en) * 1992-04-10 1993-11-05 Nippon Steel Corp Method and apparatus for rinsing
JPH10223585A (en) 1997-02-04 1998-08-21 Canon Inc Device and method for treating wafer and manufacture of soi wafer

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JPH05291222A (en) * 1992-04-10 1993-11-05 Nippon Steel Corp Method and apparatus for rinsing
JPH10223585A (en) 1997-02-04 1998-08-21 Canon Inc Device and method for treating wafer and manufacture of soi wafer

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101612032B1 (en) 2015-09-21 2016-04-12 (주)파인에코 Chip-size Silicon Cleaning Method and Apparatus
CN108889702A (en) * 2018-08-11 2018-11-27 山东联盛电子设备有限公司 A kind of double-station wafer cleaning machine
CN108889702B (en) * 2018-08-11 2023-09-26 山东联盛电子设备有限公司 Double-station wafer cleaning machine
CN113305095A (en) * 2021-04-14 2021-08-27 浙江韩宇光电科技有限公司 High-performance ultrasonic cleaning machine for LED patch bracket
CN117316560A (en) * 2023-09-17 2023-12-29 瑞能光伏科技(句容)有限公司 Thermistor processing device
CN117324306A (en) * 2023-10-24 2024-01-02 安徽高芯众科半导体有限公司 Ultrasonic cleaning machine for semiconductor wafer
CN117324306B (en) * 2023-10-24 2024-03-19 安徽高芯众科半导体有限公司 Ultrasonic cleaning machine for semiconductor wafer

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