CN115254800B - Probe cleaning device and probe cleaning method - Google Patents
Probe cleaning device and probe cleaning method Download PDFInfo
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- CN115254800B CN115254800B CN202210831280.5A CN202210831280A CN115254800B CN 115254800 B CN115254800 B CN 115254800B CN 202210831280 A CN202210831280 A CN 202210831280A CN 115254800 B CN115254800 B CN 115254800B
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- probe
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
Abstract
The present invention provides a probe cleaning apparatus configured to clean a plurality of probes on a probe card in a noncontact manner, the probe cleaning apparatus comprising: an eddy current generation module, comprising: a magnetic field generating unit; and a metal plate arranged adjacent to the magnetic field generating unit, wherein the magnetic field generating unit is configured to generate an alternating magnetic field, and when the probes enter the range of the alternating magnetic field, eddy currents are formed on the metal plate, so that an object to be cleaned on each probe forms a first induction polarity; and a reverse magnet configured to attract the object to be cleaned, which generates the first induced polarity, away from each of the probes.
Description
Technical Field
The present invention relates to a cleaning device for an electronic inspection apparatus, and more particularly, to a cleaning device for probes on a probe card.
Background
In the process of Integrated Circuit (IC) wafer production, electrical testing is an important basis for determining wafer yield. Before an Integrated Circuit (IC) is not packaged, a probe (probe) is used for performing a functional test on a bare die, defective products are screened out, and then the packaging engineering is performed. The electrical probing process uses the probes of the probe card as electrical conduction media, the probes conduct electrical signals from the test machine to the chip, and the test machine can judge the quality of the chip by feeding back the signals transmitted by the chip through the probes. Referring to fig. 1, fig. 1 is a schematic diagram of a probe testing machine in the prior art. As shown in fig. 1, the probe test machine 100 includes a body (tester) 10, a test head (test head) 20, a carrier (probe) 30, a probe chuck (probe chuck) 32, a test carrier (test board) 22, and a probe card (probe card) 24. The probe chuck 32 is used for accommodating a wafer waiting test assembly 40 to be tested, and the probe card 24 is disposed on the test head 20 by a test board 22. The probe card 24 is aligned with the lower wafer waiting test module 40, and performs related electrical inspection on the wafer waiting test module 40 through a plurality of probes (not shown).
In the electrical conduction process of needle test, poor contact between the probe and the chip is often the main cause of unstable test. In addition, the surface roughness of the probe made of tungsten in the prior art is high, alumina is easy to adhere to cause abnormal electrical signals, the probe is required to be taken off line for needle cleaning after being used for multiple times, and when the contact times are too many and the needle cleaning cannot improve the yield, the probe is required to be sent back to the original factory for maintenance. For the general needle cleaning process, the machine is stopped to clean the alumina adhered on the needle by the chemical agent, however, the implementation mode of the machine is easy to influence the verticality of the needle and influence the accuracy of the test. Along with the continuous improvement of the probe density on the probe card, the difficulty of needle cleaning is also relatively improved.
Therefore, how to provide a probe cleaning apparatus and a probe cleaning method that can solve the above problems is an important issue for the industry.
Disclosure of Invention
In view of the foregoing, one aspect of the present disclosure provides a probe cleaning apparatus configured to clean a plurality of probes on a probe card in a non-contact manner, the probe cleaning apparatus comprising: an eddy current generation module, comprising: a magnetic field generating unit; and a metal plate arranged adjacent to the magnetic field generating unit, wherein the magnetic field generating unit is configured to generate an alternating magnetic field, and when the probes enter the range of the alternating magnetic field, eddy currents are formed on the metal plate, so that an object to be cleaned on each probe forms a first induction polarity; and a reverse magnet configured to attract the object to be cleaned, which generates the first induced polarity, away from each of the probes. The reversed phase magnet has a second induced polarity opposite to the first induced polarity generated by the object to be cleaned. The conductivity of the metal constituting the object to be cleaned is greater than the conductivity of the metal constituting the probes.
According to one or more embodiments of the present disclosure, the magnetic field generating unit includes: a coil of induction coil; an alternating current source configured to supply an alternating current to the sense coil; and a magnet drum configured to be surrounded by the induction coil and rotated in the induction coil; the induction coil generates the alternating magnetic field due to the alternating current, and when the probes enter the range of the alternating magnetic field, the eddy current is formed on the metal plate.
In accordance with one or more embodiments of the present disclosure, the Probe card may be configured in an array Test (array Test), a Chip Probe (CP) machine in wafer level Test (wafer level Test), a Final Test (FT) machine in post-package Test (package level Test), a liquid crystal cell Test machine (cell Test), or a current-voltage Probe (I-V Probe Test) machine.
In accordance with one or more embodiments of the present disclosure, the probe card is configured to perform an electrical test on a device under test, which is a semiconductor device or a wafer.
According to one or more embodiments of the present disclosure, the magnet drum is a permanent magnet, and the rotational frequency thereof can be changed by a frequency converter to generate the eddy currents of different effectiveness.
In addition, another aspect of the present disclosure provides a probe cleaning apparatus configured to clean a plurality of probes on a probe card in a non-contact manner. The probe cleaning apparatus includes: an eddy current generating module having a magnetic field generating unit, and a drying apparatus. The magnetic field generating unit is configured to generate an alternating magnetic field; when the probe card sequentially enters the range of the alternating magnetic field, an eddy current is formed by an object to be cleaned on each probe, and the object to be cleaned on each probe is separated from each probe by utilizing the reverse magnetic field change. In this embodiment, the drying device is a cooling chip electrically connected to the probe card, and the probes are dried by heating to 70 ℃. The magnetic field generating unit includes: a coil, an alternating current source and a magnet drum. The alternating current source is configured to supply an alternating current to the sense coil. The magnet drum is arranged to be surrounded by the induction coil and rotate in the induction coil. The induction coil generates the alternating magnetic field by flowing the alternating current. In this embodiment, the magnetic field generating unit and the drying device are disposed on different sides of the probe card.
In addition, another aspect of the present disclosure provides a probe cleaning apparatus configured to clean a plurality of probes on a probe card in a noncontact manner, the probe cleaning apparatus comprising: an eddy current generating module having a magnetic field generating unit, an inverse magnet and a drying device. The magnetic field generating unit is configured to generate an alternating magnetic field, and when the probe card enters the range of the alternating magnetic field, an eddy current is formed on an object to be cleaned on each probe, so that the object to be cleaned on each probe forms a first induction polarity. The magnetic field generating unit includes: a coil, an alternating current source and a magnet drum. The alternating current source is configured to supply an alternating current to the sense coil. The magnet drum is arranged to be surrounded by the induction coil and rotate in the induction coil. The induction coil generates the alternating magnetic field by flowing the alternating current. In this embodiment, the reverse magnet has a second induced polarity opposite to the first induced polarity generated by the object to be cleaned, and the reverse magnet and the magnetic field generating unit are disposed on opposite sides of the probe card for sucking the object to be cleaned having the first induced polarity away from each probe. In this embodiment, the drying device is electrically connected to the probe card, and the probes are dried by heating.
In addition, another aspect of the present disclosure provides a probe cleaning apparatus configured to clean a plurality of probes on a probe card in a non-contact manner. The probe cleaning apparatus includes: has a magnetic field generating unit, an eddy current generating module, a reversed phase magnet and a drying device. The magnetic field generating unit is configured to generate an alternating magnetic field, and when the probe card enters the range of the alternating magnetic field, an eddy current is formed on an object to be cleaned on each probe, so that the object to be cleaned on each probe forms a first induction polarity. Specifically, the magnetic field generating unit includes: a coil of induction coil and a composite magnet drum. The composite magnet rotary drum is arranged to be surrounded by the induction coil and rotate in the induction coil to generate the alternating magnetic field; wherein the composite magnet drum is composed of a plurality of magnets. The reverse magnet has a second induced polarity, wherein the second induced polarity is opposite to the first induced polarity generated by the object to be cleaned, and the reverse magnet and the magnetic field generating unit are disposed on opposite sides of the probe card for sucking the object to be cleaned, which generates the first induced polarity, away from each probe. The drying device is electrically connected with the probe card and dries the probes by heating.
In addition, another aspect of the present disclosure provides a probe cleaning method, comprising: step 1: performing an electrical test on a device under test by the probes as described above; and step 2: after the step 1, the probes are cleaned by the probe cleaning device as described above.
In addition, another aspect of the present disclosure provides a probe cleaning method for removing foreign matters adhering to a plurality of probes of a probe card by a non-contact method, comprising: the probe cleaning method uses the characteristic of eddy current to sort metals with different conductivities so as to remove the foreign matters adhered to the probes.
Drawings
The foregoing and other objects, features, advantages and embodiments of the invention will be more readily apparent from the following description taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic diagram of a prior art probe tester.
FIG. 2 is a schematic diagram showing the main components of a probe cleaning apparatus according to an embodiment of the invention.
FIG. 3 is a schematic diagram illustrating other components of the probe cleaning apparatus of FIG. 2.
FIG. 4 is a schematic diagram showing the main components of a probe cleaning apparatus according to another embodiment of the invention.
FIG. 5 is a schematic view showing the main parts of a probe cleaning apparatus according to another embodiment of the invention.
FIG. 6 is a schematic diagram showing the main components of a probe cleaning apparatus according to another embodiment of the invention.
The reference numerals are:
10: body
20: test head
22: test carrier plate
24. 44, 54, 64: probe card
24a, 44a, 54a, 64a: probe with a probe tip
26. 46, 56, 66: object to be cleaned
30: carrier table
32: probe chuck
40: waiting side assembly
100: probe test machine
200: eddy current generating module
202. 402, 502, 602: magnetic field generating unit
202a, 402a, 502a, 602a: induction coil
202b, 402b, 502b: AC current source
202c, 402c, 502c, 602c': magnet roller
204: metal plate
210. 410, 510, 610: alternating magnetic field
212. 412, 512, 612: eddy current
300: reversed phase magnet
4000. 5000, 6000: drying device
5300. 6300: reversed phase magnet
Various features and elements are not drawn to scale in accordance with conventional practice in the drawings in a manner that best serves to illustrate the specific features and elements that are pertinent to the present invention. In addition, like components and parts are designated by the same or similar reference numerals among the different drawings.
Detailed Description
For a further understanding and appreciation of the objects, shapes, structural features of the invention, and their efficacy, the invention can be best understood by reference to the following detailed description of the embodiments taken in conjunction with the accompanying drawings.
The following disclosure provides various embodiments or examples to implement various features of the provided objects. Specific examples of components and arrangements are described below for purposes of simplifying the disclosure and are not intended to be limiting; the size and shape of the components are not limited by the disclosed ranges or values, but may depend on the processing conditions or desired characteristics of the components. For example, the technical features of the present invention are described using cross-sectional views, which are schematic illustrations of idealized embodiments. Thus, variations in the shapes of the illustrations as a result of manufacturing processes and/or tolerances are to be expected and should not be construed as limiting.
Furthermore, spatially relative terms, such as "below," "under …," "below," "over …," and "above," and the like, may be used for ease of description of the relationship between elements or features depicted in the drawings; further, spatially relative terms may be intended to encompass different orientations of the component in use or operation in addition to the orientation depicted in the figures.
Referring to fig. 2 and 3, fig. 2 is a schematic diagram illustrating main components of a probe cleaning apparatus according to an embodiment of the invention. FIG. 3 is a schematic diagram illustrating other components of the probe cleaning apparatus of FIG. 2.
As shown in FIG. 2, the probe cleaning apparatus in one embodiment of the present invention is configured to clean a plurality of probes 24a on a probe card 24 in a noncontact manner. The probe cleaning apparatus includes an eddy current generating module 200 and an inverse magnet 300. The eddy current generating module 200 includes a magnetic field generating unit 202 and a metal plate 204. The metal plate 204 is disposed adjacent to the magnetic field generating unit 202, and the magnetic field generating unit 202 is configured to generate an alternating magnetic field 210, and when the probes 24a enter the range of the alternating magnetic field 210, an eddy current 212 is formed on the metal plate 204, so that an object 26 to be cleaned on each probe 24a forms a first induced polarity. In one embodiment of the present invention, the probe card 24 is configured to perform an electrical test on a device under test, which is a semiconductor device or a wafer. In one embodiment of the present invention, the Probe card 24 may be disposed in an array Test (array Test), a Chip Probe (CP) machine in wafer level Test, a Final Test (FT) machine in post-package Test (package level Test), a liquid crystal cell Test machine (cell Test), or a current-voltage Probe (I-V Probe Test) machine.
Referring to fig. 2 again, the magnetic field generating unit 202 includes a coil 202a, an ac current source 202b, and a magnet drum 202c. As shown in fig. 2, ac current source 202b is configured to supply an ac current to the sense coil. The magnet drum 202c is disposed to be surrounded by the induction coil 202a and to rotate within the induction coil 202 a. The induction coil 202a generates the alternating magnetic field 210 by flowing the alternating current, and when the probes enter the range of the alternating magnetic field, the eddy current 212 is formed on the metal plate. In one embodiment of the present invention, the magnet cylinder 202c is a permanent magnet. In one embodiment of the present invention, the magnet drum 202c may be varied in rotational frequency by a frequency converter to generate the eddy currents 212 of varying effectiveness.
In addition, as shown in fig. 3, an inverse magnet 300 is configured to attract the object 26 to be cleaned, which generates the first induced polarity, away from each of the probes 24a. In one embodiment of the present invention, the inverse magnet 300 has a second induced polarity opposite to the first induced polarity generated by the object 26.
In one embodiment of the present invention, the metal constituting the object 26 to be cleaned has a conductivity greater than that of the metal constituting the probes 24a.
In addition, referring to fig. 4, fig. 4 is a schematic diagram showing main components of a probe cleaning apparatus according to another embodiment of the invention. As shown in FIG. 4, a probe cleaning apparatus according to another embodiment of the present invention is configured to clean a plurality of probes 44a on a probe card 44 in a noncontact manner. The probe cleaning apparatus includes: an eddy current generating module having a magnetic field generating unit 402, and a drying apparatus 4000. The magnetic field generating unit 402 is configured to generate an alternating magnetic field 410; when the probe card 44 sequentially enters the range of the alternating magnetic field 410, an eddy current 412 is formed by the object 46 to be cleaned on each probe 44a, and the object 46 to be cleaned on each probe 44a is separated from each probe 44a by a reverse magnetic field change. In this embodiment, the drying device 4000 is a cooling chip electrically connected to the probe card 44, and dries the probes 44a by heating to 70 ℃.
In this embodiment, the magnetic field generating unit 402 includes: a sense coil 402a, an ac current source 402b, and a magnet drum 402c. The ac current source 402b is configured to supply an ac current to the sense coil 402 a. The magnet drum 402c is configured to be surrounded by the induction coil 402a and to rotate within the induction coil 402 a. The induction coil 402a generates the alternating magnetic field 410 by flowing the alternating current. In this embodiment, the magnetic field generating unit 402 and the drying device 4000 are disposed on different sides of the probe card 44.
In addition, referring to fig. 5, fig. 5 is a schematic diagram showing main components of a probe cleaning apparatus according to another embodiment of the invention. As shown in FIG. 5, a probe cleaning apparatus according to another embodiment of the present invention is configured to clean a plurality of probes 54a on a probe card 54 in a noncontact manner, the probe cleaning apparatus comprising: an eddy current generating module having a magnetic field generating unit 502, an inverse magnet 5300, and a drying apparatus 5000. The magnetic field generating unit 502 is configured to generate an alternating magnetic field 510, and when the probe card 54 enters the range of the alternating magnetic field 510, an eddy current 512 is formed by the object 56 to be cleaned on each probe 54a, so that the object 56 to be cleaned on each probe 54a forms a first induced polarity. In this embodiment, the magnetic field generating unit 502 includes: a sense coil 502a, an alternating current source 502b, and a magnet drum 502c. The ac current source 502b is configured to supply an ac current to the sense coil 502 a. The magnet drum 502c is configured to be surrounded by the induction coil 502a and to rotate within the induction coil 502 a. The induction coil 502a generates the alternating magnetic field 510 by flowing the alternating current. In this embodiment, the inverting magnet 5300 has a second induced polarity opposite to the first induced polarity generated by the object to be cleaned 56, and the inverting magnet 5300 and the magnetic field generating unit 502 are disposed on opposite sides of the probe card 54 for sucking the object to be cleaned 56 having the first induced polarity away from each of the probes 54 a. In this embodiment, the drying device 5000 is a cooling chip electrically connected to the probe card 54, and dries the probes 54a by heating to 70 ℃.
In addition, referring to fig. 6, fig. 6 is a schematic diagram showing main components of a probe cleaning apparatus according to another embodiment of the invention. As shown in FIG. 6, a probe cleaning apparatus according to another embodiment of the present invention is configured to clean a plurality of probes 64a on a probe card 64 in a noncontact manner. The probe cleaning apparatus includes: has a magnetic field generating unit 602, an eddy current generating module, an inverse magnet 6300 and a drying device 6000. The magnetic field generating unit 602 is configured to generate an alternating magnetic field 610, and when the probe card 64 enters the range of the alternating magnetic field 610, an eddy current 612 is formed by the object 66 to be cleaned on each probe 64a, so that the object 66 to be cleaned on each probe 64a forms a first induced polarity. In particular, the magnetic field generating unit 602 includes: a sense coil 602a and a composite magnet drum 602c. The composite magnet drum 602c is configured to be surrounded by the induction coil 602a and rotated within the induction coil 602a to generate the alternating magnetic field 610; the composite magnet drum 602c is composed of a plurality of bar-shaped or block-shaped magnets 602c, 602 c'. As shown in fig. 6, the bar or block magnets 602c, 602c' are configured with different polarities adjacent to each other. In this embodiment, the anti-phase magnet 6300 has a second induced polarity opposite to the first induced polarity generated by the object to be cleaned 66, and the anti-phase magnet 6300 and the magnetic field generating unit 602 are disposed on opposite sides of the probe card 64 for sucking the object to be cleaned 66 having the first induced polarity away from the probes 64a. In this embodiment, the drying device 6000 is a cooling chip electrically connected to the probe card 64, and dries the probes 64a by heating to 70 ℃.
In another embodiment of the present invention, a probe cleaning method includes: step 1: performing an electrical test on a device under test by using the probes as in the previous embodiments; and step 2: after the step 1, the probes are cleaned by the probe cleaning device according to the previous embodiment.
In another embodiment of the present invention, the probe cleaning method is to remove the foreign matters adhered to the plurality of probes 24a of a probe card 24 by a non-contact manner, and is characterized in that: the probe cleaning method uses the characteristic of eddy current to sort metals with different conductivities so as to remove the foreign matters adhered to the probes.
The above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solution of the present invention.
Claims (9)
1. A probe cleaning apparatus configured to clean a plurality of probes on a probe card in a noncontact manner, characterized by: the probe cleaning apparatus includes:
an eddy current generation module comprising:
a magnetic field generating unit; and
a metal plate arranged adjacent to the magnetic field generating unit, wherein the magnetic field generating unit is configured to generate an alternating magnetic field, and eddy currents are formed on the metal plate when the probes enter the range of the alternating magnetic field, so that the object to be cleaned on each probe forms a first induction polarity; and
an inverting magnet configured to attract the object to be cleaned, which generates the first induced polarity, away from each of the probes, wherein the inverting magnet has a second induced polarity opposite to the first induced polarity generated by the object to be cleaned;
wherein the conductivity of the metal constituting the object to be cleaned is greater than the conductivity of the metal constituting the probe.
2. The probe cleaning apparatus of claim 1, wherein: wherein the magnetic field generating unit includes:
a coil is sensed;
an alternating current source configured to supply alternating current to the sense coil; and
a magnet drum configured to be surrounded by the induction coil and to rotate in the induction coil;
the induction coil generates the alternating magnetic field due to the flowing of the alternating current, and when the probe enters the range of the alternating magnetic field, the eddy current is caused to form on the metal plate.
3. The probe cleaning apparatus of claim 1, wherein: the probe card is configured in an array test machine, a chip needle test machine in wafer level test, a final test machine in post-package test, a liquid crystal cell test machine or a current-voltage needle test machine.
4. A probe cleaning apparatus as claimed in claim 3, wherein: wherein the probe card is configured to perform an electrical test on a component to be tested, and the component to be tested is a semiconductor component or a wafer.
5. The probe cleaning apparatus of claim 1, wherein: the device further comprises a frequency converter and a magnet rotating drum, wherein the magnet rotating drum is a permanent magnet, and the rotating frequency of the magnet rotating drum can be changed by the frequency converter so as to generate eddy currents with different effectiveness.
6. A probe cleaning device, characterized in that: a plurality of probes on a probe card configured to be cleaned in a non-contact manner, the probe cleaning device comprising:
an eddy current generating module having a magnetic field generating unit, wherein the magnetic field generating unit is configured to generate an alternating magnetic field, when the probe card enters the range of the alternating magnetic field, eddy currents are formed by the object to be cleaned on each probe, and the object to be cleaned on each probe is separated from each probe by using reverse magnetic field change, wherein the magnetic field generating unit comprises: a coil is sensed; an alternating current source configured to supply alternating current to the sense coil; and a magnet drum configured to be surrounded by the induction coil and to rotate within the induction coil; wherein the induction coil generates the alternating magnetic field by flowing the alternating current; and
and the drying device is electrically connected with the probe card and is used for drying the probes in a heating mode.
7. A probe cleaning device, characterized in that: a plurality of probes on a probe card configured to be cleaned in a non-contact manner, the probe cleaning device comprising:
an eddy current generating module having a magnetic field generating unit, wherein the magnetic field generating unit is configured to generate an alternating magnetic field, when the probe card enters the range of the alternating magnetic field, eddy currents are formed by the object to be cleaned on each probe, so that the object to be cleaned on each probe forms a first induced polarity, and the magnetic field generating unit comprises: a coil is sensed; an alternating current source configured to supply alternating current to the sense coil; and a magnet drum configured to be surrounded by the induction coil and to rotate within the induction coil; wherein the induction coil generates the alternating magnetic field by flowing the alternating current;
the reverse magnet is provided with a second induction polarity, wherein the second induction polarity is opposite to the first induction polarity generated by the object to be cleaned, and the reverse magnet and the magnetic field generating unit are arranged on the opposite side of the probe card and are used for sucking the object to be cleaned, which generates the first induction polarity, away from each probe; and
and the drying device is electrically connected with the probe card and is used for drying the probes in a heating mode.
8. A probe cleaning device, characterized in that: a plurality of probes on a probe card configured to be cleaned in a non-contact manner, the probe cleaning device comprising:
an eddy current generating module having a magnetic field generating unit, wherein the magnetic field generating unit is configured to generate an alternating magnetic field, when the probe card enters the range of the alternating magnetic field, eddy currents are formed by the object to be cleaned on each probe, so that the object to be cleaned on each probe forms a first induced polarity, and the magnetic field generating unit comprises: a coil is sensed; and a composite magnet drum configured to be surrounded by the induction coil and rotated in the induction coil to generate the alternating magnetic field; wherein the composite magnet drum is composed of a plurality of magnets;
the reverse magnet is provided with a second induction polarity, wherein the second induction polarity is opposite to the first induction polarity generated by the object to be cleaned, and the reverse magnet and the magnetic field generating unit are arranged on the opposite side of the probe card and are used for sucking the object to be cleaned, which generates the first induction polarity, away from each probe; and
and the drying device is electrically connected with the probe card and is used for drying the probes in a heating mode.
9. A method of cleaning a probe, characterized by: comprising the following steps: step 1: performing an electrical test on the component to be tested by the probe of claim 1; and step 2: after the step 1, the probe is cleaned by the probe cleaning apparatus according to any one of claims 1, 6 to 8.
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| CN202210831280.5A CN115254800B (en) | 2022-07-15 | 2022-07-15 | Probe cleaning device and probe cleaning method |
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| TW200404622A (en) * | 2002-07-18 | 2004-04-01 | James E Orsillo | Probe device cleaner and method |
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