CN101989396A - Apparatus for array test with cleaner units - Google Patents

Apparatus for array test with cleaner units Download PDF

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Publication number
CN101989396A
CN101989396A CN2009102240884A CN200910224088A CN101989396A CN 101989396 A CN101989396 A CN 101989396A CN 2009102240884 A CN2009102240884 A CN 2009102240884A CN 200910224088 A CN200910224088 A CN 200910224088A CN 101989396 A CN101989396 A CN 101989396A
Authority
CN
China
Prior art keywords
substrate
unit
probe
cleaning unit
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009102240884A
Other languages
Chinese (zh)
Inventor
朴廷喜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Top Engineering Co Ltd
Original Assignee
Top Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR10-2009-0071427 priority Critical
Priority to KR1020090071427A priority patent/KR101033776B1/en
Application filed by Top Engineering Co Ltd filed Critical Top Engineering Co Ltd
Publication of CN101989396A publication Critical patent/CN101989396A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836Fault-finding or characterising
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046Dry cleaning only

Abstract

The present invention provides an apparatus for array test, which is used for detecting the defect in an electrode that is formed in a display substrate. A probe assembly comprises a probe rod and a probe frame. The probe rod comprises probe pins which are used for applying a voltage to the electrode formed on the display substrate. The probe frame is connected with the probe rods so that the probe rods can move in one direction relatively to the substrate. The probe frame is connected with cleaner units. Therefore, through the cleaning units, the foreign matter which is additionally generated possibly in substrate transferring or probe assembly operation period in the array test process can be removed, thereby improving test reliability.

Description

The array detecting device that comprises cleaning unit
The cross reference of related application
The application requires the senior interest of the korean patent application No.10-2009-0071427 of submission on August 3rd, 2009, and is by reference that the disclosure of this korean patent application is incorporated to satisfy various purposes in full at this.
Technical field
Following description relates to the device that detects display, is formed on the array detecting device of the electrical defect of the electrode on the display base plate in particular to detection.
Background technology
Recently, it is more and more elongated that display pannel has become, and current flat-panel monitor comprises such as LCD, plasma display (PDP) and Organic Light Emitting Diode types such as (OLED).General thin film transistor (TFT) (TFT) LCD comprises: the TFT substrate, be formed with colored filter and public electrode on it and be set in the face of the TFT substrate colored substrate, be arranged on liquid crystal and back light unit between TFT substrate and the colored substrate.
Utilize the array tester test to be formed on the defective of the TFT electrode on the TFT substrate.
Particularly, predetermined voltage is applied to the TFT electrode and is included on the modulator in the array tester, modulator is provided with near the TFT substrate, makes to produce electric field between modulator and TFT substrate.At this moment, the electric field level when having defective in the TFT electrode on the TFT substrate is less than the electric field level when not having defective.Therefore, can determine the existence of the defective in the TFT substrate according to the electric field level of measuring.
Conventional array tester comprises probe assembly.Probe assembly is applied to voltage on the electrode that is formed on the substrate.Must provide drive signal to carry out some functional test to electrode of substrate.Probe assembly comprises and driving voltage is applied to the electronic installation on the substrate and is used for mechanical hook-up that the relative substrate of electronic installation is placed or arranged.
Yet there is such problem in conventional array base palte: in the process of transmission or test base, foreign matter can be drawn the surface that is attached to substrate.Just, be clean although be loaded into the substrate of array tester, also exist extra foreign matter to be introduced in possibility in the array tester.This foreign matter can reduce the reliability and the accuracy of any test.
Summary of the invention
According to an aspect of the present invention, provide a kind of array detecting device, comprised that configuration is used for voltage is applied on the electrode that is formed on the substrate probe assembly with the defective of testing described electrode, and comprise the clearer that is positioned on probe assembly one side.
Described probe assembly comprises: the probe rod, and it comprises and is used for voltage is applied to probe pins on the electrode that is formed on the described substrate; Prober frame is connected to the probe rod, makes the probe rod to move in one direction relative to described substrate, and described prober frame is connected with described clearer.
Provide a plurality of dismountable clearers.
Clearer can also be operated on the length direction of prober frame.
Clearer can comprise foreign matter from the unit that comes off that described substrate removes.
In addition, described clearer comprises the attraction unit that is used for absorbing from the foreign matter surface or surrounding air of described substrate.In this case, described attraction unit comprises vertical described substrate and a plurality of pins that extend to described substrate.
Described clearer comprises the hyperacoustic ultrasonic head of generation.In this case, described clearer comprises being positioned and makes that to form predetermined gap at a distance of the periphery of described ultrasonic head air can be by the lid in this gap.
Described clearer comprises magnet unit, is used for metallic foreign body is removed from the surface of described substrate or from surrounding air.
Therefore, for the cleaning unit that probe assembly provides is removed effectively at the extra foreign matter that produces of test process, and do not need to install additional cleaning unit driver part.
Those skilled in the art will understand other features from the detailed description that discloses illustrative embodiments of the invention below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is the skeleton view of the array detecting device of example.
Fig. 2 is the side view that comprises the array detecting device of clearer.
Fig. 3 is explanation when the figure during generation because foreign matter leads to errors on attached to substrate.
Fig. 4 is the come off sectional view of a part of unit of example.
Fig. 5 is the sectional view of the part of example clearer.
Fig. 6 is the sectional view of a part of clearer of the instance modification of Fig. 5.
Fig. 7 is the sectional view of a part of clearer of another instance modification of the clearer of Fig. 5.
Fig. 8 is the sectional view of a part of clearer of another instance modification of the clearer of Fig. 5.
Fig. 9 is the sectional view of a part with example clearer of pin.
Figure 10 is the sectional view of the part of the ultrasonic head of example.
Figure 11 is the sectional view of a part that comprises the example clearer of lid.
Figure 12 is the sectional view of a part of clearer of instance modification of the clearer of Figure 10.
Figure 13 is the sectional view of a part of clearer of instance modification of the clearer of Figure 11.
Figure 14 is the sectional view with example clearer of magnet unit.
In drawings and detailed description, use identical Reference numeral to represent parts, feature and structure, for the purpose of clear and convenient, the size and the ratio of some parts are amplified.
Embodiment
Following detailed is used to help the reader to obtain the complete understanding in method, device and/or the system of this introduction.For various variations, modification and of equal value replacement the in system, device and/or the method for this introduction is conspicuous for those of ordinary skills.For simplicity, omit description to known function and structure.
Array detecting device comprises probe assembly.Probe assembly is applied to voltage on the electrode that is formed on the substrate so that the electrod-array that is formed on the substrate is tested.
Particularly, probe assembly comprises cleaning unit.The cleaning unit that is equipped with for probe assembly removes foreign matter from substrate.Therefore, can remove effectively and may transmit substrate or drive the meticulous foreign matter that produces during the probe assembly.
Hereinafter, the technical pattern of the array detecting device that comprises cleaning unit will be introduced with reference to the accompanying drawings.
Fig. 1 is the skeleton view of exemplary arrays proving installation 100, and Fig. 2 is the side view that comprises the example proving installation 100 of cleaning unit.
As illustrated in fig. 1 and 2, array detecting device 100 comprises loading unit 70, unloading unit 80, modulator 20, detecting unit 60, light source 30 and probe assembly 300.
Loading unit 70 loads the substrate 90 for the treatment of test in array detecting device 100.The substrate 90 that is loaded by loading unit 70 moves into place in the zone of testing of light source 30 tops.Each loading unit 70 can comprise load plate and a plurality of airport 71.When substrate 90 floats,, transmit substrate by clamping unit 95 by pressure-air is sprayed onto from airport 71 on the bottom of substrate 90 above load plate.
Unloading unit 80 will be finished substrate 90 unloadings of test and come out.Each unloading unit 80 can comprise and unloads support plate and a plurality of airport 81.The same with the operation of loading unit 70, when above substrate 90 is unloading support plate, floating,, transmit substrate 90 by the clamping unit (not shown) by pressure-air is sprayed onto from airport 81 on the bottom of substrate 90.
Modulator 20 is arranged on the top surface top of substrate 90 and the top surface of very close substrate 90.Each modulator 20 can comprise electrode layer and photonic layer.The electrode layer of each modulator 20 it self and the electrode layer of substrate between form electric field, and can form by tin indium oxide (ITO), CNT (CNT) etc.In addition, the photonic layer of each modulator 20 changes the light quantity of passing wherein according to electric field level, and can be made up of liquid crystal, inorganic EL, Polymer Dispersed Liquid Crystal etc.
For example, when voltage was applied on the electrode layer of the electrode layer of substrate 90 and each modulator 20, the particular community of modulator 20 changed according to the existence of defective in the substrate.That is, when the electrode layer on being formed on substrate to be tested 90 does not have defective, form electric field in each modulator 20, the molecule of modulator 20 is arranged on specific direction, thereby makes light pass through modulator 20.On the contrary, during electrode layer defectiveness on being formed on substrate 90, do not form electric field in modulator 20, so the molecules align of modulator 20 do not change, light is also with regard to obstructed ovennodulation device.
Array detecting device 100 also can comprise optical fiber chuck (optic chuck) (not shown).The optical fiber chuck is arranged on below the substrate to be tested 90, and substrate 90 is positioned on the optical fiber chuck.The optical fiber chuck is made up of the transparent material such as glass.The optical fiber chuck can comprise a plurality of airports so that substrate 90 floats or remains on some places by adsorbing.
Each detecting unit 60 is arranged on the upper side of each modulator 20.Whether the variation of the particular community of detecting unit 60 measuring modulators is to exist defective in the electrode layer that detects substrate 90.For example, detecting unit 60 can be measured the light quantity of passing electrode layer according to the state that is formed on the electrode layer on the substrate 90, and uses signal processing unit to determine measurement data is to detect in the substrate 90 whether have defective.
Light source 30 relative modulators 20 are placed, and are inserted with substrate 90 between them.Light source 30 is to modulator 20 emission bright dippings.Pass through optical fiber chuck, substrate 90 and modulator from the fairing preface that light source 30 is launched, and arrive detecting unit 60.The example of light source 30 can comprise various types of light sources, such as xenon light source, sodium lamp, quartzy Halogen lamp LED and laser.
Each probe assembly 300 comprises probe rod 310 and prober frame 320.
Probe rod 310 comprises probe pins 312.Each probe pins 312 is applied to voltage on the electrode of substrate 90.In addition, prober frame 320 is connected to probe rod 310, drives probe rod 310 in one direction with respect to substrate 90.
Particularly, prober frame 320 comprises linear motor 321.Linear motor 321 forms and is fixed on the prober frame 320 along X-direction.Linear motor 321 is connected to X-axis slide unit 311, and X-axis slide unit 311 can prober frame 320 slips relatively on X-direction.
X-axis slide unit 311 is connected with Z axle driver element 315, and probe rod 310 is connected with Z axle driver element 315.And prober frame 320 is connected to Y-axis slide unit 330.Y-axis slide unit 330 is connected with Y-axis guide rail 340, and can slide on Y direction.
Therefore, prober frame 320 can move on Y direction relative to substrate 90, and probe rod 310 can move at X, Y and Z-direction relative to substrate 90.Probe pins 312 can move on the top of substrate 90 on X and Y direction, and can move up and down electrode with contact substrate 90 along Z-direction.
Particularly, cleaning unit 200 can be connected with prober frame 320.Correspondingly, drive cleaning unit 200 and prober frame 320 together so that foreign matter is removed from the top surface of substrate 90.Therefore, only use the driving power of the driving arrangement of prober frame 320 to drive cleaning unit 200, and do not need the driving arrangement that adds.
Therefore, a plurality of cleaning units 200 removably are connected to prober frame 320.If substrate 90 is bigger, can on a line, arrange cleaning unit 200 with predetermined space.Correspondingly, when substrate 90 passes through cleaning unit 200, can be by cleaning is clean fully.Equally, because can be, to the replacing of cleaning unit 200 with maintenance is easy to and convenient from prober frame 320 dismounting cleaning units 200.
And cleaning unit 200 relative prober frame 320 have at least one degree of freedom.That is, single clearing unit 200 can be connected with prober frame 320 and be removable on X-direction.Therefore, when on the X-direction when prober frame 320 moves, single clearing unit 200 can be removed foreign matter effectively from the top surface of substrate 90.In this case, when mobile, cleaning unit 200 can be removed foreign matter from whole base plate 90 on all three directions of X, Y and Z axle.
Cleaning unit 200 can be configured to operate when driving prober frame 320 on the top of substrate 90.Correspondingly, during the tester substrate each time when pixel electrode drives prober frame 320, cleaning unit 200 is clean substrate 90 repeatedly.
As an alternative, can dispose cleaning unit 200 operates when probe rod 310 moves regularly at substrate 90.Therefore, when transmitting substrate 90, can remove the foreign matter on the top surface of substrate 90 effectively by prober frame 320.
In addition, array detecting device 100 also can comprise sensing cell.Sensing cell detects the foreign matter that is attached on the substrate 90.In this case, when sensing cell detects foreign matter, start cleaning unit 200.And, can dispose the position that sensing cell is discerned foreign matter.
Fig. 3 is that explanation is when the figure that is attached to substrate 90 when causing making a mistake on the substrate 90 owing to foreign matter 9.Referring to Fig. 3, substrate 90 is near the following placement of modulator 20.On the top surface of substrate 90, form electrode 92,93 and 94.Suppose electrode 93 defectiveness, other electrode 92 and 94 does not have defective.At first, with the detection of introducing defective electrode, the influence of introduce foreign substances then.A plurality of liquid crystal molecules 1,2 and 3 are distributed in the modulator 20, and modulator 20 has the transparency electrode on the one surface of being formed at.
When being applied on each in the electrode 92,93 and 94 of the transparency electrode 21 of modulator 20 and substrate 90 when voltage, at modulator 20 with do not have to produce electric field 8 between the electrode 92 and 94 of defective.Liquid crystal molecule 1 around electric field 8 and 3 arrangement change, and the arrangement that is arranged in the liquid crystal molecule 2 in the zone that does not produce electric field does not change.The light beam 5,6 that sends from light source 30 and 7 can be by arranging the liquid crystal molecule 1 and 3 that has changed, but can not be by arranging the liquid crystal molecule 2 that does not change.Therefore, the light quantity by measurement penetrates might detect the defective that is formed on the substrate 90.
Some light beams 5 and 7 that send from light source 30 directly pass through liquid crystal molecule 1 and 3, and other light beam 6 can not pass through liquid crystal molecule 2.As a result, can detect defective in the electrode 93.
Yet if foreign matter 9 is attached on the substrate 90, what the light beam 7 that sends from light source 30 can not be had no effect passes through, but is refracted and scattering.Therefore, because foreign matter in the equipment of general type, will not have to possible errors the electrode 94 of defective to be defined as defectiveness.
Yet according to the present invention, cleaning unit 200 is removed foreign matter 9 from the top surface of substrate 90, thereby has reduced reliability wrong and the raising test.
Fig. 4 is the sectional view of a part of the unit 180 that comes off of example.As shown in Figure 4, cleaning unit 200 can comprise the unit 180 that comes off.The unit 180 that comes off removes foreign matter from substrate 90.The unit 180 that comes off can be an air ejector, to the top surface injection air of substrate 90.Air ejector inject high pressure air is with the surface isolation of foreign matter from substrate 90.
Fig. 5 is the sectional view of the part of example cleaning unit 200.As shown in Figure 5, cleaning unit 200 can comprise attraction unit 170.Attract unit 170 to absorb foreign matter or surrounding air.Therefore, not floating air from the foreign matter that substrate 90 is separated, thereby can remove fully from array detecting device 100.
Fig. 6 is the sectional view of the part of the cleaning unit 200 after the exemplary modification of Fig. 5, Fig. 7 is the sectional view of the part of the cleaning unit 200 after another exemplary modification of Fig. 5, and Fig. 8 is the sectional view of the part of the cleaning unit 200 after another exemplary modification of Fig. 5.
As shown in Figure 6, come off unit 180 and one attract unit 170 to be arranged side by side.As an alternative, as shown in Figure 7, the unit 180 that comes off has the attraction unit 170 that is positioned at its both sides.Correspondingly, attached to can be come off fully unit 180 and attract unit 170 to absorb of the foreign matter on the substrate 90 and dust in air particle, thereby can constantly keep clean environment.In addition, as shown in Figure 8, also can use an attraction unit 170 that is provided with the unit 180 that comes off in its both sides.
Fig. 9 is the sectional view of a part with example cleaning unit 200 of pin 171.As shown in Figure 9, attract unit 170 to comprise a plurality of pins 171.Each pin 171 (Z-direction) on perpendicular to the direction of the top surface of substrate 90 extends to the top surface of substrate 90.Be installed in the pin 171 that attracts on the unit 170 and produce the uprush that is inhaled in the suction opening.Therefore, the foreign matter around substrate 90 can easily be removed, and is inhaled in the attraction unit 170 through level and uprush.
Figure 10 is the sectional view of the part of the ultrasonic head 150 of example.Ultrasonic head 150 produce ultrasound waves with when the foreign matter activity with the surface removal of foreign matter from substrate 90.
Figure 11 is the sectional view that comprises a part of covering 160 example cleaning unit 200.As shown in figure 11, cleaning unit 200 also comprises and covers 160.
Lid 160 surrounds ultrasonic head 150 to be positioned, forms and ultrasonic head 150 predetermined gap apart.One side of lid 160 is connected to air ejector, forms to spray opening 161 with the jet surface air to substrate 90 on opposite side.
Secondly therefore, ultrasonic head 150 at first comes the surface isolation of foreign matter from substrate 90,, from covering 160 injection opening 161 ejection pressure-airs with foreign matter from the surface of substrate 90 separately, thereby has carried out cleaning more effectively.
Figure 12 is the sectional view of the part of the cleaning unit 200 after the instance modification of Figure 10, and Figure 13 is the sectional view of the part of the cleaning unit 200 after the instance modification of Figure 11.
As shown in figure 12, can be and attract each side of unit 170 that ultrasonic head 150 is set.And, as shown in figure 13, can be provided with and attract unit 170 for having each side of covering 160 ultrasonic head 150.
Although not shown, cleaning unit 200 can comprise the static absorber element.The static absorber element is eliminated the static attached to the foreign matter on the substrate 90, to reduce the adsorptive power of foreign matter.Therefore, cleaning unit 200 can more easily absorb foreign matter.
Figure 14 is the sectional view with example cleaning unit 200 of magnet unit 172.As shown in figure 14, cleaning unit 200 also can comprise magnet unit 172.Magnet unit 172 is with metallic foreign body sucking-off from the surface of substrate 90 or surrounding air.Magnet unit 172 can be by permanent magnet or high-speed double electromagnet.
Refer again to Fig. 3, metallic foreign body can stop between the electrode 92 and 94 of the transparency electrode 21 of modulator 20 and substrate 90 and forms electric field.Therefore, the magnet unit 172 of cleaning unit 200 is removed any metallic foreign body to reduce the probability that makes a mistake in the test and to improve testing reliability.
Therefore, utilize cleaning unit to remove and in the array test process, transmit the foreign matter that additionally produces during substrate or the operation probe assembly, thereby can reduce test errors and improve testing reliability.
And cleaning unit additionally is not installed in the array detecting device, thereby does not require the additional space that is used for cleaning unit, and can clean large-sized substrate and the cleaning unit driver part that do not need to add.
And, not floating from the particle that substrate is separated around substrate, and can clear out of array detecting device fully.
By the agency of comprise a plurality of exemplary embodiments of the array detecting device of cleaning unit.Yet, should be appreciated that and can carry out various modifications.For example, if carry out the technology of being introduced with different orders, if and/or the parts in the system of being introduced, structure, equipment or circuit make up in a different manner and/or by miscellaneous part or be equal to and replace that institute is replaced or additional, can obtain suitable result.Therefore, other embodiment falls within the scope of the present invention.

Claims (10)

1. array detecting device comprises:
Probe assembly is configured to voltage is applied to the electrode that is formed on the substrate testing the defective in the described electrode, and comprises the cleaning unit that is positioned on probe assembly one side.
2. array detecting device as claimed in claim 1, wherein, described probe assembly comprises: the probe rod comprises being used for voltage is applied to the probe pins that is formed on the electrode on the described substrate; Prober frame is connected to described probe rod, makes the probe rod to move in one direction relative to described substrate, and described prober frame is connected with described cleaning unit.
3. as the described array detecting device in one of claim 1 and 2, wherein, be provided with a plurality of dismountable cleaning units.
4. array detecting device as claimed in claim 2, wherein, described cleaning unit is operated on the length direction of described prober frame.
5. as the described array detecting device in one of claim 1 and 2, wherein, described cleaning unit comprises foreign matter from the unit that comes off that described substrate removes.
6. as the described array detecting device in one of claim 1 and 2, wherein, described cleaning unit comprises and is used for absorbing from the surface of described substrate or is included in the attraction unit of any foreign matter of surrounding air.
7. array detecting device as claimed in claim 6, wherein, described attraction unit comprises vertical described substrate and a plurality of pins that extend to described substrate.
8. array detecting device as claimed in claim 5, wherein, described cleaning unit comprises the hyperacoustic ultrasonic head of generation.
9. array detecting device as claimed in claim 8, wherein, described cleaning unit comprises being positioned as at a distance of the periphery of described ultrasonic head formation predetermined gap makes that air can be by the lid in this gap.
10. as the described array detecting device in one of claim 1 and 2, wherein, described cleaning unit comprises magnet unit, is used for metallic foreign body is removed from the surface of described substrate or from surrounding air.
CN2009102240884A 2009-08-03 2009-12-07 Apparatus for array test with cleaner units Pending CN101989396A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR10-2009-0071427 2009-08-03
KR1020090071427A KR101033776B1 (en) 2009-08-03 2009-08-03 Apparatus for array test with cleaner

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Publication Number Publication Date
CN101989396A true CN101989396A (en) 2011-03-23

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KR (1) KR101033776B1 (en)
CN (1) CN101989396A (en)
TW (1) TW201105988A (en)

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