201120435 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種基板之檢測裝置。 【先前技術】 就大眾所知，平面顯示器係一種輕薄型的影像顯示 器，它比傳統使用陰極射線管的顯示器更輕、更薄。平面 顯示器的種類繁多，目前已經被發展並使用的例如為液晶 顯示器、電漿顯示器、場發射顯示器、有機發光二極體顯 示器等。 其中，液晶顯示器具有複數液晶單元陣列設置，並依 據影像資料提供資料訊號至各液晶單元以調整各液晶單 元之光線穿透率進而顯示晝面。由於其薄型化、輕量化、 低耗電以及低操作電壓等優點*液晶顯不裔已被廣泛的使 用。以下簡述一種習知液晶顯示面板的製造方法。 首先，於一上基板形成一彩色渡光層及一共同電極 層，並於一下基板形成複數薄膜電晶體及晝素電極。上基 板與下基板係相對設置。然後，於上基板與下基板各形成 一配向層。之後，在配向膜上磨擦以提供一預傾角及一配 向方向來配向液晶層之液晶分子。其中，液晶層將會形成 於兩基板之間。 此外，依據一預定圖案在兩基板之至少一基板上塗 〆 膠，以形成框膠，藉以在兩基板之間形成一間隙，並避免 液晶洩漏到基板外。然後兩基板在維持一間隙的情況下封 201120435 合。之後，在兩基板之間形成液晶層，如此就製成液晶面 板。 在製造方法的過程中，需要有一檢測程序來檢驗下基 板（以下皆稱為基板，其上設置有薄膜電晶體及畫素電極） 是否有缺陷存在，例如設置於基板之資料線或掃描線的電 性連接是否良好、或是畫素單元之色彩的精確度。 一種習知用來檢測基板之檢測裝置係包含一光源、一 調支器以及一攝像器。其中，施加一預定壓力給調變器及 基板，使得調變器靠近基板。然後，若基板係無缺陷，在 調變器與基板之間會形成一電場。然而，若基板有缺陷的 情況下，調變器與基板之間便無法形成電場、或者所形成 電場之值較小。這樣，基板檢測裝置便可藉由量測在調變 器與基板之間之電場的大小來判斷基板是否有缺陷。 在基板檢測裝置的檢測過程中，若基板上有雜質、或 雜質存在於調變器與基板之間，則調變器與基板之間所形 成的電場，會導致錯誤或誤差的產生。在此情況下，就無 法精確地判斷基板是否具有缺陷。基於上述問題，如何提 供一種基板檢測裝置，能夠有效從基板上移除雜質，實為 當前重要課題之一。 【發明内容】 為解決上述習知技術所產生的問題，本發明之目的係 提供一種基板檢測裝置，能夠有效地將基板上、或位於調 變元件與基板之間的雜質移除。 4 201120435 為達成上述目的，本發明提供/種基板檢測裝置，其 係包含一調變元件、一支持框體、以及一去雜質單元。調 變元件係可上下移動地設置於一檢剎模組内。支持框體係 設置於調變元件之周園，一氣體通道設置於支持框體内， 且一氣體係經由氣體通道流向—基板。去雜質單元係設置 於一預設位置’並鄰設於調變元件，用以除去基板之雜質。 在本發明之—實施例中，去雜質單元包含一電磁鐵及 一電源供應器。電磁鐵係鄰設於調變元件，電源供應器係 供應電力至電磁鐵。 在本發明之一實施例中’去雜質單元包含一吸嘴及一 吸力產生盗。吸嘴係鄰設於調變元件。吸力產生器係與吸 噍連結，並提供吸力給吸嘴。 、令赏a之基板檢測裝置藉由鄰設於調變元件之電磁 鐵吸附磁f生雜質，便能將存在於基板或位於調變元件與基 ^之間的雜雜f除去。藉此，在基㈣檢測過程中，便 w：雜:在於基板上或位於調變元件與基板之間的磁 性雜質而導致錯誤或誤差產生。 而本翻之基板檢崎置可經由吸嘴吸入雜質， 在農位於賴元件與基板之_雜質。藉此， ==Γ’便能避免由存在於基板上或調變元 件與基板之間所導致的錯誤或誤差產生。 【實施方式】 説明依據本發明較佳實施例之 以下將參照相關圖式 5 201120435 基板檢測裝置，其中相同的元件將以相同的參照符號加以 說明。 如圖1所示，依據本發明第一實施例之一種基板檢測 裝置10係包含一承載單元20、一檢測單元30以及一卸載 單元40。承載單元20用以承載一基板S。檢測單元30係 檢測承載於承載單元20之基板S。卸載單元40係在基板 S檢測之後，將其從承載單元20上卸載下來。 承載單元係包含複數承載平台22,該等承載平台22 係以預設之距離間隔設置。承載單元20係用以支持待檢 測之基板S，並將其傳送至檢測單元30。 卸載單元40包含複數卸載平台42，該等卸載平台42 係以預設之距離間隔設置。卸載單元40用以支持檢測過 之基板S，並將其傳送至檢測裝置10之外。 另外，承載平台22與卸載平台42可分別設置複數排 氣孔24、44。氣體係從排氣孔24、44排出，並吹向基板 S以使基板S位於飄浮的狀態。此外，承載單元20與卸載 單元40更可設置一傳送組件70，其可藉由吸力來支持基 板S並傳送基板S。 檢測單元30用以檢測基板S，並判斷是否有電性上的 缺陷。檢測單元30包含一檢測平台31、一檢測組件32以 及一探針組件33。基板S係設置於檢測平台31上，檢測 組件32用以檢測基板S是否有電性上的缺陷，探針組件 33係傳送電性訊號至基板S上之電極。 檢測組件32係由一導引機構60所導引，導引機構60 6 201120435 係設置於檢測平台31之上，且在x方向具有一預設長度。 檢測組件32可藉由導引機構6〇而沿著X方向移動。在本 實施例中，檢測單元30係包含複數檢測組件32 ,該等檢 測檢測組件3 2係在X方向上間隔設置。 基板S係设置於仏測平台31上，而檢測組件32係位 於基板S之上並檢測基板S是否良好。各檢測組件32係 包含一檢測模組100以及一影像擷取單元9〇。檢測模組 1〇〇係鄰设於基板s並具有—調變元件12〇，影像擷取單 元90係擷取調變元件12〇之一影像。 在本實知例中，檢測單元守具有光線反射式與光線穿 透式兩種態樣。於反射態樣中，—光源係設置於檢測組件 3!内且反射層係設置於調變元件12〇具有一反射層。 以樣在光源發射光線進入調變元件之後，藉由量測 光線的量，便可判斷基板S是否具有缺 ^ L樣中’一光源係設置於檢測平台31上， =牛：:::入調變元件m之後，藉由量測穿透調 :發明中反身:：的量便可匈斷基板s是否具有缺陷。在 本發明中，反射與穿读 ^ 單元3〇。 逐的悲樣皆可應用於本實施例之檢測 請參照圖2及圖3 件12〇、一支持框體’撿測模、组100係包含調變元 21〇。調變元件120」1〜殼體110以及一去雜質單元 反射態幻或穿透率電材料層’其反射率（若為 調變元件⑽之間的透態樣）可依據在基板S與 电琢之大小而變化。支持框體130係 201120435 設置於調變元件120之周園。至少一氣體通道i3i係設置 於支持框體13G内’且氣體可經由氣體通道⑶吹向基板 s。調變元件12〇係可上下移動地由殼體ΐι〇支持。去雜 質單元210係設置於殼體m之一預設位置，並鄰設於調 變元件120 〇 支持才匚體130係可上下移動地設置於殼體削下方的 内周緣’藉此，調變元件⑽係可上下移動地設置於檢測 模組100。影像擷取單元90係設置於殼體11〇之上。 »周反元件12〇之光電材料層係可藉由能夠依據電場大 小而改變物理特性之材質所製成。如此-來，當電性訊號 施予基板S與調變元件120時，光電材料層之光線反射率 或光線穿透率便會依據基板S與調變元件12〇之間的電場 大小而改變。較佳者，光電材料層可包含聚合物分散型液 晶（polymer dispersed liquid crystal, PDLC)，其可依據電 場大小而產生一偏振方向，進而使入射光偏振化。 在本實施例中，至少一氣體通道131設置於支持框體 130内’並分別位於調變元件120的相對兩側，且氣體係 經由氣體通道131吹向基板s，藉以在調變元件120之一 下表面與基板S之一上表面之間形成一間隔G，且間隔〇 可藉由吹向基板S之氣體的量而得到最佳化的控制。 較佳者，氣體通道131係均勻地設置於支持框體130 的周緣，使得經由氣體通道131吹向基板S的氣體能夠產 生均勻的氣壓，進而穩定維持調變元件120與基板S之間 的間隔G。 201120435 7所述，當調變元件120接近基板s以檢測基板s 夺’讀係經由支持框體13G的氣體通道i3i排出並吹向 j。#此’調變元件12G能夠確實地避免震動，並且 月匕夠快逮地平行於基板8並_穩定。此外，藉由排出之 亂體’調變树12G能夠避免撞擊或接觸到基板S，進而 避免調變元件12G祕板S顺_傷。㈣，基板s與 調變讀120之間的間隔G可藉由控制氣體通道i3i所排 出氣體的量而調整。 如圖3及圖4所示，去雜質單元21〇包含一電磁鐵 211、一電源供應H 2Π、-開關213及一控制器214。電 磁鐵211係固设於殼體11〇，電源供應器212係供電給電 磁鐵211，開關213係控制電源供應器212與電磁鐵2ΐι 之間的電性連接’控制器214係控制電源供應器212以及 開關213。 备氣體經由氣體通道131流向基板s，且調變元件12〇 向基板s罪近以檢測基板s是否良好時，控制器214係控 制電源供應212以及開關213以使電力傳送至電磁鐵 2H。藉此，氣體係經由氣體通道131流出並吹向基板s， 使基板S上之雜質離開基板s，且被氣流帶走。同時，在 氣流中的磁性雜質係被電磁鐵211吸走。 在基板s之缺陷檢測操作完成之後，檢測組件32係 沿著導引機構60在X方向移動，並向遠離檢測平台31之 方向移動然後，^供應電磁鐵211之電源中斷時，吸附 於電磁鐵211的雜質會從電磁鐵211掉落。在本實施例中， 201120435 可藉由一收納容器來收集從電磁鐵211掉落的雜質。 承上所述，本發明第一實施例之基板檢測裝置藉由鄰 設於調變元件12〇之電磁鐵211吸附磁性雜質，便能將存 在於基板S或位於調變元件12〇與基板s之間的磁性雜質 除去。藉此’在基板S的檢測過程中’便能避免由存在於 基板S上或調變元件12〇與基板S之間的磁性雜質而導致 錯誤或誤差產生。 請參照圖5及圖6以說明本發明第二實施例之一種基 板檢測裝置。 在本發明第二實施例之基板檢測裝置中，一去雜質單 元220係包含一吸嘴221、一吸力產生器222、一連結閥 223、一控制器224以及一收集器225。其中，吸嘴221係 鄰設於調變元件120,並由突設於一殼體110。吸力產生 器222係提供吸力給吸嘴221。連結閥223係連結吸嘴221 與吸力產生器222。控制器224係控制吸力產生器222與 連結閥223。收集器225係設置於吸嘴221與吸力產生器 222之間，並收集被吸嘴221吸入之雜質。 就效率而論’吸嘴221的開口係朝向基板S為較佳。 另外，空氣壓縮機或真空產生機可應用於吸力產生器222。 在本實施例中，當調變元件120靠近基板移動以檢測 基板S是否良好時’氣體係由設置於支持框體13〇内之氣 體通道131流出並朝基板S方向吹去。在此過程中，控制 器224係控制吸力產生器222以及連結閥223，俾使吸嘴 221能夠藉由吸力而將氣體吸入。藉此，在基板s上之雜 201120435 =係被由氣體通道131所排出之氣體吹離基板s，並被氣 帶走同時在氣流中之雜質係藉由吸力而被吸嘴221 吸入。 ,另卜可在適當時間，例如完成基板s檢測程序之 後’ /月理去雜質單元22〇之收集$ 225。這樣，便可將去 雜質單元22G所收集的雜質完全除去。 承上所述’本發明第二實施例之基板檢測裴置可經由 吸嘴221吸收雜貝，而去除基板$上或位於調變元件12〇 ^基板s之間的雜質。藉此，在基板s的檢測過程中，便 j免由存在於基板s上或碰元件no與基板s之間的 雜質而導致錯誤或誤差產生。 為庄心者上述所有實施例的技術特徵可單獨實施、 2 口使用<»例如’第—實施例之去雜質單元2⑺以及 一貫施例之去雜質單元22〇可一同鄰設於調變元件120。 以上所述僅為舉例性，而非為限制性者。任何未 本發明之精神與範_，& 甘.任，_ 脫維 爪作/、乾可，而對其進行之等效修改或變更， 應包含於後附之申請專利範圍中。 勻 圖式簡單說明】 圖； 圖1為本發明較佳實施例之一種基板檢測褒置的示音 意圖； 圖2為圖1所示之基板檢測裝置之一種檢測模組的 不 11 201120435 圖3為圖2所示之檢測模組的剖面示意圖； 圖4為本發明第一實施例之基板檢測裝置之一去雜質 單元的方塊圖； 圖5為本發明第二實施例之基板檢測裝置之一檢測模 組的剖面不意圖，以及 圖6為圖5所示之基板檢測裝置之一去雜質單元的方 塊圖。 【主要元件符號說明】 10 :基板檢測裝置 20 :承載單元 22 :承載平台 24、44 :排氣孔 30 :檢測單元 31 :檢測平台 3 2 ·檢測組件 33 :探針組件 40 :卸載單元 42 :卸載平台 60 :導引機構 70 :傳送組件 90 :影像擷取單元 100 :檢測模組 110 :殼體 12 201120435 120 :調變元件 130 :支持框體 131 :氣體通道 210 :去雜質單元 211 :電磁鐵 212 :電源供應器 213 :開關. 214 :控制器 221 :吸嘴 222 :吸力產生器 223 :連結閥 224 :控制器 225 :收集器 G :間隔 S :基板201120435 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a substrate detecting device. [Prior Art] As far as the public is concerned, a flat panel display is a thin and light image display device which is lighter and thinner than a conventional display using a cathode ray tube. A wide variety of flat panel displays have been developed and used, for example, liquid crystal displays, plasma displays, field emission displays, organic light emitting diode displays, and the like. The liquid crystal display has a plurality of liquid crystal cell arrays, and provides data signals to the liquid crystal cells according to the image data to adjust the light transmittance of each liquid crystal cell to display the kneading surface. Due to its thinness, light weight, low power consumption, and low operating voltage, liquid crystal display has been widely used. A method of manufacturing a conventional liquid crystal display panel will be briefly described below. First, a color light-passing layer and a common electrode layer are formed on an upper substrate, and a plurality of thin film transistors and a halogen electrode are formed on the lower substrate. The upper substrate is disposed opposite to the lower substrate. Then, an alignment layer is formed on each of the upper substrate and the lower substrate. Thereafter, rubbing on the alignment film to provide a pretilt angle and an alignment direction to align liquid crystal molecules of the liquid crystal layer. Among them, the liquid crystal layer will be formed between the two substrates. Further, a glue is applied on at least one of the substrates of the two substrates in accordance with a predetermined pattern to form a sealant, thereby forming a gap between the substrates and preventing the liquid crystal from leaking out of the substrate. Then the two substrates are sealed with a gap of 201120435. Thereafter, a liquid crystal layer was formed between the two substrates, thus forming a liquid crystal panel. In the process of the manufacturing method, a test procedure is required to inspect whether the lower substrate (hereinafter referred to as the substrate on which the thin film transistor and the pixel electrode are disposed) is defective, such as a data line or a scan line disposed on the substrate. Whether the electrical connection is good or the color of the pixel unit is accurate. A conventional detecting device for detecting a substrate includes a light source, a modulator, and a camera. Wherein, a predetermined pressure is applied to the modulator and the substrate such that the modulator is adjacent to the substrate. Then, if the substrate is free of defects, an electric field is formed between the modulator and the substrate. However, if the substrate is defective, an electric field cannot be formed between the modulator and the substrate, or the value of the generated electric field is small. Thus, the substrate detecting device can determine whether the substrate is defective by measuring the magnitude of the electric field between the modulator and the substrate. In the detection process of the substrate detecting device, if impurities or impurities are present on the substrate between the modulator and the substrate, an electric field formed between the modulator and the substrate may cause an error or an error. In this case, it is impossible to accurately judge whether or not the substrate has a defect. Based on the above problems, how to provide a substrate detecting device capable of effectively removing impurities from a substrate is one of the current important issues. SUMMARY OF THE INVENTION In order to solve the problems caused by the above-described prior art, it is an object of the present invention to provide a substrate detecting apparatus capable of effectively removing impurities on a substrate or between a modulation element and a substrate. 4 201120435 In order to achieve the above object, the present invention provides a substrate detecting apparatus comprising a modulation element, a support frame, and a de-impurity unit. The modulation component can be disposed in a brake module by moving up and down. The support frame system is disposed on the periphery of the modulation component, a gas passage is disposed in the support frame, and the one gas system flows to the substrate via the gas passage. The impurity removing unit is disposed at a predetermined position and adjacent to the modulation element for removing impurities of the substrate. In an embodiment of the invention, the impurity removal unit comprises an electromagnet and a power supply. The electromagnet is placed adjacent to the modulation element, and the power supply supplies power to the electromagnet. In one embodiment of the invention, the 'de-impurity unit comprises a nozzle and a suction generating thief. The nozzle is adjacent to the modulation element. The suction generator is coupled to the suction and provides suction to the nozzle. The substrate detecting device of the present invention can remove the impurities f present between the substrate or the modulation element and the substrate by adsorbing magnetic impurities from the electromagnetic iron adjacent to the modulation element. Thereby, in the base (four) detection process, w:hetery: magnetic impurities on the substrate or between the modulation element and the substrate cause errors or errors. The substrate of the substrate can be inhaled by the nozzle, and the impurity is located in the element and the substrate. Thereby, ==Γ' can avoid errors or errors caused by the presence on the substrate or between the modulation element and the substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, reference will be made to the related art of the present invention, wherein the same elements will be described with the same reference numerals. As shown in FIG. 1, a substrate detecting apparatus 10 according to a first embodiment of the present invention includes a carrying unit 20, a detecting unit 30, and an unloading unit 40. The carrying unit 20 is used to carry a substrate S. The detecting unit 30 detects the substrate S carried on the carrying unit 20. The unloading unit 40 unloads the substrate S from the carrying unit 20 after it is detected. The bearer unit includes a plurality of load bearing platforms 22 that are arranged at predetermined distance intervals. The carrier unit 20 is for supporting the substrate S to be inspected and transmitting it to the detecting unit 30. The unloading unit 40 includes a plurality of unloading platforms 42 that are arranged at predetermined distance intervals. The unloading unit 40 is for supporting the detected substrate S and transmitting it to the outside of the detecting device 10. In addition, the load bearing platform 22 and the unloading platform 42 may be provided with a plurality of air venting holes 24, 44, respectively. The gas system is discharged from the vent holes 24, 44 and blown toward the substrate S so that the substrate S is in a floating state. Further, the carrying unit 20 and the unloading unit 40 may further be provided with a transporting unit 70 which can support the substrate S and transfer the substrate S by suction. The detecting unit 30 is configured to detect the substrate S and determine whether there is an electrical defect. The detection unit 30 includes a detection platform 31, a detection assembly 32, and a probe assembly 33. The substrate S is disposed on the detecting platform 31. The detecting component 32 is configured to detect whether the substrate S has electrical defects, and the probe component 33 transmits electrical signals to the electrodes on the substrate S. The detecting component 32 is guided by a guiding mechanism 60, and the guiding mechanism 60 6 201120435 is disposed above the detecting platform 31 and has a preset length in the x direction. The detecting assembly 32 is movable in the X direction by the guiding mechanism 6〇. In the present embodiment, the detecting unit 30 includes a plurality of detecting components 32 which are spaced apart in the X direction. The substrate S is disposed on the inspection platform 31, and the detecting component 32 is positioned above the substrate S and detects whether the substrate S is good. Each detection component 32 includes a detection module 100 and an image capture unit 9A. The detecting module 1 is disposed adjacent to the substrate s and has a modulation component 12A, and the image capturing unit 90 captures an image of the modulation component 12〇. In the present embodiment, the detecting unit has two modes of light reflection and light penetration. In the reflective aspect, the light source is disposed in the detecting component 3! and the reflective layer is disposed in the modulating component 12A and has a reflective layer. After the light source emits light into the modulation component, by measuring the amount of light, it can be determined whether the substrate S has a missing light source. The light source system is disposed on the detection platform 31, = cow:::: After the modulation element m, by measuring the penetration adjustment: the amount of reflexion in the invention: can be used to check whether the substrate s has defects. In the present invention, the reflection and the reading unit 3 are. The sadness can be applied to the detection of this embodiment. Please refer to Fig. 2 and Fig. 3, Fig. 12, a support frame, and the group 100 includes modulation elements. The modulation element 120"1~the housing 110 and a de-immiscing unit reflect the morphological or transmissive electrical material layer' its reflectivity (if the transmissive state between the modulation elements (10)) can be based on the substrate S and the electricity The size of the cockroach changes. The support frame 130 system 201120435 is disposed in the peripheral garden of the modulation element 120. At least one gas passage i3i is disposed in the support frame 13G' and the gas can be blown toward the substrate s via the gas passage (3). The modulating element 12 is supported by the housing 可ι〇 in a vertically movable manner. The impurity removing unit 210 is disposed at a preset position of the housing m, and is disposed adjacent to the modulation element 120. The supporting body 130 is disposed on the inner circumference of the housing under the movement of the housing. The component (10) is disposed on the detection module 100 so as to be movable up and down. The image capturing unit 90 is disposed above the casing 11A. » The photovoltaic element layer of the 12-turn element can be made of a material that can change the physical properties depending on the size of the electric field. Thus, when the electrical signal is applied to the substrate S and the modulation element 120, the light reflectance or light transmittance of the photovoltaic material layer changes depending on the magnitude of the electric field between the substrate S and the modulation element 12A. Preferably, the layer of photovoltaic material may comprise a polymer dispersed liquid crystal (PDLC) which produces a polarization direction depending on the magnitude of the electric field, thereby polarizing the incident light. In this embodiment, at least one gas passage 131 is disposed in the support frame 130 and is respectively located on opposite sides of the modulation component 120, and the gas system is blown to the substrate s via the gas passage 131, thereby being used in the modulation component 120. A gap G is formed between the lower surface and an upper surface of the substrate S, and the spacing 〇 can be optimally controlled by the amount of gas blown toward the substrate S. Preferably, the gas passages 131 are uniformly disposed on the periphery of the support frame 130 such that the gas blown toward the substrate S via the gas passages 131 can generate a uniform gas pressure, thereby stably maintaining the interval between the modulation element 120 and the substrate S. G. As described in 201120435, when the modulation element 120 approaches the substrate s to detect the substrate s, the read system is discharged through the gas channel i3i of the support frame 13G and blown toward j. The # this modulation element 12G can surely avoid vibration, and the moon is fast enough to be parallel to the substrate 8 and stabilized. In addition, by displacing the disordered body' modulation tree 12G, it is possible to avoid impact or contact with the substrate S, thereby avoiding the slashing of the modulating element 12G. (d) The interval G between the substrate s and the modulation read 120 can be adjusted by controlling the amount of gas discharged from the gas passage i3i. As shown in FIG. 3 and FIG. 4, the impurity removing unit 21A includes an electromagnet 211, a power supply H2, a switch 213, and a controller 214. The electromagnet 211 is fixed to the casing 11 〇, the power supply 212 is supplied to the electromagnet 211, and the switch 213 controls the electrical connection between the power supply 212 and the electromagnet 2 '. The controller 214 controls the power supply 212. And a switch 213. When the standby gas flows to the substrate s via the gas passage 131, and the modulation element 12 approaches the substrate sin to detect whether the substrate s is good, the controller 214 controls the power supply 212 and the switch 213 to transmit power to the electromagnet 2H. Thereby, the gas system flows out through the gas passage 131 and is blown toward the substrate s, so that the impurities on the substrate S are separated from the substrate s and carried away by the gas flow. At the same time, the magnetic impurities in the gas stream are sucked away by the electromagnet 211. After the defect detecting operation of the substrate s is completed, the detecting component 32 moves in the X direction along the guiding mechanism 60, and moves away from the detecting platform 31, and then, when the power supply to the electromagnet 211 is interrupted, the electromagnetic magnet is adsorbed to the electromagnet. The impurities of 211 will fall from the electromagnet 211. In the present embodiment, 201120435 can collect impurities dropped from the electromagnet 211 by a storage container. As described above, the substrate detecting device of the first embodiment of the present invention can be present on the substrate S or on the modulation element 12 and the substrate s by adsorbing magnetic impurities by the electromagnet 211 disposed adjacent to the modulation element 12 . The magnetic impurities are removed between. Thereby, it is possible to avoid the occurrence of errors or errors due to magnetic impurities existing on the substrate S or between the modulation element 12 and the substrate S during the detection of the substrate S. Referring to Figures 5 and 6, a substrate detecting apparatus according to a second embodiment of the present invention will be described. In the substrate detecting apparatus of the second embodiment of the present invention, a de-contaminating unit 220 includes a suction nozzle 221, a suction generator 222, a connection valve 223, a controller 224, and a collector 225. The nozzle 221 is disposed adjacent to the modulation element 120 and protrudes from a housing 110. The suction generator 222 provides suction to the nozzle 221. The connection valve 223 connects the suction nozzle 221 and the suction force generator 222. The controller 224 controls the suction generator 222 and the coupling valve 223. The collector 225 is disposed between the suction nozzle 221 and the suction generator 222, and collects impurities sucked by the suction nozzle 221. As far as efficiency is concerned, the opening of the nozzle 221 is preferably directed toward the substrate S. In addition, an air compressor or a vacuum generator can be applied to the suction generator 222. In the present embodiment, when the modulation element 120 moves closer to the substrate to detect whether the substrate S is good or not, the gas system flows out of the gas passage 131 provided in the support frame 13A and blows toward the substrate S. In the process, the controller 224 controls the suction generator 222 and the coupling valve 223 so that the suction nozzle 221 can suck the gas by suction. Thereby, the impurities on the substrate s 201120435 = are blown off the substrate s by the gas discharged from the gas passage 131, and are carried away by the gas while the impurities in the gas flow are sucked by the suction nozzle 221 by suction. Alternatively, the collection of the impurity unit 22 may be $225 after the appropriate time, for example, after the completion of the substrate s detecting procedure. Thus, the impurities collected by the impurity removing unit 22G can be completely removed. The substrate detecting device of the second embodiment of the present invention can absorb the miscellaneous shells via the suction nozzle 221, and remove the impurities on the substrate $ or between the modulation elements 12 基板 ^ substrate s. Thereby, during the detection of the substrate s, the occurrence of errors or errors due to impurities existing on the substrate s or between the element no and the substrate s is prevented. For those skilled in the art, the technical features of all the above embodiments can be separately implemented, and the two-port use <», for example, the de-impurity unit 2 (7) of the first embodiment and the de-impurity unit 22 of the consistent embodiment can be disposed adjacent to the modulation element. 120. The above is intended to be illustrative only and not limiting. Any spirit and scope of the present invention and the equivalents of the invention may be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic illustration of a substrate detecting device according to a preferred embodiment of the present invention; FIG. 2 is a scanning module of the substrate detecting device shown in FIG. FIG. 4 is a block diagram of an impurity removing unit of a substrate detecting device according to a first embodiment of the present invention; FIG. 5 is a block diagram of a substrate detecting device according to a second embodiment of the present invention; The cross section of the detecting module is not intended, and FIG. 6 is a block diagram of one of the substrate detecting devices shown in FIG. [Main component symbol description] 10: Substrate detecting device 20: carrying unit 22: carrying platform 24, 44: exhaust hole 30: detecting unit 31: detecting platform 3 2 · detecting component 33: probe assembly 40: unloading unit 42: Unloading platform 60: guiding mechanism 70: conveying assembly 90: image capturing unit 100: detecting module 110: housing 12 201120435 120: modulation element 130: supporting frame 131: gas channel 210: de-contaminating unit 211: electromagnetic Iron 212: power supply 213: switch. 214: controller 221: suction nozzle 222: suction generator 223: connection valve 224: controller 225: collector G: interval S: substrate