CN102314004A - Array test device - Google Patents
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- CN102314004A CN102314004A CN2010102833505A CN201010283350A CN102314004A CN 102314004 A CN102314004 A CN 102314004A CN 2010102833505 A CN2010102833505 A CN 2010102833505A CN 201010283350 A CN201010283350 A CN 201010283350A CN 102314004 A CN102314004 A CN 102314004A
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Abstract
The invention discloses an array test device which is applied for detecting whether there is a fault in a substrate or not. The array test device comprises a testing module and a gap measuring unit. The testing module comprises a modulator with a first surface facing the substrate. The gap measuring unit comprises a base surface and a distance measuring device. The base surface is located on the testing module which makes the first surface face the base surface. The distance measuring device is applied for measuring the gap between the first surface and the base surface. Therefore, the array test device provided in the invention and equipped with the measuring module has a simplified structure.
Description
Technical field
Present invention relates in general to array detecting device.
Background technology
The development of our information society has strengthened to the demand of display and to the diversification of demand of display.In order to satisfy these demands, various flat-panel monitors have been developed recently such as LCD (LCD), plasma display (PDP), electroluminescent display (ELD), vacuum fluorescent display (VFD) etc.
Possessed the performance that strengthens because of the fast development of semiconductor technology makes LCD, and it is substituting existing cathode ray tube (CRT).Because LCD has good and the little and light weight and low in energy consumption of size of display quality, therefore uses widely.
Therefore; Not only be widely used in small-size portable device as a kind of LCD in the flat-panel monitor, also be applied to the TV (televisor) such as receiving broadcast signal and display image, display of computing machine or the like such as mobile phone, PDA (personal digital assistant) and PMP (portable media player) etc.
LCD is such image display: it shows the expection image one by one to provide to the liquid crystal cells that is arranged as matrix shape based on the data of image information signal and with this mode of controlling the light transmission of liquid crystal cells.
LCD comprises liquid crystal layer, and said liquid crystal layer is arranged between thin film transistor (TFT) (hereinafter being called " TFT ") substrate that forms a plurality of pattern of pixels and the colored filter substrate that forms chromatic filter layer.Liquid crystal layer determines whether allowing light transmission according to the electric signal that is applied.
In a kind of method of making such LCD, on the TFT substrate, form a plurality of gate lines, a plurality of data line, a plurality of pixel electrode and a plurality of TFT.Arrange gate line along a direction.Along direction layout data line perpendicular to gate line.On each pixel region that limits the intersection between gate line and data line, form pixel electrode.TFT is that the signal by gate line comes switch, and its signal with data line transfers to corresponding pixel electrode.
In addition, on colored filter substrate, form black matrix", RGB chromatic filter layer and common electrode.The black matrix" block light is passed the zone of non-pixel region.The RGB chromatic filter layer shows color.Common electrode is used for realizing image.
Afterwards, alignment film is applied to TFT substrate and colored filter substrate respectively.The friction matching film is so that provide tilt angle and orientation for the liquid crystal molecule in the liquid crystal layer that will between TFT substrate and colored filter substrate, form subsequently.
After this, form sealant pattern through at least one that fluid sealant is applied in the substrate, with keep between substrate the gap, prevent the gap between liquid crystal leakage and hermetic sealing substrate.Subsequently, between substrate, form liquid crystal layer, thereby accomplish liquid crystal panel.
In said process, test TFT substrate whether defective operation be the broken string through for example detecting gate line or data line and open, or whether defectiveness is realized to detect circuit on the TFT substrate.
Array detecting device is used for test base.Array detecting device comprises test module that is equipped with modulator and the probe assembly that is equipped with a plurality of probe pins.
In array detecting device, probe pins is connected with electrode on being arranged in substrate to be measured.Under this state, make between modulator and the substrate and form electric field through apply electric signal to electrode.Confirm the defective of substrate according to the amplitude of electric field.
Afterwards, test module is moved to another part of substrate, and repeat above-mentioned test.Through carrying out whether defectiveness of whole zone that these processes come test base times without number.
This need accurately be provided with the gap between substrate and the test module, to improve the reliability of test.In present technology, the gap between substrate and the test module is to measure and be provided with through the distance-measuring device that in test module, is provided with.
Yet,, therefore have the baroque problem of test module because distance-measuring device is arranged in the test module.This has increased makes the test module must be with the burden that moves at a high speed the substrate top and receive accurate control.
Summary of the invention
Therefore, propose the present invention to the above problem that is produced in the prior art, and the purpose of this invention is to provide a kind of array detecting device that comprises test module with simple structure.
In order to realize the above object, one aspect of the present invention provides a kind of whether defective array detecting device of test base that is used for, and comprising: test module, and said test module comprises modulator, said modulator has the first surface towards substrate; And clearance measurement unit; Said clearance measurement unit has basal plane and distance-measuring device; Said basal plane is positioned at the position that test module can move to makes first surface towards said basal plane, and said distance-measuring device is used to measure the gap between first surface and the basal plane.
Array detecting device can also comprise: lifting unit, said lifting unit mobile test module; And control module, said control module is to control the gap between first surface and the substrate according to the mode of being operated lifting unit by the data in measured first surface in clearance measurement unit and the gap between the basal plane.
Another aspect of the present invention provides a kind of whether defective array detecting device of test base that is used for, and comprising: test module, and said test module comprises the framework that supports modulator, said framework has the second surface towards substrate; With the clearance measurement unit; Said clearance measurement unit has basal plane and distance-measuring device; Said basal plane is positioned at the position that test module can move to makes second surface towards basal plane, and said distance-measuring device is used to measure the gap between second surface and the basal plane.
Array detecting device can also comprise: lifting unit, said lifting unit mobile test module; And control module, said control module is to control the gap between second surface and the basal plane according to the mode of being operated lifting unit by the data in measured second surface in clearance measurement unit and the gap between the basal plane.
Array detecting device can also comprise the test cell that is placed with substrate on it, and wherein, the clearance measurement unit is positioned at the pre-position of network topology testing unit.
Basal plane can have identical height with the test cell of placement substrate on it.
Description of drawings
In conjunction with accompanying drawing, to specific descriptions of the present invention, can know aforesaid purpose, characteristic, aspect and the advantage with other of the present invention by following more, wherein:
Fig. 1 is the stereographic map according to the array detecting device of the embodiment of the invention;
Fig. 2 illustrates to be used for according to the mounting blocks of the test module of array detecting device of the present invention and the exploded perspective view of modulator block;
Fig. 3 is the mounting blocks of Fig. 2 and the combination stereogram of modulator block;
Fig. 4 and Fig. 5 illustrate among Fig. 2 to couple mutually with mounting blocks so that the sectional view of the structure of the modulator block that can move up or down with respect to mounting blocks;
Fig. 6 and Fig. 7 are that diagram is measured the sectional view according to the method in the modulator block of array detecting device of the present invention and the gap between the clearance measurement unit; And
Fig. 8 is a diagram according to the sectional view of the relative position of the basal plane of the clearance measurement unit of array detecting device of the present invention and test cell.
Embodiment
Hereinafter will combine accompanying drawing to describe the preferred embodiments of the present invention in detail.Then, the present invention should not be construed as limited to the embodiment described in the literary composition.But, provide these embodiment to make the disclosure can scope of the present invention fully be conveyed to those skilled in the art.
Below will combine Fig. 1 to Fig. 5 to specify array detecting device according to the embodiment of the invention.
Fig. 1 is the stereographic map according to the array detecting device 10 of the embodiment of the invention.Fig. 2 illustrates the mounting blocks 210 of the test module 200 that is used for array detecting device 10 and the exploded perspective view of modulator block 220.Fig. 3 is the combination stereogram of mounting blocks 210 and modulator block 220.Fig. 4 and Fig. 5 illustrate to couple mutually with mounting blocks 210 so that the sectional view of the structure of the modulator block 220 that can move up or down with respect to mounting blocks 210.
Whether array detecting device 10 test base S have electric defective, such as the circuit defect that on substrate S, forms.
Substrate S can be arranged on the substrate in the flat-panel monitor, and for example, it can be TFT (thin film transistor (TFT)) substrate of LCD (LCD).
Loading unit 600 can comprise two first back up pads 610 at least.The distance that first back up pad, 610 each intervals are predetermined.First back up pad 610 supports the substrate S to be measured on it and substrate S is delivered to test cell 300.
For whether test base S has electric defective, on substrate S, form electrode, thereby make electric signal be applied to said electrode.The quantity and the position of the electrode that can change substrate S according to the size and the position of the panel area on the substrate S.
In addition, array detecting device 10 also comprises probe assembly 900, and said probe assembly 900 is applied to the electrode of substrate S with electric signal, places the substrate S defectiveness whether on the test cell 300 with test.Probe assembly 900 comprises probe (not shown) and probe pins (not shown).The quantity and the position of the electrode on the quantity of probe and probe pins and position and the substrate S are corresponding.
In exemplary embodiment, test module 200 can be included in a plurality of test modules 200 of going up the position layout of each interval along the bearing of trend of support bar 800 (X-direction).Each test module 200 comprises modulator block 220, mounting blocks 210, image unit 230 and lifting unit 250.
The lifting unit 250 of test module 200 moves up or down mounting blocks 210.The hydraulic cylinder of for example being operated by hydraulic pressure, the various devices of the linear motor of perhaps operating alternately through the electromagnetism between stator and the mover can be used as lifting unit 250, as long as it can move up or down mounting blocks 210.
In addition, array detecting device 10 also comprises the control module (not shown), said control module control lifting unit 250, thus can adjust the gap between modulator block 220 and the substrate S.
According to method of operating, array detecting device is divided into two types, comprises array detecting device that utilizes reflection method and the array detecting device that utilizes optical transmission method.In reflectometry, light source is placed with test module 200, and the modulator 225 of test module 200 is provided with the reflection horizon.Like this, get into measurement is reflected by the reflection horizon of modulator 225 after the modulator 225 light quantity through the light that sends at light source and confirm whether defectiveness of substrate S.
In transmission beam method, light source is arranged on test cell 300 belows.Confirm whether defectiveness of substrate S through the light quantity of measuring the light transmission modulator 225 that sends from light source.
Maybe can adopt reflection method maybe can adopt optical transmission method according to array detecting device of the present invention.
In the present invention, the gap between measurement clearance measuring unit 400 and the modulator block 220 is to be provided with the gap between substrate S and the modulator block 220.Do like this is because can prevent to produce such as because the contacting or the problem of pollution, scuffing and damage that substrate S that collision causes is surperficial of substrate S and modulator block 220.Hereinafter will specify the method in the gap between this measurement clearance measuring unit 400 and the modulator block 220.
Distance-measuring device 500 is included in the distance-measuring device 500 of the desired amt that the pre-position of clearance measurement unit 400 is provided with.Along with the quantity of distance-measuring device 500 increases, the degree of accuracy raising during gap between measurement clearance measuring unit 400 and the modulator block 220.
Unloading unit 700 is arranged on the position of network topology testing unit 300.Substrate S through test moves to unloading unit 700 from test cell 300, transfers out array detecting device 10 by unloading unit 700 then.Unloading unit 700 can comprise second back up pad 710, and said second back up pad 710 supports test base S and the regular gap of each interval on it.
Preferably, can form the gas hole 620 and 720 of second back up pad 710 of first back up pad 610 of passing loading unit 600 and unloading unit 700 respectively.In the case, blow to substrate S with predetermined pressure through gas hole 620 and 720.Gas hole 620 is connected with the positive pressure source that is used to supply air with 720.In addition, can in loading unit 600 and unloading unit 700, adsorption element 630 be set, keep the lower surface of substrate S to utilize absorption affinity.
When substrate S places 610 last times of first back up pad, blow through gas hole 620, so that substrate S suspends.Begin from this state, adsorption element 630 moves up and utilizes absorption affinity to keep the lower surface of substrate S.Afterwards, adsorption element 630 moves so that substrate S is moved to test cell 300 along Y direction.In adsorption element 630, be formed with adsorption hole.Adsorption hole be connected through the air-breathing negative pressure source of adsorption hole.
After being transported to substrate S on the test cell 300, interrupt blowing from the gas hole 620 of first back up pad 610.Respective electrode with the probe pins (not shown) align substrates S of probe assembly 900.Subsequently, test cell 300 test base S defectiveness whether.
In order to test, the operation through lifting unit 250 moves down mounting blocks 210, thereby between modulator block 220 and substrate S, forms suitable gap.When modulator 225 (referring to Fig. 2) during near the upper surface of substrate S, to the electrode application voltage of modulator 225.
Then, between substrate S and modulator 225, produced electric field.From light source send and by modulator 225 reflection or the light quantity that sees through modulator 225 with electric field change.Image through utilizing the captured modulator 225 of image unit 230 is analyzed light quantity, can measure the amplitude of the electric field that is produced between substrate S and the modulator 225.
Can utilize measured electric field amplitude to confirm whether defectiveness of substrate S.Particularly, if substrate S does not have defective, then formation is in the standard electric field in the preset range between modulator 225 and substrate S.Yet, if substrate S is defective, between modulator 225 and substrate S, can not form electric field, perhaps form non-type electric field.
Like this, after a part of having tested substrate S at least, the operation through lifting unit 250 moves up mounting blocks 210, makes that the gap between modulator block 220 and the substrate S becomes than big in the formed gap of test period.Subsequently, test module 200 is towards another desired portions of substrate S and above moving to test cell 300 along support bar 800 on the X-direction, thereby perhaps substrate S is positioned on the test cell 300 another desired portions of substrate S along y-axis shift is moving.Afterwards, the said desired portions of test base S.Also repeatedly carry out these processes continuously, test up to Zone Full with substrate S.
In the method, test module 200 can move along support bar 800 on X-direction, and substrate S can move along Y direction by loading unit 600, test cell 300 and unloading unit 700.Therefore, with the mode along X-direction or suitably mobile test module of Y direction 200 or substrate S, whether a part that at least can test base S defectiveness.
Yet array detecting device 10 of the present invention is not limited to the array detecting device among Fig. 1.For example, whether array detecting device 10 can be configured at test base S during defectiveness, substrate S is fixed on the static back up pad test module 200 is moved along X axle or Y direction.Alternatively, can remain static about horizontal direction with test module 200 and only make substrate S come test base S along the mode that X-direction or Y direction move.
After accomplishing test, substrate S is transferred out array detecting device 10 by second back up pad 710.
Referring to Fig. 2, test module 200 shown in Figure 1 comprises mounting blocks 210 and modulator block 220.
Mounting blocks 210 can have the frame shape of hollow, thereby modulator block 220 is taken by the image unit that is positioned at mounting blocks 210 tops 230.
Modulator block 220 couples with mounting blocks 210 mutually, so that can move, and liftable especially.Modulator block 220 comprises modulator 225, framework 223 and removable 221.Modulator 225 forms the electric field between itself and the substrate S, thereby confirms the defective of substrate S based on the amplitude of electric field.Framework 223 surrounds and supports modulator 225.Utilize for removable 221 pull of vacuum to keep framework 223.
After modulator block 220 is placed adjacent substrates S part, when the respective electrode of the electrode of the modulator 225 of modulator block 220 and substrate S all is applied with voltage, between substrate S and modulator 225, produce electric field.
The amplitude of electric field is different between the defective part of substrate S and normal part, makes the desired portions defectiveness whether that can detect substrate S through the variation of electric field amplitude.
In addition, modulator 225 has towards the first surface 225-1 of substrate S, test cell 300 or clearance measurement unit 400.
Utilize vacuum adsorption force to make modulator 225 and framework 223 remain in removable 221.Be coupled to mounting blocks 210 by coupler member 222 for removable 221, so that can move up or down.
Referring to Fig. 3, coupler member 222 and removable 221 part that couples be inserted into respectively in mounting blocks 210, form couple recess 215.
The structure that modulator block 220 and mounting blocks 210 are coupled can adopt various exemplary embodiments.In an exemplary embodiment, like Fig. 4 and shown in Figure 5, the bottom of coupler member 222 is by extremely removable 221 of screw retention.The upper end of coupler member 222 is inserted the corresponding of mounting blocks 210 and is coupled in the recess 215, so that can move up or down.
In order to prevent that removable 221 undesirably breaks away from mounting blocks 210, couple at each and to be formed with stopper section 211 in the recess 215, and the upper end of corresponding coupler member 222 is crooked, thus make it by stopper section 211 backstops.
Like this, prevented that removable 221 breaks away from mounting blocks 210.Under this state, the upper end of coupler member 222 moves up in the recess 215 or moves down corresponding coupling, thereby can the gap between mounting blocks 210 and removable 221 be adjusted to the distance of K1 for example or K2.
In at least three of four sides of mounting blocks 210, form and couple recess 215, couple with mounting blocks 210 more reliably thereby make removable 221.And, coupler member 222 is installed in is formed in the mounting blocks 210 each and couples in the recess 215.
In addition, can the air bearing (not shown) be installed between mounting blocks 210 and modulator block 220, to prevent that modulator block 220 moves to left or moves to right when test module 200 moves.
Simultaneously, come whether defectiveness of test base, the modulator block 220 of array detecting device and the gap between the substrate S importantly are set in order to utilize array detecting device 10.
Along with the gap turn narrow between modulator block 220 and the substrate S, formed electric field becomes sufficient between the electrode of the electrode of modulator 225 and substrate S, and whether defective degree of accuracy improves thereby make test base S.Yet, in the case, possibly exist such as contacting or collide the problem that produces to pollution, scuffing or the damage on the surface of substrate S and/or modulator 225 because of substrate S and modulator 225.
On the contrary, along with the gap between modulator block 220 and the substrate S broadens, because of between modulator block 220 and the substrate S contact or problem that collision causes reduces, but test base S whether defective degree of accuracy reduces.
Preferably; At test base S whether during defectiveness; Must the gap between substrate S and the modulator 225 be arranged on several microns (μ m) to the scope of tens microns (μ m); Between the electrode with the electrode that guarantees modulator 225 and substrate S enough electric field intensity is arranged, and avoid contacting or the problem of collision between modulator block 220 and the substrate S.
In addition, when modulator block 220 moves other parts with test base S upwards, downwards, to the left or to the right with respect to substrate S, the gap that the gap between substrate S and the modulator block 220 must be when testing.
For example; If the gap when testing between substrate S and the modulator block 220 is arranged in the scope of 20 μ m to 40 μ m; Then desirable situation is when modulator block 220 is moved to the left with respect to substrate S or moves right, and the gap between substrate S and the modulator block 220 is set to 80 μ m to 100 μ m.
Simultaneously, in modulator block 220, be provided with the insufflation unit (not shown) of blowing towards substrate S, with the gap between adjustment substrate S and the modulator block 220 with predetermined pressure.In addition, in the framework 223 of modulator block 220, be formed with gas hole 224a and gas hole passage 224b, thereby air is blown out towards substrate S from insufflation unit through gas hole 224a and gas hole passage 224b (referring to Fig. 2).
Insufflation unit can comprise the low pressure insufflation unit of the air that blows out relatively low pressure and the high pressure blow-gas unit that blows out the air of relatively high pressure.Desirable situation is alternately to arrange low pressure insufflation unit and high pressure blow-gas unit.
In this situation, when modulator block 220 with respect to substrate S upwards, downwards, when moving to the left or to the right, operate low pressure insufflation unit and high pressure blow-gas unit simultaneously, with the gap between increase substrate S and the modulator block 220.On the other hand, as test base S whether during defectiveness, operation low pressure insufflation unit so that the gap between substrate S and the modulator block 220 minimize.The operation of insufflation unit is not limited thereto instance.
Like this, owing to utilize air to regulate the gap between modulator block 220 and the substrate S, necessary is measures in advance when testing and to be the pressure of the required air in maintenance gap for the pressure that keeps the required air in gap and when modulator block 220 moves.
Fig. 6 is that diagram is measured the sectional view according to the method in the modulator block 220 of array detecting device of the present invention and the gap between the clearance measurement unit 400.
For be provided with and modulator block 220 and substrate S between wait to establish the corresponding air pressure in gap, at first test module 200 is moved to 400 tops, clearance measurement unit.Afterwards, the lifting unit 250 through operational testing module 200 moves up or down mounting blocks 210.At this moment, come the gap of the variation between measuring modulator piece 220 and the clearance measurement unit 400 by distance-measuring device 500.Thus, obtain and the corresponding gaseous tension amount in desirable gap.
When whether test base S has electric defective,, control the first surface 225-1 of modulator 225 and the gap between the substrate S through operating lifting unit 250 based on clearance measurement unit 400 measured gap data.
In other words, for be formed on the required gap of test period or when modulator block 220 moves required gap, according to test or move modulator block 220 actually, blow with clearance measurement unit 400 measured suitable pressure.Therefore, testing or can be provided with during mobile modulator block 220 and suitably keeping the gap between modulator block 220 and the substrate S.
Here, distance-measuring device 500 is arranged in the position towards the modulator 225 of modulator block 220 of clearance measurement unit 400.Desirable situation is that distance-measuring device 500 places towards the position at modulator 225 edges.
In addition; Between modulator block 220 and substrate S, form the required air pressure amount of appropriate gap in order to measure; As shown in Figure 7, by the gap that is arranged between the second surface 223-1 of basal plane 410 and framework 223 that distance-measuring device 500 in the clearance measurement unit 400 comes measurement clearance measuring unit 400.Store together with gap width with the corresponding air pressure of desirable gap width.
The second surface 223-1 of basal plane 410 frame orienteds 223 of clearance measurement unit 400.
In addition, as test base S whether during defectiveness,, come the second surface 223-1 of control framework 223 and the gap between the substrate S through operating lifting unit 250 based on clearance measurement unit 400 measured gap data.
Because if distance-measuring device 500 is forming towards the position of modulator 225 in clearance measurement unit 400 when measurement clearance; Therefore then possibly damage the surface of modulator 225, distance-measuring device 500 is formed on the position towards the framework 223 of modulator block 220 in the clearance measurement unit 400.
The employed distance-measuring device of array detecting device of the present invention is not limited to the particular distance measurement mechanism.Can use contact-type distance-measuring device or non-contact type distance-measuring device.Can use the for example any sensor or the plant equipment of LVDT (linear variable-differential transformer), laser sensor, load sensor etc., as long as it can measuring distance.
Like this; Gap between measuring modulator piece 220 and the clearance measurement unit 400 is provided with the gap between modulator block 220 and the substrate S, because this can prevent when mounting blocks 210 moves up or move down with measurement clearance such as contacting or collide the problem to pollution, scuffing and the damage on substrate S surface that produces because of substrate S and modulator block 220.
In addition, in array detecting device according to the present invention, distance-measuring device 500 is arranged in the clearance measurement unit 400 as individual component, rather than is arranged in the test module 200.Like this, simplified the structure of test module 200.In addition and since simplified must with at a high speed upwards, downwards, the structure of the test module 200 that moves to the left or to the right, can reduce the load that is applied to test module 200.Therefore.Can improve the reliability of test significantly.
Fig. 8 is that diagram is according to the basal plane 410 of the clearance measurement unit 400 of array detecting device of the present invention and the sectional view of the relative position of test cell 300.
As shown in Figure 8, desirable situation is that clearance measurement unit 400 is placed network topology testing unit 300 parts, and the basal plane 410 of clearance measurement unit 400 with its on be placed with the test cell 300 of substrate S the surface have identical height.
As implied above, in array detecting device according to the present invention, distance-measuring device is arranged in the clearance measurement unit as individual component, rather than is arranged in the test module.Like this, simplify the structure of test module, thereby can reduce the load that is applied to test module.Therefore.Can improve the reliability of test significantly.
In addition, in the present invention, the gap between measurement clearance measuring unit and the modulator block is based on the gap of measuring between clearance measurement unit and the modulator block then the gap between substrate and the modulator block is set.Therefore, the present invention can avoid such as contacting or collide the problem to pollution, scuffing and the damage on substrate S surface that produces because of substrate S and modulator block.
Though explain and described the present invention particularly in conjunction with exemplary embodiment, it will be apparent to one skilled in the art that under the situation that does not break away from the scope of the invention and essence, can carry out various variation in form and details.
Claims (6)
1. one kind is used for whether defective array detecting device of test base, comprising:
Test module, said test module comprises modulator, said modulator has the first surface towards said substrate; And
The clearance measurement unit, said clearance measurement unit comprises: basal plane, said basal plane are positioned at the position that said test module can move to makes said first surface towards said basal plane; Distance-measuring device, said distance-measuring device are used to measure the gap between said first surface and the said basal plane.
2. array detecting device according to claim 1 also comprises:
Lifting unit, said lifting unit moves said test module; With
Control module, said control module is controlled the gap between said first surface and the said substrate with according to the mode of operating said lifting unit by measured first surface in said clearance measurement unit and the gap data between the basal plane.
3. one kind is used for whether defective array detecting device of test base, comprising:
Test module, said test module comprises the framework that supports modulator, said framework has the second surface towards said substrate; And
The clearance measurement unit, said clearance measurement unit comprises: basal plane, said basal plane are positioned at the position that said test module can move to makes said second surface towards said basal plane; Distance-measuring device, said distance-measuring device are used to measure the gap between said second surface and the said basal plane.
4. array detecting device according to claim 3 also comprises:
Lifting unit, said lifting unit moves said test module; With
Control module, said control module is controlled the gap between said second surface and the said substrate with according to the mode of operating said lifting unit by measured second surface in said clearance measurement unit and the gap data between the basal plane.
5. according to each described array detecting device in the claim 1 to 4, also comprise:
Test cell is placed with said substrate on said test cell,
Wherein, said clearance measurement unit is positioned at the pre-position of contiguous said test cell.
6. array detecting device according to claim 5, wherein, said basal plane with its on be placed with the said test cell of substrate the surface have identical height.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20100066431 | 2010-07-09 | ||
| KR10-2010-0066431 | 2010-07-09 | ||
| KR10-2010-0068351 | 2010-07-15 | ||
| KR1020100068351A KR101763619B1 (en) | 2010-07-09 | 2010-07-15 | Array Test Device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102314004A true CN102314004A (en) | 2012-01-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102833505A Pending CN102314004A (en) | 2010-07-09 | 2010-09-16 | Array test device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103698630A (en) * | 2013-12-12 | 2014-04-02 | 合肥京东方光电科技有限公司 | Electrical array detection equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1336549A (en) * | 2000-05-31 | 2002-02-20 | 株式会社鼎新 | Probe contacting system having plane adjusting mechanism |
| KR100752237B1 (en) * | 2006-09-20 | 2007-08-28 | 주식회사 탑 엔지니어링 | Method for measuring distance between nozzle and gap sensor of paste dispenser |
| CN101276213A (en) * | 2007-03-29 | 2008-10-01 | 三星电子株式会社 | System for testing electronic parts and control method thereof |
| CN101713894A (en) * | 2008-10-06 | 2010-05-26 | 塔工程有限公司 | Array tester |
-
2010
- 2010-09-16 CN CN2010102833505A patent/CN102314004A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1336549A (en) * | 2000-05-31 | 2002-02-20 | 株式会社鼎新 | Probe contacting system having plane adjusting mechanism |
| KR100752237B1 (en) * | 2006-09-20 | 2007-08-28 | 주식회사 탑 엔지니어링 | Method for measuring distance between nozzle and gap sensor of paste dispenser |
| CN101276213A (en) * | 2007-03-29 | 2008-10-01 | 三星电子株式会社 | System for testing electronic parts and control method thereof |
| CN101713894A (en) * | 2008-10-06 | 2010-05-26 | 塔工程有限公司 | Array tester |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103698630A (en) * | 2013-12-12 | 2014-04-02 | 合肥京东方光电科技有限公司 | Electrical array detection equipment |
| CN103698630B (en) * | 2013-12-12 | 2016-04-06 | 合肥京东方光电科技有限公司 | A kind of electrical array detection equipment |
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Application publication date: 20120111 |