TW201006014A - Semiconductor device having rough sidewall - Google Patents
Semiconductor device having rough sidewall Download PDFInfo
- Publication number
- TW201006014A TW201006014A TW098116717A TW98116717A TW201006014A TW 201006014 A TW201006014 A TW 201006014A TW 098116717 A TW098116717 A TW 098116717A TW 98116717 A TW98116717 A TW 98116717A TW 201006014 A TW201006014 A TW 201006014A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor
- semiconductor device
- layer
- sidewall
- plane
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/012—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group II-IV materials
- H10H20/0125—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group II-IV materials with a substrate not being Group II-VI materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2913—Materials being Group IIB-VIA materials
- H10P14/2914—Oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2918—Materials being semiconductor metal oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2926—Crystal orientations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3424—Deposited materials, e.g. layers characterised by the chemical composition being Group IIB-VIA materials
- H10P14/3426—Oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3434—Deposited materials, e.g. layers characterised by the chemical composition being oxide semiconductor materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3442—N-type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3444—P-type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3446—Transition metal elements; Rare earth elements
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Led Devices (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5484208P | 2008-05-21 | 2008-05-21 | |
| US6075408P | 2008-06-11 | 2008-06-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201006014A true TW201006014A (en) | 2010-02-01 |
Family
ID=40851998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098116717A TW201006014A (en) | 2008-05-21 | 2009-05-20 | Semiconductor device having rough sidewall |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8772829B2 (https=) |
| EP (1) | EP2304780A1 (https=) |
| JP (1) | JP2011521477A (https=) |
| TW (1) | TW201006014A (https=) |
| WO (2) | WO2009143226A1 (https=) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0366921A (ja) * | 1989-08-04 | 1991-03-22 | Kayseven Co Ltd | 回転力伝達手段 |
| JP5647881B2 (ja) * | 2010-12-17 | 2015-01-07 | スタンレー電気株式会社 | 酸化亜鉛系半導体の成長方法 |
| US9236530B2 (en) * | 2011-04-01 | 2016-01-12 | Soraa, Inc. | Miscut bulk substrates |
| WO2012138414A1 (en) * | 2011-04-06 | 2012-10-11 | Versatilis Llc | Optoelectronic device containing at least one active device layer having a wurtzite crystal structure, and methods of making same |
| EP2745326A1 (en) | 2011-08-17 | 2014-06-25 | Ramgoss Inc. | Vertical field effect transistor on oxide semiconductor substrate and method of manufacturing the same |
| FR2981794B1 (fr) * | 2011-10-21 | 2013-11-01 | Commissariat Energie Atomique | Procede de realisation d'un reseau organise de nanofils semiconducteurs, en particulier en zno |
| JP5644745B2 (ja) * | 2011-12-05 | 2014-12-24 | 豊田合成株式会社 | 半導体発光素子および発光装置 |
| WO2013109628A1 (en) | 2012-01-17 | 2013-07-25 | Ramgoss, Inc. | Rotated channel semiconductor field effect transistor |
| TW201337050A (zh) * | 2012-03-14 | 2013-09-16 | 國立交通大學 | 纖鋅礦結構材料之非極性晶面 |
| EP2641996A1 (en) * | 2012-03-23 | 2013-09-25 | Stanley Electric Co., Ltd. | Method for growing magnesium-zinc-oxide-based crystal |
| KR101998339B1 (ko) * | 2012-11-16 | 2019-07-09 | 삼성전자주식회사 | 금속 산화물 반도체의 성장 결정면 제어방법 및 제어된 성장 결정면을 가지는 금속 산화물 반도체 구조물 |
| EP2933847B1 (en) | 2012-12-14 | 2019-05-22 | NGK Insulators, Ltd. | Surface light-emission element using zinc oxide substrate |
| JPWO2014092168A1 (ja) * | 2012-12-14 | 2017-01-12 | 日本碍子株式会社 | 酸化亜鉛基板を用いた面発光素子 |
| JPWO2014092167A1 (ja) * | 2012-12-14 | 2017-01-12 | 日本碍子株式会社 | 酸化亜鉛基板を用いた面発光素子 |
| JPWO2014092165A1 (ja) * | 2012-12-14 | 2017-01-12 | 日本碍子株式会社 | 酸化亜鉛基板を用いた面発光素子 |
| TWI514622B (zh) * | 2013-02-19 | 2015-12-21 | Lextar Electronics Corp | 發光二極體晶粒及其製造方法 |
| WO2014185339A1 (ja) | 2013-05-17 | 2014-11-20 | 日本碍子株式会社 | 光起電力素子 |
| JP2015137189A (ja) * | 2014-01-21 | 2015-07-30 | スタンレー電気株式会社 | Agドープp型ZnO系半導体結晶層 |
| CN108305923B (zh) * | 2014-03-31 | 2020-09-15 | 日本碍子株式会社 | 多晶氮化镓自立基板和使用该多晶氮化镓自立基板的发光元件 |
| ES2671553T3 (es) | 2014-05-13 | 2018-06-07 | Coelux S.R.L. | Fuente de luz y sistema de iluminación que imita la luz solar |
| US9793248B2 (en) * | 2014-11-18 | 2017-10-17 | PlayNitride Inc. | Light emitting device |
| TWI578581B (zh) * | 2014-11-18 | 2017-04-11 | 錼創科技股份有限公司 | 發光元件 |
| CN111416025A (zh) * | 2015-09-03 | 2020-07-14 | 首尔伟傲世有限公司 | 发光元件和发光元件的制造方法 |
| KR102692637B1 (ko) * | 2016-11-24 | 2024-08-06 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 및 이를 포함하는 반도체 소자 패키지 |
| JP7314181B2 (ja) | 2018-06-07 | 2023-07-25 | シランナ・ユー・ブイ・テクノロジーズ・プライベート・リミテッド | 半導体層を形成するための方法及び材料堆積システム |
| CN208489222U (zh) * | 2018-06-28 | 2019-02-12 | 厦门市三安光电科技有限公司 | 一种发光二极管 |
| US11342484B2 (en) | 2020-05-11 | 2022-05-24 | Silanna UV Technologies Pte Ltd | Metal oxide semiconductor-based light emitting device |
| GB2595684A (en) * | 2020-06-03 | 2021-12-08 | Plessey Semiconductors Ltd | Spacer LED architecture for high efficiency micro LED displays |
| JP7814510B2 (ja) | 2021-11-10 | 2026-02-16 | シランナ・ユー・ブイ・テクノロジーズ・プライベート・リミテッド | エピタキシャル酸化物材料、構造、及びデバイス |
| JP7793776B2 (ja) | 2021-11-10 | 2026-01-05 | シランナ・ユー・ブイ・テクノロジーズ・プライベート・リミテッド | エピタキシャル酸化物材料、構造、及びデバイス |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3813740B2 (ja) * | 1997-07-11 | 2006-08-23 | Tdk株式会社 | 電子デバイス用基板 |
| US6291085B1 (en) * | 1998-08-03 | 2001-09-18 | The Curators Of The University Of Missouri | Zinc oxide films containing P-type dopant and process for preparing same |
| JP2001072498A (ja) * | 1999-07-08 | 2001-03-21 | Nippon Telegr & Teleph Corp <Ntt> | 酸化物単結晶薄膜およびその加工方法 |
| US6791119B2 (en) * | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
| TW541723B (en) * | 2001-04-27 | 2003-07-11 | Shinetsu Handotai Kk | Method for manufacturing light-emitting element |
| JP3826755B2 (ja) * | 2001-09-28 | 2006-09-27 | 株式会社村田製作所 | ZnO膜及びその製造方法並びに発光素子 |
| WO2004020686A2 (en) * | 2002-08-28 | 2004-03-11 | Moxtronics, Inc. | A hybrid beam deposition system and methods for fabricating zno films, p-type zno films, and zno-based ii-vi compound semiconductor devices |
| US6876009B2 (en) * | 2002-12-09 | 2005-04-05 | Nichia Corporation | Nitride semiconductor device and a process of manufacturing the same |
| TW200505042A (en) * | 2003-07-17 | 2005-02-01 | South Epitaxy Corp | LED device |
| JP4544898B2 (ja) * | 2004-04-08 | 2010-09-15 | エア・ウォーター株式会社 | ZnO膜の成膜方法 |
| US20060124943A1 (en) * | 2004-12-14 | 2006-06-15 | Elite Optoelectronics Inc. | Large-sized light-emitting diodes with improved light extraction efficiency |
| DE102005021099A1 (de) * | 2005-05-06 | 2006-12-07 | Universität Ulm | GaN-Schichten |
| JP4988179B2 (ja) * | 2005-09-22 | 2012-08-01 | ローム株式会社 | 酸化亜鉛系化合物半導体素子 |
| US20070126021A1 (en) * | 2005-12-06 | 2007-06-07 | Yungryel Ryu | Metal oxide semiconductor film structures and methods |
| TWI490918B (zh) * | 2006-01-20 | 2015-07-01 | 美國加利福尼亞大學董事會 | 半極性氮化(鋁,銦,鎵,硼)之改良成長方法 |
| DE112007002539T5 (de) * | 2006-10-25 | 2009-09-10 | Stanley Electric Co. Ltd. | ZnO-Schicht und lichtemittierende Halbleitervorrichtung |
| WO2008073469A1 (en) | 2006-12-11 | 2008-06-19 | Lumenz, Llc | Zinc oxide multi-junction photovoltaic cells and optoelectronic devices |
| JP2007129271A (ja) * | 2007-02-13 | 2007-05-24 | Citizen Tohoku Kk | 半導体発光素子及びその製造方法 |
| TW200949004A (en) * | 2008-04-25 | 2009-12-01 | Lumenz Inc | Metalorganic chemical vapor deposition of zinc oxide |
-
2009
- 2009-05-20 EP EP09751454A patent/EP2304780A1/en not_active Withdrawn
- 2009-05-20 WO PCT/US2009/044646 patent/WO2009143226A1/en not_active Ceased
- 2009-05-20 TW TW098116717A patent/TW201006014A/zh unknown
- 2009-05-20 JP JP2011510675A patent/JP2011521477A/ja active Pending
- 2009-05-20 WO PCT/US2009/044650 patent/WO2009143229A1/en not_active Ceased
-
2010
- 2010-11-22 US US12/951,308 patent/US8772829B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009143226A1 (en) | 2009-11-26 |
| EP2304780A1 (en) | 2011-04-06 |
| JP2011521477A (ja) | 2011-07-21 |
| WO2009143229A1 (en) | 2009-11-26 |
| US8772829B2 (en) | 2014-07-08 |
| US20110062440A1 (en) | 2011-03-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201006014A (en) | Semiconductor device having rough sidewall | |
| TWI377697B (en) | Method for growing a nitride-based iii-v group compound semiconductor | |
| TW201027801A (en) | Thin light-emitting devices and fabrication methods | |
| CN101699637B (zh) | 氮化镓基化合物半导体发光器件 | |
| US8436396B2 (en) | Semiconductor light emitting element, method for manufacturing semiconductor light emitting element, and lamp | |
| JP5049659B2 (ja) | Iii族窒化物半導体の製造方法、iii族窒化物半導体発光素子の製造方法、及びiii族窒化物半導体発光素子、並びにランプ | |
| US20110101414A1 (en) | Light emitting diodes with zinc oxide current spreading and light extraction layers deposited from low temperature aqueous solution | |
| TW201125162A (en) | Photonic device and method of making the same | |
| TW201013987A (en) | Group III nitride semiconductor light emitting device, process for producing the same, and lamp | |
| TWI580074B (zh) | Semiconductor light emitting element | |
| WO2008072681A1 (ja) | 化合物半導体発光素子及びその製造方法 | |
| WO2010033792A1 (en) | Textured semiconductor light-emitting devices | |
| TW200810155A (en) | ZnO-based semiconductor element | |
| TW200928015A (en) | III-nitride device grown on edge-dislocation template | |
| WO2009093683A1 (ja) | 化合物半導体発光素子及びその製造方法、化合物半導体発光素子用導電型透光性電極、ランプ、電子機器並びに機械装置 | |
| EP4042470A1 (en) | Indium gallium nitride light emitting diodes with reduced strain | |
| TW201230384A (en) | Method for fabrication of (Al, In, Ga) nitride based vertical light emitting diodes with enhanced current spreading of n-type electrode | |
| JP4425376B2 (ja) | シリコン基板を用いたZnO系化合物半導体発光素子およびその製法 | |
| TW201010147A (en) | Light emitting diode device and method for fabricating thereof | |
| TW200929626A (en) | Zno-group semiconductor element | |
| JP2010040692A (ja) | 窒化物系半導体素子及びその製造方法 | |
| TW200822190A (en) | Method of manufacturing semiconductor device | |
| JP2004063819A (ja) | 結晶成長基板及び半導体発光素子の製造方法 | |
| US8124992B2 (en) | Light-emitting device, manufacturing method thereof, and lamp | |
| US20150001556A1 (en) | Growth substrate and light emitting device comprising the same |