TW201003821A - Light irradiation device - Google Patents

Light irradiation device Download PDF

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Publication number
TW201003821A
TW201003821A TW098114869A TW98114869A TW201003821A TW 201003821 A TW201003821 A TW 201003821A TW 098114869 A TW098114869 A TW 098114869A TW 98114869 A TW98114869 A TW 98114869A TW 201003821 A TW201003821 A TW 201003821A
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Taiwan
Prior art keywords
opening
irradiation
light
closing
port
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TW098114869A
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Chinese (zh)
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TWI437653B (en
Inventor
Junichi Takeuchi
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Lintec Corp
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Publication of TWI437653B publication Critical patent/TWI437653B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes

Abstract

The present invention discloses an ultraviolet irradiation device (10) which irradiates ultraviolet on a semiconductor wafer (W) stuck with an ultraviolet constrictive type adhesive film (S). The ultraviolet irradiation device is stored in a sliding means (15) and set on a casing (14) under a movable condition. The casing (14) is provided with an ultraviolet irradiation unit (11), and the adhesive film (S) is used as an irradiated surface for being irradiated by ultraviolet when the sliding means (15) moves in the direction across an irradiation port (12) of the casing (14). The casing (14) is further provided with a switch means (17) which follows the movement of the sliding means (15) to open the irradiation port (12).

Description

201003821 六、發明說明: 【發明所屬之技術領域】 本發明’係有關於光照射裝置,更詳細而言,係有關 於能夠對於被照射體而將光有效率地作照射之光照射裝置 【先前技術】 在半導體晶圓(以下,單純稱爲「晶圓」)之處理裝 置中’係進行有在晶圓之電路面處貼附保護用之接著薄片 並進行背面硏削、或是貼附切割膠帶並將其個片化爲複數 之晶片的處理。在被使用於此種處理之接著薄片中,係於 接著劑中採用有紫外線硬化型(光反應型)者,並在上述 一般之處理後’藉由以紫外線照射裝置來使接著劑硬化, 而使接著力減弱’並成爲能夠不使晶圓破損地而容易的進 行剝離。 作爲前述紫外線照射裝置,例如,係在專利文獻丨中 有所揭示。於同文獻中之紫外線照射裝置,係具備有:將 經由接著薄片而使晶圓與環狀框被作了一體化後之被照射 體作吸著保持之吸著機構、和在上部成爲開放的同時,底 部爲藉由玻璃類所構成的殻體、和從前述底部之下方而照 射紫外線之光源。被照射體,係藉由以吸著機構來將殼體 作堵塞一事’而成爲位置在該殻體內,並成爲於此狀態下 而從前述底部來使紫外線透過並對被照射體作照射。 [專利文獻1]日本特開2004-281430號公報 201003821 【發明內容】 然而,在專利文獻1所揭示之紫外線照射裝置中,由 於係爲藉由透過底部之全區域的紫外線來使接著薄片的接 著劑硬化之構成,亦即是,係爲作整批性或是全面照射, 因此,爲了確保從光源而相對性地遠離之部位的照度,係 必須要使用高輸出燈管,而有著在使裝置大型化的同時, 亦使運轉成本高漲的問題。故而,當被照射體之平面面積 爲大時,對應於此,係成爲需要能夠將紫外線照射至寬廣 區域處之燈管,而此係成爲使汎用性降低的重要原因。 本發明,係爲注目於此種問題而創作者,其目的,係 在於提供一種:藉由部分照射,而將紫外線等之光對於被 照射體來有效率地作照射,並在減輕消耗電力的同時,對 運轉成本作抑制,並且,能夠對於光之朝向外部的漏洩作 防止的光照射裝置。 爲了達成前述目的,本發明,係爲一種光照射裝置, 係爲對被貼附或是暫時接著有光反應型之接著薄片的被照 射體而照射光之光照射裝置,其特徵爲,係採用有以下構 成:具備有:殻體,係在內部具備有光照射單元,且同時 具備有照射光之照射口;和滑動手段,係可在橫切過前述 照射口之方向上作相對移動地被作設置,並具備有收容前 述被照射體之收容口;和保持手段,係將前述被照射體作 保持’同時在通過前述收容口而將被照射體配置在了滑動 手段之內部時,與該滑動手段相卡合並將收容口堵塞;和 -6 - 201003821 開閉手段,係將前述照射口作開閉;和推壓手段,係將此 開閉手段朝向特定方向作推壓,前述開閉手段,係經由前 述推壓手段而被朝向使前述照射口恆常開放之方向作推壓 ’同時,追隨於前述滑動手段之移動,而將前述照射口作 開閉。 在本發明中,係以採用下述構成爲理想:前述開閉手 段,係包含有沿著前述滑動手段之移動方向而以將前述光 照射單元挾持於中間的方式而被作了配置之第1以及第2 開閉手段,此些之開閉手段,係當前述滑動手段從紫外線 照射待機位置來朝向紫外線照射結束位置而橫切過照射口 時,使第1開閉手段朝向將照射口逐漸開放之方向而移動 ,並使第2開閉手段朝向將照射口逐漸堵塞的方向而移動 〇 又,亦可採用下述之構成:前述開閉手段,係被設爲 在前述光照射單元之側方向上作單一配置,該開閉手段, 係當前述滑動手段從紫外線照射待機位置來朝向紫外線照 射結束位置而橫切過照射口時,朝向將前述照射口逐漸開 放之方向而移動。 進而,本發明,係可包含有檢測出前述開閉手段之位 置的位置檢測手段,並以當前述照射口之開閉未被正確地 進行時,將特定之訊號輸出至外部的方式來作設置。 [發明之效果] 若藉由本發明,則由於係爲追隨於滑動手段之移動而 -7- 201003821 使開閉手段將照射口作開閉之構成,因此,當收容了被照 射體之滑動手段橫切過照射口時,係可逐漸開放該照射口 並照射紫外線地來進行部分照射。故而,係成爲不需要進 行如同先前技術一般之整批或是全面照射,而不需要使用 高輸出燈管,光之輸出就算是相較於先前技術之裝置而爲 較小,亦成爲足夠,而成爲能夠提供省能源型之光照射裝 置。並且,開閉手段,由於係將在對於被照射體而進行光 照射時所需要之區域以外的部分作堵塞,因此,能夠防止 紫外線等之有害的光漏洩至外部,且亦能夠避免像是該當 光進入至作業者之眼睛一般的問題。 又,在將開閉手段設爲單一的構成中,能夠達成殻體 之小型化,特別是,在以光照射面積爲小之被照射體作爲 對象的情況時,係可得到實際利益。 進而,在設置有檢測手段之構成中,係能夠避免如同 產生有開閉手段之非預期的動作不良並使紫外線之照射無 法正確地進行一般之問題。 【實施方式】 以下,參考圖面,針對本發明之實施形態作說明。 圖1中,係展示有本發明之被適用在紫外線照射裝置 中的實施形態之槪略立體圖,圖2中,係展示有將其之一 部份剖面視之時的槪略正面圖,圖3中,係展示有圖2之 A箭頭方向剖面圖。於此些之圖中,作爲光照射裝置之紫 外線照射裝置1 0,係作爲對於作爲被照射體之暫時接著有 -8 - 201003821 光反應型(紫外線硬化型)之接著薄片s的晶圓W照射 光(紫外線)之裝置而被構成。此紫外線照射裝置1 〇,其 構成係具備有:殼體1 4,係在內部被配置有紫外線照射單 元1 1 ’且同時於上面被設置有紫外線之照射口 1 2 ;和滑 動手段15’係可移動地被支持於此殼體14處;和保持手 段1 6 ’係將晶圓W作保持;和一對之開閉手段1 7,係被 設置在殼體1 4內;和一對之推壓手段丨8,係將此些之開 閉手段1 7朝向使前述照射口 1 2恆常開放之方向作推壓; 和位置檢測手段1 9,係檢測出開閉手段1 7之位置。 前述紫外線照射單元1 1,係由成爲光源之水銀燈管 20、和形成用以將從該水銀燈管所發光之紫外線作集光並 照射至接著薄片S處的反射面之反射罩2 1所成。水銀燈 管20,係沿著殻體14之Y軸方向而被配置,反射罩21, 係如圖2中所示一般,而將其剖面沿著水銀燈管20來設 置爲略U子形狀(抛物線形狀)。此反射罩21,係被構 成爲將從水銀燈2 0而來之紫外線藉由內側之曲面來作反 射,並成爲對於接著薄片S來進行沿著Y軸方向之特定寬 幅的線狀之部分照射。 前述殼體14,係包含有略直方體狀之本體23、和被 設置在此本體23之上面23A處的照射口 12、和在X軸方 向上延伸之導引軌2 5,照射口 1 2,係被形成爲與反射罩 2 1之上部開口區域略對應的形狀。 前述滑動手段15,係藉由滑動本體26、和被設置在 此滑動本體2 6之X軸方向兩側處的滑動器2 7所構成。滑 -9- 201003821 動本體26,係被設爲包含有具備有將晶圓W作收容之略 圓形的收容口 29之頂壁28、和從此頂壁28之外週而垂下 的側壁3 0,並使下部成爲開放口 3 0的形狀。又,滑動器 27’係被設爲可沿著導引軌25而移動,藉由此,滑動本 體26係被設置爲可在紫外線照射待機位置P 1 (參考圖2 )和紫外線照射結束位置P2 (參考圖7 )之間,而於橫切 過照射口 1 2之方向上作相對移動。 在前述滑動本體26處,於圖3中左端側之側壁30的 中央部處,係被設置有L型支架33,在該支架33之上部 平面部處,係被形成有對其與保持手段1 6間之相對位置 作決定的定位孔3 3 A。又,滑動本體2 6,當位於紫外線照 射待機位置P1處時,係成爲經由擋止器3 5而被作位置規 制。此擋止器3 5,係藉由被設置在圖3中左側壁3 0處之 擋止片3 6、和汽缸3 7所構成。 前述保持手段16,其構成係具備有:支持基板39、 和在被設爲較該支持基板3 9爲更小口徑的同時’被連接 於未圖示之減壓幫浦,並對應於晶圓 W之形狀的吸著板 4 0、和被連結於支持基板3 9之上面側,並在Y軸方向上 延伸之臂41、和將該臂41可在Z軸方向上作移動地支持 之Z軸機器人42、和將此Z軸機器人42可在X軸方向上 作移動地支持之X軸機器人4 3。吸著板4 〇 ’係將下面側 作爲吸著面’而被設置有未圖示之吸著孔’並成爲能夠將 晶圓W作吸著。另外’在殻體14之鄰接位置處’係被配 置有晶圓w之支持台4 5。又’在臂41之下面側處’係被 -10- 201003821 突出設置有卡合銷47,並成爲在定位孔33A處作卡合脫 離,於卡合狀態中,吸著板40以及晶圓W係位置於滑動 本體26內,支持基板39係與滑動本體26相卡合,並將 收容口 2 9堵塞。 前述開閉手段1 7,係如圖2中所示一般,藉由將紫外 線照射單元1 1挾持於中間並作對稱配置的第1開閉手段 1 7 A、和被配置於右側處之第2開閉手段1 7 B所構成。又 ,推壓手段1 8,係藉由對各開閉手段1 7、1 7B作推壓之 第1、第2推壓手段1 8 A、1 8B所構成。另外,關於第2 開閉手段1 7B以及第2推壓手段1 8B,由於只要將第1開 閉手段1 7A及第2推壓手段1 8A之末端符號「A」置換爲 ^ B」便可作說明,因此,係將說明簡略化。 前述第1開閉手段1 7 A,係藉由在被設爲可將殼體1 4 之照射口 1 2作堵塞之大小的同時,亦具備有立起部5 1 A 之開閉板5 0 A所構成。立起部5 1 A,係被設置在可抵接於 滑動本體26之側壁30的內面之高度處。 前述第1堆壓手段18A,係藉由空氣汽缸53A而被構 成,在此空氣汽缸53A之滑動器54A處,係被支持有開 閉板5 0 A,並成爲將該開閉板50A恆常朝向圖2中之箭頭 a方向來推壓。藉由此,開閉板50A,係以滑動本體26朝 向圖2中左側移動一事作爲條件,追隨於滑動本體26,開 閉板5 0 A係移動,並將照射口 1 2開放。201003821 VI. Description of the Invention: [Technical Field] The present invention relates to a light irradiation device, and more particularly to a light irradiation device capable of efficiently irradiating light to an object to be irradiated [previously Technology] In a semiconductor wafer (hereinafter simply referred to as "wafer") processing device, a subsequent sheet for attaching a protective surface to a circuit surface of a wafer is subjected to back boring or dicing The tape is taped and processed into a plurality of wafers. In the subsequent sheet used for such treatment, an ultraviolet curing type (photoreactive type) is used in the adhesive, and after the above general treatment, the adhesive is hardened by an ultraviolet irradiation device. The adhesion force is weakened and the peeling can be easily performed without breaking the wafer. The ultraviolet irradiation device is disclosed, for example, in the patent document. The ultraviolet irradiation device of the same document is provided with a suction mechanism for absorbing and holding an irradiated body in which a wafer and a ring frame are integrated via a sheet, and is opened at the upper portion. At the same time, the bottom is a casing made of glass and a light source that irradiates ultraviolet rays from below the bottom. The irradiated body is placed in the casing by clogging the casing by the absorbing mechanism, and in this state, ultraviolet rays are transmitted from the bottom portion and irradiated to the irradiated body. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2004-281430, No. 201003821 [Invention] However, in the ultraviolet irradiation device disclosed in Patent Document 1, the subsequent sheet is adhered by ultraviolet rays transmitted through the entire region of the bottom portion. The composition of the hardening of the agent, that is, for the whole batch or the full illumination, therefore, in order to ensure the illuminance of the portion far from the light source, it is necessary to use a high output lamp, and the device is At the same time of large-scale, it also raises the problem of high operating costs. Therefore, when the area of the plane of the object to be irradiated is large, it is necessary to irradiate the ultraviolet ray to a wide area, which is an important factor for lowering the versatility. The present invention has been made in an effort to pay attention to such a problem, and an object thereof is to provide a method of efficiently irradiating light such as ultraviolet rays to an object to be irradiated by partial irradiation, and reducing power consumption. At the same time, it is possible to suppress the running cost and to provide a light irradiation device that prevents leakage of light toward the outside. In order to achieve the above object, the present invention is a light irradiation device which is a light irradiation device that irradiates light to an irradiated body to which a subsequent sheet having a photoreactive type is attached or temporarily attached, and is characterized in that A housing having a light irradiation unit and an irradiation port for illuminating light, and a sliding means for relatively moving in a direction transverse to the irradiation opening Provided with a storage port for accommodating the object to be irradiated; and a holding means for holding the object to be irradiated while placing the object to be irradiated inside the sliding means through the storage port, The sliding means is merging and clogging the accommodating port; and -6 - 201003821 opening and closing means opens and closes the illuminating port; and the pressing means presses the opening and closing means in a specific direction, and the opening and closing means is via the foregoing The pressing means is pressed toward the direction in which the irradiation opening is constantly opened. At the same time, the irradiation port is opened in accordance with the movement of the sliding means. close. In the present invention, it is preferable that the opening and closing means includes a first and a first arrangement in which the light irradiation unit is held in the middle along the moving direction of the sliding means. In the second opening and closing means, when the sliding means crosses the irradiation opening from the ultraviolet irradiation standby position toward the ultraviolet irradiation end position, the first opening and closing means is moved in a direction in which the irradiation opening is gradually opened. Further, the second opening and closing means may be moved in a direction in which the irradiation port is gradually blocked. Alternatively, the opening and closing means may be arranged in a single direction in the side direction of the light irradiation unit. In the opening and closing means, when the sliding means crosses the irradiation opening from the ultraviolet irradiation standby position toward the ultraviolet irradiation end position, the opening means is moved in a direction in which the irradiation opening is gradually opened. Further, the present invention may include a position detecting means for detecting the position of the opening and closing means, and may be provided to output a specific signal to the outside when the opening and closing of the irradiation port is not performed correctly. [Effects of the Invention] According to the present invention, since the opening and closing means opens and closes the irradiation opening in accordance with the movement of the sliding means, the sliding means for accommodating the irradiated body is cross-cut. When the mouth is illuminated, the irradiation port can be gradually opened and irradiated with ultraviolet rays to perform partial irradiation. Therefore, it is not necessary to perform batch or full illumination as in the prior art, and it is not necessary to use a high output lamp, and the output of light is smaller than that of the prior art device, and is sufficient. It becomes an energy-saving light irradiation device. In addition, since the opening and closing means occludes a portion other than the region required for light irradiation on the object to be irradiated, it is possible to prevent harmful light such as ultraviolet rays from leaking to the outside, and it is also possible to avoid such light. Enter the general problem of the operator's eyes. Further, in the configuration in which the opening and closing means is a single unit, the size of the casing can be reduced, and in particular, when the object to be irradiated having a small light irradiation area is targeted, an actual advantage can be obtained. Further, in the configuration in which the detecting means is provided, it is possible to avoid an unintended operation failure such as the opening and closing means, and to prevent the ultraviolet light from being accurately performed. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic perspective view showing an embodiment of the present invention applied to an ultraviolet ray irradiation apparatus, and Fig. 2 is a front view showing a partial cross-sectional view thereof, Fig. 3 In the middle, a cross-sectional view of the arrow A of Fig. 2 is shown. In the above-mentioned figures, the ultraviolet irradiation device 10 as the light irradiation device is irradiated with the wafer W as the subsequent sheet s of the light-reactive type (ultraviolet curing type) of the -8 - 201003821 as the object to be irradiated. Light (ultraviolet) device is constructed. The ultraviolet irradiation device 1 is configured to include a casing 14 having an ultraviolet irradiation unit 1 1 ' disposed therein and an ultraviolet irradiation port 1 2 on the upper surface thereof; and a sliding means 15' Removably supported at the housing 14; and holding means 16' to hold the wafer W; and a pair of opening and closing means 17 are disposed in the housing 14; and a pair of pushes The pressing means 8 is to press the opening and closing means 17 toward the direction in which the irradiation opening 12 is constantly opened; and the position detecting means 197 detects the position of the opening and closing means 17. The ultraviolet irradiation unit 1 1 is formed of a mercury lamp tube 20 serving as a light source, and a reflection cover 2 1 for forming a reflection surface for collecting the ultraviolet light emitted from the mercury lamp tube and irradiating it to the subsequent sheet S. The mercury lamp tube 20 is disposed along the Y-axis direction of the casing 14, and the reflection cover 21 is generally shown in Fig. 2, and its cross section is set along the mercury lamp tube 20 to have a slightly U-shaped shape (parabolic shape). ). The reflector 21 is configured such that ultraviolet rays from the mercury lamp 20 are reflected by the inner curved surface, and are partially irradiated with a specific width along the Y-axis direction for the subsequent sheet S. . The housing 14 includes a body 23 having a substantially rectangular parallelepiped shape, an illumination port 12 disposed at an upper surface 23A of the body 23, and a guide rail 25 extending in the X-axis direction. The illumination port 1 2 The shape is formed to slightly correspond to the opening area of the upper portion of the reflector cover 21. The sliding means 15 is constituted by a sliding body 26 and a slider 27 provided at both sides of the sliding body 26 in the X-axis direction.滑-9-201003821 The movable body 26 is provided with a top wall 28 including a storage port 29 having a substantially circular shape for accommodating the wafer W, and a side wall 30 which is suspended from the outer periphery of the top wall 28. And make the lower part into the shape of the opening port 30. Further, the slider 27' is configured to be movable along the guide rail 25, whereby the slide body 26 is provided to be at the ultraviolet irradiation standby position P1 (refer to FIG. 2) and the ultraviolet irradiation end position P2. Between (refer to Fig. 7), the relative movement is made in the direction transverse to the irradiation opening 12. At the sliding body 26, at the central portion of the side wall 30 on the left end side in FIG. 3, an L-shaped bracket 33 is provided, and at the upper flat portion of the bracket 33, it is formed with the holding means 1 The relative position of the six positions is determined as the positioning hole 3 3 A. Further, when the slide main body 26 is located at the ultraviolet irradiation standby position P1, it is positionally regulated by the stopper 35. The stopper 35 is constituted by a stopper piece 36 provided at the left side wall 30 of Fig. 3, and a cylinder 37. The holding means 16 is configured to include a support substrate 39 and a smaller diameter than the support substrate 39, and is connected to a decompression pump (not shown) and corresponds to the wafer. A suction plate 40 having a shape of W, and an arm 41 connected to the upper surface side of the support substrate 39 and extending in the Y-axis direction, and a support Z for moving the arm 41 in the Z-axis direction The axis robot 42 and the X-axis robot 43 that can move the Z-axis robot 42 in the X-axis direction are supported. The suction plate 4 〇 ′ is provided with a suction hole ” (not shown) as a suction surface ‘, and the wafer W can be sucked. Further, 'at the adjacent position of the casing 14' is a support table 45 in which the wafer w is disposed. Further, 'the lower side of the arm 41' is -10-201003821, and the engaging pin 47 is protruded, and is engaged and disengaged at the positioning hole 33A. In the engaged state, the absorbing plate 40 and the wafer W are in the engaged state. The support base 39 is engaged with the slide main body 26 and blocks the storage opening 29. The opening and closing means 17 is generally a first opening and closing means 1 7 A in which the ultraviolet irradiation unit 11 is held in the middle and arranged symmetrically, and a second opening and closing means disposed on the right side, as shown in FIG. 1 7 B constitutes. Further, the pressing means 18 is constituted by the first and second pressing means 1 8 A, 1 8B for pressing the opening and closing means 17 and 17B. In addition, the second opening/closing means 17B and the second pressing means 18B can be described by replacing the end symbol "A" of the first opening and closing means 17A and the second pressing means 18A with ^B". Therefore, the system will explain the simplification. The first opening and closing means 1 7 A is also provided with a size of the illuminating port 1 2 of the casing 14 and a closing plate 5 0 A of the rising portion 5 1 A. Composition. The rising portion 5 1 A is provided at a height that can abut against the inner surface of the side wall 30 of the sliding body 26. The first stacking means 18A is configured by the air cylinder 53A, and the shutter 54A of the air cylinder 53A is supported by the opening and closing plate 510, and the opening and closing plate 50A is constantly oriented. In the direction of arrow a in 2, push. As a result, the opening and closing plate 50A is moved to the left side of FIG. 2 as a condition, and follows the sliding body 26, and the opening and closing plate 50A moves, and the irradiation port 12 is opened.

另一方面,構成前述第2開閉手段1 7B之開閉板50B ,係被朝向圖2中箭頭b方向推壓。藉由此,開閉板50B -11 - 201003821 ,係以滑動本體2 6朝向圖2中左側移動一事作爲條件, 而於右側壁30處卡合立起部51B,追隨於滑動本體26, 開閉板5 0 B係移動,並將照射口 1 2堵塞。 前述位置檢測手段1 9,係由被配置在汽缸5 3 A之左 右兩側處的自動開關所成,並包含有開放位置檢測開關 60 A、和堵塞位置檢測開關6 1 A。開放位置檢測開關60 A ,係當開閉板5 0 A到達開放位置(參考圖6 )時,檢測出 滑動器54A ’並將訊號輸出至未圖示之控制裝置處。另一 方面,堵塞位置檢測開關6 1 A,係成爲當開閉板5 0 A到達 堵塞位置(參考圖2 )時,檢測出滑動器54A,並同樣的 將訊號輸出。另外,控制裝置,係當滑動本體2 6位置在 特定之條件下時’若是未被輸入有從前述開關60A、61A 而來之訊號,則將特定之訊號輸出至外部。 接著,針對本實施形態之紫外線照射方法,一面參考 圖4乃至圖7,一面作說明。 若是被施加了特定之處理的附有接著薄片S之晶圓W 經由未圖7Γ;之移載臂等而被移載至支持台45之上面,貝[J 經由X、Z軸機器人43、42 ’吸著板40係將晶圓w作吸 著保持,並移動至滑動本體26之正上方。而後,經由以 Z軸機器人42而使吸著板40下降特定量,晶圓w係被收 容在滑動本體26內,並將收容口 29堵塞。此時,銷47 係卡合於支架33之定位孔33A中。若是經由未圖示之檢 測手段而檢測出銷4 7與支架3 3間的卡合,則檔止器35 所致之滑動本體2 6的固定係被解除,同時,前述堵塞位 -12 - 201003821 置檢測開關6 1以及開放位置檢測開關60B,係分別將檢 測到滑動器54A、54B —事作爲條件,並移行至後續之控 制中。 藉由X軸機器人4 3之驅動,如圖5中所不一般,滑 動本體2 6係開始沿著X軸方向而朝向左側移動。如此一 來’開閉板5 0 A係經由第1推壓手段1 8 A之推壓力,而 追隨滑動本體2 6來移動,並將照射口 1 2逐漸開放,而藉 由紫外線照射單元1 1,被收束爲線狀之紫外線係照射至接 著薄片S處’並使該接著薄片S之接著劑產生硬化反應。 如圖6中所示一般,若是滑動本體26更進一步移動 ’則立起部5 1 A係抵接於照射口 1 2,同時,右側壁3 0係 抵接於立起部5 1 B ’開閉板5 Ο B係開始朝向左側移動,並 成爲以不會使紫外線從照射口丨2而漏洩至外部的方式, 來與滑動本體26相互地作用並將照射口 12逐漸地堵塞。 另外,在此開閉板5 0 A之開放動作中,當滑動本體2 6之 左側壁3 0通過了照射口丨2之左端的時間點下,而滑動器 5 4 A並未經由開放位置檢測開關6 〇 a而被檢測出來時,開 閉板5 0 A係停止移動’而成爲紫外線並未被照射至接著薄 片S處便結束處理。因此,控制手段,係成爲當在上述一 般之特疋條件下而不存在有從開放位置檢測開關6〇A而來 之訊號輸入時,使警告手段(旋轉燈或是蜂鳴器)等之外 部3¾置動作並輸出訊號,而將異常通知給作業昌等。 藉由滑動本體26更進一步移動並到達圖7中所示之 紫外線照射結束位置P2 —事,紫外線照射係結束。此紫 -13- 201003821 外線照射結束位置P 2,係當將紫外線照射單元i〗作爲中 心時,被設定於與紫外線照射待機位置p丨成爲線對稱的 位置。 而後’滑動手段1 5 ’係進行與上述動作相反之動作, 而經由保持手段1 6來回歸到紫外線照射待機位置p1處, 並經由擋止器3 5而被固定。在此回歸動作中,紫外線亦 係照射於接著薄片S處,於開閉板5 〇B之開放動作中,當 滑動本體26之右側壁30通過了照射口丨2之右端的時間 點下’而滑動器54B並未經由開放位置檢測開關6〇b而被 檢測出來時’係與上述相同的,成爲經由警告手段等來將 異常通知給作業員等。接著,照射完紫外線之晶圓W,係 經由保持手段1 6而被移載至支持台45處,並經由未圖示 之移載臂而被移載至下一工程處。而後,在將用以接著進 行紫外線照射之新的晶圓移載至支持台45處後,藉由反 覆進行與上述相同之動作,而依序進行紫外線照射。 故而,若藉由此種實施形態,則當被收容在滑動本體 2 6內之晶圓朝向橫切過照射口 1 2之上方的方向移動時, 係能夠得到可在閉塞之空間內而對於晶圓W照射紫外線 之效果。 如上述一般,用以實施本發明之最佳的構成、方法等 ’係於前述記載中而有所揭示,但是,本發明’係並不被 限定於此。 亦即是,本發明,係主要對於特定之實施形態而特別 作了圖示、說明,但是’只要不脫離本發明之技術性思想 -14- 201003821 以及目的之範圍,則對於以上所說明了的實施形態,關於 形狀、位置或是配置等,同業者係可因應於必要而施加各 種之變更。 例如,構成本發明之紫外線照射裝置1 0的各部之相 對位置、亦即是佈局,係並非爲被限定於圖示構成例者, 亦可將殼體14與保持手段16等作上下或是左右反轉,或 是使其朝向上下方向。故而,表示方向之用語,係成爲可 隨著裝置各部之佈局的變更而成爲下面、下部、上下等者 ,將此些作了變更的形態,係亦作爲與本發明均等者而被 包含。 又,在前述實施形態中,係設爲藉由使保持手段16 沿著X軸方向移動一事來使滑動手段15在殼體14上作移 動之構成,但是,亦可採用將殼體14或是該些之雙方設 爲可移動,並進行與滑動手段1 5間之相對移動的構成。 於此情況,只要設置將殼體1 4可移動地作支持之適宜的 移動手段即可。 又,在前述實施形態中,係針對經由照射紫外線而使 接著薄片S之接著劑硬化的情況來作了說明,但是,亦可 適用在將感熱接著性之接著薄片暫時接著於晶圓W上, 並藉由對此作加熱來來將該接著薄片強力地貼附在晶圓w 上的裝置等之中。作爲此情況之光,係可例示有紅外線等 〇 進而,被照射體,係並不被限定於晶圓W ’而亦可將 玻璃板、鋼板、或是樹脂板等的其他物品作爲對象’半導 -15- 201003821 體晶圓,係亦可爲矽晶圓或是化合物晶圓。 又,作爲紫外線照射單元1 1之光源,除了水銀燈管 以外,亦可採用鹵素燈管、螢光燈、金屬鹵素燈管、發光 二極體等。On the other hand, the opening and closing plate 50B constituting the second opening and closing means 17B is pressed in the direction of the arrow b in Fig. 2 . Thereby, the opening and closing plates 50B-11 - 201003821 are conditional on the movement of the sliding body 26 toward the left side in FIG. 2, and the rising portion 51B is engaged with the right side wall 30, following the sliding body 26, and the opening and closing plate 5 0 B moves, and the irradiation port 12 is blocked. The position detecting means 197 is formed by an automatic switch disposed at the left and right sides of the cylinder 523A, and includes an open position detecting switch 60A and a clogging position detecting switch 61A. The open position detecting switch 60 A detects the slider 54A ' and outputs the signal to a control device (not shown) when the opening and closing plate 50 A reaches the open position (refer to Fig. 6). On the other hand, when the opening/closing plate 605 is reached at the clogging position (refer to Fig. 2), the slider 54A is detected, and the signal is outputted in the same manner. Further, when the position of the slide main body 26 is under a specific condition, the control unit outputs a specific signal to the outside if the signal from the switches 60A and 61A is not input. Next, the ultraviolet irradiation method of the present embodiment will be described with reference to Figs. 4 to 7 . If the wafer W with the subsequent sheet S to which the specific treatment is applied is transferred to the upper surface of the support table 45 via the transfer arm or the like, the shell [J is passed through the X and Z axis robots 43, 42. The suction plate 40 holds the wafer w absorbing and moves to directly above the sliding body 26. Then, the absorbing plate 40 is lowered by a specific amount by the Z-axis robot 42, and the wafer w is accommodated in the sliding body 26, and the accommodating port 29 is closed. At this time, the pin 47 is engaged with the positioning hole 33A of the bracket 33. When the engagement between the pin 47 and the bracket 3 3 is detected by a detecting means (not shown), the fixing of the sliding body 26 by the stopper 35 is released, and the clogging position -12 - 201003821 The detection switch 61 and the open position detection switch 60B respectively detect the sliders 54A and 54B as conditions, and move to the subsequent control. By the driving of the X-axis robot 4 3, as shown in Fig. 5, the sliding body 26 starts to move toward the left side in the X-axis direction. In this way, the opening and closing plate 50A is moved by the sliding body 26 by the pressing force of the first pressing means 18A, and the irradiation opening 12 is gradually opened, and the ultraviolet irradiation unit 11 is used. The ultraviolet ray which is bundled into a linear shape is irradiated to the subsequent sheet S and causes the adhesive of the subsequent sheet S to cause a hardening reaction. As shown in Fig. 6, in general, if the sliding body 26 moves further, the rising portion 5 1 A abuts against the irradiation opening 12, and the right side wall 30 abuts against the rising portion 5 1 B 'opens and closes. The plate 5 Ο B system starts to move to the left side, and the ultraviolet rays are prevented from leaking to the outside from the irradiation port 2, and interact with the sliding body 26 to gradually block the irradiation port 12. In addition, in the opening operation of the opening and closing plate 510, when the left side wall 30 of the sliding body 26 passes the left end of the illuminating port 2, the slider 5 4 A does not pass the open position detecting switch. When 6 〇a is detected, the opening and closing plate 50 A stops moving, and the ultraviolet ray is not irradiated to the subsequent sheet S, and the processing is terminated. Therefore, the control means is such that when the signal input from the open position detecting switch 6A is not present under the above-described general characteristics, the warning means (rotating lamp or buzzer) or the like is externally provided. 33⁄4 set the action and output the signal, and notify the job Chang and so on. The ultraviolet irradiation system ends by the sliding body 26 moving further and reaching the ultraviolet irradiation end position P2 shown in Fig. 7. In the case where the ultraviolet irradiation unit i is the center, the purple line irradiation end position P 2 is set to a line symmetrical with the ultraviolet irradiation standby position p丨. Then, the sliding means 15 5 performs an operation opposite to the above-described operation, and returns to the ultraviolet irradiation standby position p1 via the holding means 16 and is fixed via the stopper 35. In this returning operation, the ultraviolet ray is also irradiated on the succeeding sheet S, and in the opening operation of the opening and closing plate 5 〇B, when the right side wall 30 of the sliding body 26 passes the right end of the illuminating port 2, it slides. When the device 54B is not detected by the open position detecting switch 6〇b, the same as the above, the notification is notified to the operator or the like via the warning means or the like. Then, the wafer W irradiated with ultraviolet rays is transferred to the support table 45 via the holding means 16 and transferred to the next project via a transfer arm (not shown). Then, after the new wafer for subsequent ultraviolet irradiation is transferred to the support table 45, the same operation as described above is performed in reverse, and ultraviolet irradiation is sequentially performed. Therefore, according to this embodiment, when the wafer accommodated in the sliding body 26 moves in a direction crossing the irradiation port 12, it is possible to obtain a crystal in the occluded space. The effect of the round W on the ultraviolet light. As described above, the best configuration, method, and the like for carrying out the invention are disclosed in the above description, but the present invention is not limited thereto. That is, the present invention has been particularly illustrated and described with respect to specific embodiments, but 'as long as it does not depart from the technical idea of the present invention-14-201003821 and the scope of the object, In the embodiment, the shape, the position, the arrangement, and the like may be changed by the same person in accordance with the necessity. For example, the relative positions of the respective portions constituting the ultraviolet ray irradiation device 10 of the present invention, that is, the layout, are not limited to the illustrated configuration, and the casing 14 and the holding means 16 may be used up and down or left and right. Reverse, or make it face up and down. Therefore, the term indicating the direction is such that it can be changed to the lower, lower, upper and lower, etc., depending on the layout of each part of the apparatus, and the modifications are also included as equivalent to the present invention. Further, in the above-described embodiment, the sliding means 15 is moved on the casing 14 by moving the holding means 16 in the X-axis direction. However, it is also possible to use the casing 14 or Both of these are configured to be movable and to move relative to the sliding means 15 . In this case, it is sufficient to provide a suitable moving means for movably supporting the casing 14. Further, in the above-described embodiment, the case where the adhesive of the succeeding sheet S is cured by irradiation of ultraviolet rays has been described. However, the present invention may be applied to temporarily attach the sheet of thermal adhesion to the wafer W. By heating this, the bonding sheet is strongly attached to the device or the like on the wafer w. In this case, it is possible to exemplify that there is an infrared ray or the like, and the object to be irradiated is not limited to the wafer W', and other objects such as a glass plate, a steel plate, or a resin plate may be used as the object 'half Guide -15- 201003821 The body wafer can also be a germanium wafer or a compound wafer. Further, as the light source of the ultraviolet irradiation unit 11, a halogen lamp, a fluorescent lamp, a metal halide lamp, a light-emitting diode, or the like may be used in addition to the mercury lamp.

進而,開閉手段1 7,係只要至少作爲第1開閉手段 1 7 A之單一配置即可,於此情況,係將殼體1 4之沿著X 軸方向的長度短尺寸化,而成爲能夠將全體形成爲緊緻化 (compact) 。 又,滑動手段1 5,係亦可作爲將其本身連結於單軸機 器人之滑動器上的自走型。 進而,位置檢測手段1 9 ’係亦可僅藉由開放位置檢測 開關60A、60B而構成’該當開關類,亦可採用除了自動 開關以外之各種的開關。 又’當將滑動本體26內藉由玻璃等之紫外線可透過 的構件來作區劃’並藉由支持基板39來將收容口 29作堵 塞時,亦可作爲密閉狀態’而進行氮洗淨。藉由此,能夠 防止紫外線硬化型之接著薄片S受到氧之阻礙而產生硬化 不良的事態。 【圖式簡單說明】 [圖1 ]本實施形態之紫外線照射裝置的槪略立體圖。 [圖2 ]將前述紫外線照射裝置的一部份作了剖面後之 槪略正面圖。 [圖3]圖3之A箭頭方向剖面圖。 -16- 201003821 [圖4]將晶圓被收容在滑動本體內之狀態作展示的動 作說明圖。 [圖5 ]對滑動手段朝向橫切過照射口之方向而作了移 動的狀態作展示之動作說明圖。 [圖6]對使滑動手段相較於圖5而更進一步作了移動 的狀態作展示之動作說明圖。 [圖7]對使滑動手段移動至了紫外線照射結束位置處 的狀態作展示之動作說明圖。 【主要元件符號說明】 10 :紫外線照射裝置 11 :紫外線照射單元 1 2 :照射口 14 :殼體 1 5 :滑動手段 1 6 :保持手段 1 7 :開閉手段 PA :第1開閉手段 17B :第2開閉手段 1 8 :推壓手段 18A :第1推壓手段 1 8 B :第2推壓手段 1 9 :位置檢測手段 2 0 :水銀燈管 -17- 201003821 2 1 :反射罩 23 :本體 23 A :上面 25 :導引軌 2 6 :滑動本體 27 :滑動器 2 8 :頂壁 29 :收容口 3 0 :側壁 33 :支架 3 3 A :定位孔 35 :擋止器 36 :擋止片 3 7 :汽缸 3 9 :支持基板 40 :吸著板 41 :臂 42 : Z軸機器人 43 : X軸機器人 4 5 :支持台 4 7 :卡合銷 5 0 A :開閉板 5 0 B :開閉板 5 1 A :立起部 -18- 201003821 5 1 B :立起部 5 3 A :空氣汽缸 54A :滑動器 54B :滑動器 60A :開放位置檢測開關 60B :開放位置檢測開關 6 1 A :堵塞位置檢測開關 P 1 :紫外線照射待機位置 P2 =紫外線照射結束位置 S :接著薄片 W :晶圓 -19-Further, the opening and closing means 17 is only required to be at least a single arrangement of the first opening and closing means 1 7 A. In this case, the length of the casing 14 in the X-axis direction is shortened, and it is possible to The whole is formed as compact. Further, the sliding means 15 can also be used as a self-propelled type that connects itself to a slider of a single-axis robot. Further, the position detecting means 1 9 ' may be constituted by only the open position detecting switches 60A and 60B, or may be various switches other than the automatic switches. Further, when the accommodating port 29 is blocked by the ultraviolet permeable member such as glass in the sliding body 26, and the accommodating port 29 is blocked by the supporting substrate 39, the nitrogen can be washed as a sealed state. As a result, it is possible to prevent the ultraviolet curable type of the succeeding sheet S from being hindered by oxygen and causing hardening failure. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] A schematic perspective view of an ultraviolet irradiation device of the present embodiment. Fig. 2 is a front elevational view showing a portion of the ultraviolet irradiation device. Fig. 3 is a cross-sectional view taken along the line A of Fig. 3; -16- 201003821 [Fig. 4] An operation explanatory diagram showing a state in which a wafer is housed in a sliding body. Fig. 5 is an operation explanatory view showing a state in which the sliding means is moved in a direction transverse to the irradiation opening. Fig. 6 is an operation explanatory view showing a state in which the sliding means is further moved than Fig. 5; Fig. 7 is an operation explanatory view showing a state in which the sliding means is moved to the ultraviolet irradiation end position. [Explanation of main component symbols] 10 : Ultraviolet irradiation device 11 : Ultraviolet irradiation unit 1 2 : Irradiation port 14 : Housing 1 5 : Sliding means 1 6 : Holding means 1 7 : Opening and closing means PA : First opening and closing means 17B : 2nd Opening and closing means 18: Pushing means 18A: First pressing means 1 8 B: Second pressing means 1 9 : Position detecting means 2 0: Mercury lamp-17 - 201003821 2 1 : Reflector 23: Main body 23 A : Upper 25: guide rail 2 6 : sliding body 27 : slider 2 8 : top wall 29 : receiving port 3 0 : side wall 33 : bracket 3 3 A : positioning hole 35 : stopper 36 : stopper piece 3 7 : Cylinder 3 9 : Support substrate 40 : Suction plate 41 : Arm 42 : Z-axis robot 43 : X-axis robot 4 5 : Support table 4 7 : Engagement pin 5 0 A : Opening and closing plate 5 0 B : Opening and closing plate 5 1 A :立起部-18- 201003821 5 1 B : Stand up part 5 3 A : Air cylinder 54A : Slider 54B : Slider 60A : Open position detection switch 60B : Open position detection switch 6 1 A : Blocking position detection switch P 1 : UV irradiation standby position P2 = UV irradiation end position S: Next sheet W: Wafer-19-

Claims (1)

201003821 七、申請專利範圍: 1. 一種光照射裝置,係爲對被貼附或是暫時接著 光反應型之接著薄片的被照射體而照射光之光照射裝置 其特徵爲,具備有: 殼體,係在內部具備有光照射單元’且同時具備有 射光之照射口;和 滑動手段,係可在橫切過前述照射口之方向上作相 移動地被作設置,並具備有收容前述被照射體之收容口 和 保持手段,係將前述被照射體作保持,同時在通過 述收容口而將被照射體配置在了滑動手段之內部時,與 滑動手段相卡合並將收容口堵塞;和 開閉手段,係將前述照射口作開閉;和 推壓手段,係將此開閉手段朝向特定方向作推壓, 前述開閉手段,係經由前述推壓手段而被朝向使前 照射口恆常開放之方向作推壓,同時,追隨於前述滑動 段之移動’而將前述照射口作開閉。 2 ·如申請專利範圍第1項所記載之光照射裝置, 中’前述開閉手段,係包含有以沿著前述滑動手段之移 方向而將前述光照射單元挾持於中間的方式而被作了配 之第1以及第2開閉手段,此些之開閉手段,係當前述 動手段從紫外線照射待機位置來朝向紫外線照射結束位 而橫切過照射口時,使第1開閉手段朝向將照射口逐漸 放之方向而移動’並使第2開閉手段朝向將照射口逐漸 有 昭 ^\\\ 對 刖 該 述 手 其 動 置 滑 置 開 堵 -20- 201003821 塞的方 3 . 中,前 上作單 照射待 時,朝 4. 之光照 置的位 行時, 向而移動。 如申請專利範圍第1項所記載之光照射裝置,其 述開閉手段’係被設爲在前述光照射單元之側方向 一配置’該開閉手段,係當前述滑動手段從紫外線 機位置來朝向紫外線照射結束位置而橫切過照射口 向將前述照射口逐漸開放之方向而移動。 如申請專利範圍第1項、第2項或第3項所記載 射裝置,其中,係包含有檢測出前述開閉手段之位 置檢測手段,並當前述照射口之開閉未被正確地進 將特定之訊號輸出至外部。 -21 -201003821 VII. Patent application scope: 1. A light irradiation device which is a light irradiation device that irradiates light to an irradiated body to which a subsequent sheet of a photoreactive type is attached or temporarily attached, and is characterized in that: a light-irradiating unit having a light-emitting unit and a light-emitting unit; and a sliding means for movably moving in a direction transverse to the irradiation opening, and accommodating the irradiated The accommodating port and the holding means of the body hold the object to be irradiated, and when the object to be irradiated is disposed inside the sliding means through the accommodating port, the sliding means is engaged with the sliding means to block the accommodating port; and opening and closing The means for opening and closing the irradiation port; and the pressing means for pressing the opening and closing means in a specific direction, wherein the opening and closing means is oriented in a direction in which the front irradiation opening is constantly opened by the pressing means At the same time, the irradiation port is opened and closed following the movement of the sliding section. (2) The light-irradiating device according to the first aspect of the invention, wherein the opening and closing means includes the method of holding the light-irradiating unit in the middle along the moving direction of the sliding means. In the first and second opening and closing means, when the moving means crosses the irradiation opening toward the ultraviolet irradiation end position from the ultraviolet irradiation standby position, the first opening and closing means is gradually placed toward the irradiation opening. Move in the direction of 'the second opening and closing means to face the irradiation port gradually \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ \ When it is time to move, it moves toward the bit line set by the light of 4. In the light-irradiating device according to the first aspect of the invention, the opening and closing means is configured to "dispose the opening/closing means in the side direction of the light-irradiating means", and the sliding means is directed to the ultraviolet ray from the position of the ultraviolet ray machine. The irradiation end position is moved across the irradiation port in a direction in which the irradiation port is gradually opened. The apparatus for detecting a position according to the first aspect, the second aspect or the third aspect of the invention, wherein the position detecting means for detecting the opening and closing means is included, and the opening and closing of the irradiation port is not correctly entered. The signal is output to the outside. -twenty one -
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TWI644340B (en) * 2014-09-09 2018-12-11 日商東京應化工業股份有限公司 Uv irradiation apparatus and irradiation method thereof, substrate processing apparatus and production method thereof

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JP2023023594A (en) 2021-08-05 2023-02-16 株式会社ディスコ Substrate processing apparatus

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JPH04740A (en) * 1990-04-17 1992-01-06 Fujitsu Ltd Manufacture of semiconductor device
JPH06252262A (en) * 1993-02-26 1994-09-09 Nec Kansai Ltd Ultraviolet ray irradiation equipment
JP4488686B2 (en) 2003-03-12 2010-06-23 日東電工株式会社 Ultraviolet irradiation method and apparatus using the same
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Publication number Priority date Publication date Assignee Title
TWI588881B (en) * 2012-08-07 2017-06-21 Sekisui Chemical Co Ltd Wafer processing method
TWI644340B (en) * 2014-09-09 2018-12-11 日商東京應化工業股份有限公司 Uv irradiation apparatus and irradiation method thereof, substrate processing apparatus and production method thereof

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