JP5554034B2 - Light irradiation apparatus and light irradiation method - Google Patents

Description

  The present invention relates to a light irradiation apparatus and a light irradiation method, and more particularly to a light irradiation apparatus and a light irradiation method capable of irradiating light to an adhesive sheet having a photoreactive adhesive layer attached to a semiconductor wafer or the like.

  In a processing apparatus for a semiconductor wafer (hereinafter simply referred to as “wafer”), a protective adhesive sheet is applied to the circuit surface of the wafer to perform back surface grinding, or a dicing tape is applied to a plurality of chips. A process of tidy up is performed. The adhesive sheet used for such treatment employs an ultraviolet curable (photoreactive) adhesive as the adhesive, and after the treatment as described above, the ultraviolet ray (light) is adhered by an ultraviolet irradiation device. By irradiating the adhesive, the adhesive is cured to weaken the adhesive force, and the wafer can be prevented from being broken and easily peeled off.

  Patent Document 1 discloses an apparatus that attaches an adhesive sheet (adhesive tape) having an ultraviolet curable (sensitive) adhesive layer to one surface of a semiconductor wafer and irradiates the adhesive of the adhesive tape with ultraviolet rays. Has been. The apparatus includes an ultraviolet lamp, a workpiece suction holding mechanism in which a wafer and a ring frame are integrated via an adhesive sheet, and a shielding plate that conceals a workpiece processing chamber when performing ultraviolet irradiation. Yes.

JP-A-6-204335

  However, in the ultraviolet irradiation device described in Patent Document 1, ultraviolet light that has passed through the adhesive sheet portion on the outer peripheral side of the wafer, that is, light that has passed through the adherend is reflected by the shielding plate, and the reflected ultraviolet light is reflected. However, this causes a disadvantage that the other surface of the wafer, that is, the circuit surface may be damaged.

[Object of invention]
The object of the present invention is to prevent the adherend from adhering to the other surface of the adherend, even if light such as ultraviolet light that has passed through the adherend such as a semiconductor wafer having an adhesive sheet attached to one surface is reflected on the other surface. It is providing the light irradiation apparatus and light irradiation method which are not irradiated to the other surface side.

In order to achieve the above object, the present invention is an adhesive sheet having a photoreactive adhesive layer on one surface of a base sheet, and is attached to one surface of an adherend through the adhesive layer. In the light irradiation apparatus for irradiating the adhered adhesive sheet with light, the light emitting means disposed on one surface side of the adherend, the light emitting device disposed on the other surface side of the adherend, and the adherend A configuration is adopted in which light shielding means is provided for preventing light passing through the side from being reflected by another object and irradiating the other surface of the adherend.

Furthermore, the present invention is an adhesive sheet provided with a photoreactive adhesive layer on one surface of a base sheet, and the adhesive sheet attached to one surface of the adherend via the adhesive layer. In the light irradiation method for performing light irradiation, the reflected light is irradiated by irradiating light from one surface side of the adherend, and shielding the light reflected by the other object from the light passing through the side of the adherend. Is used to prevent the other surface of the adherend from being irradiated.

According to the present invention, the light shielding means is arranged on the other surface side of the adherend so that the light passing through the adherend having the adhesive sheet attached to one surface is reflected by another object. The reflected light is shielded by the light shielding means. Therefore, for example, when the adherend is a wafer, there is no inconvenience that damages the circuit of the wafer. In addition, even if the adherend is a plate-like member other than a wafer, it is possible to prevent inconveniences such as extraneous surfaces such as the plate-like member being irradiated with light and deteriorating.
Further, if the light shielding means forms a sealed chamber surrounding the adherend, the light reflected by the inner surface of the cover material can be completely blocked.
Furthermore, in the configuration in which the injection means for injecting the inert gas into the sealed chamber is provided, it is sufficient to fill the case material with a small amount of the inert gas as compared with the case of injecting the inert gas into the entire case material. Wasteful consumption of active gas can be suppressed.

The fragmentary sectional view of the light irradiation apparatus concerning this embodiment. Schematic plan view of FIG. 1 with the cover material omitted

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  1 and 2, the light irradiation apparatus 10 has an adhesive sheet S having a size that protrudes outward from the outer periphery of the wafer W on one surface (lower surface in FIG. 1) of the wafer W as an adherend. The workpiece W1 is affixed and integrated with the outer peripheral side of the adhesive sheet S attached to the ring frame RF. The adhesive sheet S includes an ultraviolet curable (photoreactive) adhesive AD layer that adheres the wafer W to one surface (upper surface in FIG. 1) of the base sheet BS.

  The light irradiation device 10 includes a case material 11 that accommodates a workpiece W1, light-emitting means 12 provided on the side of one surface of the wafer W (the lower surface in FIG. 1) in the case material 11, and the wafer W It includes a cover material 13 as another object arranged on the other surface (upper surface in FIG. 1) side, and a light shielding means 14 provided between the wafer W and the cover material 13.

  The case material 11 is provided in the shape of a bottomed square tube having an opening 15 at the top, and a shelf plate portion 16 is formed on the inner peripheral surface of the peripheral wall. Further, on the inner peripheral side of the shelf plate portion 16, a glass plate 17 having an upper surface located on substantially the same plane as the upper surface of the shelf plate portion 16 is disposed. Can be supported. In addition, on the upper surface side of the shelf plate portion 16, positioning members 18 are disposed on the left side and the lower side in FIG. 2 to contact the outer periphery of the ring frame RF and position the workpiece W <b> 1. These positioning members 18 can be provided so as to be movable in the directions of arrows A and B in FIG. 2 via driving means such as a motor (not shown), thereby positioning the workpiece W1 corresponding to the size of the ring frame RF. Is possible. In addition, it may replace with the glass plate 17 and you may comprise by the resin plate etc. which can permeate | transmit the light which the light emission means 12 light-emits. Further, if the shelf plate portion 16 can support the workpiece W1, the glass plate 17 may not be provided.

  The light-emitting means 12 receives a mercury lamp 19 as a light-emitting source having a shape extending in a direction orthogonal to the paper surface in FIG. 1, and a condensing surface 20 made of a mirror, mirror-finished metal or the like while receiving the mercury lamp 19. The light-condensing plate 21 provided with. The light collecting plate 21 has a length for accommodating the mercury lamp 19, and the light collecting surface 20 is provided in a substantially U shape with an opening width gradually increasing toward the upper side in FIG. The ultraviolet light (light) emitted from the mercury lamp 19 is condensed, and the line light P extending in the direction orthogonal to the paper surface in FIG. Further, the light collector 21 is supported by a slider 22 of a linear motor M provided at the bottom of the case material 11, and the line light P is bonded along the left and right directions in the figure as the slider 22 moves. It is provided so as to scan on the adhesive AD layer of S.

  The cover material 13 is configured to be able to open and close the opening 15 of the case material 11 so that light emitted from the light emitting means 12 does not leak to the outside, and the light shielding means 14 is attached to the cover material 13. Yes. The light shielding unit 14 is in contact with the adhesive AD layer of the adhesive sheet S, and moves to move the light shielding member 30 up and down, and a lower open type light shielding member 30 that forms a sealed chamber C surrounding the wafer W. A linear motor M1 that can be supported, a supply hose 32 as injection means for injecting an inert gas such as nitrogen gas into the sealed chamber C, and the sealed chamber when the inert gas is supplied into the sealed chamber C And an exhaust hose 33 for discharging the air in C to the outside. The light shielding member 30 is connected to the output shaft 37 of the linear motor M <b> 1 at the center of the top wall 36 located at the upper end of the peripheral wall 35. Note that the lower end surface of the peripheral wall 35 is subjected to non-adhesion treatment, and the adhesive sheet S is not pulled upward when the peripheral wall 35 leaves the state in contact with the adhesive AD layer.

Next, a light irradiation method using the light irradiation apparatus 10 will be described.
With opened cover member 13, via a conveying means (not shown) disposed workpiece W1 on the shelf plate 16 and the glass plate 17 in the case member 11, the workpiece W1 at a predetermined position via the positioning member 18 After the positioning, the opening 15 is closed with the cover material 13.
Next, the linear motor M1 is driven to lower the light shielding member 30 from the position indicated by the two-dot chain line in FIG. 1 to the position indicated by the solid line. Thereby, the lower end surface of the peripheral wall 35 abuts on the adhesive sheet S, and the sealed chamber C is formed in a state of surrounding the wafer W.
When the sealed chamber C is formed, an unillustrated on-off valve connected to the exhaust hose 33 is opened for a predetermined time, while a not-illustrated gas supply valve connected to the supply hose 32 is opened for a predetermined time. After injecting the inert gas, the opening / closing valve of the exhaust hole 33 is closed to replace the atmosphere in the sealed chamber C with the inert gas. Thereby, the hardening inhibition of adhesive agent AD layer can be prevented beforehand.
Thereafter, the linear motor M is driven in a state where the mercury lamp 19 emits light, so that the light collecting plate 21 moves from the right side to the left side in FIG. The adhesive AD layer of the adhesive sheet S is scanned from the lower surface side, whereby the adhesive AD layer of the adhesive sheet S is cured.
At this time, the ultraviolet rays that have passed through the adhesive sheet S portion between the wafer W and the ring frame RF, that is, the ultraviolet rays that have passed through the side of the wafer W are reflected by the inner surface of the cover material 13, Then, the light is shielded by the light shielding means 14, and the ultraviolet irradiation to the other surface of the wafer W is blocked.

  Therefore, according to such an embodiment, even if the ultraviolet light that has passed through the side of the wafer W having the adhesive sheet S attached to one surface is reflected on the other surface side of the wafer W, the other surface of the wafer W is As a result, the inconvenience of damaging the circuit surface of the wafer W can be solved.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the embodiment, the case where the light is ultraviolet light has been described, but light other than ultraviolet light, for example, other light rays such as infrared light may be used.

  Further, although the light shielding means 14 is configured by the lower open type light shielding member 30, it can also be configured by using a plate-like member corresponding to the top wall 36. The light shielding means 14 in the present invention only needs to be configured so that the ultraviolet light reflected by the cover material 13 is not irradiated onto the circuit surface of the wafer W.

  In addition to the mercury lamp 19, the light emitting source 12 does not interfere with the adoption of a halogen lamp, a fluorescent lamp, a metal halide lamp, a light emitting diode, or the like. Moreover, in the said embodiment, although the light emission means 12 was comprised so that line light P might be formed using the light-condensing plate 21, the light-condensing plate 21 and the linear motion motor M are not essential, and a single or several light emission source is used. The adhesive AD may be used so that light is irradiated entirely or partially.

Further, the adherend is not limited to the wafer W, and other adherends such as a glass plate, a steel plate, pottery, a wooden plate, or a resin plate can be targeted. It may be a compound wafer.
Furthermore, in the above-described embodiment, the adhesive sheet S is illustrated with a size that protrudes outside the outer periphery of the wafer W. However, the apparatus that irradiates the adhesive sheet S that does not protrude outward from the outer periphery of the wafer W. It may be.
Moreover, when there is no cover material 13, a peripheral device etc. can be illustrated as another object. In such a case, even if the reflected light is reflected on the other surface side of the wafer W, the light shielding means 14 does not irradiate the other surface side of the wafer W.

DESCRIPTION OF SYMBOLS 10 Light irradiation apparatus 12 Light emission means 13 Cover material 14 Light-shielding means 32 Supply hose (injection means)
AD Adhesive BS Base sheet C Sealed chamber S Adhesive sheet W Semiconductor wafer (Substrate)

Claims (2)

Light irradiation for irradiating light to an adhesive sheet having a photoreactive adhesive layer on one surface of a base sheet , and being attached to one surface of an adherend through the adhesive layer In the device
A light emitting means disposed on one surface side of the adherend;
A light-shielding means that is disposed on the other surface side of the adherend and prevents light passing through the adherend side from being reflected by another object and irradiated to the other surface of the adherend. The light irradiation apparatus characterized by providing. Light irradiation for irradiating light to an adhesive sheet having a photoreactive adhesive layer on one surface of a base sheet , and being attached to one surface of an adherend through the adhesive layer In the method
Irradiate light from one side of the adherend,
The light irradiation method characterized in that the light passing through the adherend is shielded from the light reflected by another object so that the reflected light is not irradiated to the other surface of the adherend.

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