JP5728265B2 - Light irradiation apparatus and light irradiation method - Google Patents

Description

  The present invention relates to a light irradiation apparatus and a light irradiation method for irradiating light to an irradiated body including an adherend to which an adhesive sheet is attached.

2. Description of the Related Art Conventionally, there has been proposed an ultraviolet irradiation apparatus that cures a resin by irradiating a photocurable resin provided on the surface of the workpiece with ultraviolet light or the like (see, for example, Patent Document 1).
Further, there has been proposed a peeling apparatus that peels off an adhesive sheet attached to the surface of an adherend such as a semiconductor wafer via a photocurable adhesive layer (see, for example, Patent Document 2). When peeling an adhesive sheet in such a peeling device, by using a light irradiation device as described in Patent Document 1 as a pretreatment, the adhesive layer is irradiated with light to cure the adhesive. After weakening the adhesive force, the adhesive sheet is peeled from the adherend.

The ultraviolet irradiation device disclosed in Patent Document 1 includes an ultraviolet lamp that irradiates ultraviolet rays onto a resin provided on the surface of a workpiece, and a gas supply that prevents curing failure by setting an inert gas atmosphere around the resin when irradiating ultraviolet rays. Part. The gas supply unit has a plurality of gas discharge holes provided so as to face the resin, and discharges an inert gas such as nitrogen from the discharge holes toward the work, while the ultraviolet ray is emitted from the ultraviolet lamp toward the resin. It is comprised so that it may irradiate.
In the case of the protective tape (adhesive sheet) described in Patent Document 2, since the adhesive layer is exposed at the edge of the adhesive sheet, the adhesive is not cured by oxygen in the atmosphere when this part is exposed to the atmosphere. In order to cause so-called oxygen inhibition, the adhesive layer exposed at the edge of the adhesive sheet is reliably cured using an ultraviolet irradiation device such as that disclosed in Patent Document 1.

JP-A-2005-81738 JP 2009-70837 A

  However, when an inert gas is supplied from a plurality of gas discharge holes provided opposite to the resin (adhesive sheet) as in the ultraviolet irradiation device described in Patent Document 1, a large amount of the inert gas is consumed. End up. However, if the supply amount of the inert gas is reduced, the exposed adhesive will be hardened, and when the adhesive sheet is peeled off, the semiconductor wafer is lifted together with the peeled adhesive sheet, and the semiconductor There is a possibility of damaging the wafer.

  The object of the present invention is to efficiently supply inert gas to the adhesive of the exposed adhesive sheet, so that light irradiation that can reliably suppress poor curing of the adhesive even if the amount of inert gas supplied is reduced. An object is to provide an apparatus and a light irradiation method.

In order to achieve the above object, a light irradiation apparatus according to the present invention is a light irradiation apparatus that irradiates light to an irradiated object including an adhesive sheet and an adherend to which the adhesive sheet is attached via an adhesive layer. A support means for supporting the irradiated body, a light emitting means disposed opposite to the irradiated body and capable of irradiating light of a predetermined wavelength, and a space between the irradiated body and the light emitting means is inert. A supply means for supplying a gas; and a gas guiding means for guiding the supplied inert gas to a pasting edge of the adhesive sheet in the irradiated body , the gas guiding means approaching the irradiated body a proximity surface that is, with connected to this approach surface, than the approach surface Ru and a recess spaced from the irradiated body, adopts a configuration that.

At this time, the between the light emitting means and the irradiation object is permeable irradiation auxiliary member with light emitted from the light emitting means is provided, said gas guiding means, shape formed on the irradiation auxiliary member It is preferable that

On the other hand, the light irradiation method of the present invention is a light irradiation method for irradiating light to an irradiated body including an adhesive sheet and an adherend to which the adhesive sheet is attached via an adhesive layer, A body facing the light emitting means, supplying an inert gas to a space between the irradiated body and the light emitting means, and an approach surface in which the supplied inert gas approaches the irradiated body; with continuous to this approach surface, induces the attached edges of the adhesive sheet in Hence the irradiated body in the gas guiding means and a recess spaced from the irradiated body than the approach surface, the inert gas The light emitting means irradiates the irradiated body with light having a predetermined wavelength in a state where the light is supplied.

According to the present invention as described above, the inert gas can be efficiently supplied to the edge portion of the adhesive sheet by guiding the inert gas to the pasting edge portion of the adhesive sheet by the gas guiding means, Even with a small supply of inert gas, the edge of the adhesive sheet can be surely made into an inert gas atmosphere, and when irradiated with light of a predetermined wavelength, it is ensured that the adhesive of the adhesive sheet causes poor curing. Can be prevented. Therefore, for example, when the adhesive sheet is peeled off by the peeling device after light irradiation, the adherend is lifted together with the adhesive sheet and damaged because the adhesive layer at the edge portion of the adhesive sheet is not cured. Can be prevented.
In addition, it is possible to prevent unnecessary substances such as dust and dirt from adhering to the adhesive exposed at the edge portion of the adhesive sheet until the adhesive sheet is peeled off.

Further, by supplying the inert gas to the space by the supply means, it is possible to further save the gas, and to eliminate the retention of the inert gas by supplying the inert gas along the irradiated surface from the air supply port, An inert gas atmosphere without spots can be formed.
Further, the gas guiding means is configured by the approach surface and the recess formed on the surface of the irradiation assisting member, so that an inert gas is provided at a desired position without providing a separate member that blocks the light to be irradiated. In addition, the structure can be simplified.
Moreover, an inert gas can be smoothly guide | induced on an approach surface from a recessed part by forming an inclined surface in the outer edge of an approach surface.

Sectional drawing of the light irradiation apparatus which concerns on one Embodiment of this invention. The perspective view of a part of light irradiation apparatus of FIG. Operation | movement explanatory drawing of the light irradiation apparatus of FIG. The top view of the light irradiation apparatus which concerns on the modification of this invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
For example, when a direction such as up, down, left, right, near side, or back side is shown without referring to a reference figure in this embodiment, FIG. 1 is used as a reference.
1 and 2, the light irradiation apparatus 1 includes a base sheet BS and an adhesive sheet S having an adhesive layer AD, and a semiconductor wafer as an adherend to which the adhesive sheet S is attached via the adhesive layer AD. This is an apparatus for irradiating light to an irradiated object W1 including W (hereinafter sometimes simply referred to as wafer W). The irradiated object W1 is integrated with the ring frame RF through a mount sheet MS attached to the back surface of the wafer W (hereinafter, simply referred to as an integrated object WM). The adhesive layer AD is composed of a photo-curing type (ultraviolet curing type) adhesive, and is designed to start curing when irradiated with light having a predetermined wavelength (for example, λ = 365 nm). Is hardened, the adhesive strength is reduced and the wafer W is easily peeled off.

  The light irradiation device 1 is attached to the device main body 2 and the upper portion of the device main body 2, and is provided with support means 3 for supporting the irradiated object W <b> 1 via the ring frame RF, and provided inside the device main body 2 to be irradiated. Formed by a light emitting means 4 capable of irradiating light of a predetermined wavelength toward the body W1, a moving means 5 for supporting the light emitting means 4 so as to be movable in the left-right direction, an irradiated body W1, the apparatus main body 2, and a supporting means 3. And a supply means 6 for supplying an inert gas such as nitrogen gas to the space SP. Further, the operation of each part is controlled by a control means (not shown).

  The apparatus main body 2 includes an upper-opening rectangular tube-shaped external frame 21, quartz glass 22 as an irradiation auxiliary member provided above the external frame 21, and an arm that is attached to the external frame 21 and is rotatable. 26 and a lid member 27 supported by 26. A circular opening 24 for fitting the quartz glass 22 and a rib portion 25 for supporting the quartz glass 22 are formed on the upper surface 23 of the external frame 21, and the support means 3 is supported on the upper surface 23. . The quartz glass 22 is provided so as to be able to transmit light emitted from the light emitting means 4 and is attached so as to seal the opening 24. Further, on the upper surface of the quartz glass 22, an approach surface 22B approaching the irradiated body W1 supported by the support means 3, and the approach surface 22B are connected to each other, and further away from the irradiated body W1 than the approach surface 22B. A recess 22A is provided. The recess 22A includes an inclined surface 22C that is inclined radially outward from the approach surface 22B, and an upper surface 23 of the external frame 21 and a bottom surface 22D that is formed substantially flat. The gas guiding means of the present invention includes an approach surface 22B, an inclined surface 22C, and a bottom surface 22D. When the lid member 27 is in the closed state shown in FIG. 1, the lower surface side is provided so as to abut against the mount sheet MS, and the ring frame RF is supported by the urging means such as a spring or an elastic member (not shown). It is provided so as to be biased to the side (downward). An upper support means that can support the mount sheet MS by suction or the like may be provided on the lower surface side of the lid member 27.

  The support means 3 is constituted by an overall annular support member 31, and the support member 31 is a bottom surface of a recess opening upward, a support portion 32 for supporting the integrated object WM, and a support portion 32. The inner peripheral surface portion 33 is formed to be continuous and located below the support portion 32. The irradiated body W1 is supported by the support means 3 by placing the ring frame RF on the support portion 32 with the adhesive sheet S facing downward, and in this support state, the lower surface of the adhesive layer AD. Is the irradiated surface WA, and the adhesive sheet S and the upper surface of the approaching surface 22B are opposed to each other with a relatively small gap. Note that a positioning pin (not shown) that can engage the notch of the ring frame RF and position the irradiated object W1 is provided on the upper surface of the support portion 32 (see FIG. 4). Moreover, the adhesive sheet S and the upper surface of the approach surface 22B may be in contact with each other. Here, the support means 3 is configured so that the space SP is formed by the quartz glass 22, the inner peripheral surface portion 33 of the support member 31, the ring frame RF, and the mount sheet MS in the support state of the irradiated object W1. It has become. This space SP is a gap space formed between the ring-shaped space SP1 formed by the inner peripheral surface portion 33, the ring frame RF, the mount sheet MS, the inclined surface 22C and the bottom surface 22D, and the adhesive sheet S and the approach surface 22B. It consists of SP2. The gap space SP2 may not be formed.

  As shown in FIG. 1, the light emitting means 4 includes a case 41 having an upper surface opening type, a transmissive glass 42 provided in the opening of the case 41, a light source 43 provided in the case 41, and a reflection in a U-shaped cross section. And a plate 44. The light source 43 is an LED (Light Emitting Diode) lamp. Such a light emitting means 4 extends in the depth direction of the paper and is formed longer than the maximum outer diameter of the adhesive layer AD, and the light from the light source 43 is focused on the adhesive layer AD of the adhesive sheet S by the reflector 44. Are adapted to be irradiated. Note that a plurality of LED lamps may be provided in the depth direction of the page, or a single LED lamp may be configured.

  The moving means 5 is composed of a single-axis robot 51 as a driving device supported on the bottom surface of the external frame 21 and extending in the left-right direction, and a case 41 is supported on a slider 52 of the single-axis robot 51. By moving the light emitting means 4 in the left-right direction by the moving means 5, the entire surface of the adhesive layer AD of the adhesive sheet S can be irradiated with light having a predetermined wavelength emitted from the light source 43.

  The supply means 6 includes a storage unit 61 in which an inert gas is stored, an air supply port 62 that is connected to the storage unit 61 via a pipe or the like (not shown), and that opens into the space SP. An exhaust port 63 is provided on the opposite side of the support member 31 with respect to the port 62 and exhausts the inert gas in the space SP. The exhaust port 63 is connected to the exhaust port 63 via a pipe or the like (not shown). And a processing unit 64 for processing the above.

  As the operation of the light irradiation apparatus 1 as described above, first, the integrated object WM is placed on the support means 3 so that the notch of the ring frame RF is positioned by a positioning pin (not shown). Thereby, the space SP is formed. Next, when the lid member 27 is rotated to be in the closed state as shown in FIG. 1, the integral object WM is sandwiched between the lower surface of the lid member 27 and the support portion 32 by an urging means (not shown) and the movement thereof is restricted. The At this time, since the lower surface of the lid member 27 contacts the mount sheet MS, it may be supported by suction through an upper support means (not shown).

  Next, when the inert gas is supplied into the space SP by the supply means 6, as indicated by the white arrows in FIGS. 2 and 3, the air current flows from the air supply port 62 to the ring-shaped space SP1 and flows into the gap space SP2. Airflow is generated. The airflow in the ring-shaped space SP <b> 1 circulates along the inner peripheral surface portion 33 of the support member 31 and is exhausted from the exhaust port 63. On the other hand, the airflow rising toward the irradiation object W1 along the inclined surface 22C and flowing into the clearance space SP2 flows along the upper surface of the approach surface 22B and the surface of the adhesive sheet S and is exhausted from the exhaust port 63. . As described above, the gas guiding means can be filled with the inert gas throughout the space SP. In addition, suction means such as a suction fan or a suction pump is provided to suck the inert gas from the exhaust port 63 to suppress the stagnation of the air flow in the space SP and to actively replace the atmosphere inside the space SP with the inert gas. May be. Further, the supply of the inert gas may be stopped during the light irradiation, or may be continuously supplied.

  As described above, the light emitting means 4 emits light from the light source 43 in a state where the space SP is filled with the inert gas and the surface of the adhesive sheet S and the pasting edge SE are placed in an inert gas atmosphere. The emitted light is collected by the reflecting plate 44 and becomes line light extending in the direction orthogonal to the paper surface in FIG. This line light is focused on the adhesive layer AD of the adhesive sheet S. The moving unit 5 moves the light emitting unit 4 so that the line light can be irradiated from the left end, which is the irradiation start end of the adhesive layer AD, to the right end, which is the irradiation end end, so that the adhesive layer AD of the adhesive sheet S is moved. Harden the whole. In addition, since the mount sheet MS is in contact with the lid member 27, it is possible to prevent the irradiated object W1 from separating upward due to the supply of the inert gas and the line light from being defocused. Further, if the mount sheet MS is configured to be adsorbed and supported by the upper support means (not shown) of the lid member 27, the mount sheet MS hangs down due to the weight of the irradiated object W1 or suction by the inert gas suction means, and the line light is defocused. This can be prevented. By not forming the gap space SP2, it is possible to prevent the line light from being defocused. When the irradiation of light to the entire adhesive layer AD is completed, the light emitting means 4 turns off the light source 43 and returns to the irradiation start position, and the supply means 6 stops the supply of the inert gas. Thereafter, the lid member 27 is opened, and the integrated object WM is taken out by an appropriate conveying device and is conveyed to the next step, for example, a peeling device, and thereafter the same operation as described above is repeated.

According to this embodiment, there are the following effects.
That is, the proximity surface 22B and the concave portion 22A formed on the surface of the quartz glass 22 guide the inert gas supplied into the space SP to the pasting edge portion SE of the adhesive sheet S, so that the vicinity of the pasting edge portion SE. Can be irradiated with light of a predetermined wavelength from the light emitting means 4 in a state in which the gas is reliably in an inert gas atmosphere, and poor curing of the adhesive layer AD of the adhesive sheet S due to oxygen inhibition can be prevented. Therefore, when the adhesive sheet S is peeled from the wafer W, the wafer W is damaged, or when the integrated object WM is transported by an appropriate transporting means after irradiation with light, etc. It is also possible to prevent unnecessary substances such as dust and dirt from adhering to the exposed adhesive AD.

  As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to particular embodiments, but with respect to the embodiments described above, such as shape and the like, without departing from the scope and spirit of the invention. In the detailed configuration, various modifications can be made by those skilled in the art. Moreover, since the description which limited the shape etc. which were disclosed above was illustrated in order to make an understanding of this invention easy, it does not limit this invention, Therefore The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, in the above-described embodiment, the light irradiation apparatus 1 that irradiates the irradiated object W1 with the adhesive sheet S attached to the wafer W is exemplified. However, the irradiated object is the wafer W as the adherend. Not limited to. That is, the type and material of the adherend and the adhesive sheet S in the present invention are not particularly limited. For example, the adherend is an appropriate article (for example, a cardboard case or a resin container), and the adhesive sheet S. May be a label, and when the adherend is a semiconductor wafer, the adhesive sheet S may be a protective sheet, a dicing tape, a die attach film, or the like. The semiconductor wafer can be exemplified by a silicon semiconductor wafer, a compound semiconductor wafer, and the like. The adhesive sheet to be attached to such a semiconductor wafer is not limited to a protective sheet, dicing tape, and die attach film, but any other sheet or film. Adhesive sheets with arbitrary uses and shapes, such as tape, can be applied. Furthermore, as a to-be-adhered body, not only a glass plate, a steel plate, a resin plate, etc., and other plate-shaped members but also members and articles in any form can be targeted.

Further, the supply means 6 is not limited to the one provided with one air supply port 62 and one exhaust port 63 as in the above embodiment, and either one or both may be provided at a plurality of locations. For example, as shown in FIG. 4 (A), the air supply port 62 may be provided at two locations and the exhaust port 63 may be provided at one location, or as shown in FIG. 4 (B). Two exhaust ports 63 may be provided.
In the light irradiation apparatus according to the modification of the present invention shown in FIG. 4 (B), a wafer W in which a cutting groove C is formed on the adhesive sheet S by so-called tip dicing and is separated into pieces is used as the irradiated object W2. A mount sheet MS is attached to the singulated wafer W side and integrated with the ring frame RF. In the case of such an irradiation object W2, the support means 3 provided with the air supply ports 62 in the circumferential direction of 12:00 and 9 o'clock and the exhaust ports 63 in the directions of 3 o'clock and 6 o'clock is employed. It is preferable. As a result, the inert gas supplied from the air supply port 62 in the 12 o'clock direction is exhausted from the exhaust port 63 in the 6 o'clock direction, so that the inert gas easily enters the vertical cutting groove C. Further, the inert gas supplied from the air supply port 62 in the 9 o'clock direction is exhausted from the exhaust port 63 in the 3 o'clock direction, so that the inert gas easily enters the horizontal cutting groove C. . Therefore, the inert gas can be efficiently guided to the sticking edge portion of the adhesive sheet S (in this case, the cutting edge portion of the wafer W) without the retention of the inert gas.

Moreover, in the said embodiment, although the gas guidance means was comprised by the uneven | corrugated shape of the quartz glass 22 as an irradiation auxiliary member, a gas guidance means may be comprised with a member separate from an irradiation auxiliary member, and a support means. 3 or a part of the supply means 6 may be provided. When the gas guiding means is provided in the support means 3, an annular gas conduction path is formed inside the support member 31, and a plurality of air supply ports opened from the gas conduction path to the inner peripheral surface portion 33 are provided. A configuration in which the inert gas supplied to the space from the air supply port is blown out toward the pasting edge portion SE of the adhesive sheet S can be exemplified. When the gas guiding means is provided in the supply means 6, an annular pipe having a plurality of air supply ports is provided in the supply means 6, and the plurality of air supply ports are directed toward the pasting edge SE of the adhesive sheet S. The structure which blows off an inert gas can be illustrated.
Further, when the gas assisting means is provided on the irradiation assisting member, the shape is not limited to the concavo-convex shape such as the approaching surface 22B, the bottom surface 22D, and the inclined surface 22C of the quartz glass 22 in the embodiment, but may be appropriately determined according to the irradiated object. A surface shape or a cross-sectional shape can be employed. A plurality of approach surfaces 22B may be provided. Further, when the adhesive sheet S is scattered and stuck at a plurality of locations, the plurality of approach surfaces 22B may be configured to face each other according to the position of the scattered adhesive sheet S. Good.

Further, the light emitting means 4 is not limited to the one moved by the moving means 5 as described above, and is configured to have a light emitting surface having a width corresponding to the shape of the irradiated object. It is possible to irradiate light on the entire surface of the irradiated object by emitting light of.
Furthermore, the light source 43 can employ other light emitting means such as a high-pressure mercury lamp, a low-pressure mercury lamp, a fluorescent lamp, a metal halide lamp, a xenon lamp, or a halogen lamp, and can cause a photoreaction to occur on the irradiated object. What is necessary is just to be comprised with a thing, for example, you may raise | generate the photoreaction which irradiates a to-be-irradiated body with infrared rays, and softens.
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).
Moreover, although the example which uses nitrogen gas as an inert gas was demonstrated in the said embodiment, it is not limited to this, You may use inert gas, such as helium gas and argon gas other than nitrogen gas.
Furthermore, although the two-layered adhesive sheet S having the adhesive layer AD on one surface of the base sheet BS is illustrated in the above embodiment, the adhesive sheet S may be three or more layers having other layers. For example, the adhesive sheet S having a single-layer structure such as a double-sided adhesive sheet without the base sheet BS may be used.

DESCRIPTION OF SYMBOLS 1 Light irradiation apparatus 3 Support means 4 Light emission means 6 Supply means 22 Quartz glass (irradiation auxiliary member)
22A Concave portion 22B Approaching surface 22C Inclined surface 62 Air supply port 63 Air exhaust port 64 Suction unit (suction means)
S Adhesive sheet SE Affixing edge SP Space W Wafer (Substrate)
W1, W2 Object to be irradiated WA Surface to be irradiated

Claims (3)

A light irradiation device that irradiates light to an irradiated body including an adhesive sheet and an adherend to which the adhesive sheet is attached via an adhesive layer,
Support means for supporting the irradiated object;
A light emitting means disposed opposite to the irradiated body and capable of emitting light of a predetermined wavelength;
Supply means for supplying an inert gas to a space between the irradiated body and the light emitting means;
Gas guiding means for guiding the supplied inert gas to a pasting edge portion of the adhesive sheet in the irradiated body;
The gas guiding unit includes an approach surface that is close to the irradiated body, and a concave portion that is connected to the approach surface and is further away from the irradiated body than the approach surface. An irradiation auxiliary member capable of transmitting light emitted from the light emitting means is provided between the irradiated body and the light emitting means,
The light irradiation apparatus according to claim 1, wherein the gas guiding unit is formed on the irradiation auxiliary member. A light irradiation method for irradiating light to an irradiated body including an adhesive sheet and an adherend to which the adhesive sheet is attached via an adhesive layer,
Supporting the irradiated object so as to face the light emitting means,
While supplying an inert gas to the space between the irradiated object and the light emitting means, the supplied inert gas is connected to the approaching surface approaching the irradiated object, and is connected to the approaching surface. also induce the in sticking edges of the adhesive sheet in Hence the irradiated body in the gas guiding means comprising a spaced recess from the irradiated object,
A light irradiation method comprising irradiating the irradiated body with light having a predetermined wavelength from the light emitting means in a state where the inert gas is supplied.

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