TW200952106A - Test system - Google Patents

Test system Download PDF

Info

Publication number
TW200952106A
TW200952106A TW098118028A TW98118028A TW200952106A TW 200952106 A TW200952106 A TW 200952106A TW 098118028 A TW098118028 A TW 098118028A TW 98118028 A TW98118028 A TW 98118028A TW 200952106 A TW200952106 A TW 200952106A
Authority
TW
Taiwan
Prior art keywords
wafer
semiconductor wafer
test
semiconductor
alignment mark
Prior art date
Application number
TW098118028A
Other languages
English (en)
Chinese (zh)
Other versions
TWI379369B (enExample
Inventor
Yoshio Komoto
Yoshiharu Umemura
Yasuo Tokunaga
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200952106A publication Critical patent/TW200952106A/zh
Application granted granted Critical
Publication of TWI379369B publication Critical patent/TWI379369B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW098118028A 2008-06-02 2009-06-01 Test system TW200952106A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/060171 WO2009147719A1 (ja) 2008-06-02 2008-06-02 試験システム

Publications (2)

Publication Number Publication Date
TW200952106A true TW200952106A (en) 2009-12-16
TWI379369B TWI379369B (enExample) 2012-12-11

Family

ID=41397810

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098118028A TW200952106A (en) 2008-06-02 2009-06-01 Test system

Country Status (3)

Country Link
JP (1) JP5368440B2 (enExample)
TW (1) TW200952106A (enExample)
WO (1) WO2009147719A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI656350B (zh) * 2017-08-07 2019-04-11 日商泰克霍隆公司 探測站

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6471401B1 (ja) * 2017-10-31 2019-02-20 合同会社Pleson 半導体ウエハーの試験ユニット
CN114779034A (zh) * 2022-04-13 2022-07-22 苏州晶睿半导体科技有限公司 一种基于半导体晶圆的测试设备和map图偏移检测方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07105432B2 (ja) * 1986-10-09 1995-11-13 タツモ株式会社 基板の自動位置合せ装置
JPH11274252A (ja) * 1998-03-19 1999-10-08 Mitsubishi Electric Corp 半導体装置の検査装置及びその検査方法
JP2000164655A (ja) * 1998-11-24 2000-06-16 Matsushita Electric Ind Co Ltd アライメント装置及びアライメント方法
JP4423991B2 (ja) * 2003-02-18 2010-03-03 Ｊｓｒ株式会社 異方導電性コネクターおよびプローブ部材並びにウエハ検査装置およびウエハ検査方法
JP4867219B2 (ja) * 2005-07-14 2012-02-01 株式会社デンソー 検査装置及び検査装置の位置決め方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI656350B (zh) * 2017-08-07 2019-04-11 日商泰克霍隆公司 探測站

Also Published As

Publication number Publication date
JPWO2009147719A1 (ja) 2011-10-20
JP5368440B2 (ja) 2013-12-18
TWI379369B (enExample) 2012-12-11
WO2009147719A1 (ja) 2009-12-10

Similar Documents

Publication Publication Date Title
TWI442509B (zh) Check the device
TWI442495B (zh) Check the device
JP2004085259A (ja) プローブ装置
US11346861B2 (en) Contact accuracy assurance method, contact accuracy assurance mechanism, and inspection apparatus
JPH0792479B2 (ja) プローブ装置の平行度調整方法
TW200947576A (en) Inspection method and program recording medium recording the inspection method
JP6615680B2 (ja) プローブカード
KR20200007952A (ko) 검사 시스템 및 검사 시스템에 있어서의 온도 측정 방법
KR102243840B1 (ko) 회로 장치, 테스터, 검사 장치 및 회로 기판의 휨 조정 방법
TW200952106A (en) Test system
JPH0943276A (ja) プローブ装置に用いられるプローブカードデバイス
JP5529605B2 (ja) ウエハチャックの傾き補正方法及びプローブ装置
JP2019161185A (ja) プローバ
JP2995134B2 (ja) プローブ装置
WO2014021024A1 (ja) プローブカードへの基板当接装置及び基板当接装置を備えた基板検査装置
US11408926B2 (en) Electrical connecting device, inspection apparatus, and method for electrical connection between contact target and contact member
JP2007035856A (ja) 集積回路の製造方法、集積回路の測定装置及びウェハ
KR20170049880A (ko) 프로브 카드 정렬 방법
JP3193659B2 (ja) プロービング方法
JP2019091773A (ja) 半導体装置用評価装置および半導体装置の評価方法
US11269004B2 (en) Inspection apparatus and inspection method for inspecting electrical characteristic of electronic device
CN110383444B (zh) 检查系统
JP2963828B2 (ja) プローブ装置
JP2006514271A (ja) 静電イメージャー
JP2003240820A (ja) プロービング装置および検査装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees