TW200950686A - Socket guide, socket unit, electronic component test apparatus, and method of controlling socket temperature - Google Patents

Socket guide, socket unit, electronic component test apparatus, and method of controlling socket temperature Download PDF

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Publication number
TW200950686A
TW200950686A TW098104917A TW98104917A TW200950686A TW 200950686 A TW200950686 A TW 200950686A TW 098104917 A TW098104917 A TW 098104917A TW 98104917 A TW98104917 A TW 98104917A TW 200950686 A TW200950686 A TW 200950686A
Authority
TW
Taiwan
Prior art keywords
socket
fluid
electronic component
plug
guide
Prior art date
Application number
TW098104917A
Other languages
English (en)
Chinese (zh)
Other versions
TWI377005B (enrdf_load_stackoverflow
Inventor
Aritomo Kikuchi
Mitsuo Ishikawa
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200950686A publication Critical patent/TW200950686A/zh
Application granted granted Critical
Publication of TWI377005B publication Critical patent/TWI377005B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
TW098104917A 2008-03-27 2009-02-17 Socket guide, socket unit, electronic component test apparatus, and method of controlling socket temperature TW200950686A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/055843 WO2009118855A1 (ja) 2008-03-27 2008-03-27 ソケットガイド、ソケットユニット、電子部品試験装置およびソケットの温度制御方法

Publications (2)

Publication Number Publication Date
TW200950686A true TW200950686A (en) 2009-12-01
TWI377005B TWI377005B (enrdf_load_stackoverflow) 2012-11-11

Family

ID=41113096

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098104917A TW200950686A (en) 2008-03-27 2009-02-17 Socket guide, socket unit, electronic component test apparatus, and method of controlling socket temperature

Country Status (3)

Country Link
JP (1) JP5161870B2 (enrdf_load_stackoverflow)
TW (1) TW200950686A (enrdf_load_stackoverflow)
WO (1) WO2009118855A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI572870B (zh) * 2014-07-17 2017-03-01 Seiko Epson Corp Electronic parts conveyor and electronic parts inspection device
TWI600911B (zh) * 2015-08-27 2017-10-01 Seiko Epson Corp Electronic parts conveying apparatus and electronic parts inspection apparatus
TWI641848B (zh) * 2014-10-06 2018-11-21 日商精工愛普生股份有限公司 Electronic component conveying device and electronic component inspection device

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2013051099A1 (ja) * 2011-10-04 2015-03-30 富士通株式会社 試験用治具及び半導体装置の試験方法
KR102133414B1 (ko) * 2014-04-24 2020-07-15 (주)테크윙 전자부품 테스트용 핸들러 및 그 작동방법
JP2016070778A (ja) * 2014-09-30 2016-05-09 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP2016070777A (ja) * 2014-09-30 2016-05-09 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP6818527B2 (ja) * 2016-11-30 2021-01-20 三菱電機株式会社 半導体デバイスの位置決め加圧機構
US10782316B2 (en) 2017-01-09 2020-09-22 Delta Design, Inc. Socket side thermal system
EP3527994A1 (en) * 2018-02-20 2019-08-21 Rasco GmbH Contactor socket and ic test apparatus
IT201800007609A1 (it) * 2018-07-30 2020-01-30 Microtest Srl Una macchina integrata per condurre test in temperatura su componenti elettronici quali i chip
JP7191735B2 (ja) * 2019-03-07 2022-12-19 株式会社東芝 テスト治具
WO2021132488A1 (ja) * 2019-12-25 2021-07-01 株式会社エンプラス 風案内部材、試験装置ユニット、試験装置、電気部品用ソケット及び該電気部品ソケットを複数有する試験装置
KR102332664B1 (ko) * 2020-05-14 2021-12-01 주식회사 티에프이 반도체 패키지 테스트 장치 및 반도체 패키지 테스트용 소켓 테스트 장치
KR102807351B1 (ko) 2020-07-22 2025-05-13 삼성전자주식회사 테스트 핸들러 및 이를 포함하는 반도체 소자 테스트 장치
WO2023278632A1 (en) 2021-06-30 2023-01-05 Delta Design, Inc. Temperature control system including contactor assembly
CN114296493B (zh) * 2022-03-11 2022-08-09 杭州长川智能制造有限公司 一种芯片温度调节方法
WO2024018536A1 (ja) * 2022-07-19 2024-01-25 株式会社アドバンテスト 熱交換器、電子部品ハンドリング装置、及び、電子部品試験装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3774057B2 (ja) * 1998-03-23 2006-05-10 株式会社アドバンテスト Ｉｃ試験装置
JP3157782B2 (ja) * 1998-07-23 2001-04-16 茨城日本電気株式会社 Ｉｃソケット
JP4789125B2 (ja) * 2000-12-07 2011-10-12 株式会社アドバンテスト 電子部品試験用ソケットおよびこれを用いた電子部品試験装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI572870B (zh) * 2014-07-17 2017-03-01 Seiko Epson Corp Electronic parts conveyor and electronic parts inspection device
TWI641848B (zh) * 2014-10-06 2018-11-21 日商精工愛普生股份有限公司 Electronic component conveying device and electronic component inspection device
TWI600911B (zh) * 2015-08-27 2017-10-01 Seiko Epson Corp Electronic parts conveying apparatus and electronic parts inspection apparatus

Also Published As

Publication number Publication date
TWI377005B (enrdf_load_stackoverflow) 2012-11-11
JPWO2009118855A1 (ja) 2011-07-21
WO2009118855A1 (ja) 2009-10-01
JP5161870B2 (ja) 2013-03-13

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