TW200942095A - Resist ink and method for manufacturing multilayer printed wiring board - Google Patents

Resist ink and method for manufacturing multilayer printed wiring board Download PDF

Info

Publication number
TW200942095A
TW200942095A TW098103472A TW98103472A TW200942095A TW 200942095 A TW200942095 A TW 200942095A TW 098103472 A TW098103472 A TW 098103472A TW 98103472 A TW98103472 A TW 98103472A TW 200942095 A TW200942095 A TW 200942095A
Authority
TW
Taiwan
Prior art keywords
layer
ink
wiring pattern
insulating layer
wiring board
Prior art date
Application number
TW098103472A
Other languages
English (en)
Chinese (zh)
Inventor
Takeshi Nishio
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of TW200942095A publication Critical patent/TW200942095A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW098103472A 2008-02-04 2009-02-04 Resist ink and method for manufacturing multilayer printed wiring board TW200942095A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008024317 2008-02-04

Publications (1)

Publication Number Publication Date
TW200942095A true TW200942095A (en) 2009-10-01

Family

ID=40952140

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098103472A TW200942095A (en) 2008-02-04 2009-02-04 Resist ink and method for manufacturing multilayer printed wiring board

Country Status (5)

Country Link
JP (1) JPWO2009099065A1 (ja)
KR (1) KR20100119759A (ja)
CN (1) CN102017821A (ja)
TW (1) TW200942095A (ja)
WO (1) WO2009099065A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8516694B2 (en) 2010-06-07 2013-08-27 Fukui Precision Component (Shenzhen) Co., Ltd. Method for manufacturing printed circuit board with cavity
US9282626B2 (en) 2010-10-20 2016-03-08 Lg Innotek Co., Ltd. Printed circuit board and method for manufacturing the same

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101750836B1 (ko) * 2015-10-14 2017-06-27 대덕전자 주식회사 캐비티 회로기판 제조방법
KR102466204B1 (ko) * 2015-12-16 2022-11-11 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조방법
CN105530755B (zh) * 2016-02-25 2018-01-23 广东欧珀移动通信有限公司 软硬结合板及移动终端
JP6559743B2 (ja) 2017-08-08 2019-08-14 太陽誘電株式会社 半導体モジュール
WO2019230357A1 (ja) * 2018-05-31 2019-12-05 株式会社カネカ パターン印刷用レジスト組成物及びそれを用いた回路パターンの製造方法
EP3806593A4 (en) * 2018-06-18 2021-07-21 Kaneka Corporation COMPOSITION OF RESERVE FOR PRINTING OF PATTERNS AND METHOD OF MANUFACTURING CIRCUIT PATTERNS USING IT
WO2020175476A1 (ja) * 2019-02-27 2020-09-03 住友電工プリントサーキット株式会社 プリント配線板及びプリント配線板の製造方法
FI20195798A1 (en) * 2019-09-23 2021-03-24 Canatu Oy LAYERED PRESSURE TREATMENT EQUIPMENT AND METHOD

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0239594A (ja) * 1988-07-29 1990-02-08 Sharp Corp リジッドフレキシブル配線板の製造方法
JPH08174755A (ja) * 1994-12-21 1996-07-09 Toagosei Co Ltd 銅張絶縁シートおよび多層プリント配線板の製造方法
JP2001015917A (ja) * 1999-06-30 2001-01-19 Toshiba Corp リジッドフレックスプリント配線板の製造方法
KR100688826B1 (ko) * 2005-01-20 2007-03-02 삼성전기주식회사 리지드-플렉시블 인쇄회로기판 제조방법
JP2007063252A (ja) * 2005-06-23 2007-03-15 Sekisui Chem Co Ltd 重合性化合物及び重合性化合物の製造方法
JP2008019368A (ja) * 2006-07-14 2008-01-31 Toyo Ink Mfg Co Ltd 顔料組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8516694B2 (en) 2010-06-07 2013-08-27 Fukui Precision Component (Shenzhen) Co., Ltd. Method for manufacturing printed circuit board with cavity
US9282626B2 (en) 2010-10-20 2016-03-08 Lg Innotek Co., Ltd. Printed circuit board and method for manufacturing the same

Also Published As

Publication number Publication date
CN102017821A (zh) 2011-04-13
KR20100119759A (ko) 2010-11-10
JPWO2009099065A1 (ja) 2011-05-26
WO2009099065A1 (ja) 2009-08-13

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