TW200941322A - Manufacturing method for conducting films on two surfaces of transparent substrate of touch-control circuit - Google Patents

Manufacturing method for conducting films on two surfaces of transparent substrate of touch-control circuit Download PDF

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Publication number
TW200941322A
TW200941322A TW097111246A TW97111246A TW200941322A TW 200941322 A TW200941322 A TW 200941322A TW 097111246 A TW097111246 A TW 097111246A TW 97111246 A TW97111246 A TW 97111246A TW 200941322 A TW200941322 A TW 200941322A
Authority
TW
Taiwan
Prior art keywords
layer
conductive
substrate
transparent substrate
touch
Prior art date
Application number
TW097111246A
Other languages
English (en)
Chinese (zh)
Other versions
TWI339809B (enExample
Inventor
Wei-Ping Chou
Original Assignee
Tpk Touch Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tpk Touch Solutions Inc filed Critical Tpk Touch Solutions Inc
Priority to TW097111246A priority Critical patent/TW200941322A/zh
Priority to US12/117,814 priority patent/US7887997B2/en
Publication of TW200941322A publication Critical patent/TW200941322A/zh
Application granted granted Critical
Publication of TWI339809B publication Critical patent/TWI339809B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2032—Simultaneous exposure of the front side and the backside

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)
  • Materials For Photolithography (AREA)
TW097111246A 2008-03-28 2008-03-28 Manufacturing method for conducting films on two surfaces of transparent substrate of touch-control circuit TW200941322A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW097111246A TW200941322A (en) 2008-03-28 2008-03-28 Manufacturing method for conducting films on two surfaces of transparent substrate of touch-control circuit
US12/117,814 US7887997B2 (en) 2008-03-28 2008-05-09 Manufacturing method for conducting films on two surfaces of transparent substrate of touch control circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097111246A TW200941322A (en) 2008-03-28 2008-03-28 Manufacturing method for conducting films on two surfaces of transparent substrate of touch-control circuit

Publications (2)

Publication Number Publication Date
TW200941322A true TW200941322A (en) 2009-10-01
TWI339809B TWI339809B (enExample) 2011-04-01

Family

ID=41117797

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097111246A TW200941322A (en) 2008-03-28 2008-03-28 Manufacturing method for conducting films on two surfaces of transparent substrate of touch-control circuit

Country Status (2)

Country Link
US (1) US7887997B2 (enExample)
TW (1) TW200941322A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103207529A (zh) * 2013-03-22 2013-07-17 京东方科技集团股份有限公司 曝光方法及曝光设备
CN103310904A (zh) * 2012-03-14 2013-09-18 深圳欧菲光科技股份有限公司 Ito电极的制备方法及采用该方法所制备的ito电极
TWI411838B (enExample) * 2010-12-13 2013-10-11

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI459436B (zh) * 2008-10-27 2014-11-01 Tpk Touch Solutions Inc The Method of Making Double - sided Graphic Structure of Touch Circuit
TWI411012B (zh) * 2009-11-23 2013-10-01 Echem Solutions Corp 雙面圖案化結構之製造方法
TWI394663B (zh) * 2010-02-06 2013-05-01 Ushine Photonics Corp 具反射光調整層之透明導電疊層體
TWI406352B (zh) * 2010-03-16 2013-08-21 Ind Tech Res Inst 晶圓承載基板及其製造方法
CN101907946A (zh) * 2010-08-13 2010-12-08 牧东光电（苏州）有限公司 触控面板线路单边外扩的方法
EP2726217B1 (en) * 2011-07-01 2017-11-22 CAM Holding Corporation Anisotropy reduction in coating of conductive films
TWI466007B (zh) * 2011-10-14 2014-12-21 Acer Inc 多重觸控輸入方法及其電子裝置
US20150305166A1 (en) 2014-04-22 2015-10-22 Carestream Health, Inc. Laser patterning of dual sided transparent conductive films
CN104461178B (zh) * 2014-12-26 2017-07-04 京东方科技集团股份有限公司 光触控结构、光触控显示基板及其制备方法
JP6617928B2 (ja) * 2016-11-18 2019-12-11 株式会社村田製作所 圧電振動素子の製造方法
CN109614008B (zh) * 2018-12-28 2022-04-12 业成科技（成都）有限公司 双面图案化的方法及触控面板的制造方法
CN111698835A (zh) * 2019-03-11 2020-09-22 恒煦电子材料股份有限公司 具有紫外线吸收层的双面透明功能板及其制造方法

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JPS56140322A (en) * 1980-04-04 1981-11-02 Casio Comput Co Ltd Substrate having electrodes on both sides for display cell
GB2277382A (en) 1993-04-19 1994-10-26 Pan Graphics Ind Limited Photoresist composition
US6653055B1 (en) 1998-09-18 2003-11-25 Vantico, Inc. Method for producing etched circuits
US6444391B2 (en) 1998-09-24 2002-09-03 Toyo Gosei Kogyo Co., Ltd. Photosensitive compositions and pattern formation method
US6551859B1 (en) 2001-02-22 2003-04-22 National Semiconductor Corporation Chip scale and land grid array semiconductor packages
US20070048626A1 (en) * 2005-08-30 2007-03-01 Asml Netherlands B.V. Device manufacturing method, mask and device
KR101211293B1 (ko) 2005-12-29 2012-12-11 엘지디스플레이 주식회사 전계를 이용한 미세패턴이 형성된 인쇄판의 제조방법
JP4667471B2 (ja) * 2007-01-18 2011-04-13 日東電工株式会社 透明導電性フィルム、その製造方法及びそれを備えたタッチパネル

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411838B (enExample) * 2010-12-13 2013-10-11
CN103310904A (zh) * 2012-03-14 2013-09-18 深圳欧菲光科技股份有限公司 Ito电极的制备方法及采用该方法所制备的ito电极
CN103310904B (zh) * 2012-03-14 2016-04-13 深圳欧菲光科技股份有限公司 Ito电极的制备方法及采用该方法所制备的ito电极
CN103207529A (zh) * 2013-03-22 2013-07-17 京东方科技集团股份有限公司 曝光方法及曝光设备
CN103207529B (zh) * 2013-03-22 2015-04-29 京东方科技集团股份有限公司 曝光方法及曝光设备

Also Published As

Publication number Publication date
US20090246704A1 (en) 2009-10-01
US7887997B2 (en) 2011-02-15
TWI339809B (enExample) 2011-04-01

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