TWI339809B - - Google Patents
Info
- Publication number
- TWI339809B TWI339809B TW097111246A TW97111246A TWI339809B TW I339809 B TWI339809 B TW I339809B TW 097111246 A TW097111246 A TW 097111246A TW 97111246 A TW97111246 A TW 97111246A TW I339809 B TWI339809 B TW I339809B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/2032—Simultaneous exposure of the front side and the backside
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
- Materials For Photolithography (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097111246A TW200941322A (en) | 2008-03-28 | 2008-03-28 | Manufacturing method for conducting films on two surfaces of transparent substrate of touch-control circuit |
| US12/117,814 US7887997B2 (en) | 2008-03-28 | 2008-05-09 | Manufacturing method for conducting films on two surfaces of transparent substrate of touch control circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097111246A TW200941322A (en) | 2008-03-28 | 2008-03-28 | Manufacturing method for conducting films on two surfaces of transparent substrate of touch-control circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200941322A TW200941322A (en) | 2009-10-01 |
| TWI339809B true TWI339809B (enExample) | 2011-04-01 |
Family
ID=41117797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097111246A TW200941322A (en) | 2008-03-28 | 2008-03-28 | Manufacturing method for conducting films on two surfaces of transparent substrate of touch-control circuit |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7887997B2 (enExample) |
| TW (1) | TW200941322A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI553668B (zh) * | 2011-07-01 | 2016-10-11 | 坎畢歐科技公司 | 形成導電膜之方法及其製得的導電膜 |
| TWI690778B (zh) * | 2018-12-28 | 2020-04-11 | 大陸商業成科技(成都)有限公司 | 雙面圖案化的方法及觸控面板的製造方法 |
| TWI705661B (zh) * | 2016-11-18 | 2020-09-21 | 日商村田製作所股份有限公司 | 壓電振動元件的製造方法 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI459436B (zh) * | 2008-10-27 | 2014-11-01 | Tpk Touch Solutions Inc | The Method of Making Double - sided Graphic Structure of Touch Circuit |
| TWI411012B (zh) * | 2009-11-23 | 2013-10-01 | Echem Solutions Corp | 雙面圖案化結構之製造方法 |
| TWI394663B (zh) * | 2010-02-06 | 2013-05-01 | Ushine Photonics Corp | 具反射光調整層之透明導電疊層體 |
| TWI406352B (zh) * | 2010-03-16 | 2013-08-21 | Ind Tech Res Inst | 晶圓承載基板及其製造方法 |
| CN101907946A (zh) * | 2010-08-13 | 2010-12-08 | 牧东光电(苏州)有限公司 | 触控面板线路单边外扩的方法 |
| TW201224585A (en) * | 2010-12-13 | 2012-06-16 | Join Well Technology Co Ltd | Manufacturing method for circuit of touch panel |
| TWI466007B (zh) * | 2011-10-14 | 2014-12-21 | Acer Inc | 多重觸控輸入方法及其電子裝置 |
| CN103310904B (zh) * | 2012-03-14 | 2016-04-13 | 深圳欧菲光科技股份有限公司 | Ito电极的制备方法及采用该方法所制备的ito电极 |
| CN103207529B (zh) * | 2013-03-22 | 2015-04-29 | 京东方科技集团股份有限公司 | 曝光方法及曝光设备 |
| US20150305166A1 (en) | 2014-04-22 | 2015-10-22 | Carestream Health, Inc. | Laser patterning of dual sided transparent conductive films |
| CN104461178B (zh) * | 2014-12-26 | 2017-07-04 | 京东方科技集团股份有限公司 | 光触控结构、光触控显示基板及其制备方法 |
| CN111698835A (zh) * | 2019-03-11 | 2020-09-22 | 恒煦电子材料股份有限公司 | 具有紫外线吸收层的双面透明功能板及其制造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56140322A (en) * | 1980-04-04 | 1981-11-02 | Casio Comput Co Ltd | Substrate having electrodes on both sides for display cell |
| GB2277382A (en) | 1993-04-19 | 1994-10-26 | Pan Graphics Ind Limited | Photoresist composition |
| US6653055B1 (en) | 1998-09-18 | 2003-11-25 | Vantico, Inc. | Method for producing etched circuits |
| US6444391B2 (en) | 1998-09-24 | 2002-09-03 | Toyo Gosei Kogyo Co., Ltd. | Photosensitive compositions and pattern formation method |
| US6551859B1 (en) | 2001-02-22 | 2003-04-22 | National Semiconductor Corporation | Chip scale and land grid array semiconductor packages |
| US20070048626A1 (en) * | 2005-08-30 | 2007-03-01 | Asml Netherlands B.V. | Device manufacturing method, mask and device |
| KR101211293B1 (ko) | 2005-12-29 | 2012-12-11 | 엘지디스플레이 주식회사 | 전계를 이용한 미세패턴이 형성된 인쇄판의 제조방법 |
| JP4667471B2 (ja) * | 2007-01-18 | 2011-04-13 | 日東電工株式会社 | 透明導電性フィルム、その製造方法及びそれを備えたタッチパネル |
-
2008
- 2008-03-28 TW TW097111246A patent/TW200941322A/zh not_active IP Right Cessation
- 2008-05-09 US US12/117,814 patent/US7887997B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI553668B (zh) * | 2011-07-01 | 2016-10-11 | 坎畢歐科技公司 | 形成導電膜之方法及其製得的導電膜 |
| TWI705661B (zh) * | 2016-11-18 | 2020-09-21 | 日商村田製作所股份有限公司 | 壓電振動元件的製造方法 |
| TWI690778B (zh) * | 2018-12-28 | 2020-04-11 | 大陸商業成科技(成都)有限公司 | 雙面圖案化的方法及觸控面板的製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090246704A1 (en) | 2009-10-01 |
| US7887997B2 (en) | 2011-02-15 |
| TW200941322A (en) | 2009-10-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |