TW200932867A - Adhesive sheet and method for manufacturing same - Google Patents
Adhesive sheet and method for manufacturing same Download PDFInfo
- Publication number
- TW200932867A TW200932867A TW097145475A TW97145475A TW200932867A TW 200932867 A TW200932867 A TW 200932867A TW 097145475 A TW097145475 A TW 097145475A TW 97145475 A TW97145475 A TW 97145475A TW 200932867 A TW200932867 A TW 200932867A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- adhesive sheet
- polymer
- acrylate
- conductive filler
- Prior art date
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 117
- 239000000853 adhesive Substances 0.000 title claims abstract description 116
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title abstract description 6
- 229920000642 polymer Polymers 0.000 claims abstract description 68
- 239000011231 conductive filler Substances 0.000 claims abstract description 61
- 239000000203 mixture Substances 0.000 claims abstract description 44
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 38
- 239000002998 adhesive polymer Substances 0.000 claims abstract description 37
- 239000000178 monomer Substances 0.000 claims abstract description 24
- 238000002156 mixing Methods 0.000 claims abstract description 11
- 239000002002 slurry Substances 0.000 claims description 50
- 239000010970 precious metal Substances 0.000 claims description 33
- -1 n-octyl Chemical group 0.000 claims description 26
- 239000007789 gas Substances 0.000 claims description 21
- 239000000945 filler Substances 0.000 claims description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 10
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 9
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 9
- 239000004094 surface-active agent Substances 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 8
- 239000002952 polymeric resin Substances 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 125000005250 alkyl acrylate group Chemical group 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 239000000052 vinegar Substances 0.000 claims description 5
- 235000021419 vinegar Nutrition 0.000 claims description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229920001940 conductive polymer Polymers 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 229910052755 nonmetal Inorganic materials 0.000 claims description 4
- 150000002843 nonmetals Chemical class 0.000 claims description 4
- 229920000058 polyacrylate Polymers 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 2
- 150000003926 acrylamides Chemical class 0.000 claims description 2
- 239000003570 air Substances 0.000 claims description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 2
- 239000002216 antistatic agent Substances 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 2
- 239000001569 carbon dioxide Substances 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229920001197 polyacetylene Polymers 0.000 claims description 2
- 229920000767 polyaniline Polymers 0.000 claims description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 2
- 229920000128 polypyrrole Polymers 0.000 claims description 2
- 229920000123 polythiophene Polymers 0.000 claims description 2
- 229910000510 noble metal Inorganic materials 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 239000011135 tin Substances 0.000 claims 2
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 claims 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims 1
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 claims 1
- 239000004641 Diallyl-phthalate Substances 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- NGPHCCBDMPHGMX-UHFFFAOYSA-N N1C(=CC2=CC=CC=C12)N.C=CC Chemical compound N1C(=CC2=CC=CC=C12)N.C=CC NGPHCCBDMPHGMX-UHFFFAOYSA-N 0.000 claims 1
- 238000002679 ablation Methods 0.000 claims 1
- 125000005907 alkyl ester group Chemical group 0.000 claims 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- 210000000078 claw Anatomy 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- DKQVJMREABFYNT-UHFFFAOYSA-N ethene Chemical group C=C.C=C DKQVJMREABFYNT-UHFFFAOYSA-N 0.000 claims 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 claims 1
- 229960002702 piroxicam Drugs 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 239000011593 sulfur Substances 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 abstract description 12
- 230000005670 electromagnetic radiation Effects 0.000 abstract description 6
- 230000001678 irradiating effect Effects 0.000 abstract description 6
- 239000006188 syrup Substances 0.000 abstract 6
- 235000020357 syrup Nutrition 0.000 abstract 6
- 239000000463 material Substances 0.000 description 10
- 239000003431 cross linking reagent Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- 239000000523 sample Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 4
- 238000005187 foaming Methods 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000004005 microsphere Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- XEKOWRVHYACXOJ-UHFFFAOYSA-N ethyl acetate Substances CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 2
- ZYMKZMDQUPCXRP-UHFFFAOYSA-N fluoro prop-2-enoate Chemical compound FOC(=O)C=C ZYMKZMDQUPCXRP-UHFFFAOYSA-N 0.000 description 2
- QEWYKACRFQMRMB-UHFFFAOYSA-N fluoroacetic acid Chemical compound OC(=O)CF QEWYKACRFQMRMB-UHFFFAOYSA-N 0.000 description 2
- 239000004088 foaming agent Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical class C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- NKYRAXWYDRHWOG-UHFFFAOYSA-N 12-hydroxydodecyl prop-2-enoate Chemical compound OCCCCCCCCCCCCOC(=O)C=C NKYRAXWYDRHWOG-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- ZOGLCAJXTCUJEO-UHFFFAOYSA-N C(C=C)(=O)O.C(C1=CC(C(=O)O)=CC=C1)(=O)O Chemical compound C(C=C)(=O)O.C(C1=CC(C(=O)O)=CC=C1)(=O)O ZOGLCAJXTCUJEO-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical class C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- HVUMOYIDDBPOLL-XWVZOOPGSA-N Sorbitan monostearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O HVUMOYIDDBPOLL-XWVZOOPGSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- RQBBFKINEJYDOB-UHFFFAOYSA-N acetic acid;acetonitrile Chemical compound CC#N.CC(O)=O RQBBFKINEJYDOB-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- WLGDAKIJYPIYLR-UHFFFAOYSA-N octane-1-sulfonic acid Chemical compound CCCCCCCCS(O)(=O)=O WLGDAKIJYPIYLR-UHFFFAOYSA-N 0.000 description 1
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000001587 sorbitan monostearate Substances 0.000 description 1
- 229940035048 sorbitan monostearate Drugs 0.000 description 1
- 235000011076 sorbitan monostearate Nutrition 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002888 zwitterionic surfactant Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070120938A KR20090054198A (ko) | 2007-11-26 | 2007-11-26 | 점착 시트의 제조방법 및 이에 의한 점착 시트 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200932867A true TW200932867A (en) | 2009-08-01 |
Family
ID=40679201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097145475A TW200932867A (en) | 2007-11-26 | 2008-11-25 | Adhesive sheet and method for manufacturing same |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20100317759A1 (https=) |
| EP (1) | EP2222809A2 (https=) |
| JP (1) | JP2011504961A (https=) |
| KR (1) | KR20090054198A (https=) |
| CN (1) | CN101874089A (https=) |
| BR (1) | BRPI0820399A2 (https=) |
| CA (1) | CA2706754A1 (https=) |
| MX (1) | MX2010005707A (https=) |
| RU (1) | RU2010121725A (https=) |
| TW (1) | TW200932867A (https=) |
| WO (1) | WO2009070504A2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI469866B (zh) * | 2009-08-04 | 2015-01-21 | Nippon Steel & Sumitomo Metal Corp | Precoated metal plate |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100608533B1 (ko) | 2005-05-13 | 2006-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 전기 전도성이 우수한 고분자 수지 및 그 제조방법 |
| KR20080004021A (ko) * | 2006-07-04 | 2008-01-09 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법 |
| WO2012053373A1 (ja) * | 2010-10-22 | 2012-04-26 | リンテック株式会社 | 導電性粘着剤組成物、電子デバイス及び電子デバイスの製造方法 |
| BRPI1005182A2 (pt) * | 2010-12-10 | 2013-04-02 | 3M Innovative Properties Co | processo para a produÇço de um adesivo e processo para a uniço de duas peÇas por adesivo |
| JP6146302B2 (ja) * | 2011-05-18 | 2017-06-14 | 日立化成株式会社 | 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法 |
| KR101856214B1 (ko) * | 2011-07-28 | 2018-06-25 | 엘지이노텍 주식회사 | 전도성 필름 및 그 제조방법 |
| CN103917372B (zh) * | 2011-09-15 | 2015-11-25 | 斯特塔西有限公司 | 控制所分配的打印材料的密度 |
| CN102443365B (zh) * | 2011-10-16 | 2013-11-06 | 上海晶华粘胶制品发展有限公司 | 导电胶带用胶粘剂及导电胶带 |
| KR101523817B1 (ko) * | 2012-07-10 | 2015-05-28 | (주)엘지하우시스 | 기포 안정성이 향상된 난연용 점착제 조성물 및 그의 제조방법 |
| CN103666363B (zh) * | 2012-09-10 | 2015-07-08 | 珠海方正科技高密电子有限公司 | 一种含有导电高分子的导电胶及其制备方法 |
| JP6289831B2 (ja) * | 2013-07-29 | 2018-03-07 | デクセリアルズ株式会社 | 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法 |
| WO2016117718A1 (en) * | 2015-01-20 | 2016-07-28 | Chang Sung Co., Ltd. | Electromagnetic wave shielding and absorbing sheet and manufacturing method of the same |
| KR102285233B1 (ko) * | 2015-02-27 | 2021-08-03 | 삼성전자주식회사 | 전자 장치 |
| EP3138886A1 (en) * | 2015-09-02 | 2017-03-08 | Allnex Belgium S.A. | Method for gluing involving the use of a radiation curable adhesive composition comprising short fibers |
| CN108440938A (zh) * | 2018-02-11 | 2018-08-24 | 宁波格林美孚新材料科技有限公司 | 一种微积分弹性单元导电材料及其制备方法 |
| CN108913065A (zh) * | 2018-05-03 | 2018-11-30 | 南通康尔乐复合材料有限公司 | 一种导电布胶水及其制备方法 |
| CN114945850B (zh) * | 2020-01-09 | 2024-03-19 | Lg伊诺特有限公司 | 光路控制构件及包括其的显示装置 |
| WO2022055148A1 (ko) * | 2020-09-11 | 2022-03-17 | 주식회사 엘지화학 | 폴더블 디스플레이용 점착 조성물 및 이의 경화물을 포함하는 폴더블 디스플레이용 점착필름 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5826381B2 (ja) * | 1979-04-28 | 1983-06-02 | 信越ポリマ−株式会社 | 電磁気シ−ルドガスケットおよびその製造方法 |
| US4448837A (en) * | 1982-07-19 | 1984-05-15 | Oki Densen Kabushiki Kaisha | Pressure-sensitive conductive elastic sheet |
| US4548862A (en) * | 1984-09-04 | 1985-10-22 | Minnesota Mining And Manufacturing Company | Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer |
| JPH06275123A (ja) * | 1993-03-18 | 1994-09-30 | Fujitsu Ltd | カプセル型導電性接着剤用導電性フィラー |
| US5443876A (en) * | 1993-12-30 | 1995-08-22 | Minnesota Mining And Manufacturing Company | Electrically conductive structured sheets |
| US5851644A (en) * | 1995-08-01 | 1998-12-22 | Loctite (Ireland) Limited | Films and coatings having anisotropic conductive pathways therein |
| US6548175B2 (en) * | 2001-01-11 | 2003-04-15 | International Business Machines Corporation | Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof |
| US6591496B2 (en) * | 2001-08-28 | 2003-07-15 | 3M Innovative Properties Company | Method for making embedded electrical traces |
| US6784363B2 (en) * | 2001-10-02 | 2004-08-31 | Parker-Hannifin Corporation | EMI shielding gasket construction |
| US7625633B2 (en) * | 2003-03-25 | 2009-12-01 | Shin-Etsu Polymer., Ltd. | Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods |
| TW200535205A (en) * | 2003-11-13 | 2005-11-01 | Lg Chemical Ltd | Adhesives having advanced flame-retardant property |
| CN101146885B (zh) * | 2005-03-04 | 2012-09-05 | 索尼化学&信息部件株式会社 | 各向异性导电性粘结剂及使用了该粘结剂的电极连接方法 |
| KR100608533B1 (ko) * | 2005-05-13 | 2006-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 전기 전도성이 우수한 고분자 수지 및 그 제조방법 |
| JP2007299907A (ja) * | 2006-04-28 | 2007-11-15 | Nitto Denko Corp | 電磁波を伝導又は吸収する特性を有する構造体 |
| KR20080004021A (ko) * | 2006-07-04 | 2008-01-09 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법 |
| KR101269741B1 (ko) * | 2006-07-04 | 2013-05-30 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 탄성 및 접착성을 갖는 전자기파 차단용 가스켓 |
-
2007
- 2007-11-26 KR KR1020070120938A patent/KR20090054198A/ko not_active Withdrawn
-
2008
- 2008-11-21 CN CN200880117857A patent/CN101874089A/zh active Pending
- 2008-11-21 BR BRPI0820399-7A patent/BRPI0820399A2/pt not_active IP Right Cessation
- 2008-11-21 MX MX2010005707A patent/MX2010005707A/es unknown
- 2008-11-21 JP JP2010536081A patent/JP2011504961A/ja not_active Withdrawn
- 2008-11-21 US US12/744,115 patent/US20100317759A1/en not_active Abandoned
- 2008-11-21 RU RU2010121725/05A patent/RU2010121725A/ru not_active Application Discontinuation
- 2008-11-21 EP EP08854975A patent/EP2222809A2/en not_active Withdrawn
- 2008-11-21 CA CA2706754A patent/CA2706754A1/en not_active Abandoned
- 2008-11-21 WO PCT/US2008/084354 patent/WO2009070504A2/en not_active Ceased
- 2008-11-25 TW TW097145475A patent/TW200932867A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI469866B (zh) * | 2009-08-04 | 2015-01-21 | Nippon Steel & Sumitomo Metal Corp | Precoated metal plate |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090054198A (ko) | 2009-05-29 |
| CN101874089A (zh) | 2010-10-27 |
| EP2222809A2 (en) | 2010-09-01 |
| JP2011504961A (ja) | 2011-02-17 |
| US20100317759A1 (en) | 2010-12-16 |
| BRPI0820399A2 (pt) | 2015-05-19 |
| WO2009070504A3 (en) | 2009-07-23 |
| WO2009070504A2 (en) | 2009-06-04 |
| CA2706754A1 (en) | 2009-06-04 |
| RU2010121725A (ru) | 2012-01-10 |
| MX2010005707A (es) | 2010-06-02 |
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