CN101874089A - 粘合片及其制造方法 - Google Patents

粘合片及其制造方法 Download PDF

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Publication number
CN101874089A
CN101874089A CN200880117857A CN200880117857A CN101874089A CN 101874089 A CN101874089 A CN 101874089A CN 200880117857 A CN200880117857 A CN 200880117857A CN 200880117857 A CN200880117857 A CN 200880117857A CN 101874089 A CN101874089 A CN 101874089A
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CN
China
Prior art keywords
adhesive sheet
adhesive
conductive filler
polymer resin
mixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200880117857A
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English (en)
Chinese (zh)
Inventor
柳正铉
崔汀完
朴晋佑
杨辛艾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN101874089A publication Critical patent/CN101874089A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN200880117857A 2007-11-26 2008-11-21 粘合片及其制造方法 Pending CN101874089A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2007-0120938 2007-11-26
KR1020070120938A KR20090054198A (ko) 2007-11-26 2007-11-26 점착 시트의 제조방법 및 이에 의한 점착 시트
PCT/US2008/084354 WO2009070504A2 (en) 2007-11-26 2008-11-21 Adhesive sheet and method for manufacturing same

Publications (1)

Publication Number Publication Date
CN101874089A true CN101874089A (zh) 2010-10-27

Family

ID=40679201

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880117857A Pending CN101874089A (zh) 2007-11-26 2008-11-21 粘合片及其制造方法

Country Status (11)

Country Link
US (1) US20100317759A1 (https=)
EP (1) EP2222809A2 (https=)
JP (1) JP2011504961A (https=)
KR (1) KR20090054198A (https=)
CN (1) CN101874089A (https=)
BR (1) BRPI0820399A2 (https=)
CA (1) CA2706754A1 (https=)
MX (1) MX2010005707A (https=)
RU (1) RU2010121725A (https=)
TW (1) TW200932867A (https=)
WO (1) WO2009070504A2 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104471006A (zh) * 2012-07-10 2015-03-25 乐金华奥斯有限公司 气泡稳定性提高的阻燃性粘结剂组合物及其制备方法
US9193157B2 (en) 2011-09-15 2015-11-24 Stratasys Ltd. Controlling density of dispensed printing material
CN107922789A (zh) * 2015-09-02 2018-04-17 湛新比利时股份有限公司 涉及使用含短纤维的可辐射固化的粘合剂组合物的胶合方法
CN108440938A (zh) * 2018-02-11 2018-08-24 宁波格林美孚新材料科技有限公司 一种微积分弹性单元导电材料及其制备方法
CN108913065A (zh) * 2018-05-03 2018-11-30 南通康尔乐复合材料有限公司 一种导电布胶水及其制备方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
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KR100608533B1 (ko) 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전기 전도성이 우수한 고분자 수지 및 그 제조방법
KR20080004021A (ko) * 2006-07-04 2008-01-09 쓰리엠 이노베이티브 프로퍼티즈 캄파니 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법
IN2012DN00699A (https=) * 2009-08-04 2015-06-19 Nippon Steel & Sumitomo Metal Corp
WO2012053373A1 (ja) * 2010-10-22 2012-04-26 リンテック株式会社 導電性粘着剤組成物、電子デバイス及び電子デバイスの製造方法
BRPI1005182A2 (pt) * 2010-12-10 2013-04-02 3M Innovative Properties Co processo para a produÇço de um adesivo e processo para a uniço de duas peÇas por adesivo
JP6146302B2 (ja) * 2011-05-18 2017-06-14 日立化成株式会社 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
KR101856214B1 (ko) * 2011-07-28 2018-06-25 엘지이노텍 주식회사 전도성 필름 및 그 제조방법
CN102443365B (zh) * 2011-10-16 2013-11-06 上海晶华粘胶制品发展有限公司 导电胶带用胶粘剂及导电胶带
CN103666363B (zh) * 2012-09-10 2015-07-08 珠海方正科技高密电子有限公司 一种含有导电高分子的导电胶及其制备方法
JP6289831B2 (ja) * 2013-07-29 2018-03-07 デクセリアルズ株式会社 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法
WO2016117718A1 (en) * 2015-01-20 2016-07-28 Chang Sung Co., Ltd. Electromagnetic wave shielding and absorbing sheet and manufacturing method of the same
KR102285233B1 (ko) * 2015-02-27 2021-08-03 삼성전자주식회사 전자 장치
CN114945850B (zh) * 2020-01-09 2024-03-19 Lg伊诺特有限公司 光路控制构件及包括其的显示装置
WO2022055148A1 (ko) * 2020-09-11 2022-03-17 주식회사 엘지화학 폴더블 디스플레이용 점착 조성물 및 이의 경화물을 포함하는 폴더블 디스플레이용 점착필름

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275123A (ja) * 1993-03-18 1994-09-30 Fujitsu Ltd カプセル型導電性接着剤用導電性フィラー
US20020127406A1 (en) * 2001-01-11 2002-09-12 International Business Machines Corporation Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
CN1867644A (zh) * 2003-11-13 2006-11-22 Lg化学株式会社 具有改进的阻燃性的粘合剂
CN101146885A (zh) * 2005-03-04 2008-03-19 索尼化学&信息部件株式会社 各向异性导电性粘结剂及使用了该粘结剂的电极连接方法

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JPS5826381B2 (ja) * 1979-04-28 1983-06-02 信越ポリマ−株式会社 電磁気シ−ルドガスケットおよびその製造方法
US4448837A (en) * 1982-07-19 1984-05-15 Oki Densen Kabushiki Kaisha Pressure-sensitive conductive elastic sheet
US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
US5443876A (en) * 1993-12-30 1995-08-22 Minnesota Mining And Manufacturing Company Electrically conductive structured sheets
US5851644A (en) * 1995-08-01 1998-12-22 Loctite (Ireland) Limited Films and coatings having anisotropic conductive pathways therein
US6591496B2 (en) * 2001-08-28 2003-07-15 3M Innovative Properties Company Method for making embedded electrical traces
US6784363B2 (en) * 2001-10-02 2004-08-31 Parker-Hannifin Corporation EMI shielding gasket construction
US7625633B2 (en) * 2003-03-25 2009-12-01 Shin-Etsu Polymer., Ltd. Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods
KR100608533B1 (ko) * 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전기 전도성이 우수한 고분자 수지 및 그 제조방법
JP2007299907A (ja) * 2006-04-28 2007-11-15 Nitto Denko Corp 電磁波を伝導又は吸収する特性を有する構造体
KR20080004021A (ko) * 2006-07-04 2008-01-09 쓰리엠 이노베이티브 프로퍼티즈 캄파니 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법
KR101269741B1 (ko) * 2006-07-04 2013-05-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 탄성 및 접착성을 갖는 전자기파 차단용 가스켓

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275123A (ja) * 1993-03-18 1994-09-30 Fujitsu Ltd カプセル型導電性接着剤用導電性フィラー
US20020127406A1 (en) * 2001-01-11 2002-09-12 International Business Machines Corporation Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
CN1867644A (zh) * 2003-11-13 2006-11-22 Lg化学株式会社 具有改进的阻燃性的粘合剂
CN101146885A (zh) * 2005-03-04 2008-03-19 索尼化学&信息部件株式会社 各向异性导电性粘结剂及使用了该粘结剂的电极连接方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9193157B2 (en) 2011-09-15 2015-11-24 Stratasys Ltd. Controlling density of dispensed printing material
CN103917372B (zh) * 2011-09-15 2015-11-25 斯特塔西有限公司 控制所分配的打印材料的密度
CN104471006A (zh) * 2012-07-10 2015-03-25 乐金华奥斯有限公司 气泡稳定性提高的阻燃性粘结剂组合物及其制备方法
CN107325762A (zh) * 2012-07-10 2017-11-07 株式会社Lg化学 气泡稳定性提高的阻燃性粘结剂组合物及其制备方法
CN107325762B (zh) * 2012-07-10 2021-04-27 株式会社Lg化学 气泡稳定性提高的阻燃性粘结剂组合物及其制备方法
CN107922789A (zh) * 2015-09-02 2018-04-17 湛新比利时股份有限公司 涉及使用含短纤维的可辐射固化的粘合剂组合物的胶合方法
CN108440938A (zh) * 2018-02-11 2018-08-24 宁波格林美孚新材料科技有限公司 一种微积分弹性单元导电材料及其制备方法
CN108913065A (zh) * 2018-05-03 2018-11-30 南通康尔乐复合材料有限公司 一种导电布胶水及其制备方法

Also Published As

Publication number Publication date
TW200932867A (en) 2009-08-01
KR20090054198A (ko) 2009-05-29
EP2222809A2 (en) 2010-09-01
JP2011504961A (ja) 2011-02-17
US20100317759A1 (en) 2010-12-16
BRPI0820399A2 (pt) 2015-05-19
WO2009070504A3 (en) 2009-07-23
WO2009070504A2 (en) 2009-06-04
CA2706754A1 (en) 2009-06-04
RU2010121725A (ru) 2012-01-10
MX2010005707A (es) 2010-06-02

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
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Application publication date: 20101027