TW200922429A - Structure and manufacturing method of (with embedded component) multilayer circuit board - Google Patents
Structure and manufacturing method of (with embedded component) multilayer circuit board Download PDFInfo
- Publication number
- TW200922429A TW200922429A TW96143157A TW96143157A TW200922429A TW 200922429 A TW200922429 A TW 200922429A TW 96143157 A TW96143157 A TW 96143157A TW 96143157 A TW96143157 A TW 96143157A TW 200922429 A TW200922429 A TW 200922429A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- conductive layer
- recess
- multilayer circuit
- forming
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000000034 method Methods 0.000 claims description 29
- 238000005553 drilling Methods 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 4
- 230000032683 aging Effects 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000004020 conductor Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96143157A TW200922429A (en) | 2007-11-14 | 2007-11-14 | Structure and manufacturing method of (with embedded component) multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96143157A TW200922429A (en) | 2007-11-14 | 2007-11-14 | Structure and manufacturing method of (with embedded component) multilayer circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200922429A true TW200922429A (en) | 2009-05-16 |
| TWI334325B TWI334325B (enrdf_load_stackoverflow) | 2010-12-01 |
Family
ID=44211800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96143157A TW200922429A (en) | 2007-11-14 | 2007-11-14 | Structure and manufacturing method of (with embedded component) multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200922429A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036497A (zh) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Pcb板埋入磁芯的方法 |
| CN103906372A (zh) * | 2012-12-27 | 2014-07-02 | 富葵精密组件(深圳)有限公司 | 具有内埋元件的电路板及其制作方法 |
| WO2023272642A1 (zh) * | 2021-06-30 | 2023-01-05 | 深南电路股份有限公司 | 电子元件封装体、电子组件、电压调节模块以及稳压器件 |
| TWI790103B (zh) * | 2022-01-24 | 2023-01-11 | 健鼎科技股份有限公司 | 多層電路板及其製造方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036492B (zh) * | 2010-12-28 | 2012-11-14 | 东莞生益电子有限公司 | Pcb板的钻孔方法 |
| JP5122018B1 (ja) * | 2012-08-10 | 2013-01-16 | 太陽誘電株式会社 | 電子部品内蔵基板 |
-
2007
- 2007-11-14 TW TW96143157A patent/TW200922429A/zh unknown
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036497A (zh) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Pcb板埋入磁芯的方法 |
| CN103906372A (zh) * | 2012-12-27 | 2014-07-02 | 富葵精密组件(深圳)有限公司 | 具有内埋元件的电路板及其制作方法 |
| TWI466607B (zh) * | 2012-12-27 | 2014-12-21 | Zhen Ding Technology Co Ltd | 具有內埋元件的電路板及其製作方法 |
| US9089082B2 (en) | 2012-12-27 | 2015-07-21 | Zhen Ding Technology Co., Ltd. | Printed circuit board with embedded component and method for manufacturing same |
| CN103906372B (zh) * | 2012-12-27 | 2017-03-01 | 碁鼎科技秦皇岛有限公司 | 具有内埋元件的电路板及其制作方法 |
| WO2023272642A1 (zh) * | 2021-06-30 | 2023-01-05 | 深南电路股份有限公司 | 电子元件封装体、电子组件、电压调节模块以及稳压器件 |
| US11737212B2 (en) | 2021-06-30 | 2023-08-22 | Shennan Circuits Co., Ltd. | Electronic component package, electronic assembly, voltage regulation module, and voltage regulator member |
| TWI790103B (zh) * | 2022-01-24 | 2023-01-11 | 健鼎科技股份有限公司 | 多層電路板及其製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI334325B (enrdf_load_stackoverflow) | 2010-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103458628B (zh) | 多层电路板及其制作方法 | |
| JP3014310B2 (ja) | 積層配線基板の構造と製作方法 | |
| TWI710301B (zh) | 薄型天線電路板的製作方法 | |
| JP3048905B2 (ja) | 積層配線基板構造体、及びその製造方法 | |
| CN103906371B (zh) | 具有内埋元件的电路板及其制作方法 | |
| TW200524502A (en) | Method of providing printed circuit board with conductive holes and board resulting therefrom | |
| TWI665949B (zh) | 柔性電路板及其製作方法 | |
| TW200423848A (en) | High speed circuit board and method for fabrication | |
| CN102548225A (zh) | 一种pcb板的制作方法 | |
| TW200922429A (en) | Structure and manufacturing method of (with embedded component) multilayer circuit board | |
| JPH08307028A (ja) | 回路カード及びその製造方法 | |
| TWI373992B (en) | Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same | |
| KR100857165B1 (ko) | 회로기판 제조방법 | |
| US10772220B2 (en) | Dummy core restrict resin process and structure | |
| CN104982097A (zh) | 内置有零件的基板及其制造方法 | |
| CN113677086B (zh) | 带币状物和介电层的印刷电路板 | |
| TWI357292B (en) | Multilayer circuit board with embedded electronic | |
| CN101742822A (zh) | 在软硬板的软板区剥离硬板的方法 | |
| CN101472399B (zh) | 内埋式线路板的制作方法 | |
| TW200948238A (en) | Structure and manufacturing process for circuit board | |
| US20090090548A1 (en) | Circuit board and fabrication method thereof | |
| CN102036498B (zh) | 内埋式组件基板结构及其制作方法 | |
| CN114980575A (zh) | 半侧金属化半侧非金属化盲槽的加工方法和印刷电路板 | |
| TWI327879B (enrdf_load_stackoverflow) | ||
| KR100797669B1 (ko) | 인쇄회로기판 및 그 제조방법 |