TW200915943A - Method to form opening on solder mask layer with high precision of alignment - Google Patents
Method to form opening on solder mask layer with high precision of alignment Download PDFInfo
- Publication number
- TW200915943A TW200915943A TW96136308A TW96136308A TW200915943A TW 200915943 A TW200915943 A TW 200915943A TW 96136308 A TW96136308 A TW 96136308A TW 96136308 A TW96136308 A TW 96136308A TW 200915943 A TW200915943 A TW 200915943A
- Authority
- TW
- Taiwan
- Prior art keywords
- solder
- solder mask
- pads
- alignment
- mask layer
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000008569 process Effects 0.000 claims abstract description 6
- 238000003466 welding Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 6
- 230000000873 masking effect Effects 0.000 abstract 1
- 238000000206 photolithography Methods 0.000 abstract 1
- 239000011295 pitch Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 10
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 208000003251 Pruritus Diseases 0.000 description 1
- 239000012754 barrier agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96136308A TW200915943A (en) | 2007-09-28 | 2007-09-28 | Method to form opening on solder mask layer with high precision of alignment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96136308A TW200915943A (en) | 2007-09-28 | 2007-09-28 | Method to form opening on solder mask layer with high precision of alignment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200915943A true TW200915943A (en) | 2009-04-01 |
| TWI333405B TWI333405B (enExample) | 2010-11-11 |
Family
ID=44725882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96136308A TW200915943A (en) | 2007-09-28 | 2007-09-28 | Method to form opening on solder mask layer with high precision of alignment |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200915943A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI455656B (zh) * | 2011-10-31 | 2014-10-01 | Mediatek Singapore Pte Ltd | 印刷電路板以及電子設備 |
| US8927878B2 (en) | 2011-10-31 | 2015-01-06 | Mediatek Singapore Pte. Ltd | Printed circuit board and electronic apparatus thereof |
| TWI551201B (zh) * | 2015-11-27 | 2016-09-21 | 達方電子股份有限公司 | 光源裝置 |
| CN108419378A (zh) * | 2018-05-09 | 2018-08-17 | 深圳市百柔新材料技术有限公司 | 印刷线路板保护层的制作方法 |
| CN111565519A (zh) * | 2020-06-02 | 2020-08-21 | 锡凡半导体无锡有限公司 | 一种印刷无感光蚀工艺 |
| CN113556883A (zh) * | 2020-04-23 | 2021-10-26 | 鹏鼎控股(深圳)股份有限公司 | 电路板封装结构的制备方法及电路板封装结构 |
| CN115038253A (zh) * | 2022-06-15 | 2022-09-09 | 江门崇达电路技术有限公司 | 一种线路板上多种类型的pad精准等大的制作方法 |
-
2007
- 2007-09-28 TW TW96136308A patent/TW200915943A/zh unknown
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI455656B (zh) * | 2011-10-31 | 2014-10-01 | Mediatek Singapore Pte Ltd | 印刷電路板以及電子設備 |
| US8927878B2 (en) | 2011-10-31 | 2015-01-06 | Mediatek Singapore Pte. Ltd | Printed circuit board and electronic apparatus thereof |
| TWI551201B (zh) * | 2015-11-27 | 2016-09-21 | 達方電子股份有限公司 | 光源裝置 |
| CN108419378A (zh) * | 2018-05-09 | 2018-08-17 | 深圳市百柔新材料技术有限公司 | 印刷线路板保护层的制作方法 |
| CN113556883A (zh) * | 2020-04-23 | 2021-10-26 | 鹏鼎控股(深圳)股份有限公司 | 电路板封装结构的制备方法及电路板封装结构 |
| CN113556883B (zh) * | 2020-04-23 | 2022-11-15 | 鹏鼎控股(深圳)股份有限公司 | 电路板封装结构的制备方法及电路板封装结构 |
| CN111565519A (zh) * | 2020-06-02 | 2020-08-21 | 锡凡半导体无锡有限公司 | 一种印刷无感光蚀工艺 |
| CN115038253A (zh) * | 2022-06-15 | 2022-09-09 | 江门崇达电路技术有限公司 | 一种线路板上多种类型的pad精准等大的制作方法 |
| CN115038253B (zh) * | 2022-06-15 | 2023-07-14 | 江门崇达电路技术有限公司 | 一种线路板上多种类型的pad精准等大的制作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI333405B (enExample) | 2010-11-11 |
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