TW200850098A - Printed-wiring board and method for manufacturing the same - Google Patents

Printed-wiring board and method for manufacturing the same Download PDF

Info

Publication number
TW200850098A
TW200850098A TW97106622A TW97106622A TW200850098A TW 200850098 A TW200850098 A TW 200850098A TW 97106622 A TW97106622 A TW 97106622A TW 97106622 A TW97106622 A TW 97106622A TW 200850098 A TW200850098 A TW 200850098A
Authority
TW
Taiwan
Prior art keywords
layer
wiring board
transmission line
signal wiring
printed wiring
Prior art date
Application number
TW97106622A
Other languages
English (en)
Chinese (zh)
Inventor
Ryoichi Toyoshima
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200850098A publication Critical patent/TW200850098A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
TW97106622A 2007-06-12 2008-02-26 Printed-wiring board and method for manufacturing the same TW200850098A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007154903A JP2008311270A (ja) 2007-06-12 2007-06-12 プリント配線板およびその製造方法

Publications (1)

Publication Number Publication Date
TW200850098A true TW200850098A (en) 2008-12-16

Family

ID=40129441

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97106622A TW200850098A (en) 2007-06-12 2008-02-26 Printed-wiring board and method for manufacturing the same

Country Status (3)

Country Link
JP (1) JP2008311270A (ja)
TW (1) TW200850098A (ja)
WO (1) WO2008152827A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105578733B (zh) * 2016-02-26 2019-03-05 青岛海信移动通信技术股份有限公司 一种pcb及其制作方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04313300A (ja) * 1991-04-10 1992-11-05 Sumitomo Electric Ind Ltd フレキシブルプリント配線板
JP2002324949A (ja) * 2001-04-24 2002-11-08 Nippon Mektron Ltd 回路基板及びその製造法
JP3969523B2 (ja) * 2002-02-25 2007-09-05 独立行政法人産業技術総合研究所 プリント配線基板の製造方法
JP2004119604A (ja) * 2002-09-25 2004-04-15 Nippon Mektron Ltd シールド型回路基板およびその製造方法
JP2006041102A (ja) * 2004-07-26 2006-02-09 Fujikura Ltd プリント配線板およびその製造方法

Also Published As

Publication number Publication date
JP2008311270A (ja) 2008-12-25
WO2008152827A1 (ja) 2008-12-18

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